CN112310798A

CN112310798A - Semiconductor laser heat abstractor

Info

Publication number: CN112310798A
Application number: CN201911040431.XA
Authority: CN
Inventors: 董建康; 夏良道; 谢翰林
Original assignee: Ningbo Baisri Medical Technology Co ltd
Current assignee: Ningbo Baisri Medical Technology Co ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2021-02-02

Abstract

The invention discloses a heat radiating device of a semiconductor laser in the technical field of semiconductor lasers, which comprises a water tank, wherein the outer wall of the water tank is provided with a water filling port, a water supply inlet, a water supply outlet and a water outlet, an assembly sheet metal part is clamped in an inner cavity of the water tank, a jet pump is screwed on the bottom wall of the inner cavity of the assembly sheet metal part, a heat radiating module is screwed on the bottom wall of the inner cavity of the assembly sheet metal part and comprises a fin radiator, an air outlet of the jet pump is contacted with the outer wall of the fin radiator, a water-cooling substrate is fixedly arranged on the top wall of the fin radiator, a water flow channel is arranged in the inner cavity of the water-cooling substrate, a semiconductor refrigerator is arranged in the inner cavity of the top wall of the water-cooling substrate, a heat conducting panel is screwed on the top wall of the heat, the device effectively reduces the volume and the noise of the heat dissipation device of the semiconductor laser generator, has small volume and is convenient to assemble and maintain.

Description

Semiconductor laser heat abstractor

Technical Field

The invention discloses a heat dissipation device of a semiconductor laser, and particularly relates to the technical field of semiconductor lasers.

Background

Through the development of many years, the semiconductor laser is widely applied to various fields which are closely related to human life, such as optical fiber communication, photoelectric integration, optical disk storage, pumping light sources, atmospheric environment detection, trace toxic gas analysis, molecular spectroscopy and the like, by the characteristics of small volume, light weight, low voltage, large power and the like, and partial applications of the semiconductor laser continuously provide higher requirements for the output power of the semiconductor laser. Generally, increasing the ridge width of the semiconductor laser and increasing the operating current are the most direct ways to increase the output power, but at the same time, it also results in an increase in the operating temperature of the active region of the semiconductor laser. The temperature of the semiconductor laser during working has a significant influence on the threshold current density, the slope efficiency, the spectral stability and the like, and overheating of a light emitting region can cause damage to the cavity surface of the light emitting region and even device degradation, so that the device is finally failed, and therefore heat dissipation needs to be effectively carried out. Effective means for improving heat dissipation of semiconductor lasers in general mainly include the use of device flip-chip bonding, the use of high thermal conductivity materials as device insulating layers, the use of buried heterojunction structures, the use of high thermal conductivity heat sink materials, and the like.

In the prior art, materials such as copper or aluminum nitride are mainly used as heat sink materials, the cost of the copper used as the heat sink material is low, the copper is suitable for large-scale use, but the thermal conductivity of the copper is still different from that of certain high thermal conductivity materials, aluminum nitride is a novel high thermal conductivity material, the linear expansion coefficient of the aluminum nitride is matched with that of a semiconductor material, but the aluminum nitride is easily etched by aqueous solution, and the preparation process of aluminum nitride single crystal is complex and the cost is extremely high. In addition, under the condition of a laboratory test platform, auxiliary methods such as circulating cooling water and even liquid nitrogen can be generally used for assisting the laser in heat dissipation, and the heat dissipation device is large in size, complex in structure and difficult to realize modularization and miniaturization.

Disclosure of Invention

The present invention is directed to a heat dissipation device for a semiconductor laser, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor laser heat dissipation device comprises a water tank, wherein the outer wall of the water tank is provided with a water filling port, a water supply inlet, a water supply outlet and a water outlet, the inner cavity of the water tank is provided with a water pump, the water outlet port of the water pump is connected with the water supply outlet, the inner cavity of the water tank is clamped with an assembly sheet metal part, the inner cavity bottom wall of the assembly sheet metal part is in threaded connection with a jet pump, the inner cavity bottom wall of the assembly sheet metal part is in threaded connection with a heat dissipation module, the heat dissipation module comprises a fin radiator, the air outlet of the jet pump is in contact with the outer wall of the fin radiator, the bottom wall of the fin radiator is in contact with the inner cavity bottom wall of the assembly sheet metal part, a water cooling substrate is fixedly installed on the top wall of the fin radiator, the inner cavity of the water cooling substrate is provided with a water, the roof inner chamber of water-cooling base plate is provided with the semiconductor refrigeration ware, the roof spiro union of water-cooling base plate has the heat conduction panel, the cold and hot terminal surface of semiconductor refrigeration ware contacts with the outer wall of heat conduction panel and water-cooling base plate respectively, the laser instrument module is installed to heat dissipation module's roof, the outer wall spiro union of laser instrument module has the M screw, the one end of M screw and the roof spiro union of fin radiator.

Preferably, the inner cavity of the water filling port is provided with a filter screen.

Preferably, the front wall of the water tank is provided with a water level gauge.

Preferably, the outer wall of the heat-conducting panel is coated with one of a heat-conducting silicone grease layer, a heat-conducting silicone rubber layer and the like.

Preferably, the bottom wall of the heat conducting panel is provided with an NTC temperature sensor.

Compared with the prior art, the invention has the beneficial effects that:

1) the device is provided with a heat conduction panel, a semiconductor refrigerator, a heat dissipation module and a jet pump, when the laser module works, a cold surface of the semiconductor refrigerator is in contact with the heat conduction panel at the lower part of the laser module, heat generated by the laser module is subjected to heat exchange with the cold surface of the semiconductor refrigerator through the heat conduction panel, heat generated by a hot surface of the semiconductor refrigerator is respectively dissipated by circulating water cooling and heat dissipation fins through forced air cooling through the jet pump, and the jet pump is used for blowing and cooling the heat dissipation fins and a heat dissipation water path, so that the volume and the noise of the heat dissipation device of the semiconductor laser generator are effectively reduced;

2) this device sets up assembly sheet metal component and water tank, and the water tank passes through the separation such as sheet metal component and thermal module, and the assembly sheet metal component seals the formation wind channel with fin radiator bottom, makes the effectual heat of taking away the thermal module production of air current that the jet pump produced, and the assembly sheet metal component makes each module concentrate, reduces the volume, is convenient for assemble the maintenance.

Drawings

FIG. 1 is a schematic view of a heat dissipation device of a semiconductor laser according to the present invention;

FIG. 2 is a schematic front view of the water tank of the present invention;

FIG. 3 is a schematic top view of the water tank of the present invention;

FIG. 4 is a schematic front view of the jet pump of the present invention;

fig. 5 is a front view of the heat dissipation module of the present invention.

In the figure: 100 water tank, 110 water filling port, 120 water supply inlet, 130 water supply outlet, 140 water level gauge, 200 assembling sheet metal parts, 210 jet pump, 300 heat dissipation module, 310 fin radiator, 320 water cooling base plate, 321 water flow channel, 330 semiconductor refrigerator, 340 heat conduction panel, 400 laser module, 410M 6 screw.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides a semiconductor laser heat sink, which effectively reduces the volume and noise of a semiconductor laser generator heat sink, and has the advantages that each module is concentrated, the volume is reduced, and the assembly and maintenance are convenient, please refer to fig. 1, fig. 2 and fig. 3, the semiconductor laser heat sink comprises a water tank 100, the outer wall of the water tank 100 is provided with a water filling port 110, a water supply inlet 120, a water supply outlet 130 and a water outlet, the inner cavity of the water tank 100 is provided with a water pump, the water outlet of the water pump is connected with the water supply outlet 130, and the water inlet of the water pump sinks into the bottom of the;

referring to fig. 1 and 4, an assembly sheet metal part 200 is clamped in an inner cavity of the water tank 100, a jet pump 210 is screwed on the bottom wall of the inner cavity of the assembly sheet metal part 200, the assembly sheet metal part 200 is used for bearing the jet pump 210, and the jet pump 210 is used for blowing away heat generated by the heat dissipation module 300 through air blowing;

referring to fig. 1 and 5, a heat dissipation module 300 is screwed on the bottom wall of the inner cavity of the assembled sheet metal part 200, the heat dissipation module 300 includes a fin radiator 310, an air outlet of the jet pump 210 contacts with an outer wall of the fin radiator 310, the bottom wall of the fin radiator 310 contacts with the bottom wall of the inner cavity of the assembled sheet metal part 200, a water cooling substrate 320 is fixedly installed on the top wall of the fin radiator 310, an inner cavity of the water cooling substrate 320 is provided with a water flow channel 321, inner cavities at two ends of the water flow channel 321 are respectively clamped with a pagoda interface, a water supply inlet 120 and a water supply outlet 130 are respectively connected with the pagoda interface through pipes, an inner cavity of the top wall of the water cooling substrate 320 is provided with a semiconductor refrigerator 330, the top wall of the water cooling substrate 320 is screwed with a heat conduction panel 340, cold and hot end faces of the, the water-cooled substrate 320 is used for exchanging heat with the hot end of the semiconductor refrigerator 330 and the fin radiator 310 through the water flow channel 321, the cold end of the semiconductor refrigerator 330 is used for exchanging heat with the heat-conducting panel 340, the heat-conducting panel 340 is used for increasing the heat-radiating area of the laser module 400, and the heat-conducting panel 340 is used for exchanging heat between the heat of the laser module 400 and the cold end of the semiconductor refrigerator 330;

referring to fig. 1, a laser module 400 is mounted on the top wall of the heat dissipation module 300, an M6 screw 410 is screwed on the outer wall of the laser module 400, and one end of the M6 screw 410 is screwed on the top wall of the fin heat sink 310;

referring to fig. 1 and 2, a filter screen is disposed in an inner cavity of the water filling port 110 for filtering impurities in the water;

referring to fig. 2, a water level gauge 140 is disposed on the front wall of the water tank 100 to indicate the level of water, and a red float is disposed inside the water tank 100 and connected to the water tank 100, when the water level of the water tank 100 is higher than the interface level, water is filled into the water level gauge 140, and the float in the water level gauge 140 can reflect the water filling condition of the water tank;

the outer wall of the heat-conducting panel 340 is coated with one of heat-conducting silicone grease or heat-conducting silicone layer, etc., so that the effective heat-conducting area of the heat-conducting panel 340 is increased;

the bottom wall of the heat conducting panel 340 is provided with an NTC temperature sensor for monitoring temperature variation and simultaneously being a feedback temperature of the temperature control of the semiconductor refrigerator 330, and the temperature control of the semiconductor refrigerator 330 can supply power to the semiconductor refrigerator 330 according to the set temperature and the monitored temperature condition to ensure the temperature stability of the heat conducting panel 340.

While the invention has been described with reference to certain embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the various embodiments of the invention disclosed may be used in any combination whatsoever without structural conflict, and the failure to exhaustively describe such combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A semiconductor laser heat dissipation device is characterized in that: including water tank (100), the outer wall of water tank (100) is provided with water filling port (110), water supply entry (120), water supply export (130) and outlet, the inner chamber of water tank (100) is provided with the water pump, and the play water port of water pump is connected with water supply export (130), the inner chamber joint of water tank (100) has assembly sheet metal component (200), the inner chamber diapire spiro union of assembly sheet metal component (200) has jet pump (210), the inner chamber diapire spiro union of assembly sheet metal component (200) has heat radiation module (300), heat radiation module (300) include fin radiator (310), the air outlet of jet pump (210) and the outer wall contact of fin radiator (310), the diapire of fin radiator (310) and the inner chamber diapire contact of assembly sheet metal component (200), the roof fixed mounting of fin radiator (310) has water-cooling base plate (320), the inner chamber of water-cooling base plate (320) is provided with rivers passageway (321), the equal joint in both ends inner chamber of rivers passageway (321) has the pagoda interface, water supply entry (120) and water supply export (130) are respectively through pipeline and pagoda interface connection, the roof inner chamber of water-cooling base plate (320) is provided with semiconductor cooler (330), the roof spiro union of water-cooling base plate (320) has heat conduction panel (340), the cold and hot terminal surface of semiconductor cooler (330) contacts with the outer wall of heat conduction panel (340) and water-cooling base plate (329) respectively, laser instrument module (400) is installed to the roof of heat dissipation module (300), the outer wall spiro union of laser instrument module (400) has M6 roof screw (410), the spiro union of the one end of M6 screw (410) and fin radiator (310).

2. A semiconductor laser heat sink according to claim 1, wherein: the inner cavity of the water injection port (110) is provided with a filter screen.

3. A semiconductor laser heat sink according to claim 1, wherein: the front wall of the water tank (100) is provided with a water level gauge (140).

4. A semiconductor laser heat sink according to claim 1, wherein: the outer wall of the heat conduction panel (340) is coated with one of heat conduction silicone grease or heat conduction silica gel layer and the like.

5. A semiconductor laser heat sink according to claim 1, wherein: the bottom wall of the heat conducting panel (340) is provided with an NTC temperature sensor.