CN221176206U

CN221176206U - Electronic packaging piece

Info

Publication number: CN221176206U
Application number: CN202322997802.1U
Authority: CN
Inventors: 安屹; 陈琦; 秦太梦
Original assignee: Dongguan Paipo Technology Co ltd; Shenzhen Paipo Technology Co ltd
Current assignee: Dongguan Paipo Technology Co ltd; Shenzhen Paipo Technology Co ltd
Priority date: 2023-11-06
Filing date: 2023-11-06
Publication date: 2024-06-18
Anticipated expiration: 2033-11-06

Abstract

The utility model provides an electronic package, comprising: an electronic element provided with a bonding pad; the first bearing piece and the second bearing piece are coated on the periphery of the electronic element, a conductive track is arranged on the first bearing piece, and the welding pad is electrically connected with the conductive track; the heat dissipation piece is arranged on the second bearing piece, the heat dissipation piece comprises a heat dissipation main body and more than two heat dissipation secondary bodies, the more than two heat dissipation secondary bodies are arranged at intervals along the periphery of the heat dissipation main body, the heat dissipation secondary bodies are positioned on the first side of the heat dissipation main body, and the electronic element is positioned on the second side of the heat dissipation main body. By reasonably planning the position of the electronic packaging piece, the utility model avoids heat accumulation generated by the electronic element, improves the heat dissipation efficiency and ensures that the electronic packaging piece has good heat dissipation effect.

Description

Electronic packaging piece

Technical Field

The utility model relates to the technical field of electronic packaging, in particular to an electronic packaging piece.

Background

The electronic package is a shell for mounting the built-in chip of the integrated circuit for external use, and is used for placing, fixing and sealing the built-in chip of the integrated circuit so as to protect the built-in chip of the integrated circuit and enhance the environment adaptability.

In the existing package, a bare chip is closely mounted on a substrate, and then a plurality of metal wires (generally gold wires) are used for connecting metal contact points on the bare chip with pins outside through welding, then resin is embedded, and a plastic tube shell is used for sealing, so that the whole chip is formed.

However, the packaging mode has a certain problem that the chip can emit certain heat during working, but the completely-coated chip cannot emit the heat to the outside well through the packaging structure, so that the processing speed of the chip is affected to a certain extent.

Disclosure of utility model

In order to overcome the defects in the prior art, the utility model provides an electronic package, which comprises the following specific technical scheme:

An electronic package, comprising:

An electronic component provided with a pad;

The first bearing piece and the second bearing piece are coated on the periphery of the electronic element, a conductive track is arranged on the first bearing piece, and the welding pad is electrically connected with the conductive track;

The heat dissipation piece, the heat dissipation piece sets up on the second bears the weight of the piece, the heat dissipation piece includes heat dissipation main part and the heat dissipation secondary body more than two, the heat dissipation secondary body more than two is followed the periphery interval setting of heat dissipation main part, the heat dissipation secondary body is located the first side of heat dissipation main part, electronic component is located the second side of heat dissipation main part.

In a specific embodiment, the heat dissipation sub-body comprises a first heat dissipation sub-body and a second heat dissipation sub-body;

The first heat dissipation secondary body is parallel to the heat dissipation main body, the first heat dissipation secondary body and the second bearing piece are far away from the surface of one side of the first bearing piece to form a flush surface, and two ends of the second heat dissipation secondary body are respectively connected with the first heat dissipation secondary body and the heat dissipation main body.

In a specific embodiment, the electronic component has a first surface and a second surface, the first surface being in contact with the heat dissipating body;

the first surface is provided with the welding pad, the welding pad is electrically connected with the conductive track through a wire, and the area ratio of the projection area of the radiating main body on the plane where the electronic element is positioned to the first surface is 75-90%;

Or, the second surface is provided with the welding pad, the welding pad is electrically connected with the conductive track through a welding ball, and the area ratio of the projection area of the radiating main body on the plane where the electronic element is located to the first surface is more than or equal to 100%.

In a specific embodiment, the projection of the heat dissipation main body on the plane of the electronic element is square, and the more than two heat dissipation sub-bodies comprise four heat dissipation sub-bodies, and four sides of the heat dissipation main body are respectively connected with the second heat dissipation sub-bodies of the four heat dissipation sub-bodies;

the first heat dissipation secondary body of the heat dissipation secondary body comprises a trapezoid part and a square part, the upper bottom edge of the trapezoid part is connected with the second heat dissipation secondary body, and the lower bottom edge of the trapezoid part is connected with the first heat dissipation secondary body.

In a specific embodiment, the projection of the heat dissipation main body on the plane where the electronic component is located is rectangular, the more than two heat dissipation sub-bodies comprise two heat dissipation sub-bodies, and two long sides of the heat dissipation main body are respectively connected with the second heat dissipation sub-bodies of the two heat dissipation sub-bodies.

In a specific embodiment, the axis of the heat dissipating body coincides with the axis of the electronic component.

In a specific embodiment, an included angle between the second heat dissipation secondary body and a perpendicular line of a plane where the first heat dissipation secondary body is located is 5-45 degrees;

The included angle between the second heat dissipation secondary body and the perpendicular line of the plane where the heat dissipation main body is located is 5-45 degrees.

In a specific embodiment, the distance between the first heat dissipation sub-body and the heat dissipation main body is greater than 90nm.

In a specific embodiment, the heat dissipating main body and the heat dissipating sub-body are integrally formed.

In a specific embodiment, the electronic component and the heat dissipation body are connected through a heat conducting colloid.

The utility model has at least the following beneficial effects:

An electronic package of the present utility model includes: an electronic element provided with a bonding pad; the first bearing piece and the second bearing piece are coated on the periphery of the electronic element, a conductive track is arranged on the first bearing piece, and the welding pad is electrically connected with the conductive track; the heat dissipation piece is arranged on the second bearing piece, the heat dissipation piece comprises a heat dissipation main body and more than two heat dissipation secondary bodies, the more than two heat dissipation secondary bodies are arranged at intervals along the periphery of the heat dissipation main body, the heat dissipation secondary bodies are positioned on the first side of the heat dissipation main body, and the electronic element is positioned on the second side of the heat dissipation main body.

According to the utility model, the electronic element and the heat dissipation part are respectively arranged at two sides of the contact surface of the electronic element and the heat dissipation part by reasonably planning the position of the electronic package part, so that the heat dissipation sub-body is far away from the electronic element.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a first schematic structural diagram of an electronic package provided in embodiment 1;

fig. 2 is a second schematic structural diagram of an electronic package provided in embodiment 1;

Fig. 3 is a first schematic structural diagram of an electronic package according to embodiment 2;

fig. 4 is a second schematic structural diagram of an electronic package according to embodiment 2.

Reference numerals:

1-an electronic component; 2-a first carrier; 3-a second carrier; 4-a heat sink; 11-bonding pads; 12-a first surface; 13-a second surface; 21-conductive tracks; 22-wires; 23-solder balls; 41-a heat dissipating body; 42-radiating secondary body; 121-a heat conducting colloid; 131-an adhesive gel; 421-a first heat dissipation sub-body; 422-a second heat dissipating secondary; 4211-trapezoid part; 4212-square parts.

Detailed Description

Hereinafter, various embodiments of the present utility model will be described more fully. The utility model is capable of various embodiments and of modifications and variations therein. However, it should be understood that: there is no intention to limit the various embodiments of the utility model to the specific embodiments disclosed herein, but rather the utility model is to be understood to cover all modifications, equivalents, and/or alternatives falling within the spirit and scope of the various embodiments of the utility model.

Hereinafter, the terms "comprises" or "comprising" as may be used in various embodiments of the present utility model indicate the presence of the disclosed functions, operations or elements, and are not limiting of the addition of one or more functions, operations or elements. Furthermore, as used in various embodiments of the utility model, the terms "comprises," "comprising," and their cognate terms are intended to refer to a particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be interpreted as first excluding the existence of or increasing likelihood of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.

In various embodiments of the utility model, the expression "or" at least one of a or/and B "includes any or all combinations of the words listed simultaneously. For example, the expression "a or B" or "at least one of a or/and B" may include a, may include B or may include both a and B.

Expressions (such as "first", "second", etc.) used in the various embodiments of the utility model may modify various constituent elements in the various embodiments, but the respective constituent elements may not be limited. For example, the above description does not limit the order and/or importance of the elements. The above description is only intended to distinguish one element from another element. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of various embodiments of the present utility model.

It should be noted that: in the present utility model, unless explicitly specified and defined otherwise, terms such as "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; may be a communication between the interiors of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, it should be understood by those of ordinary skill in the art that the terms indicating an orientation or a positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of description, not to indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model.

The terminology used in the various embodiments of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the various embodiments of the utility model. As used herein, the singular is intended to include the plural as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the utility model belong. The terms (such as those defined in commonly used dictionaries) will be interpreted as having a meaning that is the same as the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in connection with the various embodiments of the utility model.

As shown in fig. 1 to 4, the electronic package provided in this embodiment includes:

An electronic component 1, the electronic component 1 being provided with pads 11;

The first bearing piece 2 and the second bearing piece 3 are coated on the periphery of the electronic element 1, the first bearing piece 2 is provided with a conductive track 21, and the welding pad 11 is electrically connected with the conductive track 21;

The heat dissipation piece 3, the heat dissipation piece 3 sets up on the second bears piece 3, and the heat dissipation piece 3 includes heat dissipation main part 31 and the heat dissipation secondary body 32 more than two, and the periphery interval setting of heat dissipation main part 31 is followed to the heat dissipation secondary body 32 more than two, and heat dissipation secondary body 32 is located the first side of heat dissipation main part 31, and electronic component 1 is located the second side of heat dissipation main part 32.

Example 1

As shown in fig. 1 and 2, in the present embodiment, the electronic component 1 has a first surface 12 and a second surface 13 opposite to each other, the electronic component 1 is located on the second carrier 3, the first surface 12 of the electronic component is in contact with the heat dissipation body 41, the second surface 13 of the electronic component exposes a surface of the second carrier 3 near a side of the first carrier 2, and the first carrier 2 and the second carrier 3 cooperate with each other to encapsulate the electronic component 1.

Specifically, in one embodiment, the second surface 13 of the electronic component is connected to the first carrier 2 by an adhesive gel 131. The adhesive gel 131 is preferably an electrically insulating glue.

Specifically, in one embodiment, the first carrier 2 and the second carrier 3 are made of an insulating material. Preferably, the first carrier 2 and the second carrier 3 are resins.

As shown in fig. 1 and 2, in one embodiment, the first surface 12 of the electronic component and the heat dissipating body 41 are connected by a thermally conductive gel 121 to enhance the ability of the heat dissipating body 41 to receive heat generated by the electronic component 1.

Specifically, the thermally conductive gel 121 is a gel that allows heat transfer, preferably a gel having a thermal conductivity of greater than 32W/mK.

As shown in fig. 1 and 2, in one embodiment, the heat dissipating main body 41 and the heat dissipating sub-body 42 are integrally formed, and this arrangement reduces the connection points between the heat dissipating main body 41 and the heat dissipating sub-body 42, facilitates production and installation, and facilitates conduction of heat for subsequent heat dissipation.

In one embodiment, the heat dissipating body 41 and the heat dissipating secondary body 42 are made of a thermally conductive material, such as a metal, preferably copper, having a thermal conductivity of greater than 390W/mK, but is not limited thereto.

As shown in fig. 1 and 2, in one embodiment, the heat dissipation sub-body 42 includes a first heat dissipation sub-body 421 and a second heat dissipation sub-body 422; the first heat dissipation sub-body 421 is parallel to the heat dissipation main body 41, and the first heat dissipation sub-body 421 and the surface of the second bearing member 3 on one side far away from the first bearing member 2 form a flush surface, and two ends of the second heat dissipation sub-body 422 are respectively connected with the first heat dissipation sub-body 421 and the heat dissipation main body 41.

As shown in fig. 1 and 2, in one embodiment, an included angle between the second heat dissipation sub-body 422 and a perpendicular to the plane in which the first heat dissipation sub-body 421 is located is between 5 ° and 45 °, and an included angle between the second heat dissipation sub-body 422 and a perpendicular to the plane in which the heat dissipation main body 41 is located is between 5 ° and 45 °.

In this embodiment, the angle at which the second heat dissipation sub-body 422 is connected with the first heat dissipation sub-body 421 and the heat dissipation main body 41 is limited, so that the structural strength of the heat dissipation element 4 is improved, the structural strength of the heat dissipation element 4 is prevented from being low, the heat dissipation element is easy to damage, and the service life is short.

As shown in fig. 1 and 2, in one embodiment, the first surface 12 of the electronic component is provided with the bonding pad 11, the first surface 12 of the electronic component is in contact with the heat dissipation body 41, the projection of the heat dissipation body 41 on the plane of the electronic component 1 is not overlapped with the bonding pad 11, and the ratio of the projection area of the heat dissipation body 41 on the plane of the electronic component 1 to the area of the first surface 12 of the electronic component is between 75% and 90%.

The present embodiment keeps the heat dissipating body 41 in contact with the electronic component 1 over a large area, which helps the heat dissipating body 41 to receive heat generated by the electronic component 1.

As shown in fig. 1 and 2, in one embodiment, the bonding pad 11 is electrically connected to the conductive track 21 through the conductive wire 22, and the distance between the heat dissipation main body 41 and the first heat dissipation sub-body 421 is greater than 90nm, so as to avoid the heat dissipation sub-body 42 contacting the electric wire, so that the heat dissipation element 4 is insulated.

Preferably, the distance between the heat dissipation body 41 and the first heat dissipation sub-body 421 is greater than 100nm.

As shown in fig. 1 and 2, in one embodiment, the axis of the heat dissipating body 41 coincides with the axis of the electronic component 1, facilitating production and installation, and facilitating uniform heat dissipation of the electronic component 1 by the heat dissipating body 41.

As shown in fig. 1 and fig. 2, in one embodiment, the projection of the heat dissipating main body 41 on the plane of the electronic component 1 is square, and more than two heat dissipating sub-bodies 42 include four heat dissipating sub-bodies 42, and four sides of the heat dissipating main body 41 are respectively connected to the second heat dissipating sub-bodies 422 of the four heat dissipating sub-bodies; the first heat dissipation sub-body 421 of the heat dissipation sub-body includes a trapezoid portion 4211 and a square portion 4212, an upper bottom edge of the trapezoid portion 4211 is connected to the second heat dissipation sub-body 422, and a lower bottom edge of the trapezoid portion 4211 is connected to the first heat dissipation sub-body 422.

Specifically, the area ratio of the sum of the areas of all the first heat dissipation sub-bodies 421 to the surface of the second carrier 3 on the side away from the first carrier 2 is between 40% and 90%.

The first heat dissipation sub-body 421 of the embodiment is composed of a trapezoid portion 4211 and a square portion 4212, which increases the area of the first heat dissipation sub-body 421, increases the duty ratio of the first heat dissipation sub-body 421 in the surface of the second carrier 3 far away from the first carrier 2, further improves the heat dissipation efficiency, and improves the heat dissipation effect.

Example 2

As shown in fig. 3 and 4, in one embodiment, the electronic component 1 has a first surface 12 and a second surface 13, the first surface 12 of the electronic component is in contact with the heat dissipation body 41, the second surface 13 of the electronic component is provided with a bonding pad 11, and the bonding pad 11 is electrically connected to the conductive track 21 through a solder ball 23. That is, in the present embodiment, the flip chip bonding method is adopted, the bonding pad 11 is not required to be connected with the conductive track 21 by using a wire, and the insulating arrangement for the wire is not required, so that the production and installation steps are reduced.

As shown in FIGS. 3 and 4, in one embodiment, the ratio of the projected area of the heat dissipating body 41 on the plane of the electronic component 1 to the area of the first surface 12 of the electronic component is equal to or greater than 100%. The present embodiment is based on a flip chip modification of the heat dissipating body 41 such that the heat dissipating body 41 completely covers the first surface 12 of the electronic component, and maximizes the heat generated by the heat dissipating body 41 conducting the electronic component 1.

As shown in fig. 3 and 4, in one embodiment, the projection of the heat dissipating main body 41 on the plane of the electronic component 1 is rectangular, and more than two heat dissipating sub-bodies 42 include two heat dissipating sub-bodies 42, and two long sides of the heat dissipating main body 41 are respectively connected to the second heat dissipating sub-bodies 422 of the two heat dissipating sub-bodies 42. The heat dissipation element 4 provided in this embodiment has a simple structure and is convenient to manufacture.

Other contents in this embodiment are the same as those in embodiment 1, and will not be described here again.

Those skilled in the art will appreciate that the drawing is merely a schematic illustration of a preferred implementation scenario and that the modules or flows in the drawing are not necessarily required to practice the utility model.

The above-mentioned inventive sequence numbers are merely for description and do not represent advantages or disadvantages of the implementation scenario.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.

Claims

1. An electronic package, comprising:

An electronic component provided with a pad;

2. The electronic package of claim 1, wherein the heat sink sub-body comprises a first heat sink sub-body and a second heat sink sub-body;

3. The electronic package of claim 2, wherein the electronic component has a first surface and a second surface, the first surface being in contact with the heat dissipating body;

4. The electronic package of claim 3, wherein the projection of the heat dissipating main body on the plane of the electronic component is square, and the two or more heat dissipating sub-bodies comprise four heat dissipating sub-bodies, and four sides of the heat dissipating main body are respectively connected with the second heat dissipating sub-bodies of the four heat dissipating sub-bodies;

5. The electronic package according to claim 3, wherein the projection of the heat dissipating main body on the plane of the electronic component is rectangular, and the two or more heat dissipating sub-bodies comprise two heat dissipating sub-bodies, and two long sides of the heat dissipating main body are respectively connected with the second heat dissipating sub-bodies of the two heat dissipating sub-bodies.

6. The electronic package of claim 4 or 5, wherein an axis of the heat dissipating body coincides with an axis of the electronic component.

7. The electronic package of claim 2, wherein an included angle between the second heat dissipation sub-body and a perpendicular to a plane in which the first heat dissipation sub-body is located is between 5 ° and 45 °;

8. The electronic package of claim 2, wherein a distance between the first heat dissipating sub-body and the heat dissipating main body is greater than 90nm.

9. The electronic package of claim 1 or 2, wherein the heat dissipating body and the heat dissipating sub-body are integrally formed.

10. The electronic package of claim 1, wherein the electronic component and the heat dissipating body are connected by a thermally conductive gel.