CN214588753U - Semiconductor packaging detection device - Google Patents
Semiconductor packaging detection device Download PDFInfo
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- CN214588753U CN214588753U CN202120217446.5U CN202120217446U CN214588753U CN 214588753 U CN214588753 U CN 214588753U CN 202120217446 U CN202120217446 U CN 202120217446U CN 214588753 U CN214588753 U CN 214588753U
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- detection head
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Abstract
The utility model discloses a semiconductor packaging detection device, including the workstation, the workstation top surface sets up the mounting groove, arranges in the mounting groove and sets up a plurality of pivots, and all sets up a pair of eccentric wheel and belt pulley in each pivot, and adopts the belt to carry out the transmission between the belt pulley and connect, and one of them pivot adopts step motor drive, places the material board on the eccentric wheel, sets up a plurality of recesses that are used for placing the semiconductor on the material board, the recess equidistance sets up; a lifting column is arranged on the top surface of the workbench, an installation plate is arranged on the top of the lifting column, the installation plate extends to the upper part of the material plate, and a detection head is arranged; the material plate moves forwards and upwards under the action of the eccentric wheel and is close to the detection head for the detection of the detection head. The utility model discloses a set up step motor and eccentric wheel, can drive the material board and carry out intermittent type nature motion to it detects to be close to the detection head, thereby the test time of the encapsulation semiconductor on the board is placed in the extension, and the detection head of being convenient for carries out abundant detection to the encapsulation semiconductor.
Description
Technical Field
The utility model relates to a semiconductor processing equipment technical field, concretely relates to semiconductor package detection device.
Background
Semiconductor package is the engineering that will pass through the wafer of test and process according to product model and functional requirement and obtain independent chip, it detects to need the packaging body usually after semiconductor package finishes, packaging ex-warehouse just can be packed through the packaging body that detects, current semiconductor package check out test set can not be nimble when using adjust the packaging body and detect the distance between the head, it detects the packaging body that the detection head can not be fine, the support plate that loads the packaging body can not carry on spacing fixed to the packaging body, the packaging body easily takes place the skew in the testing process, and the packaging body is short when detecting the head, detection effect is relatively weak.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor package detection device.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a semiconductor package detection device, includes the workstation, its innovation point lies in: the top surface of the workbench is provided with a mounting groove, a plurality of rotating shafts are arranged in the mounting groove, each rotating shaft is provided with a pair of eccentric wheels and belt pulleys, the belt pulleys are in transmission connection by adopting a belt, one rotating shaft is driven by adopting a stepping motor, the eccentric wheels are provided with material plates, the material plates are provided with a plurality of grooves for placing semiconductors, and the grooves are arranged at equal intervals; a lifting column is arranged on the top surface of the workbench, an installation plate is arranged at the top of the lifting column, the installation plate extends to the upper part of the material plate, and a detection head is arranged; the material plate moves forwards and upwards under the action of the eccentric wheel and is close to the detection head for the detection of the detection head.
Furthermore, a plurality of limiting columns are arranged on the front side face and the back side face of the workbench along the moving direction of the material plate.
Further, a starting point mark is set on the workbench.
After the structure is adopted, the utility model discloses beneficial effect does:
the utility model has reasonable design, compact structure and convenient use; through setting up step motor and eccentric wheel, can drive the material board and carry out intermittent type nature motion to be close to and detect the head and detect, thereby the extension is placed the check-out time of the encapsulation semiconductor on the board, and the detection head of being convenient for carries out abundant detection to the encapsulation semiconductor, and the recess on the material board is used for spacing the semiconductor simultaneously, prevents to take place the skew in the testing process.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Description of reference numerals:
the device comprises a working table 1, a mounting groove 2, a rotating shaft 3, an eccentric wheel 4, a belt wheel 5, a belt 6, a material plate 7, a groove 8, a lifting column 9, a mounting plate 10, a detection head 11 and a limiting column 12.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the invention, are given by way of illustration only.
Referring to fig. 1, a semiconductor packaging detection device comprises a workbench 1, wherein a mounting groove 2 is formed in the top surface of the workbench 1, a plurality of rotating shafts 3 are arranged in the mounting groove 2 in an arrayed manner, a pair of eccentric wheels 4 and belt pulleys 5 are arranged on each rotating shaft 3, the belt pulleys 5 are in transmission connection through a belt 6, one rotating shaft 3 is driven by a stepping motor (not shown), a material plate 7 is placed on each eccentric wheel 4, a plurality of grooves 8 for placing semiconductors are formed in each material plate 7, and the grooves 8 are arranged at equal intervals; a lifting column 9 is arranged on the top surface of the workbench 1, a mounting plate 10 is arranged at the top of the lifting column 9, the mounting plate 10 extends to the upper part of the material plate 7, and a detection head 11 is arranged; the material plate 7 moves forwards and upwards under the action of the eccentric wheel 4 and is close to the detection head 11 for the detection of the detection head 11. Specifically, firstly, a packaged semiconductor is placed in a groove 8 of a material plate 7, then the material plate 7 is placed on an eccentric wheel 4, a stepping motor is started to drive a rotating shaft 3 to rotate, the rotating shaft 3 drives the eccentric wheel 4 to rotate, so that the material plate 7 moves forwards and upwards, and stops moving when moving to the highest point, the packaged semiconductor is close to a detection head 11 to be detected, and after the detection is finished, the packaged semiconductor continues to move, so that the packaged semiconductor is sequentially detected; after the packaged semiconductor on the material plate 7 is detected, replacing the material plate 7 or packaging the semiconductor; the lifting column 9 is used for adjusting the height of the detection head 11 to ensure normal use, and the lifting column 9 can be manual or electric.
In this embodiment, the front and back sides of the worktable 1 are provided with a plurality of limiting columns 12 along the moving direction of the material plate. The limiting columns 12 limit the material plate 7 left and right, so that the material plate 7 can move forward and backward normally, the deviation is avoided, meanwhile, the limiting columns 12 and the side faces of the material plate 7 are smooth enough, the friction coefficient is reduced, and the normal operation of the material plate 7 is ensured.
In this embodiment, the start point identifier is set on the table 1. The initial point mark is used for accurately placing the material plate 7, so that the material plate 7 can be accurately lifted to the position right below the detection head 11 under the action of the eccentric wheel 4, and the detection accuracy is improved.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.
Claims (2)
1. A semiconductor package inspection device includes a stage, characterized in that: the top surface of the workbench is provided with a mounting groove, a plurality of rotating shafts are arranged in the mounting groove, each rotating shaft is provided with a pair of eccentric wheels and belt pulleys, the belt pulleys are in transmission connection by adopting a belt, one rotating shaft is driven by adopting a stepping motor, the eccentric wheels are provided with material plates, the material plates are provided with a plurality of grooves for placing semiconductors, and the grooves are arranged at equal intervals; a lifting column is arranged on the top surface of the workbench, an installation plate is arranged at the top of the lifting column, the installation plate extends to the upper part of the material plate, and a detection head is arranged; the material plate moves forwards and upwards under the action of the eccentric wheel and is close to the detection head for the detection of the detection head.
2. The semiconductor package inspection device of claim 1, wherein: and a plurality of limiting columns are arranged on the front side and the back side of the workbench along the moving direction of the material plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120217446.5U CN214588753U (en) | 2021-01-26 | 2021-01-26 | Semiconductor packaging detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120217446.5U CN214588753U (en) | 2021-01-26 | 2021-01-26 | Semiconductor packaging detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214588753U true CN214588753U (en) | 2021-11-02 |
Family
ID=78371659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120217446.5U Active CN214588753U (en) | 2021-01-26 | 2021-01-26 | Semiconductor packaging detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214588753U (en) |
-
2021
- 2021-01-26 CN CN202120217446.5U patent/CN214588753U/en active Active
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