CN221176206U - Electronic packaging piece - Google Patents

Abstract

The utility model provides an electronic package, comprising: an electronic component, the electronic component is provided with a welding pad; a first carrier and a second carrier, the first carrier and the second carrier are coated on the periphery of the electronic component, a conductive track is provided on the first carrier, and the welding pad is electrically connected to the conductive track; a heat sink, the heat sink is provided on the second carrier, the heat sink comprises a heat sink body and two or more heat sink secondary bodies, the two or more heat sink secondary bodies are arranged at intervals along the periphery of the heat sink body, the heat sink secondary bodies are located on the first side of the heat sink body, and the electronic component is located on the second side of the heat sink body. The utility model reasonably plans the position of the electronic package, avoids the heat accumulation generated by the electronic component, improves the heat dissipation efficiency, and makes the heat dissipation effect of the electronic package good.

Description

An electronic package

Technical Field

The utility model relates to the technical field of electronic packaging, in particular to an electronic packaging component.

Background technique

Electronic packaging is the tube shell used to install the integrated circuit's built-in chip, which is used to place, fix and seal the integrated circuit's built-in chip to protect the integrated circuit's built-in chip and enhance its environmental adaptability.

In the existing packaging, the bare chip is mounted closely on the substrate, and then multiple metal wires (bonding wires, generally gold wires) are used to connect the metal contact points on the bare chip with external pins through welding, and then buried in resin and sealed with a plastic tube shell to form the chip as a whole.

However, this packaging method has certain problems. When the chip is working, it will emit a certain amount of heat, but the completely encapsulated chip cannot dissipate the heat to the outside through the packaging structure, which in turn has a certain degree of impact on the processing speed of the chip.

Utility Model Content

In order to overcome the defects of the prior art, the utility model provides an electronic package, and the specific technical solution is as follows:

An electronic package, comprising:

An electronic component, wherein the electronic component is provided with a welding pad;

A first carrier and a second carrier, wherein the first carrier and the second carrier cover the periphery of the electronic component, a conductive track is disposed on the first carrier, and the welding pad is electrically connected to the conductive track;

A heat sink, which is arranged on the second carrier, and includes a heat sink body and two or more heat sink sub-bodies, wherein the two or more heat sink sub-bodies are arranged at intervals along the periphery of the heat sink body, the heat sink sub-bodies are located on a first side of the heat sink body, and the electronic component is located on a second side of the heat sink body.

In a specific embodiment, the heat sink comprises a first heat sink and a second heat sink;

The first heat sink is parallel to the heat sink, and forms a flush surface with a surface of the second carrier away from the first carrier. Two ends of the second heat sink are respectively connected to the first heat sink and the heat sink.

In a specific embodiment, the electronic component has a first surface and a second surface, and the first surface is in contact with the heat dissipation body;

The first surface is provided with the soldering pad, the soldering pad is electrically connected to the conductive track through a wire, and the ratio of the projected area of the heat dissipation body on the plane where the electronic component is located to the area of the first surface is between 75% and 90%;

Alternatively, the second surface is provided with the solder pad, the solder pad is electrically connected to the conductive track via a solder ball, and the ratio of the projected area of the heat dissipation body on the plane where the electronic component is located to the area of the first surface is ≥100%.

In a specific embodiment, the projection of the heat dissipation body on the plane where the electronic component is located is a square, the more than two heat dissipation sub-bodies include four heat dissipation sub-bodies, and the four sides of the heat dissipation body are respectively connected to the second heat dissipation sub-bodies of the four heat dissipation sub-bodies;

The first heat sink of the heat sink comprises a trapezoidal portion and a square portion, the upper bottom side of the trapezoidal portion is connected to the second heat sink, and the lower bottom side of the trapezoidal portion is connected to the first heat sink.

In a specific embodiment, the projection of the heat dissipation body on the plane where the electronic component is located is a rectangle, the more than two heat dissipation sub-bodies include two heat dissipation sub-bodies, and the two long sides of the heat dissipation body are respectively connected to the second heat dissipation sub-bodies of the two heat dissipation sub-bodies.

In a specific embodiment, the axis of the heat dissipation body coincides with the axis of the electronic component.

In a specific embodiment, the angle between the second heat sink and the perpendicular line of the plane where the first heat sink is located is between 5° and 45°;

The angle between the second heat sink secondary body and a perpendicular line to the plane where the heat sink main body is located is between 5° and 45°.

In a specific embodiment, the distance between the first heat dissipation secondary body and the heat dissipation main body is greater than 90 nm.

In a specific embodiment, the heat dissipation main body and the heat dissipation secondary body are integrally formed.

In a specific embodiment, the electronic component and the heat dissipation body are connected via a thermally conductive colloid.

The utility model has at least the following beneficial effects:

The utility model discloses an electronic packaging component, comprising: an electronic component, wherein the electronic component is provided with a welding pad; a first carrier and a second carrier, wherein the first carrier and the second carrier are coated on the periphery of the electronic component, wherein a conductive track is provided on the first carrier, and the welding pad is electrically connected to the conductive track; and a heat sink, wherein the heat sink is provided on the second carrier, and wherein the heat sink comprises a heat sink body and two or more heat sink sub-bodies, wherein the two or more heat sink sub-bodies are arranged at intervals along the periphery of the heat sink body, wherein the heat sink sub-bodies are located on a first side of the heat sink body, and the electronic component is located on a second side of the heat sink body.

The utility model reasonably plans the position of the electronic package, and arranges the electronic components and the heat sink on both sides of the contact surface between the electronic components and the heat sink, so that the heat sink is far away from the electronic components. Compared with the technical solution of the prior art in which the heat sink and the electronic components are gathered, the utility model receives the heat generated by the electronic components through the heat sink main body, and then dissipates the received heat outward through the heat sink sub-body far away from the electronic components, thereby avoiding the accumulation of heat generated by the electronic components, improving the heat dissipation efficiency, and achieving good heat dissipation effect of the electronic package.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

FIG1 is a first structural schematic diagram of an electronic package provided in Example 1;

FIG2 is a second structural schematic diagram of an electronic package provided in Example 1;

FIG3 is a first structural schematic diagram of an electronic package provided in Example 2;

FIG. 4 is a second structural schematic diagram of an electronic package provided in Example 2.

Reference numerals:

1-electronic component; 2-first carrier; 3-second carrier; 4-heat sink; 11-solder pad; 12-first surface; 13-second surface; 21-conductive track; 22-conducting wire; 23-solder ball; 41-heat sink body; 42-heat sink secondary body; 121-thermal conductive colloid; 131-adhesive colloid; 421-first heat sink secondary body; 422-second heat sink secondary body; 4211-trapezoidal portion; 4212-square portion.

Detailed ways

In the following, various embodiments of the present invention will be described more fully. The present invention may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present invention to the specific embodiments disclosed herein, but rather the present invention should be understood to cover all adjustments, equivalents and/or alternatives that fall within the spirit and scope of the various embodiments of the present invention.

Hereinafter, the terms "include" or "may include" used in various embodiments of the present invention indicate the presence of disclosed functions, operations or elements, and do not limit the addition of one or more functions, operations or elements. In addition, as used in various embodiments of the present invention, the terms "include", "have" and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the presence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

In various embodiments of the present invention, the expression "or" or "at least one of A or/and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or/and B" may include A, may include B, or may include both A and B.

The expressions (such as "first", "second", etc.) used in various embodiments of the present invention may modify various constituent elements in various embodiments, but may not limit the corresponding constituent elements. For example, the above expressions do not limit the order and/or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of various embodiments of the present invention, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

It should be noted that in the present invention, unless otherwise clearly specified and defined, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

In the present invention, those skilled in the art need to understand that the terms indicating orientation or positional relationship herein are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

The terms used in the various embodiments of the present invention are only used for the purpose of describing specific embodiments and are not intended to limit the various embodiments of the present invention. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. Unless otherwise defined, all terms used herein (including technical terms and scientific terms) have the same meaning as the meanings commonly understood by ordinary technicians in the field of the various embodiments of the present invention. The terms (such as the terms defined in the dictionary used in general) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly defined in the various embodiments of the present invention.

As shown in FIGS. 1 to 4 , this embodiment provides an electronic package, including:

The electronic component 1 is provided with a soldering pad 11;

A first carrier 2 and a second carrier 3, the first carrier 2 and the second carrier 3 are coated on the outer periphery of the electronic component 1, a conductive track 21 is arranged on the first carrier 2, and the pad 11 is electrically connected to the conductive track 21;

The heat sink 3 is arranged on the second carrier 3, and the heat sink 3 includes a heat sink body 31 and two or more heat sink sub-bodies 32. The two or more heat sink sub-bodies 32 are arranged at intervals along the periphery of the heat sink body 31. The heat sink sub-bodies 32 are located on a first side of the heat sink body 31, and the electronic component 1 is located on a second side of the heat sink body 32.

The utility model reasonably plans the position of the electronic package, and arranges the electronic components and the heat sink on both sides of the contact surface between the electronic components and the heat sink, so that the heat sink is far away from the electronic components. Compared with the technical solution of the prior art in which the heat sink and the electronic components are gathered, the utility model receives the heat generated by the electronic components through the heat sink main body, and then dissipates the received heat outward through the heat sink sub-body far away from the electronic components, thereby avoiding the accumulation of heat generated by the electronic components, improving the heat dissipation efficiency, and achieving good heat dissipation effect of the electronic package.

Example 1

As shown in Figures 1 and 2, in this embodiment, the electronic component 1 has a first surface 12 and a second surface 13 relative to each other. The electronic component 1 is located on the second carrier 3. The first surface 12 of the electronic component is in contact with the heat dissipation body 41. The second surface 13 of the electronic component is exposed to the surface of the second carrier 3 on the side close to the first carrier 2. The first carrier 2 and the second carrier 3 cooperate with each other to cover the electronic component 1.

Specifically, in one embodiment, the second surface 13 of the electronic component is connected to the first carrier 2 via an adhesive colloid 131. The adhesive colloid 131 is preferably an electrically insulating glue.

Specifically, in one embodiment, the first carrier 2 and the second carrier 3 are made of insulating material. Preferably, the first carrier 2 and the second carrier 3 are resin.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the first surface 12 of the electronic component and the heat dissipation body 41 are connected via a thermally conductive adhesive 121 to improve the ability of the heat dissipation body 41 to receive heat generated by the electronic component 1 .

Specifically, the thermally conductive colloid 121 is a colloid that allows heat transfer, preferably a colloid with a thermal conductivity greater than 32 W/mK.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the heat dissipation body 41 and the heat dissipation sub-body 42 are integrally formed. This arrangement reduces the number of connection points between the heat dissipation body 41 and the heat dissipation sub-body 42 , facilitates production and installation, and facilitates heat conduction and subsequent heat dissipation.

In one embodiment, the heat dissipation main body 41 and the heat dissipation secondary body 42 are made of a thermally conductive material, which is a material with a thermal conductivity greater than 390 W/mK, such as a metal, preferably copper, but not limited thereto.

As shown in Figures 1 and 2, in one embodiment, the heat dissipation sub-body 42 includes a first heat dissipation sub-body 421 and a second heat dissipation sub-body 422; the first heat dissipation sub-body 421 is parallel to the heat dissipation main body 41, and the first heat dissipation sub-body 421 forms a flush surface with the surface of the second carrier 3 on the side away from the first carrier 2, and the two ends of the second heat dissipation sub-body 422 are respectively connected to the first heat dissipation sub-body 421 and the heat dissipation main body 41.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the angle between the second heat dissipation secondary body 422 and the perpendicular line of the plane where the first heat dissipation secondary body 421 is located is between 5° and 45°, and the angle between the second heat dissipation secondary body 422 and the perpendicular line of the plane where the heat dissipation main body 41 is located is between 5° and 45°.

This embodiment limits the angle at which the second heat sink 422 is connected to the first heat sink 421 and the heat sink body 41 , thereby improving the structural strength of the heat sink 4 and preventing the heat sink 4 from having low structural strength, being easily damaged and having a short service life.

As shown in Figures 1 and 2, in one embodiment, a soldering pad 11 is provided on the first surface 12 of the electronic component, the first surface 12 of the electronic component is in contact with a heat dissipation body 41, a projection of the heat dissipation body 41 on the plane where the electronic component 1 is located does not overlap with the soldering pad 11, and a ratio of a projection area of the heat dissipation body 41 on the plane where the electronic component 1 is located to an area of the first surface 12 of the electronic component is between 75% and 90%.

In this embodiment, the heat dissipation body 41 maintains a relatively large contact area with the electronic component 1 , which helps the heat dissipation body 41 to receive the heat generated by the electronic component 1 .

As shown in FIG. 1 and FIG. 2 , in one embodiment, the pad 11 is electrically connected to the conductive track 21 through the wire 22 , and the distance between the heat dissipation body 41 and the first heat dissipation secondary body 421 is greater than 90 nm to avoid contact between the heat dissipation secondary body 42 and the wire, so that the heat dissipation element 4 remains insulated.

Preferably, the distance between the heat dissipation body 41 and the first heat dissipation secondary body 421 is greater than 100 nm.

As shown in FIG. 1 and FIG. 2 , in one embodiment, the axis of the heat dissipation body 41 coincides with the axis of the electronic component 1 , which facilitates production and installation, and facilitates the heat dissipation body 41 to achieve uniform heat dissipation for the electronic component 1 .

As shown in FIGS. 1 and 2 , in one embodiment, the projection of the heat dissipation body 41 on the plane where the electronic component 1 is located is a square, the more than two heat dissipation sub-bodies 42 include four heat dissipation sub-bodies 42, and the four sides of the heat dissipation body 41 are respectively connected to the second heat dissipation sub-bodies 422 of the four heat dissipation sub-bodies; the first heat dissipation sub-body 421 of the heat dissipation sub-body includes a trapezoidal portion 4211 and a square portion 4212, the upper bottom side of the trapezoidal portion 4211 is connected to the second heat dissipation sub-body 422, and the lower bottom side of the trapezoidal portion 4211 is connected to the first heat dissipation sub-body 422.

Specifically, the ratio of the sum of the areas of all the first heat dissipation sub-bodies 421 to the area of the surface of the second carrier 3 away from the first carrier 2 is between 40% and 90%.

The first heat dissipation sub-body 421 of the present embodiment is composed of a trapezoidal portion 4211 and a square portion 4212, which increases the area of the first heat dissipation sub-body 421 and increases the proportion of the first heat dissipation sub-body 421 in the surface of the second carrier 3 away from the first carrier 2, thereby improving the heat dissipation efficiency and the heat dissipation effect.

Example 2

As shown in FIG. 3 and FIG. 4 , in one embodiment, the electronic component 1 has a first surface 12 and a second surface 13, the first surface 12 of the electronic component contacts the heat dissipation body 41, and the second surface 13 of the electronic component is provided with a solder pad 11, and the solder pad 11 is electrically connected to the conductive track 21 through a solder ball 23. That is, this embodiment adopts a flip chip bonding method, and there is no need to use a wire to connect the solder pad 11 to the conductive track 21, and there is no need to perform insulation settings for the wire, thereby reducing the production and installation steps.

As shown in Fig. 3 and Fig. 4, in one embodiment, the ratio of the projected area of the heat dissipation body 41 on the plane where the electronic component 1 is located to the area of the first surface 12 of the electronic component is ≥ 100%. This embodiment improves the heat dissipation body 41 based on the flip chip, so that the heat dissipation body 41 completely covers the first surface 12 of the electronic component, and maximizes the heat generated by the electronic component 1 conducted by the heat dissipation body 41.

As shown in Fig. 3 and Fig. 4, in one embodiment, the projection of the heat dissipation body 41 on the plane where the electronic component 1 is located is a rectangle, the two or more heat dissipation sub-bodies 42 include two heat dissipation sub-bodies 42, and the two long sides of the heat dissipation body 41 are respectively connected to the second heat dissipation sub-bodies 422 of the two heat dissipation sub-bodies 42. The heat dissipation element 4 provided in this embodiment has a simple structure and is easy to manufacture.

The other contents of this embodiment are the same as those of Embodiment 1 and will not be described again here.

Those skilled in the art can understand that the accompanying drawings are only schematic diagrams of a preferred implementation scenario, and the modules or processes in the accompanying drawings are not necessarily required for implementing the present utility model.

The above serial numbers of the utility model are for description only and do not represent the advantages or disadvantages of the implementation scenarios.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims (10)

1. An electronic package, comprising: An electronic component, wherein the electronic component is provided with a welding pad; A first carrier and a second carrier, wherein the first carrier and the second carrier cover the periphery of the electronic component, a conductive track is disposed on the first carrier, and the welding pad is electrically connected to the conductive track; A heat sink, which is arranged on the second carrier, and includes a heat sink body and two or more heat sink sub-bodies, wherein the two or more heat sink sub-bodies are arranged at intervals along the periphery of the heat sink body, the heat sink sub-bodies are located on a first side of the heat sink body, and the electronic component is located on a second side of the heat sink body. 2. The electronic package according to claim 1, wherein the heat sink comprises a first heat sink and a second heat sink; The first heat sink is parallel to the heat sink, and forms a flush surface with a surface of the second carrier away from the first carrier. Two ends of the second heat sink are respectively connected to the first heat sink and the heat sink. 3. The electronic package according to claim 2, wherein the electronic component has a first surface and a second surface, and the first surface is in contact with the heat dissipation body; The first surface is provided with the soldering pad, the soldering pad is electrically connected to the conductive track through a wire, and the ratio of the projected area of the heat dissipation body on the plane where the electronic component is located to the area of the first surface is between 75% and 90%; Alternatively, the second surface is provided with the solder pad, the solder pad is electrically connected to the conductive track via a solder ball, and the ratio of the projected area of the heat dissipation body on the plane where the electronic component is located to the area of the first surface is ≥100%. 4. The electronic package according to claim 3, characterized in that the projection of the heat dissipation body on the plane where the electronic component is located is a square, the more than two heat dissipation sub-bodies include four heat dissipation sub-bodies, and the four sides of the heat dissipation body are respectively connected to the second heat dissipation sub-bodies of the four heat dissipation sub-bodies; The first heat sink of the heat sink comprises a trapezoidal portion and a square portion, the upper bottom side of the trapezoidal portion is connected to the second heat sink, and the lower bottom side of the trapezoidal portion is connected to the first heat sink. 5. The electronic package according to claim 3 is characterized in that the projection of the heat dissipation body on the plane where the electronic component is located is a rectangle, the more than two heat dissipation sub-bodies include two heat dissipation sub-bodies, and the two long sides of the heat dissipation body are respectively connected to the second heat dissipation sub-bodies of the two heat dissipation sub-bodies. 6 . The electronic package according to claim 4 , wherein the axis of the heat dissipation body coincides with the axis of the electronic component. 7. The electronic package according to claim 2, wherein the angle between the second heat sink and the perpendicular line of the plane where the first heat sink is located is between 5° and 45°; The angle between the second heat sink secondary body and a perpendicular line to the plane where the heat sink main body is located is between 5° and 45°. 8 . The electronic package according to claim 2 , wherein a distance between the first heat dissipation secondary body and the heat dissipation main body is greater than 90 nm. 9 . The electronic package according to claim 1 , wherein the heat dissipation main body and the heat dissipation secondary body are integrally formed. 10 . The electronic package according to claim 1 , wherein the electronic component and the heat dissipation body are connected via a thermally conductive colloid.