CN221178238U

CN221178238U - Signal shielding and heat dissipation structure

Info

Publication number: CN221178238U
Application number: CN202322675968.1U
Authority: CN
Inventors: 郑志; 崔长将
Original assignee: Zhejiang Cambridge Communication Equipment Co ltd
Current assignee: Zhejiang Cambridge Communication Equipment Co ltd
Priority date: 2023-10-07
Filing date: 2023-10-07
Publication date: 2024-06-18
Anticipated expiration: 2033-10-07

Abstract

The application discloses a signal shielding and heat radiating structure, which comprises a shielding heat conducting piece fixedly arranged on a control board and covered on a BOSA device, wherein the shielding heat conducting piece comprises a cover body for signal shielding and a heat conducting plate integrally arranged on the outer surface of the cover body.

Description

Signal shielding and heat dissipation structure

Technical Field

The utility model relates to the technical field of optical fiber communication systems, in particular to a signal shielding and heat dissipation structure.

Background

BOSA is an integrated optical device used in an optical fiber communication system for converting an optical signal into an electrical signal or vice versa, and has a high requirement for its operation stability because BOSA plays a key role in the optical fiber communication system.

To ensure high quality signal transmission and detection, the BOSA requires proper shielding to reduce the effects of external electromagnetic interference on it, while its operating environment is maintained within a safe temperature range to prevent degradation and damage to the BOSA caused by overheating.

The shielding signal and heat dissipation design scheme of the existing BOSA device is as shown in fig. 1, the shielding frame 410 and the shielding cover 420 form a signal shielding space of the BOSA device, and meanwhile, the heat conduction glue 300 and the heat dissipation fins 430 conduct heat on the BOSA device.

Disclosure of utility model

Aiming at the defects of the prior art, the utility model provides the signal shielding and heat dissipating structure which has the advantages of simple structure, convenience in installation and strong working stability.

In order to achieve the above object, the present utility model is achieved by the following technical scheme.

The application provides a signal shielding and heat dissipation structure, which comprises a shielding heat conduction piece fixedly arranged on a control board and covered on a BOSA device;

The shielding heat-conducting piece comprises a cover body and a heat-conducting plate which is integrally formed on the outer surface of the cover body, a shielding cavity for accommodating the BOSA device is arranged in the cover body, and heat-conducting glue is arranged between the inner wall of one side of the shielding cavity, which is close to the heat-conducting plate, and the BOSA device;

The cover body is used for shielding signals, and heat of the BOSA device can be conducted to the heat conducting plate through the heat conducting glue to achieve heat dissipation.

Further limited, the signal shielding and heat dissipating structure is characterized in that the heat conducting plate is provided with a plurality of parallel plates on the end face of the cover body far away from the control board.

Further limited, in the signal shielding and heat dissipating structure, a positioning frame capable of being abutted to the BOSA device is fixedly arranged on the inner wall of the shielding cavity close to one side of the heat conducting plate;

the abutting surface of the locating frame and the BOSA device is matched with the outer surface of the corresponding position of the BOSA device in shape.

Further limited, the signal shielding and heat dissipating structure is characterized in that a connecting cavity is arranged on the end surface of one side of the locating rack, which is far away from the heat conducting plate;

Wherein, the heat conduction glue inlays and establishes in linking the intracavity and keep away from heat-conducting plate one side terminal surface and laminating with BOSA device.

Further limited, the signal shielding and heat dissipating structure is characterized in that a connecting cavity is arranged on the inner wall of one side of the shielding cavity, which is close to the heat conducting plate;

Further limited, the signal shielding and heat dissipating structure is characterized in that a through hole is arranged between the side wall of the shielding cavity and the end face of the corresponding side of the cover body;

The signal transmission end of the BOSA device can extend to the outer side of the shielding heat conducting piece through the through hole.

Further limited, in the signal shielding and heat dissipating structure, a plurality of plug-ins are fixedly arranged on the end face of the cover body, which is close to one side of the control board, along the edge;

The control board is provided with jacks which can be inserted with the plug-ins in corresponding positions of the plug-ins.

The utility model has at least the following beneficial effects:

1. Aiming at the shielding signal and heat dissipation requirement of the BOSA device, a signal shielding and heat dissipation structure is integrally arranged on the shielding heat conduction piece, namely, the signal shielding is realized through the cover body, and meanwhile, the heat conduction and heat dissipation of the BOSA device are realized through the heat conduction glue and the heat conduction plate;

2. The BOSA device is positioned through the positioning frame, so that the self shock resistance of the BOSA device is improved, and the installation stability and the working reliability of the BOSA device are further enhanced;

3. The heat conducting glue is positioned through the connecting cavity, and meanwhile the distance between the heat conducting glue and the heat conducting plate can be shortened through the connecting cavity, so that the heat conducting efficiency from the heat conducting glue to the heat conducting plate is improved, and the heat dissipation effect on the BOSA device is further improved.

Drawings

FIG. 1 is a schematic diagram of a prior art shielding signal and heat dissipation scheme for a BOSA device 200;

FIG. 2 is a schematic diagram of a signal shielding and heat dissipating structure according to an embodiment of the present application;

FIG. 3 is a schematic exploded view of a signal shielding and heat dissipating structure according to an embodiment of the present application;

Fig. 4 is a schematic structural diagram of a "shielding heat-conducting member 500" in the signal shielding and heat dissipating structure according to an embodiment of the present application;

Fig. 5 is a schematic structural diagram of a "shielding heat-conducting member 500" in the signal shielding and heat dissipating structure according to an embodiment of the present application.

Reference numerals

The heat-conducting plate comprises a control panel-100, a BOSA device-200, a heat-conducting adhesive-300, a shielding frame-410, a shielding cover-420, a radiating fin-430, a shielding heat-conducting piece-500, a cover body-510, a heat-conducting plate-520, a shielding cavity-530, a positioning frame-540, a connecting cavity-550, an insert-560 and a perforation-570.

Detailed Description

The technical solutions of the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which are obtained by a person skilled in the art based on the embodiments of the present application, fall within the scope of protection of the present application.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The signal shielding and heat dissipation structure provided by the embodiment of the application is described in detail below by means of specific embodiments and application scenarios thereof with reference to the accompanying drawings.

The embodiment of the present application provides a signal shielding and heat dissipating structure, as shown in fig. 2 to 5, including a shielding heat conductive member 500 fixedly disposed on a control board 100 and covering a BOSA device 200.

The shielding heat-conducting member 500 comprises a cover body 510 for shielding signals and a heat-conducting plate 520 integrally arranged on the outer surface of the cover body 510, wherein a shielding cavity 530 for accommodating the BOSA device 200 is arranged in the cover body 510, and a heat-conducting adhesive 300 is arranged between the inner wall of one side of the shielding cavity 530, which is close to the heat-conducting plate 520, and the BOSA device 200.

The heat-conducting glue 300 can conduct the heat generated by the BOSA device 200 to the heat-conducting plate 520 and dissipate the heat by the heat-conducting plate 520.

In the embodiment of the application, the signal shielding and heat dissipation structure is integrally arranged on the shielding heat conducting member 500 according to the shielding signal and heat dissipation requirement of the BOSA device 200, namely, the signal shielding is realized through the cover body 510, and meanwhile, the heat conduction and heat dissipation of the BOSA device 200 are realized through the heat conducting glue 300 and the heat conducting plate 520.

It can be understood that the cover 510 and the heat conducting plate 520 can be integrally formed by adopting materials with signal shielding and heat dissipation properties, such as copper, aluminum, etc., or the cover 510 and the heat conducting plate 520 are integrally formed by adopting heat dissipation materials, and meanwhile, the cover 510 is provided with signal shielding paint, so that the shielding heat conducting member 500 can also integrate signal shielding and heat dissipation.

Of course, the cover 510 and the heat conducting plate 520 can also be integrally formed by adopting different functional materials, but the processing difficulty of the heat conducting plate is greatly improved, so that the economical efficiency of the shielding heat conducting piece 500 is affected.

In a preferred embodiment, as shown in fig. 2 to 5, a plurality of heat conductive plates 520 are disposed parallel to each other on an end surface of the cover 510 on a side far from the control board 100.

It can be appreciated that when the heat conducting plate 520 is disposed at the top of the cover 510, the heat conducted to the heat conducting plate 520 by the BOSA device 200 can be fully dispersed along the gaps between the heat conducting plates 520, and the heated air at the corresponding position of the heat conducting plate 520 will not be interfered by the heat conducting plate 520 when rising, thereby improving the heat dissipation effect.

In a preferred embodiment, as shown in fig. 5, a through hole 570 is formed between the side wall of the shielding cavity 530 and the corresponding side end surface of the cover 510, and the signal transmission end of the bosa device 200 extends to the outside of the shielding heat conducting member 500 through the through hole 570.

In a preferred embodiment, as shown in fig. 5, a positioning frame 540 capable of abutting against the BOSA device 200 is fixedly disposed on an inner wall of the shielding cavity 530 on a side far from the control board 100.

It is appreciated that the abutment surface of the positioning frame 540 is in shape fit with the outer surface of the BOSA device 200 at the corresponding position, thereby positioning the BOSA device 200.

In the embodiment of the present application, the positioning frame 540 is used to position the BOSA device 200 by adopting the signal shielding and heat dissipation structure, so as to improve the self shock resistance of the BOSA device 200, thereby further enhancing the installation stability and the working reliability of the BOSA device 200.

In a preferred embodiment, as shown in fig. 5, a connecting cavity 550 is disposed on an end surface of the positioning frame 540 near the control board 100, and the heat conductive adhesive 300 is embedded in the connecting cavity 550 and is attached to the BOSA device 200 near the end surface of the control board 100.

In the embodiment of the present application, the signal shielding and heat dissipation structure is adopted, the heat conducting glue 300 is positioned through the linking cavity 550, and meanwhile, the distance between the heat conducting glue 300 and the heat conducting plate 520 can be shortened through the linking cavity 550, so that the heat conduction efficiency from the heat conducting glue 300 to the heat conducting plate 520 is improved, and the heat dissipation effect on the BOSA device 200 is further improved.

It is to be understood that the arrangement form of the connection cavity 550 is not limited to the above-mentioned one, for example, the connection cavity 550 can be directly disposed on the inner wall of the side of the shielding cavity 530 away from the control board 100, so long as the positioning of the heat-conducting glue 300 in the connection cavity 550 and the heat conduction of the heat-conducting glue 300 between the BOSA device 200 and the heat-conducting board 520 can be achieved, which is not described herein in detail.

In a preferred embodiment, as shown in fig. 3 to 5, a plurality of inserts 560 are fixedly provided along the edge on the end surface of the cover 510 near one side of the control board 100.

Wherein, the control board 100 is provided with jacks corresponding to the plurality of plug-ins 560, and when the shielding and heat conducting member 500 is fixedly arranged on the control board 100, the plug-ins 560 are matched with the jacks on the control board 100 to realize the positioning of the cover 510.

In a preferred embodiment, the fixing manner of the shielding and heat-conducting member 500 on the control board 100 can be an adhesive, screw connection, clamping connection, etc., so long as the fixing of the cover 510 on the control board 100 can be achieved, and detailed description thereof will be omitted.

In a preferred embodiment, the control board 100 is embodied as a PCB board.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.

Claims

1. The signal shielding and heat dissipating structure is characterized by comprising a shielding heat conducting piece fixedly arranged on a control board and covered on a BOSA device;

2. The signal shielding and heat dissipating structure of claim 1, wherein the heat conducting plate is provided with a plurality of mutually parallel heat conducting plates on an end surface of the cover body on a side far away from the control board.

3. The signal shielding and heat dissipating structure according to claim 1, wherein a positioning frame capable of being abutted against the BOSA device is fixedly arranged on the inner wall of the shielding cavity on one side close to the heat conducting plate;

4. The signal shielding and heat dissipating structure of claim 3, wherein the positioning frame has a connecting cavity on an end surface of one side away from the heat conducting plate;

5. A signal shielding and heat dissipating structure according to any one of claims 1 to 3, wherein a joint cavity is provided on an inner wall of the shielding cavity on a side close to the heat conducting plate;

6. The signal shielding and heat dissipating structure according to claim 1, wherein a through hole is provided between the side wall of the shielding cavity and the end surface of the corresponding side of the cover;

7. The signal shielding and heat dissipating structure according to claim 1, wherein a plurality of plug-ins are fixedly provided along an edge on an end face of the cover body on one side close to the control board;