CN114791475A - Semiconductor chip defect detection device and detection method - Google Patents
Semiconductor chip defect detection device and detection method Download PDFInfo
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- 238000000034 method Methods 0.000 claims abstract description 55
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 29
- 239000007789 gas Substances 0.000 claims description 26
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract
The invention discloses a defect detection device and a defect detection method for a semiconductor chip, wherein the device comprises: the box body and the cover body matched with the box body; the box body comprises a groove formed in the peripheral wall and an automatic lifting system positioned in the groove, wherein the automatic lifting system is used for placing a semiconductor chip to be detected; the cover body comprises a cover plate, a limiting strip and a conducting rod, the conducting rod is fixedly connected with the limiting strip, and the cover plate and the limiting strip are of an integral structure; the side wall of the box body further comprises a conduction rail, and the conduction rod can reciprocate in the conduction rail to drive the cover plate to open or close the groove. Compared with the chip defect detection method of the existing processing mode, the method greatly reduces the influences of illumination, dust, impurities, touch, vibration and the like, and the detected semiconductor chip can be traced.
Description
Technical Field
The invention belongs to the field of semiconductor defect detection, and particularly relates to a defect detection device and a defect detection method for a semiconductor chip.
Background
Along with the promotion of semiconductor wafer functional structure, the wafer is more and more sensitive to illumination and dust etc. but in the chip testing process, some defect detection can't go on in situ, need with the help of external equipment, in the in-process of transferring the chip to external defect detection equipment from the processing position, how let wait to detect the chip and be in safe environment, do not receive illumination, dust impurity, vibrations, touching etc. influence, become the key of deciding chip defect detection degree of accuracy, multi-purpose manipulator and manual transfer wait to detect the chip at present, this transfer process produces great interference to chip defect detection.
Disclosure of Invention
In order to solve the above-mentioned disadvantages in the prior art, the present invention provides a defect detecting device for a semiconductor chip, the device comprising: the box body and the cover body matched with the box body;
the box body comprises a groove formed in the peripheral wall and an automatic lifting system positioned in the groove, wherein the automatic lifting system is used for placing a semiconductor chip to be detected;
the cover body comprises a cover plate, a limiting strip and a conducting rod, the conducting rod is fixedly connected with the limiting strip, and the cover plate and the limiting strip are of an integral structure;
the side wall of the box body further comprises a conduction rail, and the conduction rod can reciprocate in the conduction rail to drive the cover plate to open or close the groove.
In the device for detecting the defects of the semiconductor chip, one end of the conduction rod is fixedly connected with the limiting strip, the other end of the conduction rod is fixedly connected with the conduction piston, and the conduction piston is in contact with and in sealing fit with the inner wall of the conduction track; wherein the first end of the conducting track is open for access to the conducting rod, and the second end of the conducting track is sealed; air can be stored between the conduction piston and the second end of the conduction track, and the air enables the conduction piston to reciprocate along with pressure change, so that the cover body is driven by the conduction rod to open or close the groove.
In the defect detection device for the semiconductor chip, the limiting strip comprises a first plane, a second plane and a third plane which are vertically connected with each other, the cover plate comprises a fourth plane, and the second plane and the fourth plane are coplanar; the box body comprises a fifth plane, a sixth plane and a seventh plane which are vertical to each other; wherein, upon the cover closing the recess, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane.
In the device for detecting the defects of the semiconductor chip, the box body further comprises a first bearing surface and a second bearing surface which are coplanar, after the cover plate closes the groove, the first bearing surface is used for bearing the limiting strip, and the second bearing surface is used for bearing the cover plate; and in the process of opening the groove by the cover plate, the cover plate slides to the first bearing surface along the second bearing surface.
In the device for detecting the defects of the semiconductor chip, the second bearing surface is encircled into a U-shaped structure, and the first bearing surface and the second bearing surface are made of rubber; the apron is closed behind the recess, under the equal circumstances of inside and outside atmospheric pressure of recess, when no external force acts on, the apron with second bearing surface sealing contact, spacing with first bearing surface sealing contact makes the recess with the device outside can't carry out gas exchange.
In the device for detecting the defects of the semiconductor chip, the automatic lifting system comprises an object stage, a support rod, a lifting piston, a lifting channel and a lead; the object stage is used for bearing the semiconductor chip to be detected; the supporting rod is fixedly connected with and supports the objective table; the lifting piston is fixedly connected with the supporting rod and is in sealing contact with the inner wall of the lifting channel; the first end of the lifting channel is provided with an opening for the support rod to reciprocate up and down, the objective table is positioned above the lifting channel, and the second end of the lifting channel is fixedly and hermetically connected with the bottom of the box body; the wire is electrically connected with the objective table, the wire is electrically connected with the bottom of the box body, and the bottom of the box body is made of metal; the lifting piston and the bottom of the box body can be sealed by gas, and the sealing gas between the lifting piston and the bottom of the box body can enable the lifting piston to reciprocate up and down along with pressure change, so that the objective table is driven to reciprocate up and down.
In the defect detection device for the semiconductor chip, two conduction rails are respectively positioned at two opposite ends of the box body, and the conduction rails are far away from the bottom of the box body; the number of the conduction rods is two, and the conduction rods are respectively matched with the two conduction tracks; one lifting channel is arranged, is vertical to the bottom of the box body and is positioned in the middle of the bottom of the box body; the second end of the conducting track comprises a sealable first vent valve, the sealed space formed by the conducting track and the conducting piston can be inflated through the first vent valve, and after the inflation is finished, the first vent valve can be sealed; and the second end of the lifting channel comprises a sealable second vent valve, the second vent valve can be used for inflating a closed space formed by the lifting channel and the lifting piston, and the second vent valve can be sealed after inflation is finished.
The present invention also provides a semiconductor chip defect detecting method using the semiconductor chip defect detecting apparatus according to any one of claims 1 to 7, comprising the steps of:
step 1, placing the conducting piston in the conducting channel, and placing the lifting piston in the lifting channel;
step 2, after filling inert gas into the lifting channel, sealing the second vent valve to enable the objective table to be located in the groove, wherein the lifting piston cannot leave the first end of the lifting channel;
step 3, adhering the semiconductor chip to be detected to the objective table through conductive adhesive, wherein the semiconductor chip does not contact the cover body;
step 4, after filling inert gas into the conduction channel, sealing the first vent valve to enable the cover plate to completely cover the second bearing surface which is enclosed into a U-shaped structure, and the cover body to completely cover the groove, and the conduction piston cannot leave the first end of the conduction channel;
step 5, transferring the detection device obtained in the step 4 to a detection cavity of defect detection equipment, wherein negative pressure exists in the detection cavity of the defect detection equipment, and when the air pressure in the conduction channel is greater than the air pressure in the detection cavity in the process that the detection device is moved into the detection cavity, sealing gas in the conduction channel expands to push the conduction piston to move so as to drive the cover body to open the groove; when the detection device moves into the detection cavity, when the air pressure in the lifting channel is greater than the air pressure in the detection cavity, the sealing gas in the lifting channel expands to push the lifting piston to move, and the object stage ascends, so that the detection of the defect monitoring device is facilitated, and the defect detection result of the semiconductor chip is stored and recorded;
wherein, the steps 1-4 are completed in a clean room;
wherein, the gas pressure sealed in the conduction channel after the step 4 is greater than the gas pressure sealed in the lifting channel after the step 2, so that in the step 5, the process of opening the groove by the cover body is prior to the process of lifting the object stage.
In the method for detecting the defects of the semiconductor chip, the method further comprises the following steps:
step 6, after the detection of the detection equipment is finished, the detection cavity is opened, in the process, the air pressure outside the lifting channel is gradually increased, and the air outside the lifting channel pushes the lifting piston to move downwards so as to drive the lifting system to fall; the air pressure outside the conduction channel is increased, and the air outside the conduction channel pushes the conduction piston to move so as to drive the cover body to close the groove;
step 7, taking out the detection device, and transferring the detection device to a clean room;
step 8, reducing the air pressure around the detection device in a clean room, thereby opening the groove, taking out the detected semiconductor chip, and sealing for sample reservation;
wherein the step 6 is that the falling process of the lifting system is prior to the groove closing process.
In the method for detecting defects of a semiconductor chip, after the step 4 and before the step 5, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane; after step 6 and before step 7, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane.
Compared with the prior art, the method disclosed by the invention has the following characteristics:
the device and the method for detecting the chip defects disclosed by the invention can be automatically opened in a detection cavity of external detection equipment particularly in the process of moving the chip to the defect detection equipment after the chip is packaged at a processing position, and are not contacted with the interference of illumination, dust, impurities, touch and the like in the whole process, so that the accurate defect detection of the semiconductor chip is facilitated.
Secondly, the chip defect detection method of the existing processing mode is greatly influenced by vibration; according to the device and the method for detecting the defects of the semiconductor chip, the gas sealed in the conduction channel under the objective table plays a role in buffering vibration, so that the influence of the vibration on the defects of the chip to be detected can be greatly weakened, and the accurate defect detection of the semiconductor chip is facilitated.
Thirdly, in the chip defect detection method of the existing processing mode, the detected semiconductor chip is polluted in the process of taking out the detection cavity, so that the detection is difficult to trace, and once the detection needs to be carried out again, a semiconductor chip detection sample needs to be manufactured again; the device and the method for detecting can automatically close the groove in the process of opening the detection cavity after detection is finished, protect the detected semiconductor chip, so that a detected sample can be traced and reproduced, and great help is brought to problem research.
Description of the drawings:
in order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a schematic view of the groove closed state of the present application.
Fig. 2 is a schematic view of the groove open state of the present application.
Fig. 3 is a perspective view of the detecting device in the closed state of the groove.
Fig. 4 is a perspective view of the case in a fully open state of the present application.
Fig. 5 is a perspective view of the cover in a fully open state of the present application.
Fig. 6 is a perspective view of the detecting device in the open state of the groove of the present application.
FIG. 7 is a top view of the detecting device of the present application in a state where the groove is opened.
FIG. 8 is a right side view of the case shown in FIG. 4 in the fully open position of the present application.
FIG. 9 is a top view of the enclosure shown in FIG. 4 in the fully open position of the present application.
Detailed Description
The following embodiments will be described clearly and completely in conjunction with the technical solutions of the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Additionally, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity, and should be interpreted flexibly to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited.
As used herein, the terms "substantially," "generally," "substantially," "essentially," and "about" are used to describe and illustrate small variations. When used in conjunction with an event or circumstance, the terms can refer to both an instance in which the event or circumstance occurs precisely as well as an instance in which the event or circumstance occurs in close proximity. For example, when used in conjunction with numerical values, the term can refer to a range of variation that is less than or equal to ± 10% of the stated numerical value, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, less than or equal to ± 0.05%. For example, two numerical values are considered to be "substantially" identical if the difference between the two numerical values is less than or equal to ± 10% (e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, less than or equal to ± 0.05%) of the mean of the values.
In the detailed description and claims, a list of items connected by the terms "at least one of," "at least one of," or other similar terms may mean any combination of the listed items. For example, if items a and B are listed, the phrase "at least one of a and B" means a only; only B; or A and B. In another example, if items A, B and C are listed, the phrase "at least one of A, B and C" means a only; or only B; only C; a and B (excluding C); a and C (excluding B); b and C (excluding A); or A, B and C. Item a may comprise a single element or multiple elements. Item B may comprise a single element or multiple elements. Item C may comprise a single element or multiple elements.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship that is indicative of, or based on, the positional or positional relationship, but merely for purposes of describing the invention and simplifying the description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
As shown in fig. 1-9, the present invention provides a defect inspection apparatus 100 for semiconductor chips, the apparatus 100 comprising: a box body 110 and a cover body 120 matched with the box body;
as shown in fig. 4, the box body 110 includes a groove 114 formed on the peripheral wall, and an automatic lifting system located in the groove 114, the automatic lifting system being used for placing a semiconductor chip to be detected;
as shown in fig. 5, the cover 120 includes a cover plate 1212, a limiting strip 1211, and a conducting rod 122, the conducting rod 122 is fixedly connected to the limiting strip 1211, the cover plate 1212 and the limiting strip 1211 are an integral structure, if both are cut from the same structure;
as shown in fig. 4-5, the sidewall of the box 110 further includes a conductive rail 112, and the conductive rod 122 can reciprocate in the conductive rail 112 to open or close the groove 114 with the cover 1212. One end of the conductive rod 122 is fixedly connected with the limit strip 1211, the other end of the conductive rod 122 is fixedly connected with the conductive piston 123, and the conductive piston 123 is in contact with and in sealing fit with the inner wall of the conductive track 112;
as shown in fig. 1-6, a first end (not shown) of the conducting track 112 is open, the first end is an end adjacent to the stopper 1211 and is used for entering and exiting the conducting rod 122, a second end (not shown) of the conducting track 112 is sealed, and the second end (not shown) is an end away from the stopper 1211; a gas may be stored between the conductive piston 123 and the second end of the conductive track 112, and the gas causes the conductive piston 123 to reciprocate with pressure changes, thereby causing the cover 120 to open or close the groove 114 through the conductive rod 122.
As shown in fig. 3, the stop strip 1211 includes a first plane 12111, a second plane 12112 and a third plane 12113 that are vertically connected to each other, the cover plate includes a fourth plane 1212, and the second plane 12112 is coplanar with the fourth plane 1212; the box body 110 comprises a fifth plane 1163, a sixth plane 1161 and a seventh plane 1164 which are perpendicular to each other; after the cover closes the recess, the first plane 12111 is coplanar with the fifth plane 1163, the second plane 12112 is coplanar with the sixth plane 1162, and the third plane 12113 is coplanar with the seventh plane 1164. The surface of the detection device 100 after being closed has no obvious gap, so that the storage of dust or other magazines in the gap is further reduced, and the dust or other magazines even enter the groove through the gap; in addition, the detection device 100 without obvious gaps is convenient for regular cleaning; and the detection device without obvious gaps reduces the bump and the vibration in the transportation process.
As shown in fig. 4-6, the cassette further includes a first bearing surface 1131 and a second bearing surface 1132 which are coplanar, after the cover plate 1212 closes the groove 114, the first bearing surface 1131 is used for receiving the position-limiting strip 1211, and the second bearing surface 1132 is used for receiving the cover plate 1212; during the opening of the pocket 114 by the cover plate 1212, the cover plate 1212 is slid along the second bearing surface 1132 to the first bearing surface 1131. The second bearing surface 1132 encloses a U-shaped structure, and the first bearing surface 1131 and the second bearing surface 1132 are made of rubber; be favorable to being in the apron 1212 is closed behind the recess 114, under the equal circumstances of the inside and outside atmospheric pressure of recess 114, when no exogenic action, apron 1212 with second loading surface 1132 sealing contact, spacing 1211 with first loading surface 1131 sealing contact makes the recess with the device outside can't carry out gas exchange, U type structure cooperation rubber material can increase sealed effect.
As shown in fig. 1-2, the automatic lifting system includes a stage 131, a support rod 132, a lifting piston 134, a lifting channel 133, and a wire 135; the object stage 131 is used for bearing the semiconductor chip to be detected; the supporting rod 132 is fixedly connected with and supports the object stage 131; the lifting piston 134 is fixedly connected with the supporting rod 132, and the lifting piston 134 is in sealing contact with the inner wall of the lifting channel 133; a first end (not shown) of the lifting channel 133 is opened for the support rod 132 to reciprocate up and down, the object stage 131 is located above the lifting channel 133, and a second end (not shown) of the lifting channel 133 is fixed and hermetically connected with the bottom of the box body; the wire 135 is electrically connected with the object stage 131, the wire 135 is electrically connected with the bottom of the box body, the bottom of the box body and the object stage are made of metal materials, and external detection equipment can conveniently detect the metal materials after the metal materials are connected through the wire 135;
the lifting piston 134 and the bottom of the box body can be sealed by gas, and the sealing gas between the lifting piston 134 and the bottom of the box body 110 can make the lifting piston 134 reciprocate up and down along with the pressure change, so as to drive the object stage 131 to reciprocate up and down.
As shown in fig. 4-8, there are two conducting rails 112, which are respectively located at two opposite ends of the box body 110, and the conducting rails 112 are far away from the bottom of the box body 110; two conductive rods 122 are provided and respectively matched with the two conductive tracks 112;
as shown in fig. 1-2, one of the lifting channels 133 is perpendicular to the bottom of the box body 110 and is located in the middle of the bottom of the box body;
as shown in fig. 4-8, the second end (not shown) of the conducting track 112 comprises a sealable first vent valve (not shown), through which air can be filled into the closed space formed by the conducting track and the conducting piston, and when the air filling is completed, the first vent valve can be sealed; the first vent valve can adopt a rubber plug, and the rubber plug can be inserted after the inflation process is connected with the vacuum pump through the needle head;
as shown in fig. 1-2, a second end (not shown) of the lifting channel 133 includes a second sealable vent valve (not shown) through which air can be filled into the closed space formed by the lifting channel and the lifting piston, and the second vent valve can be sealed when the air is filled. The second vent valve can adopt a rubber plug, and the rubber plug is inserted after the second vent valve is connected with the vacuum pump through a needle in the inflation process;
a method for detecting defects of a semiconductor chip, which is used in the semiconductor chip defect detecting apparatus, as shown in fig. 1-9, comprising the steps of:
step 1, placing the conducting piston 122 in the conducting channel 112, and placing the lifting piston 134 in the lifting channel 133;
step 2, after filling the lifting channel 133 with the inert gas, sealing the second vent valve (not shown), as described above in connection with the second vent valve, so that the stage 131 is located in the recess 114 and the lifting piston 134 cannot leave the first end of the lifting channel 133; a stopper, such as a rivet, may be provided at the first end of the lifting channel 133 after the lifting piston 134 is disposed in the lifting channel 133, so that the lifting piston 134 does not rush out of the lifting channel when the air pressure in the lifting channel 133 is excessive.
Step 3, adhering the semiconductor chip to be detected to the objective table 131 through a conductive adhesive, wherein the semiconductor chip does not contact the cover 1212;
step 4, after filling the conducting channel 112 with the inert gas, sealing the first vent valve (not shown), as described in the foregoing description, so that the cover plate 1212 completely covers the second bearing surface 1132 enclosing the U-shaped structure, the cover 1212 completely covers the recess 114, and the conducting piston 123 cannot leave the first end of the conducting channel 112; the principle is similar to the stop mechanism in step 2, and the description is omitted.
Step 5, transferring the detection apparatus 100 after the step 4 to a detection cavity (not shown in the figure) of a defect detection device, wherein negative pressure exists in the detection cavity of the defect detection device, and when the air pressure in the conduction channel 112 is greater than the air pressure in the detection cavity in the process that the detection apparatus is moved into the detection cavity, the sealing gas in the conduction channel 112 expands to push the conduction piston 123 to move, and further the cover 1212 is driven to open the groove 114; when the detection device 100 moves into the detection chamber, when the air pressure in the lifting channel 133 is greater than the air pressure in the detection chamber, the sealing gas in the lifting channel 133 expands to push the lifting piston 134 to move, and the object stage 131 rises, so that the defect detection by the defect monitoring device is facilitated, and the defect detection result of the semiconductor chip is stored and recorded;
wherein, the steps 1 to 4 are completed in a clean room;
wherein the gas pressure sealed in the conducting channel 112 after the step 4 is greater than the gas pressure sealed in the lifting channel 133 after the step 2, so that the cover 1212 opens the recess 114 before the stage 131 is lifted in the step 5. Therefore, the semiconductor chip to be detected can not collide with the cover plate 1212, and especially when the sample of the semiconductor chip to be detected is high, the process is more meaningful.
Also comprises the following steps:
step 6, after the detection of the detection device is completed, the detection cavity is opened, and in the second process, the external air pressure of the lifting channel 133 is gradually increased, and the external air of the lifting channel 133 pushes the lifting piston 134 to move downwards, so that the object stage 131 is driven to fall; the air pressure outside the conduction channel 112 increases, and the air outside the conduction channel 112 pushes the conduction piston 123 to move, so as to drive the cover 1212 to close the groove 114;
step 7, taking out the detection device 100 and transferring the detection device to a clean room;
step 8, reducing the air pressure around the detection device 100 in a clean room, thereby opening the groove 114, taking out the detected semiconductor chip, and sealing and reserving a sample;
wherein the step 6 is that the falling process of the lifting system is prior to the groove closing process. Therefore, the semiconductor chip to be detected can not collide with the cover plate 1212, and the process is more meaningful especially when the sample of the semiconductor chip to be detected is high.
After step 4 and before step 5, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane; after step 6 and before step 7, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane.
Compared with the prior art, the method disclosed by the invention has the following characteristics:
the chip defect detection method in the existing processing mode is greatly influenced by illumination, dust, impurities, touch and the like, but the device and the detection method for detecting the defects disclosed by the invention can be automatically opened in a detection cavity of external detection equipment particularly in the process of moving the chip to the defect detection equipment for detection after the chip is packaged at a processing position, are not contacted with the interference of the illumination, the dust, the impurities, the touch and the like in the whole process, and are favorable for realizing accurate defect detection of the semiconductor chip.
The chip defect detection method of the existing processing mode is greatly influenced by vibration; according to the device and the method for detecting the defects of the semiconductor chip, the gas sealed in the conduction channel under the objective table plays a role in buffering vibration, so that the influence of the vibration on the defects of the chip to be detected can be greatly weakened, and the accurate defect detection of the semiconductor chip is facilitated.
In the chip defect detection method of the existing processing mode, a detected semiconductor chip is polluted in the process of taking out a detection cavity, so that the detection is difficult to trace, and once the detection needs to be carried out again, a semiconductor chip detection sample needs to be manufactured again; the device and the method for detecting can automatically close the groove in the process of opening the detection cavity after detection is finished, protect the detected semiconductor chip, so that the detected sample can be traced and reproduced, and great help is provided for problem research.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims. While the present application has been described and illustrated with reference to particular embodiments thereof, such description and illustration are not intended to limit the present application. It will be clearly understood by those skilled in the art that various changes may be made to adapt a particular situation, material, composition of matter, substance, method or process to the objective, spirit and scope of this application without departing from the true spirit and scope of the application as defined by the appended claims. All such modifications are intended to be within the scope of the claims appended hereto. Although the methods disclosed herein have been described with reference to particular operations being performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form equivalent methods without departing from the teachings of the present application. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the present application.
Claims (10)
1. A defect inspection apparatus for semiconductor chips, the apparatus comprising:
the box body and the cover body matched with the box body;
the box body comprises a groove formed in the peripheral wall and an automatic lifting system positioned in the groove, and the automatic lifting system is used for placing a semiconductor chip to be detected;
the cover body comprises a cover plate, a limiting strip and a conducting rod, the conducting rod is fixedly connected with the limiting strip, and the cover plate and the limiting strip are of an integral structure;
the side wall of the box body further comprises a conduction rail, and the conduction rod reciprocates in the conduction rail to drive the cover plate to open or close the groove.
2. The apparatus of claim 1, wherein one end of the conductive rod is fixedly connected to the position-limiting bar, the other end of the conductive rod is fixedly connected to a conductive piston, and the conductive piston is in contact with and in sealing fit with the inner wall of the conductive track;
the first end of the conducting track is provided with an opening for entering and exiting the conducting rod, and the second end of the conducting track is sealed; and gas is stored between the conduction piston and the second end of the conduction track, and the gas enables the conduction piston to reciprocate along with the pressure change, so that the cover body is driven by a conduction rod to open or close the groove.
3. The apparatus of claim 2, wherein the stopper comprises a first plane, a second plane, and a third plane vertically connected to each other, the cover comprises a fourth plane, and the second plane and the fourth plane are coplanar;
the box body comprises a fifth plane, a sixth plane and a seventh plane which are perpendicular to each other;
wherein, upon the cover closing the recess, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane.
4. The apparatus of claim 3, wherein the housing further comprises a first supporting surface and a second supporting surface that are coplanar, the first supporting surface is configured to receive the stopper after the cover plate closes the recess, and the second supporting surface is configured to receive the cover plate;
and in the process that the cover plate opens the groove, the cover plate slides to the first bearing surface along the second bearing surface.
5. The apparatus of claim 4, wherein the second carrying surface is formed into a U-shaped structure, and the first carrying surface and the second carrying surface are made of rubber;
after the cover plate is closed, under the condition that the air pressure inside and outside the groove is equal, when no external force acts, the cover plate is in sealing contact with the second bearing surface, and the limiting strip is in sealing contact with the first bearing surface.
6. The apparatus of claim 5, wherein the automatic lifting system comprises a stage, a support rod, a lifting piston, a lifting channel, and a wire;
the object stage bears the semiconductor chip to be detected;
the supporting rod is fixedly connected with and supports the objective table;
the lifting piston is fixedly connected with the supporting rod and is in sealing contact with the inner wall of the lifting channel;
the first end of the lifting channel is provided with an opening for the support rod to reciprocate up and down, the objective table is positioned above the lifting channel, and the second end of the lifting channel is fixedly and hermetically connected with the bottom of the box body;
the wire is electrically connected with the objective table, the wire is electrically connected with the bottom of the box body, and the bottom of the box body is made of metal;
the lifting piston and the box body bottom are sealed by gas, and the sealed gas between the lifting piston and the box body bottom can enable the lifting piston to reciprocate up and down along with pressure change, so that the objective table is driven to reciprocate up and down.
7. The apparatus of claim 6, wherein two of the conductive tracks are located at opposite ends of the box, and the conductive tracks are far away from the bottom of the box; the number of the conduction rods is two, and the conduction rods are respectively matched with the two conduction tracks;
one lifting channel is arranged, is vertical to the bottom of the box body and is positioned in the middle of the bottom of the box body;
the second end of the conducting track comprises a first vent valve, the conducting track and the conducting piston form a closed space through inflation of the first vent valve, and the first vent valve is sealed after inflation is completed;
and the second end of the lifting channel comprises a second vent valve, the second vent valve is used for inflating the closed space formed by the lifting channel and the lifting piston, and the second vent valve is sealed after the inflation is finished.
8. A semiconductor chip defect inspection method using the semiconductor chip defect inspection apparatus of claim 7, characterized by comprising the steps of:
step 1, placing the conducting piston in the conducting channel, and placing the lifting piston in the lifting channel;
step 2, after filling inert gas into the lifting channel, sealing the second vent valve to enable the objective table to be located in the groove, and enabling the lifting piston not to leave the first end of the lifting channel;
step 3, adhering the semiconductor chip to be detected to the objective table through conductive adhesive, wherein the semiconductor chip does not contact the cover body;
step 4, after filling inert gas into the conduction channel, sealing the first vent valve to enable the cover plate to completely cover the second bearing surface which is enclosed into a U-shaped structure, and the cover body to completely cover the groove, and the conduction piston cannot leave the first end of the conduction channel;
step 5, transferring the detection device obtained in the step 4 to a detection cavity of defect detection equipment, wherein negative pressure exists in the detection cavity of the defect detection equipment, and when the air pressure in the conduction channel is greater than the air pressure in the detection cavity in the process that the detection device is moved into the detection cavity, the sealing gas in the conduction channel expands to push the conduction piston to move, so that the cover body is driven to open the groove; when the detection device moves into the detection cavity, when the air pressure in the lifting channel is greater than the air pressure in the detection cavity, the sealing gas in the lifting channel expands to push the lifting piston to move, and then the object stage ascends;
wherein, the steps 1-4 are completed in a clean room;
and the gas pressure sealed in the conducting channel after the step 4 is greater than the gas pressure sealed in the lifting channel after the step 2, so that the process of opening the groove by the cover body is prior to the process of lifting the object stage in the step 5.
9. The method of claim 8, further comprising the steps of:
step 6, after the detection of the detection equipment is finished, the detection cavity is opened, in the process, the air pressure outside the lifting channel is gradually increased, and the air outside the lifting channel pushes the lifting piston to move downwards so as to drive the lifting system to fall; the air pressure outside the conduction channel is increased, and the air outside the conduction channel pushes the conduction piston to move so as to drive the cover body to close the groove;
step 7, taking out the detection device, and transferring the detection device to a clean room;
step 8, reducing the air pressure around the detection device in a clean room, thereby opening the groove, taking out the detected semiconductor chip, and sealing and reserving a sample;
wherein the falling process of the lifting system precedes the groove closing process in step 6.
10. The method of claim 9, wherein after step 4 and before step 5, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane; after step 6 and before step 7, the first plane is coplanar with the fifth plane, the second plane is coplanar with the sixth plane, and the third plane is coplanar with the seventh plane.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109127160A (en) * | 2018-08-10 | 2019-01-04 | 朱治杰 | Medical kit is used in a kind of biomedical detection |
| CN211741503U (en) * | 2020-09-14 | 2020-10-23 | 武汉精鸿电子技术有限公司 | Semiconductor test equipment capable of automatically opening and closing door |
| CN213301624U (en) * | 2020-09-10 | 2021-05-28 | 燎原检测技术(深圳)有限公司 | Electronic product detection equipment convenient to take |
| CN113777475A (en) * | 2021-11-15 | 2021-12-10 | 枣庄智博智能科技有限公司 | Automatic test platform and test method for aging of electronic product |
| CN215375660U (en) * | 2021-08-10 | 2021-12-31 | 马海宾 | Semiconductor chip detection device |
| CN215812368U (en) * | 2021-08-26 | 2022-02-11 | 山东天岳先进科技股份有限公司 | Object stage for detecting wafer defects and defect detection device |
-
2022
- 2022-04-18 CN CN202210406497.1A patent/CN114791475B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109127160A (en) * | 2018-08-10 | 2019-01-04 | 朱治杰 | Medical kit is used in a kind of biomedical detection |
| CN213301624U (en) * | 2020-09-10 | 2021-05-28 | 燎原检测技术(深圳)有限公司 | Electronic product detection equipment convenient to take |
| CN211741503U (en) * | 2020-09-14 | 2020-10-23 | 武汉精鸿电子技术有限公司 | Semiconductor test equipment capable of automatically opening and closing door |
| CN215375660U (en) * | 2021-08-10 | 2021-12-31 | 马海宾 | Semiconductor chip detection device |
| CN215812368U (en) * | 2021-08-26 | 2022-02-11 | 山东天岳先进科技股份有限公司 | Object stage for detecting wafer defects and defect detection device |
| CN113777475A (en) * | 2021-11-15 | 2021-12-10 | 枣庄智博智能科技有限公司 | Automatic test platform and test method for aging of electronic product |
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