CN221198871U - Multi-chip package crack-resistant stamping test fixture - Google Patents
Multi-chip package crack-resistant stamping test fixture Download PDFInfo
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- CN221198871U CN221198871U CN202323074848.2U CN202323074848U CN221198871U CN 221198871 U CN221198871 U CN 221198871U CN 202323074848 U CN202323074848 U CN 202323074848U CN 221198871 U CN221198871 U CN 221198871U
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- 238000012360 testing method Methods 0.000 title claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 29
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- 230000009471 action Effects 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 238000004080 punching Methods 0.000 claims description 6
- 238000009863 impact test Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims 3
- 238000000034 method Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a multi-chip package crack-resistant stamping test fixture which comprises a base, a chip carrier, a transverse sliding component, a cam driven by a rotating motor, a pressing cone, a positioning platform and an impact block, wherein a universal ball seat is arranged between the base and the chip carrier, the transverse sliding component is arranged on the periphery of the base, the transverse sliding component comprises a transverse transmission motor, a transverse driving belt wheel, a transverse transmission belt, a positioning belt wheel and a movable belt wheel, and a transverse sliding rod, the chip carrier is provided with a plurality of chip positioning grooves, the pressing cone is pressed by the rotating cam in a tangent way, the impact block is arranged at the lower end of the pressing cone, the test fixture drives the chip carrier to move rapidly by utilizing the mutual matching of the transverse sliding rod and the longitudinal sliding rod, the lifting impact action implemented by the rotating cam structure is matched with all chips in the impact block, the chip crack-resistant performance can be tested in a batch mode, the chip yield can be ensured to be detected without omission.
Description
Technical Field
The utility model relates to the technical field of semiconductor production equipment, in particular to a multi-chip packaging crack-resistant stamping test jig.
Background
The performance test procedure that the chip needs to go on before leaving the factory is extremely complicated, and wherein indispensable process just is to the anti punching press after the chip encapsulation, crack resistance test to whether to reach standard in the aspect of checking chip packaging structure intensity, and the test scheme that the tradition adopted is that the partial chip of selective examination carries out punching press test one by one to it, and the chip that batches are less only need carry out all punching press tests, but along with the semiconductor chip yields requirement is higher and higher, every chip needs to carry out anti punching press, crack resistance test, in order to guarantee that the electronic product percent is qualified and leaves the factory. But based on the existing test equipment, the test efficiency is difficult to improve, the automation degree is lower, and the method is difficult to adapt to the unified test requirements of batch and full coverage. Therefore, a jig capable of automatically testing stamping resistance and crack resistance of batch chips is specially designed, so that all chips are guaranteed to be detected without omission, and the chip yield is guaranteed.
Disclosure of utility model
The purpose of the utility model is that: in order to test all stamping resistance and crack resistance of batch chips, but under the condition of low automation degree, test of all chips is performed one by one, and the efficiency is low, the multi-chip packaging crack resistance stamping test fixture is designed, so that all chips are guaranteed to be detected without omission, and the chip yield is guaranteed.
The technical scheme adopted for solving the problems is as follows:
a multi-chip package anti-crack punching test fixture comprises a base, a chip carrier, a transverse and longitudinal sliding component, a cam driven by a rotating motor, a pressing cone, a positioning platform and an impact block,
A universal ball seat is arranged between the base and the chip carrier, a transverse and longitudinal sliding component is arranged on the periphery of the base,
The transverse and longitudinal sliding component comprises a transverse sliding mechanism and a longitudinal sliding mechanism which have the same structural principle,
The transverse sliding mechanism comprises a transverse transmission motor, a transverse driving belt wheel, a transverse transmission belt, a positioning belt wheel, a movable belt wheel and a transverse sliding rod longitudinally penetrating and sleeved with the chip carrier, wherein the main shaft of the transmission motor drives the transverse driving belt wheel to rotate, the transverse driving belt wheel drives the transverse transmission belt to transmit, the two ends of the transverse transmission belt are tangentially matched with the positioning belt wheel, the movable belt wheel is connected with the two ends of the transverse sliding rod, the transmission motor drives the transverse sliding rod to transversely slide left and right, and further drives the chip carrier to transversely slide left and right,
The chip carrier is arranged on the chip carrier, a plurality of chip positioning grooves are arranged on the transverse and longitudinal directions in an array, under the cooperative cooperation of the transverse sliding mechanism and the longitudinal sliding mechanism, the transverse and longitudinal sliding action of the chip carrier is realized, different chip positioning grooves are switched to be opposite to the vertical direction of the impact block,
The positioning platform is connected to the base through the support frame, the through hole is formed in the center of the positioning platform, the through hole is matched with the pressing cone shaft hole in a penetrating mode, a reset spring is arranged between the pressing cone and the positioning platform, the pressing cone is pressed by the rotating cam to achieve lifting action, the lower end of the pressing cone is provided with the impact block, the lower end point of the impact block is arranged to be in an inverted cone shape, and the impact block is opposite to the packaging surface of the chip below to conduct impact test.
Further, the chip positioning groove comprises positioning columns and limiting platforms and is used for limiting four corners of the chip and the placement depth of the chip.
Further, a gas spring is further arranged between the pressing cone and the cam, and the pressing cone is provided with a set pressing force through a set pneumatic pressure, so that the impact force of the impact block to the chip packaging surface is guaranteed to be adjustable.
Further, the universal ball seat comprises a positioning plate and a plurality of balls, the plurality of balls are limited on the base by the positioning plate, and a ball is arranged under the impact block in the vertical direction.
Further, a pad is arranged in the middle of the chip positioning groove and used for supporting the bottom of the chip in an auxiliary mode.
The beneficial effects of the utility model are as follows:
The multi-chip packaging crack-resistant stamping test fixture utilizes the mutual matching of the transverse slide bars and the longitudinal slide bars to drive the chip carrier to move transversely or longitudinally rapidly, and the chip carrier is matched with the lifting impact action implemented by the rotary cam structure on the impact block, so that all chips in all carriers can be rapidly detected, the chip crack-resistant stamping and crack-resistant performance can be automatically tested in batches, all chips are ensured to be detected without omission, and the chip yield is ensured.
Drawings
FIG. 1 is a schematic diagram of a multi-chip package crack-resistant stamping test fixture according to the present embodiment;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a front view of the cam, press cone, positioning platform, impact block, base, chip carrier, and lateral and longitudinal sliding assembly of the present embodiment;
FIG. 4 is a partial enlarged view at B in FIG. 3;
the device comprises a 1-longitudinal transmission motor, a 2-longitudinal slide bar, a 3-transverse transmission belt, a 4-transverse driving belt pulley, a 5-transverse transmission motor, a 6-movable belt pulley, a 7-positioning belt pulley, an 8-chip positioning groove, a 9-pad table, a 10-transverse and longitudinal sliding component, a 11-transverse slide bar, a 12-chip carrier table, a 13-positioning column, a 14-limiting platform, a 15-chip to be tested, a 16-rotating motor, a 17-cam, a 18-gas spring, a 19-shaft shoulder of a pressing cone, a 20-return spring, a 21-positioning platform, a 22-pressing cone, a 23-impact block, a 24-base, a 25-positioning plate and 26-ball.
Detailed Description
The technical solution of the present utility model will be clearly and completely described by way of example with reference to the accompanying drawings.
Referring to fig. 1-4, the embodiment provides a multi-chip package crack-resistant stamping test fixture, which comprises a base 24, a chip carrier 12, a chip carrier, a transverse and longitudinal sliding assembly, a cam 17 driven by a rotating motor 16, a pressing cone 22, a positioning platform 21 and an impact block 23, wherein a universal ball seat is arranged between the base 24 and the chip carrier 12, the periphery of the base 24 is provided with the transverse and longitudinal sliding assembly, and the transverse and longitudinal sliding assembly comprises a transverse sliding mechanism and a longitudinal sliding mechanism with the same structural principle.
Specifically, referring to fig. 1, the transverse sliding mechanism includes a transverse driving motor 5, a transverse driving pulley 4, a transverse driving belt 3, a positioning pulley 7, a movable pulley 6, and a transverse sliding rod 11 longitudinally sleeved and matched with the chip carrier 12, the main shaft of the driving motor drives the transverse driving pulley 4 to rotate, the transverse driving pulley 4 drives the transverse driving belt 3 to drive, the two ends of the transverse driving belt 3 are tangentially matched with the positioning pulley 7, the movable pulley 6 is connected with the two ends of the transverse sliding rod 11, and the driving motor drives the transverse sliding rod 11 to slide transversely leftwards and rightwards, so as to drive the chip carrier 12 to slide transversely leftwards and rightwards.
Referring to fig. 3, the chip carrier is integrally disposed on the chip carrier 12, and 9X9 chip positioning slots 8 are disposed in an array on both lateral and longitudinal directions, and under the synergistic cooperation of the lateral sliding mechanism and the longitudinal sliding mechanism, the lateral and longitudinal sliding motion of the chip carrier 12 is realized, and different chip positioning slots 8 are switched to be opposite to the vertical direction of the impact block 23.
Referring to fig. 3, the positioning platform 21 is connected to the base 24 through a supporting frame (not shown in the drawing), a through hole is formed in the center of the positioning platform, the through hole is in fit with a shaft hole of the pressing cone 22, a return spring 20 is disposed between the pressing cone 22 and the positioning platform 21, the pressing cone 22 is pressed by the rotating cam 17, lifting motion is achieved, an impact block 23 is disposed at the lower end of the pressing cone 22, the lower end point of the impact block 23 is in an inverted cone shape, and the impact block 23 is opposite to the packaging surface of the chip below to implement impact test.
Referring to fig. 2, the chip positioning slot 8 includes positioning posts 13 and a limiting platform 14 for defining four corners of the chip and a placement depth of the chip.
Referring to fig. 3, a gas spring 18 is further disposed between the pressing cone 22 and the cam 17, and a set pressing force is provided for the pressing cone 22 by a set air pressure, so that the impact force of the impact block 23 against the chip packaging surface is ensured to be adjustable.
Referring to fig. 4, the universal ball seat includes a positioning plate 25 and 5 balls 26, the positioning plate 25 limits a plurality of balls 26 on the base 24, and a ball 26 is disposed under the impact block 23 in the vertical direction, so as to ensure that the impact force is completely applied to the chip packaging surface and is not released by buffering.
Referring to fig. 1 and 4, a pad 9 is disposed in the center of the chip positioning slot 8, and is used for supporting the bottom of the chip in a complex manner, so as to ensure that the impact force is applied to the packaging surface of the chip completely, but not released by buffering, and ensure the accuracy of the test.
The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the embodiments described above, and various changes, modifications, substitutions and alterations can be made therein by those having ordinary skill in the art without departing from the spirit of the present utility model, the scope of which is defined by the appended claims and their equivalents.
Claims (5)
1. The utility model provides a multi-chip package crack resistance punching press test fixture which characterized in that: comprises a base, a chip carrier, a transverse sliding component, a longitudinal sliding component, a cam driven by a rotating motor, a pressing cone, a positioning platform and an impact block,
A universal ball seat is arranged between the base and the chip carrier, a transverse and longitudinal sliding component is arranged on the periphery of the base,
The transverse and longitudinal sliding component comprises a transverse sliding mechanism and a longitudinal sliding mechanism which have the same structural principle,
The transverse sliding mechanism comprises a transverse transmission motor, a transverse driving belt wheel, a transverse transmission belt, a positioning belt wheel and a movable belt wheel, and a transverse sliding rod longitudinally sleeved and matched with the chip carrier,
The chip carrier is arranged on the chip carrier table, a plurality of chip positioning grooves are arranged on the transverse and longitudinal directions in an array manner,
The positioning platform is connected to the base through the support frame, the through hole is formed in the center of the positioning platform, the through hole is matched with the pressing cone shaft hole in a penetrating mode, a reset spring is arranged between the pressing cone and the positioning platform, the pressing cone is pressed by the rotating cam to achieve lifting action, the lower end of the pressing cone is provided with the impact block, the lower end point of the impact block is arranged to be in an inverted cone shape, and the impact block is opposite to the packaging surface of the chip below to conduct impact test.
2. The multi-chip package crack-resistant stamping test fixture of claim 1, wherein: the transmission motor main shaft drives the transverse driving belt pulley to rotate, the transverse driving belt pulley drives the transverse driving belt to drive, positioning belt pulleys are tangentially matched at two ends of the transverse driving belt, the movable belt pulley is connected with two ends of the transverse sliding rod, and the transmission motor drives the transverse sliding rod to transversely slide left and right, so that the chip carrier is driven to transversely slide left and right.
3. The multi-chip package crack-resistant stamping test fixture of claim 1, wherein: and a gas spring is further arranged between the pressing cone and the cam, and the pressing cone is provided with a set pressing force through a set pneumatic pressure.
4. The multi-chip package crack-resistant stamping test fixture of claim 1, wherein: the universal ball seat comprises a positioning plate and a plurality of ball beads, the ball beads are limited on the base by the positioning plate, and the ball beads are arranged under the impact block in the vertical direction.
5. The multi-chip package crack-resistant stamping test fixture of claim 1, wherein: the center of the chip positioning groove is provided with a pad table for supporting the bottom of the chip in an auxiliary mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323074848.2U CN221198871U (en) | 2023-11-15 | 2023-11-15 | Multi-chip package crack-resistant stamping test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323074848.2U CN221198871U (en) | 2023-11-15 | 2023-11-15 | Multi-chip package crack-resistant stamping test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221198871U true CN221198871U (en) | 2024-06-21 |
Family
ID=91492130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323074848.2U Active CN221198871U (en) | 2023-11-15 | 2023-11-15 | Multi-chip package crack-resistant stamping test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221198871U (en) |
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2023
- 2023-11-15 CN CN202323074848.2U patent/CN221198871U/en active Active
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