CN215375660U

CN215375660U - Semiconductor chip detection device

Info

Publication number: CN215375660U
Application number: CN202121856070.9U
Authority: CN
Inventors: 马海宾
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-08-10
Filing date: 2021-08-10
Publication date: 2021-12-31
Anticipated expiration: 2031-08-10

Abstract

The utility model discloses a semiconductor chip detection device, which relates to the detection field and comprises a base and a conveyor belt, wherein a placing groove is formed in the base, the placing groove is opened on two opposite side surfaces of the base, a plurality of support rods are arranged on the base, a placing plate is connected onto the support rods, a detection device is arranged on the placing plate, and the detection device is positioned above the placing groove; the conveying belt is detachably connected with a plurality of detection seats for placing the semiconductors to be detected, and the conveying belt conveys the semiconductors to be detected on the conveying belt to the lower part of the detection device by penetrating through the placing groove; the detection seat is provided with a first groove for placing a semiconductor to be detected, a second groove is arranged in the first groove, and the second groove is provided with an ejection mechanism which can enable the semiconductor to be detected to be located above the detection seat. The device effectively improves the detection efficiency, simplifies the operation steps of operators and is more convenient for long-term use.

Description

Semiconductor chip detection device

Technical Field

The utility model relates to a detection device, in particular to a semiconductor chip detection device.

Background

In order to meet the requirements of mass production, the electrical properties of semiconductors must be predictable and stable, so that the purity of dopants and the quality of the lattice structure of semiconductors must be strictly required, and the applications of semiconductor chips are very wide. Semiconductor chip packaging testing is an essential process step for chips to become qualified products, and with the rapid progress of the semiconductor chip industry, the requirements for testing the performance of new products and packaging are very many, and the speed requirement is very high.

The existing semiconductor chip detection device usually needs an operator to place a semiconductor chip to be detected in a placing groove of the detection device, the semiconductor chip which is detected completely is taken out through a clamp after the detection is completed, and then other semiconductor chips to be detected are placed, so that the operation is troublesome, the detection efficiency is low, and the device for quickly detecting a plurality of semiconductor chips is urgently needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor chip detection device, which increases a conveyor belt on the existing detection device and improves the detection speed and efficiency.

The purpose is realized by adopting the following technical scheme: the device comprises a base and a conveyor belt, wherein a placing groove is formed in the base, the placing groove is opened in two opposite side surfaces of the base, a plurality of supporting rods are arranged on the base, a placing plate is connected to the supporting rods, a detection device is arranged on the placing plate, and the detection device is positioned above the placing groove;

the conveying belt is detachably connected with a plurality of detection seats for placing the semiconductors to be detected, and the conveying belt conveys the semiconductors to be detected on the conveying belt to the lower part of the detection device by penetrating through the placing groove; the detection seat is provided with a first groove for placing a semiconductor to be detected, a second groove is arranged in the first groove, and the second groove is provided with an ejection mechanism which can enable the semiconductor to be detected to be located above the detection seat. The conveyer belt passes the standing groove, with the below that waits to detect semiconductor on the detection seat on it and convey detection device in proper order, detection device treats in proper order and detects the semiconductor, detect the back that finishes, leave detection device under the effect of conveyer belt, when not passing through the semiconductor that detects, ejection mechanism in the second recess is used in on the semiconductor that does not pass through the detection, and the semiconductor that will not pass through the detection jack up that makes it be located the top that detects the seat, therefore operating personnel can directly take out the semiconductor that does not pass through the detection. Compared with the existing detection device, the device can continuously detect, after a semiconductor is not required to be detected, the device is stopped, the next semiconductor is placed, the detection efficiency is further improved, and meanwhile, after the device is detected, the device can directly jack up the semiconductor which is not detected through the ejection mechanism, so that an operator can rapidly and directly take out the semiconductor which is not detected, the process is changed, the conveying of the conveying belt is not required to be stopped, and the operation is more convenient.

Preferably, the supporting rod is a telescopic rod with telescopic length. When detecting, the position of detection device is adjusted to the accessible bracing piece, more is favorable to improving detection efficiency.

Preferably, the bottom is provided with a plurality of pulleys in the standing groove, and the axis place direction of pulley and the direction mutually perpendicular of conveyer belt conveying, the pulley contacts with the downside that is located the conveyer belt of standing groove, and the drive belt is connected through the pulley between conveyer belt and the standing groove at the in-process of conveying, when the conveying, more is favorable to improving conveying efficiency, improves the life of conveyer belt.

Specifically, be provided with the third recess on the interior bottom of second recess, ejection mechanism includes telescopic link and roof, and the one end of telescopic link is located the third recess, and the other end and the roof of telescopic link are connected, and the telescopic link can make through the roof and wait to detect the semiconductor and be located the top of detecting the seat, or make and wait to detect the semiconductor and be located first recess. When the telescopic link shortened, the telescopic link was located the third recess to the roof was located the second recess, and is preferred, and at this moment, the up end of roof was located same horizontal plane with the interior bottom surface of first recess, more was favorable to steadily placing of semiconductor like this. After the telescopic link extension, the telescopic link jack-up the roof upwards, and the roof is used for on the semiconductor to drive the semiconductor and upwards move together, make the semiconductor be located the top of detecting the seat, operating personnel can directly take out the semiconductor like this, and it is more convenient to operate. On the basis, the telescopic rod is sleeved with a spring, the upper end of the spring is in contact with the lower end face of the top plate, and the lower end of the spring is fixedly connected with the inner bottom of the third groove. When the telescopic link is flexible, the accessible spring cushions, more convenient to use.

And the width of the placing groove is larger than that of the conveyor belt. Therefore, when the conveyor belt is positioned in the placing groove, the two side faces of the conveyor belt cannot be in contact with the side faces of the placing groove, and the increase of the conveying friction force of the conveyor belt in the placing groove is avoided.

When the detection device is used, the detection seat is connected with the conveyor belt through the bolt, and when the detection seat needs to be taken down, the bolt is taken down, so that the detection seat and the conveyor belt can be separated. In the use process, the detection seat is connected with the conveyor belt through the bolts, so that the connection is more stable when the detection seat is used, and the conveyor belt can directly drive the detection seat to move.

Furthermore, the conveyer belt of this device is back style of calligraphy, is provided with the gyro wheel on the both ends of conveyer belt, the gyro wheel drives the conveyer belt and removes. Be provided with logical groove on the base, it is located the standing groove below to lead to the groove, the conveyer belt that is back style of calligraphy includes conveying part and lower conveying part, it passes the standing groove to go up conveying part, gyro wheel accessible motor drives rotatoryly, it is rotatory also can drive the gyro wheel through the manual rotation of operating personnel, and then drive the conveyer belt reciprocating motion on the gyro wheel, the conveyer belt conveys on the standing groove promptly, after the semiconductor detection in conveying part finishes on the conveyer belt, discharge the semiconductor through the detection on the conveyer belt one end, then the lower conveying part of conveyer belt passes the logical groove conveying of base and returns the other end of conveyer belt, and reach the upper portion of conveyer belt, operating personnel can place the semiconductor that waits to detect this moment, then convey under the detection device through the conveyer belt, detect, so reciprocal, the effectual detection efficiency that has improved.

Compared with the prior art, the utility model has the following advantages and beneficial effects:

according to the semiconductor chip detection device, the semiconductor to be detected can be continuously conveyed to the lower part of the detection device for detection through the conveyor belt and the detection seats on the conveyor belt, the semiconductor which does not pass the detection can be ejected out through the ejection mechanism after the detection is finished, so that an operator can conveniently and quickly take out the semiconductor which does not pass the detection, meanwhile, the semiconductor which passes the detection can be directly recovered at one end of the conveying through the square-shaped conveyor belt, the detection efficiency is effectively improved, the operation steps of the operator are simplified, and the semiconductor chip detection device is more convenient to use for a long time.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the utility model and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the utility model and together with the description serve to explain the principles of the utility model. In the drawings:

FIG. 1 is a schematic view of the structure of the apparatus in example 1;

FIG. 2 is a schematic view of a detection seat;

FIG. 3 is a schematic view of the structure of the inspection seat when the telescopic rod is extended;

FIG. 4 is a schematic structural view between the detection seat and the conveyor belt;

fig. 5 is a schematic structural view of the device in embodiment 3.

Reference numbers and corresponding part names in the drawings:

1-base, 2-placing groove, 3-conveyor belt, 4-detection seat, 41-first groove, 411-second groove, 5-support rod, 6-placing plate, 7-detection device, 8-telescopic rod, 9-top plate and 10-bolt.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.

In the description of the present invention, it is to be understood that the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the scope of the present invention.

[ example 1 ]

As shown in fig. 1, the device comprises a base 1 and a conveyor belt 3, wherein a placing groove 2 is arranged on the base 1, the placing groove 2 is opened on two opposite side surfaces of the base 1, four support rods 5 are arranged on the base 1, a placing plate 6 is connected to the support rods 5, a detection device 7 is arranged on the placing plate 6, and the detection device 7 is positioned above the placing groove 2; the detection seat 4 is provided with a first groove 41 for placing a semiconductor to be detected, a second groove 411 is arranged in the first groove 41, and the second groove 411 is provided with an ejection mechanism which can enable the semiconductor to be detected to be located above the detection seat 4. The detection device in this embodiment is an existing device.

The conveying belt 3 is connected with a plurality of detection seats 4 for placing the semiconductors to be detected through bolts, and the conveying belt 3 conveys the semiconductors to be detected on the conveying belt to the lower part of the detection device 7 by penetrating through the placing groove 2; the conveyer belt conveys the semiconductor to the standing groove, make detection device on the standing groove relative with waiting to detect the semiconductor on the detection seat on the conveyer belt in proper order, and then make detection device treat to detect the semiconductor, as shown in fig. 1, when using, operating personnel places on the detection seat on the left conveyer belt of base and waits to detect the semiconductor, the conveyer belt conveys from left to right, in the data send process, detection seat on the conveyer belt passes through the standing groove, when detection device with detect the seat just to the time, the conveyer belt stops the conveying, detection device detects waiting to detect the semiconductor on detecting the seat, after finishing detecting, the conveyer belt continues to move to the right, when the semiconductor that does not pass the detection, ejection mechanism acts on the semiconductor that does not pass the detection, jack up it, operating personnel can directly take out the semiconductor that does not pass the detection.

In this embodiment, the base is structured as shown in fig. 2, as shown in fig. 4, the base is connected to the conveyor belt through a bolt 10, a third groove is provided on an inner bottom portion of the second groove 411, the ejection mechanism includes a telescopic rod 8 and a top plate 9, one end of the telescopic rod 8 is located in the third groove, the other end of the telescopic rod 8 is connected to the top plate 9, and the telescopic rod 8 can enable the semiconductor to be detected to be located above the detection seat 4 through the top plate 9, or enable the semiconductor to be detected to be located in the first groove 41.

The structure of the base during the detection and transportation process is shown in fig. 2, and at this time, the telescopic rod is shortened in the third groove, and the upper end surface of the top plate 9 and the inner bottom surface of the first groove 41 are positioned on the same horizontal plane. When the semiconductor that does not pass the detection, the telescopic link extension, the telescopic link is with roof jack-up upwards, and the roof will not pass the semiconductor jack-up that detects, makes the semiconductor that does not pass the detection be located the top of detecting the seat, and when the telescopic link extension, the structure of base is as shown in fig. 3.

[ example 2 ]

On the basis of the embodiment 1, the supporting rod 5 is a telescopic rod with a telescopic length. When using, the position of detection device above the standing groove is adjusted to the accessible bracing piece, improves detection efficiency.

On this basis, the bottom is provided with a plurality of pulleys in this device's standing groove 2, and the direction mutually perpendicular of the direction of the axis place of pulley and the direction of conveyer belt 3 conveying, the pulley contacts with the downside of the conveyer belt 3 that is located standing groove 2.

The telescopic rod 8 is sleeved with a spring, the upper end of the spring is in contact with the lower end face of the top plate 9, and the lower end of the spring is fixedly connected with the inner bottom of the third groove. And the width of the placing chute 2 is larger than the width of the conveyor belt 3.

[ example 3 ]

On the basis of embodiment 2, as shown in fig. 5, the conveyor belt 3 is in a shape of a Chinese character hui, and rollers are arranged at two ends of the conveyor belt 3, and the rollers drive the conveyor belt 3 to move. Be provided with logical groove on base 1, lead to the groove and be located standing groove 2 below, the conveyer belt 3 that is back the style of calligraphy includes conveying portion and lower conveying portion, goes up conveying portion, and lower conveying portion passes the logical groove of base 1. The direction of the axis of the roller is vertical to the direction of the conveying belt, and the roller is connected with the base through a connecting rod.

When the semiconductor detection device is used, the upper conveying part of the conveying belt penetrates through the placing groove 2 to convey a semiconductor to be detected from left to right, when the semiconductor to be detected is conveyed to the lower part of the detection device, the conveying belt stops conveying, the detection device detects the semiconductor to be detected on the detection seat, after the detection is finished, the conveying belt continues to move, when the conveying belt conveys the detected semiconductor to the right side of the base, if the semiconductor which does not pass the detection is detected, the base jacks up the semiconductor which does not pass the detection through the jacking mechanism, an operator takes the semiconductor out, when the detected semiconductor moves to the right end of the conveying belt, namely the roller at the right end, the lower end of the roller at the right end is provided with the recovery box, when the detection seat moves to the roller at the right end, the semiconductor which passes the detection falls into the recovery box under the action of the gravity of the semiconductor, so that the semiconductor is not placed on the detection seat on the lower conveying part of the conveying belt, and the conveyor belt continuously conveys, when the detection seat without the semiconductor is moved to the left end of the conveyor belt from the lower conveying part and returns to the upper conveying part, the operator replaces the semiconductor to be detected on the detection seat on the upper conveying part, and the semiconductor is continuously detected in a circulating manner. The length of the conveyor belt outside the left side of the base in the embodiment is not less than 1 meter so as to place more semiconductors to be detected.

As used herein, "first," "second," "third," etc. merely distinguish the corresponding components for clarity of description and are not intended to limit any order or to emphasize importance, etc. Further, the term "connected" used herein may be either directly connected or indirectly connected via other components without being particularly described.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. The semiconductor chip detection device is characterized by comprising a base (1) and a conveyor belt (3), wherein a placing groove (2) is formed in the base (1), the placing groove (2) is opened in two opposite side surfaces of the base (1), a plurality of support rods (5) are arranged on the base (1), a placing plate (6) is connected onto the support rods (5), a detection device (7) is arranged on the placing plate (6), and the detection device (7) is positioned above the placing groove (2);

the conveying belt (3) is detachably connected with a plurality of detection seats (4) for placing the semiconductors to be detected, and the conveying belt (3) conveys the semiconductors to be detected on the conveying belt to the lower part of the detection device (7) by penetrating through the placing groove (2); the detection seat (4) is provided with a first groove (41) for placing a semiconductor to be detected, a second groove (411) is arranged in the first groove (41), and the second groove (411) is provided with an ejection mechanism which can enable the semiconductor to be detected to be located above the detection seat (4).

2. The semiconductor chip testing device according to claim 1, wherein the supporting rod (5) is a telescopic rod with a length capable of being expanded and contracted.

3. A semiconductor chip inspection apparatus according to claim 1, wherein a plurality of pulleys are provided at the bottom of the placement slot (2), the axes of the pulleys being oriented in a direction perpendicular to the direction of conveyance of the conveyor belt (3), the pulleys being in contact with the lower side of the conveyor belt (3) in the placement slot (2).

4. The semiconductor chip detection device according to claim 1, wherein a third groove is formed in the inner bottom of the second groove (411), the ejection mechanism comprises a telescopic rod (8) and a top plate (9), one end of the telescopic rod (8) is located in the third groove, the other end of the telescopic rod (8) is connected with the top plate (9), and the telescopic rod (8) can enable the semiconductor to be detected to be located above the detection seat (4) or enable the semiconductor to be detected to be located in the first groove (41) through the top plate (9).

5. The semiconductor chip detection device according to claim 4, wherein when the telescopic rod (8) enables the semiconductor to be detected to be located in the first groove (41), the upper end surface of the top plate (9) and the inner bottom surface of the first groove (41) are located on the same horizontal plane.

6. The semiconductor chip testing device according to claim 1, wherein the testing base (4) is connected to the conveyor belt (3) by a bolt (10).

7. The semiconductor chip detection device according to claim 4, wherein the telescopic rod (8) is sleeved with a spring, the upper end of the spring is in contact with the lower end face of the top plate (9), and the lower end of the spring is fixedly connected with the inner bottom of the third groove.

8. The semiconductor chip inspection device according to claim 7, wherein the width of the placement slot (2) is larger than the width of the conveyor belt (3).

9. The semiconductor chip detection device according to claim 1, wherein the conveyor belt (3) is in a shape of a Chinese character 'hui', and rollers are disposed at two ends of the conveyor belt (3) and drive the conveyor belt (3) to move.

10. The semiconductor chip inspection device according to claim 9, wherein the base (1) is provided with a through groove below the placement groove (2), and the conveyor (3) having a zigzag shape includes an upper conveying portion passing through the placement groove (2) and a lower conveying portion passing through the through groove of the base (1).