CN221262309U

CN221262309U - Die bonder

Info

Publication number: CN221262309U
Application number: CN202322923067.XU
Authority: CN
Inventors: 黄雪琴; 刘志勇; 申翠娥
Original assignee: Zhongke Haoye Dongguan Material Technology Co ltd
Current assignee: Zhongke Haoye Dongguan Material Technology Co ltd
Priority date: 2023-10-31
Filing date: 2023-10-31
Publication date: 2024-07-02
Anticipated expiration: 2033-10-31

Abstract

The utility model relates to a die bonder, which comprises a frame, a feeding mechanism, a discharging mechanism and a material taking mechanism, wherein the feeding mechanism is arranged on the frame; the feeding mechanism, the discharging mechanism and the material taking mechanism are arranged on the frame, the feeding mechanism comprises a first movable slide rail and a vibration disc arranged on the first movable slide rail, and the vibration disc is provided with a material outlet channel; the discharging mechanism is arranged on the frame and comprises a second movable slide rail and a bracket table arranged on the second movable slide rail; the material taking mechanism is arranged on the frame and comprises a mechanical arm and a crystal pick-up device, the crystal pick-up device is arranged on the mechanical arm, and the material taking mechanism moves the crystal fixing material on the discharging channel to the support table for arrangement; the step of arranging the solid crystal materials is reduced through the vibration disc, continuous feeding without stopping is realized, and the production efficiency is improved.

Description

Die bonder

Technical Field

The utility model particularly relates to a die bonder.

Background

The existing die bonder generally adopts the following die bonder process, firstly, materials needing die bonding are arranged on a film in order in a cutting or splitting mode, then a blue film is unfolded and fixed through a die expanding ring, and then an unfolded wafer and the die expanding ring are placed at a designated position of the die bonder together and fixed, and die bonding can be started after programming. But is limited by the size of the expander ring, typically 6 inches or 8 inches, which is more suitable for small size materials. If large-size materials need to be processed, only a small amount of materials can be placed due to the limitation of the size of the crystal expansion ring, and frequent shutdown is needed to replace the crystal expansion ring, so that the efficiency of the crystal fixing operation is low.

Disclosure of utility model

The utility model aims to at least solve one of the technical problems in the prior art, and provides a die bonder, which reduces the steps of arranging die bonding materials through a vibration disc, realizes continuous feeding without stopping, and improves the production efficiency.

The embodiment of the utility model provides a die bonder, which comprises the following steps:

A frame;

The feeding mechanism is arranged on the frame and comprises a first movable slide rail and a vibration disc for loading a die-bonding material, the vibration disc is arranged on the first movable slide rail and is provided with a discharging channel;

the discharging mechanism is arranged on the rack and comprises a second movable slide rail and a support table, and the support table is arranged on the second movable slide rail;

The material taking mechanism is arranged on the frame and comprises a mechanical arm and a crystal pick-up device, the crystal pick-up device is arranged on the mechanical arm, and the material taking mechanism is used for moving the crystal fixing materials on the discharging channel to the support table for arrangement.

According to some embodiments of the utility model, a first camera is arranged above the feeding mechanism, and the first camera is used for shooting an image of the feeding mechanism to determine the position of the die bonding material on the discharging channel.

According to some embodiments of the utility model, a second camera is arranged above the discharging mechanism, and the second camera is used for shooting images of the discharging mechanism to determine the position of the support table.

According to some embodiments of the utility model, the mechanical arm comprises a first driver and a swing arm, an output shaft of the first driver being connected to the swing arm.

According to some embodiments of the utility model, the die pick-up is a pneumatic suction nozzle.

According to certain embodiments of the present utility model, the first moving track comprises a first transverse electric track and a first longitudinal electric track, the first transverse electric track being disposed on the first longitudinal electric track, the vibration plate being disposed on the first transverse electric track.

According to certain embodiments of the present utility model, the second moving rail includes a second lateral electric rail and a second longitudinal electric rail, the second lateral electric rail being disposed on the second longitudinal electric rail, the rack stand being disposed on the second lateral electric rail.

According to some embodiments of the utility model, the vibration plate comprises an electromagnet, a spring piece, a movable frame and a material plate, wherein the spring piece is connected with the movable frame, and the movable frame is connected with the material plate; the electromagnet is arranged on one side of the movable frame, which is close to the spring piece.

According to some embodiments of the utility model, the end of the tapping channel is provided with a blocking piece.

According to some embodiments of the utility model, the housing is provided with a display screen.

The beneficial effects of the utility model include: pouring the die-bonding material into a vibration disc, arranging and feeding the die-bonding material in a vibration way by the vibration disc, arranging the die-bonding material on a discharging channel, picking up the die-bonding material on the discharging channel by a die pick-up device of a material taking mechanism, moving the die pick-up device and the die-bonding material on the die pick-up device to the upper part of a support table by a mechanical arm, and putting down the die-bonding material on the support table by the die pick-up device; the steps of arranging the die bonding materials and applying the films are reduced through the vibration disc, the die bonding materials are automatically arranged on the discharging channel, continuous feeding without stopping is realized, and the production efficiency is improved.

Further, additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

FIG. 1 is a schematic diagram of a prior art die bonder with a die paddle;

FIG. 2 is a block diagram of a die bonder according to an embodiment of the application;

fig. 3 is a top view of a die bonder according to an embodiment of the application.

Description of the embodiments

The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, aspects, and effects of the present utility model. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly or indirectly fixed or connected to the other feature. Further, the descriptions of the upper, lower, left, right, top, bottom, etc. used in the present utility model are merely with respect to the mutual positional relationship of the respective constituent elements of the present utility model in the drawings.

Furthermore, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any combination of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element of the same type from another. For example, a first element could also be termed a second element, and, similarly, a second element could also be termed a first element, without departing from the scope of the present disclosure.

Referring to fig. 1, the conventional die bonder generally adopts the following die bonding process, in which materials to be die bonded are firstly arranged on a film 20 in order by cutting or splitting, then the film 20 is stretched and fixed by a die-expanding ring 10, and then the stretched wafer and the die-expanding ring 10 are placed together at a designated position of the die bonder and fixed, and the die bonding can be started after programming. But is limited in size by the expander ring 10, typically 6 inches or 8 inches, which is preferred for small size materials. If large-size materials need to be processed, only a small amount of materials can be placed due to the size limitation of the die-bonding ring 10, and frequent shutdown is needed to replace the die-bonding ring, so that the die-bonding operation efficiency is low.

In order to solve the above problems, an embodiment of the present application provides a die bonder.

Referring to fig. 2 and 3, the die bonder includes: the feeding mechanism comprises a frame 100, a feeding mechanism 200, a discharging mechanism 400 and a material taking mechanism 300.

The feeding mechanism 200 is disposed on the frame 100, the feeding mechanism 200 includes a first moving slide rail 220 and a vibration plate 210 for loading a die-bonding material, the vibration plate 210 is disposed on the first moving slide rail 220, and the vibration plate 210 is provided with a discharge channel 211; the discharging mechanism 400 is arranged on the frame 100, and comprises a second movable slide rail 420 and a bracket table 410, wherein the bracket table 410 is arranged on the second movable slide rail 420; the material taking mechanism 300 is disposed on the frame 100, the material taking mechanism 300 includes a mechanical arm and a crystal pick-up device, the crystal pick-up device is disposed on the mechanical arm, and the material taking mechanism 300 is used for moving the crystal fixing material on the material discharging channel 211 to the support table 410 for arrangement.

In this embodiment, a vibration plate 210 is used to replace a die-expanding ring, the die-bonding material is poured into the vibration plate 210, the vibration plate 210 performs vibration arrangement feeding on the die-bonding material, the die-bonding material is arranged on the discharging channel 211, the die-bonding material on the discharging channel 211 is picked up by a die pick-up device of the material taking mechanism 300, the die pick-up device and the die-bonding material on the die pick-up device are moved to the upper part of the support table 410 by a mechanical arm, and the die pick-up device drops the die-bonding material onto the support table 410; the step of arranging the die bonding material is reduced by the vibration plate 210, the die bonding material is automatically arranged on the discharging channel 211, continuous feeding without stopping is realized, and the production efficiency is improved.

The vibrating tray 210 is moved by the first moving slide rail 220, so that the tail end of the discharging channel 211 of the vibrating tray 210 is positioned below the crystal pick-up device, and the crystal pick-up device can accurately pick up the crystal fixing material on the discharging channel 211.

The carrier 410 is moved by the second moving rail 420, so that the take-out mechanism 300 can place a plurality of die-bonding materials at various positions of the carrier 410 to arrange the die-bonding materials on the carrier 410.

In some embodiments, a first camera 510 is disposed above the feeding mechanism 200, and the first camera 510 is used to capture an image of the feeding mechanism 200 to determine the position of the die-bonding material on the discharging channel 211.

The first camera 510 shoots an image of the feeding mechanism 200, and the image recognition module performs image recognition processing on the image of the feeding mechanism 200 shot by the first camera 510 by using an image recognition algorithm, so as to recognize the position of the die bonding material at the tail end of the discharging channel 211.

After recognizing the position of the die bonding material at the end of the discharging channel 211, the processor controls the first moving slide rail 220 to move according to the position of the die bonding material at the end of the discharging channel 211 so as to adjust the position of the vibration disc 210, so that the die pick-up device can accurately pick up the die bonding material at the end of the discharging channel 211.

It is understood that the image recognition module may be a processor disposed inside the die bonder, or may be a server external to the die bonder. When the image recognition module is a processor arranged inside the die bonder, the first camera 510 is connected with the processor, and the first camera 510 transmits the shot image of the feeding mechanism 200 to the processor for processing through an internal circuit. When the image recognition module is an external processor of the die bonder, the second camera 520 transmits the shot image of the feeding mechanism 200 to an external server of the die bonder through a communication network for processing.

In some embodiments, a second camera 520 is disposed above the discharging mechanism, and the second camera 520 is used to capture an image of the discharging mechanism to determine the position of the stand 410.

The second camera 520 shoots an image of the discharging mechanism, and the image recognition module performs image recognition processing on the image of the feeding mechanism 200 shot by the second camera 520 by using an image recognition algorithm, so as to recognize the position of the bracket table 410.

After recognizing the position of the stage 410, the processor controls the second moving rail 420 to move according to the position of the stage 410 to adjust the position of the stage 410, so that the die bonder can accurately place and arrange the die bonder on the stage 410.

In some embodiments, the robotic arm includes a first driver and a swing arm, an output shaft of the first driver being connected to the swing arm. The first driver is a motor, and the swing arm is driven to rotate by the motor, so that the swing arm swings between the feeding mechanism 200 and the discharging mechanism 400.

In some embodiments, the wafer pick-up is a pneumatic suction nozzle connected to an air pump. When the swing arm moves to the upper part of the feeding mechanism 200, the pneumatic suction nozzle sucks up the die-bonding material at the tail end of the discharging channel 211; when the swing arm moves above the discharging mechanism 400, the pneumatic suction nozzle drops the die-bonding material down, so that the die-bonding material falls on the stand 410.

In some embodiments, the first moving rail 220 includes a first lateral power rail 221 and a first longitudinal power rail 222, the first lateral power rail 221 is disposed on the first longitudinal power rail 222, and the vibration plate 210 is disposed on the first lateral power rail 221.

The first transverse electric sliding rail 221 drives the first longitudinal electric sliding rail 222 and the vibration plate 210 on the first longitudinal electric sliding rail 222 to move along the transverse direction, the first longitudinal electric sliding rail 222 drives the vibration plate 210 to move along the longitudinal direction, and the vibration plate 210 can move randomly in the two-dimensional direction through the cooperation of the first transverse electric sliding rail 221 and the first longitudinal electric sliding rail 222.

In some embodiments, the second moving rail 420 includes a second lateral electric rail 421 and a second longitudinal electric rail 422, the second lateral electric rail 421 is disposed on the second longitudinal electric rail 422, and the rack table 410 is disposed on the second lateral electric rail 421.

The second transverse electric sliding rail 421 drives the second longitudinal electric sliding rail 422 and the stand 410 on the second longitudinal electric sliding rail 422 to move along the transverse direction, and the second longitudinal electric sliding rail 422 drives the stand 410 to move along the longitudinal direction, so that the stand 410 can move randomly in the two-dimensional direction through the cooperation of the second transverse electric sliding rail 421 and the second longitudinal electric sliding rail 422.

In some embodiments, the vibratory pan 210 includes an electromagnet, a spring plate, a movable frame, and a pan, the spring plate being coupled to the movable frame, the movable frame being coupled to the pan; the electromagnet is arranged on one side of the movable frame, which is close to the spring piece.

The vibration plate 210 is powered on and off under the action of current by means of a pulse electromagnet under the movable frame, so that the movable frame and the material plate vibrate vertically up and down, the material plate can make torsional pendulum vibration along one direction due to the inclination of a spring piece connected with the material plate, and materials in the material plate can continuously rise forwards along a spiral trough of the material plate due to the vibration, and the materials can continuously adjust the posture and uniformly scatter in the process. The vibration plate 210 can make the disordered die bonding material aligned neatly and correctly.

In some embodiments, the end of the outfeed channel 211 is provided with a stop 212. When the vibration plate 210 vibrates the die-bonding material to the discharging channel 211, the die-bonding material slides along the discharging channel 211; when the die-bonding material slides along the discharging channel 211 to the tail end of the discharging channel 211, the blocking block 212 at the tail end of the discharging channel 211 blocks the die-bonding material, so that the die-bonding material of the discharging channel 211 is prevented from leaving the discharging channel 211.

In some embodiments, the stand 100 is provided with a display screen 600, and the display screen 600 displays operation data of the die bonder, and may also display images captured by the first camera 510 and the second camera 520.

The present utility model is not limited to the above embodiments, but can be modified, equivalent, improved, etc. by the same means to achieve the technical effects of the present utility model without departing from the spirit and principles of the present disclosure. Are intended to fall within the scope of the present utility model. Various modifications and variations are possible in the technical solution and/or in the embodiments within the scope of the utility model.

Claims

1. A die bonder, comprising:

A frame (100);

The feeding mechanism (200) is arranged on the frame (100), the feeding mechanism (200) comprises a first movable slide rail (220) and a vibration disc (210) for loading a die-bonding material, the vibration disc (210) is arranged on the first movable slide rail (220), and a discharging channel (211) is arranged on the vibration disc (210);

The feeding mechanism (400), the feeding mechanism (400) is arranged on the frame (100), the feeding mechanism (400) comprises a second movable slide rail (420) and a support table (410), and the support table (410) is arranged on the second movable slide rail (420);

The material taking mechanism (300), the material taking mechanism (300) set up in on frame (100), material taking mechanism (300) include arm and crystal pick-up, the crystal pick-up set up in on the arm, material taking mechanism (300) are used for removing the solid brilliant material on ejection of compact way (211) to arrange on support platform (410).

2. The die bonder according to claim 1, wherein a first camera (510) is disposed above the feeding mechanism (200), and the first camera (510) is configured to capture an image of the feeding mechanism (200) to determine a position of the die bonding material on the discharge channel (211).

3. The die bonder according to claim 1, wherein a second camera (520) is arranged above the discharging mechanism (400), and the second camera (520) is used for shooting an image of the discharging mechanism (400) to determine the position of the support table (410).

4. The die bonder as claimed in claim 1, wherein the mechanical arm includes a first driver and a swing arm, and wherein an output shaft of the first driver is connected to the swing arm.

5. The die bonder of claim 1, wherein said die pick-up is a pneumatic suction nozzle.

6. The die bonder according to claim 1, wherein the first moving rail (220) includes a first lateral electric rail (221) and a first longitudinal electric rail (222), the first lateral electric rail (221) is disposed on the first longitudinal electric rail (222), and the vibration plate (210) is disposed on the first lateral electric rail (221).

7. The die bonder according to claim 1, wherein the second moving rail (420) includes a second transverse electric rail (421) and a second longitudinal electric rail (422), the second transverse electric rail (421) is disposed on the second longitudinal electric rail (422), and the stand (410) is disposed on the second transverse electric rail (421).

8. The die bonder of claim 1, wherein said vibration plate (210) includes an electromagnet, a spring plate, a movable frame, and a tray, said spring plate being connected to said movable frame, said movable frame being connected to said tray; the electromagnet is arranged on one side of the movable frame, which is close to the spring piece.

9. A die bonder according to claim 1, wherein the end of the discharge channel (211) is provided with a stopper (212).

10. A die bonder according to claim 1, wherein the frame (100) is provided with a display screen (600).