CN220271782U - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- CN220271782U CN220271782U CN202322250379.9U CN202322250379U CN220271782U CN 220271782 U CN220271782 U CN 220271782U CN 202322250379 U CN202322250379 U CN 202322250379U CN 220271782 U CN220271782 U CN 220271782U
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- temperature control
- circuit board
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- control device
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- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims description 45
- 239000004065 semiconductor Substances 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 21
- 238000009413 insulation Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 11
- 239000003153 chemical reaction reagent Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000523 sample Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of temperature control equipment, and provides a temperature control device which comprises an adapter and a temperature control component arranged at the bottom of the adapter, wherein the temperature control component is used for refrigerating or heating the adapter, and a control component is also integrated with the temperature control device and is electrically connected to the temperature control component so as to control the temperature control component to refrigerate or heat the adapter. According to the temperature control device, the control component for controlling the temperature control assembly is integrated, so that the temperature control device can be put into use without wiring operation on relevant electric elements of the temperature control assembly in actual use, and convenience of the temperature control device in actual use is effectively improved.
Description
Technical Field
The utility model relates to the technical field of temperature control equipment, in particular to a temperature control device.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
The existing pipetting workstations with temperature requirements for preserving samples or reagents are usually provided with temperature control devices, and the samples or the reagents can be preserved through the temperature control devices and the preserving temperature can be reasonably controlled.
In the related art, a known chinese patent application No. 2022217992396, for example, discloses a device for realizing constant temperature control of a multi-tube biochemical sample, which is based on a semiconductor refrigeration technology, and uses a semiconductor refrigeration sheet to realize refrigeration or heating of an adapter for storing a sample or a reagent, thereby realizing storage of the sample or the reagent and reasonably controlling a storage temperature.
However, since the relevant electric components of the device need to be controlled by an external control component, the device needs to be electrically connected with the external control component by wires when in actual use, so that the device has poor convenience.
Disclosure of Invention
Therefore, an object of the present utility model is to provide a temperature control device, which is capable of controlling a temperature control assembly to cool or heat an adapter by integrating a control component, and which does not need to perform a wiring operation on the relevant electrical components of the temperature control assembly during actual use, thereby being beneficial to improving the convenience of the temperature control device during actual use.
The aim of the utility model is achieved by the following technical scheme:
the temperature control device comprises an adapter and a temperature control assembly arranged at the bottom of the adapter, wherein the temperature control assembly is used for refrigerating or heating the adapter;
the temperature control device is also integrated with a control component, and the control component is electrically connected to the temperature control component so as to control the temperature control component to refrigerate or heat the adapter.
In some possible embodiments, the temperature control device further integrates a display component electrically connected to the control component to display the temperature of the adapter when the temperature control assembly is cooling or heating via the display component.
In some possible embodiments, the temperature control device further comprises a base, the temperature control component is fixedly arranged above the base, and a gap is arranged between the temperature control component and the base;
the control part is a control circuit board, and the display part and the control circuit board are both arranged in the gap.
In some possible embodiments, the adapter includes a bottom plate and a hollow column disposed on a top surface of the bottom plate, the bottom surface of the bottom plate is provided with a groove, and the groove penetrates through the bottom plate along a length or width direction of the bottom plate;
the temperature control assembly comprises a cold plate, a semiconductor refrigerating sheet, a radiator and a first cooling fan, wherein the cold plate, the semiconductor refrigerating sheet and the radiator are sequentially arranged on the bottom surface of the bottom plate from top to bottom, the top surface of the cold plate is in contact fit with the bottom surface of the bottom plate, the refrigerating surface of the semiconductor refrigerating sheet is in contact fit with the bottom surface of the cold plate, the heating surface of the semiconductor refrigerating sheet is in contact fit with the radiator, and the first cooling fan is arranged at the side of the radiator to radiate the radiator;
the semiconductor refrigerating sheet, the radiator and the first cooling fan are all electrically connected with the control circuit board.
In some possible embodiments, the temperature control assembly further comprises a temperature detection component, a heat-insulating waterproof pad, and a limit frame;
the temperature detection component is used for detecting the temperature of the cold plate and is electrically connected with the control circuit board;
the heat-insulating waterproof pad is arranged between the cold plate and the radiator, and the semiconductor refrigerating sheet is embedded on the heat-insulating waterproof pad;
the limiting frame surrounds the cold plate and the heat-insulating waterproof pad, and the limiting frame is provided with a placement groove matched with the bottom plate.
In some possible embodiments, the temperature control device further comprises a protective shell, wherein the protective shell is arranged on the base and is provided with a mounting cavity, and the temperature control assembly, the control circuit board and the display component are all positioned in the mounting cavity;
one of the lateral walls of the protective housing is provided with a wiring cavity which is sunken towards the mounting cavity, a plug of the control circuit board penetrates through the protective housing and is positioned in the wiring cavity, and a notch which is aligned with the display part is further formed in the protective housing.
In some possible embodiments, two opposite sides of the protective housing are respectively provided with an air inlet and an air outlet which are communicated with the installation cavity, and the first cooling fan is opposite to the air inlet or the air outlet.
In some possible embodiments, a second heat dissipation fan is further disposed in the mounting cavity, the second heat dissipation fan being disposed beside the control circuit board to dissipate heat of the control circuit board, and the second heat dissipation fan being electrically connected to the control circuit board.
In some possible embodiments, a heat conducting plate is further arranged on the base, and the MOS tube at the bottom of the control circuit board is in contact with the heat conducting plate.
In some possible embodiments, a thermal insulation board is further disposed between the control circuit board and the temperature control assembly.
The technical scheme of the embodiment of the utility model has at least the following advantages and beneficial effects:
according to the temperature control device, the control component for controlling the temperature control assembly is integrated, so that the temperature control device can be put into use without wiring operation on relevant electric elements of the temperature control assembly in actual use, and convenience of the temperature control device in actual use is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a temperature control device according to an embodiment of the present utility model;
FIG. 2 is a schematic view of the temperature control device of FIG. 1 with the protective housing removed;
FIG. 3 is a schematic view of the temperature control device shown in FIG. 2 from another perspective;
FIG. 4 is a schematic view of a partial cross-sectional structure of an adapter and a temperature control assembly according to an embodiment of the present utility model;
FIG. 5 is an exploded view of the adapter and temperature control assembly shown in FIG. 4;
FIG. 6 is a schematic diagram of an adapter according to an embodiment of the present utility model;
fig. 7 is a schematic structural diagram of a cold plate according to an embodiment of the present utility model;
fig. 8 is a schematic structural diagram of a base and a protective case according to an embodiment of the present utility model;
FIG. 9 is an electrical schematic block diagram of a temperature control device provided by an embodiment of the present utility model.
Icon: the heat-insulating and temperature-controlling device comprises a 10-adapter, a 11-base plate, a 12-hollow cylinder, a 13-groove, a 20-temperature-controlling component, a 21-cold plate, a 211-mounting groove, a 22-semiconductor refrigerating sheet, a 23-radiator, a 24-first cooling fan, a 25-temperature detecting component, a 26-heat-insulating waterproof pad, a 27-limiting frame, a 28-second cooling fan, a 30-control circuit board, a 40-display component, a 50-base, a 51-mounting bracket, a 52-fan bracket, a 60-heat-insulating plate, a 70-heat-conducting plate, a 80-protective shell, a 81-mounting cavity, a 82-notch, a 83-air inlet, a 84-air outlet, a 85-wiring cavity and a 90-alarm component.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described in connection with the following detailed description.
The inventors of the present utility model have found that a temperature control device such as mentioned in the background art does not have an integrated control part, so that a wiring operation is required in practical use of the temperature control device, that is, the related electrical element is electrically connected with an external control part by a wire, thereby making the temperature control device less convenient.
For this reason, referring to fig. 1 to 9, the embodiment of the present utility model provides a temperature control device, which can be directly put into use by integrating control components, and no additional wiring operation is required, so as to at least overcome the problem of poor convenience of the above-mentioned known temperature control device.
Specifically, the temperature control device includes an adapter 10, a temperature control assembly 20, and a control component. The temperature control assembly 20 is disposed at the bottom of the adapter 10, the temperature control assembly 20 is used for refrigerating or heating the adapter 10, and the temperature of the adapter 10 can be adjusted by refrigerating or heating the temperature control assembly 20, so as to adjust the preservation temperature of the sample or the reagent stored on the adapter 10.
Meanwhile, a control part is integrated on the temperature control device, and the control part is electrically connected to the temperature control assembly 20 to control cooling or heating of the adapter 10 by the temperature control assembly 20 through the control part. That is, the control part can control the temperature control assembly 20 to work, so that the temperature control assembly 20 can cool or heat the adapter 10, and further, the temperature of the adapter 10 can be automatically adjusted when the adapter 10 is cooled or heated.
It is to be understood that the control components used to control the temperature control assembly 20 may be, but are not limited to, a known controller or control circuit board 30, and that changes in the type of control components do not affect the implementation of embodiments of the present utility model.
Therefore, the temperature control device provided by the embodiment of the utility model can be put into use without wiring operation on the relevant electrical elements of the temperature control assembly when in actual use by integrating the control component for controlling the temperature control assembly 20, so that the convenience of the temperature control device in actual application is effectively improved.
On this basis, considering that the above-mentioned known temperature control device has no integrated control component, in actual use, related personnel cannot directly obtain temperature information when the adapter 10 is cooled or heated from the temperature control device, and accurately and intuitively obtain temperature information when the adapter 10 is cooled or heated, so that the related personnel can conveniently judge whether the current temperature meets the preservation requirement of related samples or reagents in time.
Based on this, in other embodiments of the present utility model, the temperature control device is further integrated with a display component 40, where the display component 40 is also electrically connected to the control component, so that the temperature of the temperature control component 20 when cooling or heating the adapter 10 is displayed by the display component 40, so that it is convenient for related personnel to directly obtain temperature information when cooling or heating the adapter 10 through the display component 40, and can timely respond when an abnormal temperature situation occurs. For example, a display screen or a nixie tube may be used as the display means 40 to display the temperature at which the adapter 10 is cooled or heated.
Of course, in addition to the display unit 40, an alarm unit 90 electrically connected to the control unit may be added, so that when an abnormality occurs in the temperature of the adapter 10 during cooling or heating, the control unit can control the alarm unit 90 to send out early warning information, thereby being more beneficial to the relevant personnel to find the abnormality in time and respond. It should be noted that, the warning information sent by the alarm component 90 may be sound and/or light, for example, the alarm component 90 may be a buzzer and/or an indicator light.
Next, in order to optimize the structure of the entire temperature control device so that the structure of the temperature control device is more compact, in other embodiments of the present utility model, the temperature control device further includes a base 50, as shown in fig. 2 or 3, and the temperature control assembly 20 is fixedly disposed above the base 50, specifically, the fixing of the temperature control assembly 20 may be implemented by disposing a mounting bracket 51 on the base 50 and fixing the temperature control assembly 20 on the mounting bracket 51.
Meanwhile, a gap is formed between the fixed temperature control assembly 20 and the base 50, and the control component is a control circuit board 30, and compared with a common controller, the control circuit board 30 has a smaller volume, and at this time, the display component 40 and the control circuit board 30 are both disposed in the gap. With this design, the entire temperature control device is advantageously more compact, and the wires are advantageously used to electrically connect the relevant electrical components in the temperature control assembly 20 to the control circuit board 30.
On the other hand, in consideration that the temperature control assembly 20 generates heat during operation and the control circuit board 30 generates heat, in order to avoid the influence of the heat generated during operation of the temperature control assembly 20 or the heat generated by the control circuit board 30 on the operation performance of the control circuit board 30, the temperature control device may further include a heat insulation board 60 and a heat conduction board 70.
As shown in fig. 2, the heat insulation plate 60 is fixedly disposed between the control circuit board 30 and the temperature control assembly 20, so that heat generated when the temperature control assembly 20 operates is prevented from being transferred to the control circuit board 30 and the display part 40 by the heat insulation plate 60. As shown in fig. 3, the heat conducting plate 70 may be disposed on the base 50, and after the control circuit board 30 is installed, the MOS tube at the bottom of the control circuit board 30 contacts with the heat conducting plate 70, so as to absorb and transfer heat generated during operation of the MOS tube of the control circuit board 30 through the heat conducting plate 70.
In order to implement cooling or heating of the adaptor 10 by using the temperature control assembly 20, and referring to fig. 3 and 4 to 6, the temperature control assembly 20 includes a cold plate 21, a semiconductor cooling plate 22, a heat sink 23, and a first heat dissipation fan 24, the adaptor 10 includes a bottom plate 11 and a hollow column 12 disposed on the top surface of the bottom plate 11, the hollow columns 12 disposed on the top surface of the bottom plate 11 may be distributed in a plurality of rectangular arrays, and the hollow columns 12 are used for accommodating corresponding samples, reagents, well plates for storing the samples or reagents, and the like.
As shown in fig. 4 or fig. 5, the cold plate 21, the semiconductor cooling plate 22 and the radiator 23 are sequentially disposed on the bottom surface of the bottom plate 11 from top to bottom, specifically, the top surface of the cold plate 21 is in contact with the bottom surface of the bottom plate 11, the cooling surface of the semiconductor cooling plate 22 is in contact with the bottom surface of the cold plate 21, and the heating surface of the semiconductor cooling plate 22 is in contact with the radiator 23. As shown in fig. 3, the radiator 24 is fixedly mounted on the mounting bracket 51, the first radiator fan 24 is disposed beside the radiator 23 to radiate heat from the radiator 23, for example, a fan bracket 52 may be disposed on the base 50 at a position beside the radiator 23, and the first radiator fan 24 is fixed on the fan bracket 52 to fix the first radiator fan 24, and the number of the first radiator fans 24 is not limited herein. As shown in fig. 9, the semiconductor refrigeration sheet 22, the radiator 23, and the first radiator fan 24 are electrically connected to the control circuit board 30.
In actual use of the temperature control device, cooling and heating the adapter 10 can be divided into a cooling stage and a heating stage. In the cooling stage, the control circuit board 30 controls the semiconductor cooling fin 22 to work so as to cool the adapter 10 through the cooling plate 21, and as the heating surface of the semiconductor cooling fin 22 continuously transfers heat to the radiator 23 during cooling, the control circuit board 30 controls the radiator 23 and the first cooling fan 24 to continuously work in the whole cooling stage so as to continuously dissipate heat of the heating surface of the semiconductor cooling fin 22 and improve the cooling effect; conversely, during the heating phase, the control circuit board 30 controls the operation of the semiconductor cooling fin 22 to heat the adapter 10 through the cold plate 21.
On this basis, considering that all areas of the cold plate 21 and the bottom plate 11 of the adapter 10 are completely contacted in the known temperature control device, condensed water is generated at the contact surface of the cold plate 21 and the bottom plate 11 in the refrigerating stage, and the condensed water causes a vacuum state between the cold plate 21 and the bottom plate 11, so that the bottom plate 11 is difficult to separate from the cold plate 21 in the later stage. For this reason, the inventors of the present utility model found that the problem of the vacuum state occurring between the cold plate 21 and the bottom plate 11 in the refrigerating stage can be solved by providing the groove 13 in the bottom surface of the bottom plate 11.
Specifically, as shown in fig. 6, the grooves 13 penetrate the bottom plate 11 along the length or width direction of the bottom plate 11, that is, the grooves 13 are straight through grooves formed on the bottom surface of the bottom plate 11, and the number of the grooves 13 is not limited herein, for example, two grooves 13 may be formed on the bottom surface of the bottom plate 11, and the two grooves 13 are disposed in a crisscross arrangement. Based on this setting, when the cold plate 21 produces the comdenstion water with the contact surface of bottom plate 11 during the refrigeration stage, the comdenstion water can be led outside the contact surface of cold plate 21 and bottom plate 11 through recess 13 to prevent that the comdenstion water from causing the vacuum condition to appear between cold plate 21 and the bottom plate 11, and set up recess 13 and can effectively reduce the weight of bottom plate 11 and even adapter 10, can also reduce the energy that adapter 10 needs to consume when refrigerating or heating simultaneously, improve the warm rate of rising and falling, and improve the temperature at bottom plate 11 edge to a certain extent, improve temperature homogeneity.
Meanwhile, in order to achieve closed-loop control of the temperature during cooling or heating of the adapter 10 and further improve the operation performance of the temperature control assembly 20, in other embodiments of the present utility model, the temperature control assembly 20 may further include a temperature detecting component 25, a heat insulation waterproof pad 26, and a limiting frame 27.
As shown in fig. 9, the temperature detecting unit 25 is configured to detect the temperature of the cold plate 21, the temperature detecting unit 25 is electrically connected to the control circuit board 30, the temperature detecting unit 25 is configured to indirectly obtain the temperature of the adapter 10 when cooling or heating the adapter by detecting the temperature of the cold plate 21, and the temperature detecting unit 25 is configured to send the detected temperature information to the control circuit board 30, so that the control circuit board 30 controls the semiconductor cooling sheet 22 to operate according to the temperature information sent by the temperature detecting unit 25, thereby realizing adjustment of the temperature of the adapter 10 when cooling or heating the adapter.
It is to be understood that the temperature detecting member 25 may be, but is not limited to, a temperature probe, and as shown in fig. 7, the temperature probe may be fixed on the cold plate 21 by a heat conductive silicone by forming a corresponding mounting groove 211 on the cold plate 21.
As shown in fig. 4 or fig. 5, the heat-insulating waterproof pad 26 is disposed between the cold plate 21 and the radiator 23, and at this time, the semiconductor cooling fins 22 are embedded on the heat-insulating waterproof pad 26, so that the influence of condensed water on the semiconductor cooling fins 22 can be effectively reduced by the heat-insulating waterproof pad 26, thereby improving the reliability of the semiconductor cooling fins 22 during operation.
With continued reference to fig. 4 or 5, the limiting frame 27 is disposed around the cold plate 21 and the heat-insulating waterproof pad 26, and the limiting frame 27 is provided with a mounting groove adapted to the bottom plate 11, so that the outer edges of the cold plate 21 and the heat-insulating waterproof pad 26 can be surrounded by the limiting frame 27, thereby reducing the loss of temperature of the cold plate 21, providing a suitable mounting position for the adapter 10, and facilitating the replacement of the adapter 10 with different numbers or different shapes of hollow columns 12.
On the other hand, in order to protect the components related to the temperature control assembly 20, the control circuit board 30, and the display component 40, and improve the aesthetic property of the temperature control device, in other embodiments of the present utility model, as shown in fig. 1 and 8, the temperature control device may further include a protective housing 80, where the protective housing 80 is disposed on the base 50 and is provided with a mounting cavity 81, for example, the protective housing 80 may be a rectangular hollow housing disposed on the base 50, where the temperature control assembly 20, the control circuit board 30, and the display component 40 are all located in the mounting cavity 81, and a notch 82 aligned with the display component 40 may be formed on a side wall of the protective housing 80 so as to expose a panel for displaying temperature information on the display component 40 through the notch 82.
At this time, in order to utilize the radiator 23 and the first radiator fan 24 to radiate heat, with continued reference to fig. 8, two opposite sides of the protective housing 80 are respectively provided with an air inlet 83 and an air outlet 84 which are communicated with the installation cavity 81, and the first radiator fan 24 is opposite to the air inlet 83 or the air outlet 84, that is, the first radiator fan 24 may be disposed close to the air inlet 83 or may be disposed close to the air outlet 84, during radiating, external air is pumped into the installation cavity 81 by the first radiator fan 24, and heat on the air-borne radiator 23 entering the installation cavity 81 flows out from the air outlet 84, and meanwhile, filter components such as filter screens may be additionally arranged at the air inlet 83 and the air outlet 84 to avoid foreign matters in the external air from entering the installation cavity 81 as much as possible.
On this basis, considering that there is often a plug as an interface on the control circuit board 30, in order to avoid the safety problem that the condensed water generated by the temperature control component 20 above the refrigerating stage flows to the plug of the control circuit board 30 to cause short circuit and the like, with continued reference to fig. 8, a wiring cavity 85 recessed toward the mounting cavity 81 may be provided on one of the side walls of the protective case 80, and as shown in fig. 1, the plug of the control circuit board 30 passes through the protective case 80 and is located in the wiring cavity 85, and the provision of the wiring cavity 85 can not only avoid the condensed water flowing to the plug of the control circuit board 30, but also realize hiding the plug of the control circuit board 30, and avoid the plug protruding outside the protective case 80 to affect the volume and the aesthetic property of the whole temperature control device.
Meanwhile, in order to further enhance the heat dissipation effect on the control circuit board 30, as shown in fig. 3, the temperature control assembly 20 may further include a second heat dissipation fan 28 disposed in the mounting cavity 81, and the second heat dissipation fan 28 is disposed beside the control circuit board 30 to dissipate heat of the control circuit board 30, for example, the second heat dissipation fan 28 may be fixedly mounted on the fan bracket 52 mounted with the first heat dissipation fan 24, and the second heat dissipation fan 28 is electrically connected to the control circuit board 30, so that the control circuit board 30 can directly control the second heat dissipation fan 28 to work to dissipate heat.
Specifically, the temperature of the control circuit board 30 may be detected by the temperature measuring element of the control circuit board 30, and when the temperature measuring element of the control circuit board 30 detects that the temperature of the control circuit board 30 is too high, the control circuit board 30 may directly control the second cooling fan 28 to work so as to cool the control circuit board 30.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. A temperature control device, which comprises an adapter and a temperature control component arranged at the bottom of the adapter, wherein the temperature control component is used for refrigerating or heating the adapter,
the temperature control device is also integrated with a control component, and the control component is electrically connected to the temperature control component so as to control the temperature control component to refrigerate or heat the adapter.
2. The temperature control device of claim 1, further integrated with a display component electrically connected to the control component to display the temperature of the temperature control assembly when cooling or heating the adapter via the display component.
3. The temperature control device of claim 2, further comprising a base, wherein the temperature control assembly is fixedly disposed above the base, and a gap is provided between the temperature control assembly and the base;
the control part is a control circuit board, and the display part and the control circuit board are both arranged in the gap.
4. The temperature control device according to claim 3, wherein the adapter comprises a bottom plate and a hollow cylinder arranged on the top surface of the bottom plate, the bottom surface of the bottom plate is provided with a groove, and the groove penetrates through the bottom plate along the length or width direction of the bottom plate;
the temperature control assembly comprises a cold plate, a semiconductor refrigerating sheet, a radiator and a first cooling fan, wherein the cold plate, the semiconductor refrigerating sheet and the radiator are sequentially arranged on the bottom surface of the bottom plate from top to bottom, the top surface of the cold plate is in contact fit with the bottom surface of the bottom plate, the refrigerating surface of the semiconductor refrigerating sheet is in contact fit with the bottom surface of the cold plate, the heating surface of the semiconductor refrigerating sheet is in contact fit with the radiator, and the first cooling fan is arranged at the side of the radiator to radiate the radiator;
the semiconductor refrigerating sheet, the radiator and the first cooling fan are all electrically connected with the control circuit board.
5. The temperature control device of claim 4, wherein the temperature control assembly further comprises a temperature detection component, a thermal insulation waterproof pad, and a limit frame;
the temperature detection component is used for detecting the temperature of the cold plate and is electrically connected with the control circuit board;
the heat-insulating waterproof pad is arranged between the cold plate and the radiator, and the semiconductor refrigerating sheet is embedded on the heat-insulating waterproof pad;
the limiting frame surrounds the cold plate and the heat-insulating waterproof pad, and the limiting frame is provided with a placement groove matched with the bottom plate.
6. The temperature control device of claim 4, further comprising a protective housing disposed on the base and having a mounting cavity, the temperature control assembly, the control circuit board, and the display component being located within the mounting cavity;
one of the lateral walls of the protective housing is provided with a wiring cavity which is sunken towards the mounting cavity, a plug of the control circuit board penetrates through the protective housing and is positioned in the wiring cavity, and a notch which is aligned with the display part is further formed in the protective housing.
7. The temperature control device of claim 6, wherein the two opposite sides of the protective housing are respectively provided with an air inlet and an air outlet which are communicated with the mounting cavity, and the first cooling fan is opposite to the air inlet or the air outlet.
8. The temperature control device of claim 6, wherein a second cooling fan is further disposed in the mounting cavity, the second cooling fan being disposed beside the control circuit board to cool the control circuit board, the second cooling fan being electrically connected to the control circuit board.
9. The temperature control device according to claim 3, wherein the base is further provided with a heat conducting plate, and the MOS tube at the bottom of the control circuit board is in contact with the heat conducting plate.
10. The temperature control device of claim 3, wherein a thermal shield is further disposed between the control circuit board and the temperature control assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322250379.9U CN220271782U (en) | 2023-08-21 | 2023-08-21 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322250379.9U CN220271782U (en) | 2023-08-21 | 2023-08-21 | Temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220271782U true CN220271782U (en) | 2023-12-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322250379.9U Active CN220271782U (en) | 2023-08-21 | 2023-08-21 | Temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220271782U (en) |
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2023
- 2023-08-21 CN CN202322250379.9U patent/CN220271782U/en active Active
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