CN211741503U - Semiconductor test equipment capable of automatically opening and closing door - Google Patents
Semiconductor test equipment capable of automatically opening and closing door Download PDFInfo
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- CN211741503U CN211741503U CN202022003578.6U CN202022003578U CN211741503U CN 211741503 U CN211741503 U CN 211741503U CN 202022003578 U CN202022003578 U CN 202022003578U CN 211741503 U CN211741503 U CN 211741503U
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Abstract
The application relates to a but semiconductor test equipment of automatic switch door belongs to semiconductor test equipment technical field, includes: the test box body is provided with two cavities with openings at the tops, test boards are arranged in the two cavities, and the tops of the two cavities are provided with upper covers; and the upper cover driving assembly comprises a translation mechanism and a lifting mechanism which are used for driving the two upper covers to move along the horizontal direction and the vertical direction respectively. The semiconductor test equipment does not need to plug and pull the test board when carrying out aging test on the semiconductor chip, and the service life of the test board is prolonged. Meanwhile, the upper cover is provided with an upper cover driving assembly, so that the upper cover can be automatically opened and closed, and the aging test efficiency is improved.
Description
Technical Field
The application relates to the technical field of semiconductor test equipment, in particular to semiconductor test equipment capable of automatically opening and closing a door.
Background
In order to achieve the yield of semiconductor chips, almost all semiconductor chips are subjected to burn-in test before shipment. The burn-in test is to provide necessary system signals for the semiconductor chip to be tested through a test board, simulate the working state of the semiconductor chip, accelerate the electrical fault of the semiconductor chip under the condition of high temperature or other conditions, acquire the fault rate of the semiconductor chip within a period of time, and enable the semiconductor chip to work under a given load state to enable the defects of the semiconductor chip to appear within a short time, thereby obtaining the approximate fault rate of the semiconductor chip in the life cycle and avoiding the faults occurring in the early stage of use.
In the related art, the aging test equipment mostly adopts a side door opening mode, a plurality of layers of test boards are arranged in the aging test equipment, and the test boards are arranged along the height direction of the aging test equipment. The method comprises the steps that a test board is pulled out by opening a side door during each aging test, a semiconductor chip to be tested is mounted on the test board, and then the test board and the semiconductor chip are inserted into an aging test device together to close the side door for aging test; and after the aging test is finished, opening a side door to pull the test board and the semiconductor chips out of the aging test equipment, and performing the aging test on the semiconductor chips of the next batch so as to repeat the aging test.
However, the aging test device with the side door opening mode needs to be inserted and pulled out of the test board during each aging test, and because the aging test interface of the test board is plugged into the wall connector mounted on the aging test device by using a golden finger or a high-density connector, the aging test interface of the frequently plugged test board is easy to damage, which causes poor contact or damage, reduces the service life of the test board and affects the test result of the semiconductor chip. Meanwhile, the door needs to be manually opened and closed during aging test, the automation degree is low, and the door is easily closed untight due to manual opening and closing, so that the test result is inaccurate.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a but semiconductor test equipment of automatic switch door to the aging testing equipment of the side mode of opening the door among the solution correlation technique, frequent plug testboard, the aging testing interface causes the damage easily, leads to contact failure or the breakage to appear, has reduced the problem of the life who surveys the board.
The first aspect of the embodiments of the present application provides a semiconductor test apparatus capable of automatically opening and closing a door, including:
the test box body is provided with two cavities with openings at the tops, test boards are arranged in the two cavities, and the tops of the two cavities are provided with upper covers;
and the upper cover driving assembly comprises a lifting mechanism and a translation mechanism, the lifting mechanism is used for driving the two upper covers to move along the vertical direction, and the translation mechanism is used for driving the two upper covers to move along the horizontal direction.
In some embodiments: the two groups of translation mechanisms are positioned on two sides of the test box body;
the two groups of lifting mechanisms are respectively and fixedly connected to the translation mechanism;
the translation mechanism is used for at least partially translating the upper cover to the upper part of the other upper cover after the upper cover is lifted to a set height by the lifting mechanism.
In some embodiments: the moving direction of the translation mechanism is parallel to the length direction of the two chambers.
In some embodiments: the translation mechanism comprises a linear module and linear guide rails, and the linear module and the linear guide rails are fixedly connected to the two sides of the test box body respectively.
In some embodiments: the lifting mechanism comprises two cylinders, the bottom of one cylinder is connected with the linear module, and the bottom of the other cylinder is connected with the linear guide rail in a sliding mode through a sliding block.
In some embodiments: the two sides of the upper cover are respectively provided with an L-shaped supporting leg, one end of each L-shaped supporting leg is fixedly connected with the upper cover, and the other end of each L-shaped supporting leg is fixedly connected with the lifting mechanism.
In some embodiments: the test box is characterized in that protective covers are arranged on two sides of the test box respectively, a notch for movement of the upper cover is formed in each protective cover, and an organ protective cover is arranged in each notch.
In some embodiments: the testing cabinet is characterized in that machine cases are arranged at two ends of the testing cabinet body, a machine set for injecting a heat source or a cold source into the cavity is arranged in each machine case, and a button for controlling the operation of the machine set and a touch screen for displaying the working state of the machine set are arranged on each machine case.
A second aspect of the embodiments of the present application provides a semiconductor test apparatus capable of automatically opening and closing a door, including:
the testing box body is provided with a cavity with an opening at the top, a testing board is arranged in the cavity, and the top of the cavity is provided with an upper cover;
and the upper cover driving assembly comprises a lifting mechanism and a translation mechanism, the lifting mechanism is used for driving the upper cover to move along the vertical direction, and the translation mechanism is used for driving the upper cover to move along the horizontal direction.
A third aspect of the embodiments of the present application provides a semiconductor test apparatus capable of automatically opening and closing a door, including:
the test box body is provided with a plurality of cavities with openings at the tops, test boards are arranged in the cavities, and upper covers are arranged at the tops of the cavities;
the upper cover driving assembly comprises a lifting mechanism and a translation mechanism, the lifting mechanism is used for driving the upper covers to move along the vertical direction, and the translation mechanism is used for driving the upper covers to move along the horizontal direction.
The beneficial effect that technical scheme that this application provided brought includes:
the embodiment of the application provides semiconductor testing equipment capable of automatically opening and closing a door, and the semiconductor testing equipment is provided with a testing box body, wherein the testing box body is provided with a cavity with an opening at the top, a testing board is arranged in the cavity, the top of the cavity is provided with an upper cover, and the upper cover and the cavity form a closed cavity; the upper cover driving assembly comprises a translation mechanism and a lifting mechanism, the lifting mechanisms are respectively movably arranged on the translation mechanism, and the lifting mechanism is used for lifting the upper cover to a set height; the translation mechanism is used for translating the upper cover to the upper part of another upper cover or other equipment after the upper cover is lifted to a set height.
Therefore, when the semiconductor testing equipment performs the aging test on the semiconductor chip, the upper cover is opened to install the semiconductor chip to be tested on the testing board, and then the upper cover is closed to perform the aging test; and after the aging test is finished, opening the upper cover to take the tested semiconductor chip off the test board. Therefore, the test board does not need to be plugged and pulled out when the semiconductor chip is subjected to the aging test, and the service life of the test board is prolonged. Meanwhile, the upper cover is provided with an upper cover driving assembly, so that the upper cover can be automatically opened and closed, and the aging test efficiency is improved.
In addition, the number of the chambers of the semiconductor testing equipment can be reasonably matched and arranged according to the feeding and discharging time and the testing time, a plurality of chambers in the testing box body can be continuously and circularly tested, the feeding and discharging time of each chamber and the time after the semiconductor testing can be fully utilized, and the working cycle and the semiconductor testing efficiency are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a semiconductor test apparatus according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a hidden shield of the semiconductor test equipment according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a first state of an upper cover of a semiconductor test apparatus according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a second state of an upper cover of a semiconductor test apparatus according to an embodiment of the present application;
FIG. 5 is a schematic view of a hidden upper cover of a semiconductor test apparatus according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of an upper cover and an upper cover driving assembly according to an embodiment of the present application.
Reference numerals:
1. testing the box body; 13. a test board; 14. a protective cover; 15. an organ shield;
2. an upper cover; 21. an L-shaped leg; 3. an upper cover drive assembly; 31. a lifting mechanism; 32. a translation mechanism; 33. cushion blocks; 4. a chassis; 41. a touch screen; 42. a button; 5. the grating is positioned.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a but semiconductor test equipment of automatic switch door, and its aging testing equipment that can solve the side mode of opening the door among the correlation technique, frequent plug testboard, the aging testing interface causes the damage easily, leads to contact failure or the breakage to appear, has reduced the problem of the life who surveys the board.
In the following embodiments of the present application, the application of the semiconductor burn-in test is taken as an example, and the technical solution of the present application is described in detail. However, the embodiments of the present application are not limited thereto, and any semiconductor test apparatus scheme using the inventive concept of the present application is within the scope of the present application.
Referring to fig. 1 to 5, the embodiment of the present application provides a semiconductor test equipment capable of automatically opening and closing a door, the semiconductor test equipment includes a test box body 1, two open-topped chambers are arranged in the test box body 1, a test board 13 horizontally arranged is arranged in each of the two chambers, an upper cover 2 is arranged at the top of each of the two chambers, and the upper cover 2 and the chambers form a closed chamber.
The upper cover 2 is provided with two, the two upper covers 2 are respectively located at the tops of the two cavities, the two upper covers 2 are used for sealing the two cavities, the two upper covers 2 respectively form two closed cavities with the two cavities, and the test board 13 is fixed in the cavities to carry out aging test on the semiconductor chip.
The upper cover driving assembly 3, this upper cover driving assembly 3 includes two sets of lifting mechanism 31 and two sets of translation mechanism 32, and two sets of lifting mechanism 31 are used for driving two upper covers 2 respectively and move along vertical direction, and two sets of translation mechanism 32 are used for driving two upper covers 2 respectively and move along the horizontal direction. The lifting mechanism 31 is used for lifting the upper cover 2 to a set height; and, the translation mechanism 32 is used for translating the upper cover 2 at least partially above another upper cover 2 after the upper cover 2 is lifted to a set height by the lifting mechanism 31.
An interlock switch is arranged between the two groups of translation mechanisms 32 and used for controlling the movement range of the two groups of translation mechanisms 32 and preventing the two groups of translation mechanisms 32 from colliding.
The utility model provides a semiconductor test equipment's test box 1 is equipped with two open-top's cavity, is equipped with two upper covers 2 of two sealed cavities respectively at the top of two cavities, and two airtight cavities that are used for ageing semiconductor chip have been constituteed to two upper covers 2 and two cavities. A test board 13 for mounting a semiconductor chip is provided in each of the two chambers, and the test board 13 is horizontally disposed in the chambers. The closed chamber can provide a set aging test temperature for the semiconductor chip, and the test board 13 is used for electrifying the semiconductor chip and collecting test data of the semiconductor chip.
When one chamber is used for carrying out the burn-in test on the semiconductor chip, the upper cover 2 of the other chamber is opened to install the semiconductor chip to be tested on the test board 13, and then the upper cover 2 is closed to carry out the burn-in test. After the aging test of one of the chambers is completed, the upper cover 2 is opened to take the tested semiconductor chip off the test board 13, and the two chambers can respectively and independently perform the aging test, so that the working beat is improved, the time utilization rate is improved, and the working efficiency is obviously improved. Meanwhile, the test board 13 does not need to be plugged and pulled out when the aging test is performed on the semiconductor chip, the test board 13 is fixedly arranged in the closed cavity, and the service life of the test board 13 is prolonged.
The upper cover 2 is provided with an upper cover driving assembly 3, and the upper cover driving assembly 3 is provided with two groups of lifting mechanisms 31 which respectively drive the two upper covers 2 to move along the vertical direction and two groups of translation mechanisms 32 which respectively drive the two upper covers 2 to move along the horizontal direction. The two groups of lifting mechanisms 31 and the two groups of translation mechanisms 32 realize automatic opening and closing of the two upper covers 2, the automation level and the sealing performance of the upper covers 2 are improved, automatic opening and closing of the two upper covers 2 are realized, and the working efficiency is improved.
In some alternative embodiments: referring to fig. 2 and 6, the embodiment of the present application provides a semiconductor test apparatus capable of automatically opening and closing a door, wherein a translation mechanism 32 of the semiconductor test apparatus is disposed at both sides of a test box 1, and a moving direction of the translation mechanism 32 is parallel to a length direction of two chambers of the test box 1. The lifting mechanism 31 is fixedly connected between the translation mechanism 32 and the upper cover 2, and the translation mechanism 32 is used for driving the lifting mechanism 31 and the upper cover 2 to move in the horizontal direction.
Specifically, the translation mechanism 32 of this embodiment includes a linear module and a linear guide, and a person skilled in the art of the specific structure of the translation mechanism 32 can also select an air cylinder, a hydraulic cylinder, an electric cylinder, a screw mechanism or a rack-and-pinion mechanism to implement the horizontal movement of the upper cover 2. The linear module and the linear guide rail are fixedly connected to two sides of the testing box body 1 through cushion blocks 33 respectively. A set of straight line module and linear guide are used for providing power and motion direction for an upper cover 2, and two upper covers 2 of this embodiment adopt two sets of straight line modules and linear guide to come to provide power and motion direction for two upper covers 2 respectively. Of course, in order to save the cost and weight of the apparatus, the two upper covers 2 may share a linear guide rail to provide the motion guidance.
The lifting mechanism 31 is preferably, but not limited to, an air cylinder, and a person skilled in the art may select a hydraulic cylinder, an electric cylinder, a linear module, a screw mechanism or a rack-and-pinion mechanism to implement the lifting movement of the upper cover 2. The cylinder is equipped with two, and two cylinders are located the both sides of test box 1 respectively, and the cylinder body bottom and the sharp module of one of them cylinder are connected, and slider and linear guide sliding connection are passed through to the cylinder body bottom of another cylinder, and the telescopic link top of two cylinders all with upper cover 2 fixed connection.
When the upper cover 2 is opened, the lifting mechanism 31 is firstly started to drive the upper cover 2 to move upwards, the upper cover 2 is separated from the chamber, then the translation mechanism 32 is driven to drive the upper cover 2 to move towards the other upper cover 2, and the reverse step is adopted when the upper cover 2 is closed. The two upper covers 2 cannot be opened simultaneously, and when one of the upper covers 2 is opened, the other upper cover 2 must be ensured to be in a closed state, so that interference collision when the two upper covers 2 are opened simultaneously is avoided. Therefore, an interlock switch is provided between the two sets of translation mechanisms 32, and the interlock switch is used for controlling the movement range of the two sets of translation mechanisms 32 and preventing interference and collision between the two sets of translation mechanisms 32.
In some alternative embodiments: referring to fig. 5 and 6, in the embodiment of the present application, a semiconductor test device capable of automatically opening and closing a door is provided, wherein L-shaped legs 21 are respectively disposed on two sides of an upper cover 2 of the semiconductor test device, one end of each L-shaped leg 21 is fixedly connected to the upper cover 2, and the other end of each L-shaped leg 21 is fixedly connected to a cylinder of a lifting mechanism 31.
The two upper covers 2 of the present embodiment are respectively connected with the cylinder through the L-shaped legs 21, the L-shaped legs 21 of the two upper covers 2 have different lengths and the same height, the length of the L-shaped leg 21 of one of the upper covers 2 is greater than the length of the L-shaped leg 21 of the other upper cover 2, and after one of the upper covers 2 is opened, the two upper covers 2 can be positioned on the top of the other upper cover 2, thereby ensuring that no interference collision occurs between the two upper covers 2.
Protective covers 14 are respectively arranged on two sides of the test box body 1, the translation mechanism 32 and the lifting mechanism 31 are both positioned in the protective covers 14, notches for movement of the L-shaped supporting legs 21 are formed in the protective covers 14, and organ protective covers 15 are arranged at the notches. Protective covers 14 are respectively arranged on two sides of the test box body 1, and the protective covers 14 can carry out closed protection on the translation mechanism 32 and the lifting mechanism 31 and prevent external objects from damaging moving parts. The organ shield 15 is used to close the slot on the shield 14 and prevent foreign objects from entering the shield 14 and damaging the moving parts.
The top of the protective cover 14 is provided with two groups of positioning gratings 5, the two groups of positioning gratings 5 are respectively positioned at two sides of the protective cover 14, and the positioning gratings 5 are used for controlling the horizontal movement range of the upper cover 2. When the upper cover 2 moves to the set position of the positioning optical grating 5 along the horizontal direction, the positioning optical grating 5 sends a detection signal to the translation mechanism 32, and the translation mechanism 32 stops moving.
In some alternative embodiments: referring to fig. 4 and 5, in the semiconductor test device capable of automatically opening and closing a door provided in the embodiments of the present application, cases 4 are disposed at two ends of a test box 1 of the semiconductor test device, a unit for injecting a heat source and a cold source into the test box 1 is disposed in each case 4, and a button 42 for controlling the operation of the unit and a touch screen 41 for displaying the operating state of the unit are disposed on each case 4. The button 42 can control the start and stop of the unit and adjust the working state of the unit, and the touch screen 41 can display the working state, the operating temperature and the operating time of the unit.
The second aspect of the embodiment provides a semiconductor test equipment capable of automatically opening and closing a door, and the semiconductor test equipment comprises a test box body 1, wherein a cavity with an open top is arranged in the test box body 1, a test board 13 horizontally arranged in the cavity is arranged in the cavity, an upper cover 2 is arranged at the top of the cavity, and the upper cover 2 and the cavity form a closed cavity.
The upper cover driving assembly 3, the upper cover driving assembly 3 includes the translation mechanism 32 and the lifting mechanism 31, the lifting mechanism 31 is movably assembled on the translation mechanism 32, the lifting mechanism 31 is used for lifting the upper cover 2 to the set height; moreover, the translation mechanism 32 is used for translating the upper cover 2 to the top of other equipment after the upper cover 2 is lifted to a set height, and the other equipment can be a workbench at one side of the test box body 1 or other equipment matched with the test box body 1, so that the arrangement space of the equipment is saved, and the space utilization rate is improved.
The third aspect of this embodiment provides a but semiconductor test equipment of automatic switch door, and this semiconductor test equipment includes test box 1, is equipped with a plurality of open-top's cavity in the test box 1, and the concrete quantity of cavity is specifically set for according to actual need, all is equipped with in a plurality of cavities and surveys test panel 13, and the top of a plurality of cavities all is equipped with upper cover 2, and airtight cavity is constituteed with the cavity to upper cover 2.
The upper cover driving assembly 3, this upper cover driving assembly 3 includes multiunit lifting mechanism 31 and multiunit translation mechanism 32, and multiunit lifting mechanism 31 is used for driving a plurality of upper covers 2 respectively and moves along vertical direction, and multiunit translation mechanism 32 is used for driving a plurality of upper covers 2 respectively and moves along the horizontal direction. The lifting mechanism 31 is used for lifting the upper cover 2 to a set height; and, the translation mechanism 32 is used to translate the upper lids 2 at least partially above the other upper lids 2 after the upper lids 2 are lifted to the set height.
Principle of operation
The utility model provides a but semiconductor test equipment of automatic switch door because the semiconductor test equipment of this application has set up test box 1, is equipped with open-top's cavity in this test box 1, is equipped with in the cavity and surveys test panel 13, all is equipped with upper cover 2 at the top of cavity, and airtight cavity is constituteed with the cavity to upper cover 2. The upper cover driving assembly 3, the upper cover driving assembly 3 includes the translation mechanism 32 and lifts the organization 31, the lifting organization 31 is set up in the translation mechanism 32 movably separately, the lifting organization 31 is used for lifting the upper cover 2 to the set height; the translation mechanism 32 is used to translate the upper cover 2 over another upper cover 2 or other equipment after the upper cover 2 is lifted to a set height.
When the semiconductor testing equipment performs the aging test on the semiconductor chip, the upper cover 2 is opened to install the semiconductor chip to be tested on the testing board 13, and then the upper cover 2 is closed to perform the aging test; after the burn-in test is completed, the upper cover is opened and the semiconductor chip that has been tested is removed from the test board 13. Therefore, the test board 13 does not need to be inserted and pulled out when the burn-in test is performed on the semiconductor chip, and the service life of the test board 13 is prolonged. Simultaneously, the upper cover 2 is provided with the upper cover driving assembly 3, so that the upper cover 2 can be automatically opened and closed, and the aging test efficiency is improved. The utility model provides an aging testing of single chamber, two-chamber and multicavity room can be realized to the test box body to realize the automatic switch of single upper cover, two upper covers and many upper covers, strengthened the work beat, practiced thrift aging testing time, very big improvement aging testing efficiency.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A semiconductor test apparatus capable of automatically opening and closing a door, comprising:
the test box comprises a test box body (1) and a test box body, wherein the test box body is provided with two cavities with openings at the tops, test boards (13) are arranged in the two cavities, and upper covers (2) are arranged at the tops of the two cavities;
the upper cover driving assembly (3) comprises a lifting mechanism (31) and a translation mechanism (32), wherein the lifting mechanism (31) is used for driving the two upper covers (2) to move along the vertical direction, and the translation mechanism (32) is used for driving the two upper covers (2) to move along the horizontal direction.
2. The semiconductor test apparatus capable of automatically opening and closing a door according to claim 1, wherein:
the two groups of translation mechanisms (32) are arranged, and the two groups of translation mechanisms (32) are positioned on two sides of the test box body (1);
two groups of lifting mechanisms (31) are arranged, and the two groups of lifting mechanisms (31) are respectively and fixedly connected to the translation mechanism (32);
the translation mechanism (32) is used for translating the upper cover (2) at least partially above another upper cover (2) after the upper cover (2) is lifted to a set height by the lifting mechanism (31).
3. The semiconductor test apparatus capable of automatically opening and closing a door according to claim 1, wherein:
the moving direction of the translation mechanism (32) is parallel to the length direction of the two chambers.
4. A semiconductor test apparatus capable of automatically opening and closing a door according to any one of claims 1 to 3, wherein:
translation mechanism (32) include sharp module and linear guide, sharp module and linear guide respectively fixed connection be in the both sides of test box (1).
5. The semiconductor test apparatus capable of automatically opening and closing a door according to claim 4, wherein:
the lifting mechanism (31) comprises two cylinders, wherein the bottom of one cylinder is connected with the linear module, and the bottom of the other cylinder is connected with the linear guide rail in a sliding mode through a sliding block.
6. The semiconductor test apparatus capable of automatically opening and closing a door according to claim 1, wherein:
the two sides of the upper cover (2) are respectively provided with an L-shaped supporting leg (21), one end of the L-shaped supporting leg (21) is fixedly connected with the upper cover (2), and the other end of the L-shaped supporting leg (21) is fixedly connected with a lifting mechanism (31).
7. The semiconductor test apparatus capable of automatically opening and closing a door according to claim 1, wherein:
protective covers (14) are respectively arranged on two sides of the test box body (1), a notch for movement of the upper cover (2) is formed in each protective cover (14), and an organ protective cover (15) is arranged on each notch.
8. The semiconductor test apparatus capable of automatically opening and closing a door according to claim 1, wherein:
the testing device is characterized in that machine cases (4) are arranged at two ends of the testing box body (1), a machine set for injecting a heat source or a cold source into the cavity is arranged in each machine case (4), and a button (42) for controlling the machine set to operate and a touch screen (41) for displaying the working state of the machine set are arranged on each machine case (4).
9. A semiconductor test apparatus capable of automatically opening and closing a door, comprising:
the test box comprises a test box body (1) and a test board (13), wherein the test box body is provided with a cavity with an opening at the top, and the top of the cavity is provided with an upper cover (2);
the upper cover driving assembly (3) comprises a lifting mechanism (31) and a translation mechanism (32), wherein the lifting mechanism (31) is used for driving the upper cover (2) to move along the vertical direction, and the translation mechanism (32) is used for driving the upper cover (2) to move along the horizontal direction.
10. A semiconductor test apparatus capable of automatically opening and closing a door, comprising:
the testing device comprises a testing box body (1), a plurality of cavities with openings at the tops, a plurality of testing boards (13) arranged in the cavities, and upper covers (2) arranged at the tops of the cavities;
the upper cover driving assembly (3) comprises a lifting mechanism (31) and a translation mechanism (32), wherein the lifting mechanism (31) is used for driving the plurality of upper covers (2) to move along the vertical direction, and the translation mechanism (32) is used for driving the plurality of upper covers (2) to move along the horizontal direction.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022003578.6U CN211741503U (en) | 2020-09-14 | 2020-09-14 | Semiconductor test equipment capable of automatically opening and closing door |
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| CN202022003578.6U CN211741503U (en) | 2020-09-14 | 2020-09-14 | Semiconductor test equipment capable of automatically opening and closing door |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113777475A (en) * | 2021-11-15 | 2021-12-10 | 枣庄智博智能科技有限公司 | Automatic test platform and test method for aging of electronic product |
| TWI760048B (en) * | 2020-12-30 | 2022-04-01 | 新加坡商Ｍｓｖ系統&服務私人有限公司 | Apparatus, transfer method, chamber and frame for semiconductor burn-in process |
| CN114791475A (en) * | 2022-04-18 | 2022-07-26 | 深圳模微半导体有限公司 | Semiconductor chip defect detection device and detection method |
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2020
- 2020-09-14 CN CN202022003578.6U patent/CN211741503U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI760048B (en) * | 2020-12-30 | 2022-04-01 | 新加坡商Ｍｓｖ系統&服務私人有限公司 | Apparatus, transfer method, chamber and frame for semiconductor burn-in process |
| CN113777475A (en) * | 2021-11-15 | 2021-12-10 | 枣庄智博智能科技有限公司 | Automatic test platform and test method for aging of electronic product |
| CN113777475B (en) * | 2021-11-15 | 2022-01-25 | 枣庄智博智能科技有限公司 | Automatic test platform and test method for aging of electronic product |
| CN114791475A (en) * | 2022-04-18 | 2022-07-26 | 深圳模微半导体有限公司 | Semiconductor chip defect detection device and detection method |
| CN114791475B (en) * | 2022-04-18 | 2024-06-14 | 深圳晨芯时代科技有限公司 | Device and method for detecting defects of semiconductor chip |
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