CN221110265U - Thermosonic flip bonding welding head - Google Patents
Thermosonic flip bonding welding head Download PDFInfo
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- CN221110265U CN221110265U CN202323119499.1U CN202323119499U CN221110265U CN 221110265 U CN221110265 U CN 221110265U CN 202323119499 U CN202323119499 U CN 202323119499U CN 221110265 U CN221110265 U CN 221110265U
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- 238000003466 welding Methods 0.000 title abstract description 57
- 239000011148 porous material Substances 0.000 claims abstract description 18
- 238000004891 communication Methods 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 241000276425 Xiphophorus maculatus Species 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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Abstract
The utility model relates to a thermosonic flip-chip bonding equipment technical field, specific can guarantee flip-chip bonding interface roughness that says so, and then improve bonding welding effect's thermosonic flip-chip bonding tool, a serial communication port, the negative pressure chamber includes the bar main cavity body that sets up along cylindricality portion axis, and main cavity body front end extends to in the platy portion, and communicates with the negative pressure hole one-to-one more than two through more than two pore channels, and the utility model compares with prior art, has rational in infrastructure, easy and simple to handle, adsorb advantages such as stable and welding interface roughness height.
Description
Technical field:
The utility model relates to a thermosonic flip-chip bonding equipment technical field, specific can guarantee flip-chip bonding interface roughness that says so, and then improve the thermosonic flip-chip bonding tool of bonding welding effect.
The background technology is as follows:
Thermosonic flip chip technology is an advanced interconnect technology for the optoelectronic field with high performance that enables convenient electrical and mechanical interconnection between chips or between chips and carriers through bumps. With the development of miniaturization and light weight of products and the increase of the number of I/O terminals, the traditional lead bonding and solder ball flip packaging technology cannot meet the requirement of high density, and the development of gold bump hot spot ultrasonic flip chip bonding of chips brings hopes for high density packaging in the radio frequency field. As shown in figure 1, in the working process, the chip positioned on the upper layer needs to be flipped over by 180 degrees and then flipped over on the lower layer chip, so that the bumps of the upper layer chip are aligned with the corresponding bonding pads of the lower layer chip, then pressure, heating and ultrasonic energy are applied to the chip, so that the bump metal and the bonding pads are inlaid, and meanwhile, the oxidation layer on the bonding interface is destroyed, so that attractive force between atoms reaches the bonding standard. In the bonding process, the output direction of pressure is vertical to the bonding surface, and the output direction of ultrasonic energy is reciprocating back and forth along the bonding surface, so that in order to ensure bonding reliability, the upper layer of chip and the lower layer of chip are required to be stably fixed in the bonding process, otherwise, position deviation can be generated to directly influence the bonding effect, and under the premise of fixing and stabilizing a bonding part, the bonding quality of a product is ensured by precisely controlling ultrasonic energy, pressure and temperature of ultrasonic bonding flip-chip welding.
At present, a welding head for thermosonic flip-chip welding is provided with a negative pressure hole, a negative pressure cavity communicated with the negative pressure hole is arranged in the welding head, and materials to be treated are stably adsorbed through negative pressure and are pressed to a bonding surface. The negative pressure cavity in the welding head for the traditional thermosonic flip-chip welding is a T-shaped negative pressure cavity as shown in the attached figure 2, the front ends of the T-shaped negative pressure cavities are respectively communicated with the negative pressure holes, the rear ends of the T-shaped negative pressure cavities are connected with external negative pressure equipment, and negative pressure adsorption force is released by utilizing the negative pressure holes, so that an upper chip to be welded is adsorbed on the welding head.
It is obvious that the prior art aims to realize reliable suction of a chip to be welded through uniform negative pressure attractive force, however, the research team of the application finds that the cavity structure of the prior welding head causes the front end of the main body of the welding head to be greatly damaged, and as in the process of thermosonic flip-chip welding, as shown in the attached figure 1, welding equipment heats welding workpieces from the lower side of a welding plane and on a welding joint, heat can be conducted to the main body of the welding head, while the cavity structure of the prior welding main body causes inconsistent heat conduction of the front end of the whole welding head, after the negative pressure treatment is overlapped, the heat of the chip contacted with the front end of the main body of the welding head is inconsistent, the flatness of the chip is reduced due to the thermal expansion and cold contraction characteristics of materials, namely, the chip to be welded is raised, partial areas are raised or recessed, and in the subsequent welding process, welding pressure and ultrasonic energy cannot be uniformly conducted to each gold bump on the chip to be welded, so that the welding quality is poor.
The invention comprises the following steps:
Aiming at the defects and shortcomings in the prior art, the utility model provides a thermosonic flip bonding welding head capable of ensuring the flatness of a flip bonding interface and further improving the bonding welding effect.
The utility model is achieved by the following measures:
The utility model provides a thermosonic flip bonding tool, is equipped with the bonding tool main part, and the bonding tool main part comprises the column part that is located the front end and is located the rear portion, and the negative pressure hole is seted up on the column part surface of bonding tool main part, sets up the negative pressure chamber that is linked together with the negative pressure hole in the bonding tool main part, and the negative pressure chamber still links to each other with outside negative pressure equipment, a serial communication port, the negative pressure chamber includes the bar main cavity body that sets up along the column part axis, and main cavity body front end extends to in the column part, and communicates with more than two negative pressure holes one-to-one through more than two pore ways.
The duct is in a straight-line segment shape, namely, the duct is a shortest straight-line channel between the negative pressure holes corresponding to the duct and the front end of the main cavity, so that the length of the duct of the negative pressure hole positioned right in front of the main cavity on the flat part is shortest, and the duct corresponding to the negative pressure hole positioned on the side surface of the front part of the main cavity is in an oblique line shape.
The surface of the welding head main body is provided with more than two equally-spaced negative pressure holes which are arranged in the same straight line, and further, the more than two negative pressure holes are arranged on the surface of the welding head main body in a central symmetry mode, namely, the negative pressure hole at the center coincides with the central axis of the main cavity, the rest negative pressure holes are respectively and symmetrically arranged on two sides of the negative pressure hole at the center, and the inner diameter of the pore canal is matched with the inner diameter of the negative pressure hole and is far smaller than the inner diameter of the main cavity.
The utility model can be provided with the negative pressure grooves for accommodating one or two or three negative pressure holes in the area of the surface of the welding head main body, and further, the utility model is provided with more than two negative pressure grooves which are symmetrically arranged according to the central negative pressure holes, and the negative pressure action area is increased by arranging the negative pressure grooves, so that the adsorption force of the chip to be treated is enhanced.
According to the utility model, the negative pressure adsorption is realized by changing the negative pressure cavity structure in the welding main body, so that the negative pressure holes are communicated with the main cavity through the pore canal with the inner diameter far smaller than that of the main cavity, the problem that the flatness of a welding interface is poor due to the fact that the cavity in the front of the welding head main body is hollow and the heat transferred to the surface of the chip to be processed by the welding head main body is uneven under the action of negative pressure and the pressure cannot be uniformly transferred to the surface of the chip to be processed due to the difference of conducting mediums is solved.
Compared with the prior art, the utility model has the advantages of reasonable structure, simple and convenient operation, stable adsorption, high flatness of a welding interface and the like.
Description of the drawings:
Fig. 1 is a schematic diagram of thermosonic flip-chip bonding welding.
Fig. 2 is a schematic view of a negative pressure cavity structure of a welding head body in the prior art.
Fig. 3 is a schematic view of the negative pressure chamber of the welding head body according to the present utility model.
Fig. 4 is a schematic structural view of an embodiment of the present utility model.
Reference numerals: the welding head comprises a welding head main body 1, a flat part 2, a cylindrical part 3, a negative pressure hole 4, a main cavity 5, a pore canal 6 and a negative pressure groove 7.
The specific embodiment is as follows:
The utility model will be further described with reference to the drawings and examples.
As shown in fig. 3, the utility model provides a thermosonic flip bonding welding head, which is provided with a welding head main body 1, wherein the welding head main body 1 consists of a flat part 2 positioned at the front end and a cylindrical part 3 positioned at the rear part, the surface of the flat part 2 of the welding head main body 1 is provided with a negative pressure hole 4, a negative pressure cavity communicated with the negative pressure hole 4 is arranged in the welding head main body 1, the negative pressure cavity is also connected with external negative pressure equipment, the negative pressure cavity comprises a strip-shaped main cavity 5 arranged along the central axis of the cylindrical part 3, and more than two pore channels 6, and the front end of the main cavity 5 extends into the flat part 2 and is correspondingly communicated with more than two negative pressure holes 4 one by one through more than two pore channels 6.
According to the utility model, the pore canal 6 is in a straight line segment shape, namely, the pore canal 6 is the shortest straight line channel between the negative pressure holes 4 corresponding to the pore canal 6 and the front end of the main cavity 5, so that the pore canal length of the negative pressure holes 4 positioned right in front of the main cavity 5 on the flat part 2 is shortest, and the pore canal 6 corresponding to the negative pressure holes 4 positioned on the side surface of the front part of the main cavity 5 is in a slant line shape.
According to the utility model, more than two equally-spaced negative pressure holes 4 which are arranged in the same straight line are formed in the surface of the welding head main body 1, and further, more than two negative pressure holes 4 are arranged on the surface of the welding head main body 1 in a central symmetry mode, namely, the negative pressure hole 4 positioned in the center coincides with the central axis of the main cavity 5, the rest negative pressure holes 4 are respectively and symmetrically arranged on two sides of the negative pressure hole 4 positioned in the center, and the inner diameter of the pore channel 6 is matched with the inner diameter of the negative pressure hole 4 and is far smaller than the inner diameter of the main cavity 5.
According to the utility model, the negative pressure grooves 7 for accommodating one or two or three negative pressure holes are arranged in the area of the surface of the welding head main body 1, which is correspondingly provided with the negative pressure holes 4, and further, more than two negative pressure grooves 7 are arranged, wherein the more than two negative pressure grooves 7 are symmetrically arranged according to the central negative pressure holes, and the negative pressure action area is increased by arranging the negative pressure grooves 7, so that the adsorption force of the chip to be treated is enhanced.
Examples:
As shown in fig. 4, this example provides a thermosonic flip bonding tool, which is provided with a bonding tool main body 1, wherein the bonding tool main body 1 is composed of a flat part 2 at the front end and a cylindrical part 3 at the rear part, the surface of the flat part 2 of the bonding tool main body 1 is provided with a negative pressure hole 4, the bonding tool main body 1 is internally provided with a negative pressure cavity communicated with the negative pressure hole 4, the negative pressure cavity is also connected with external negative pressure equipment, the negative pressure cavity comprises a strip-shaped main cavity 5 arranged along the central axis of the cylindrical part 3, and more than two pore channels 6, the front end of the main cavity 5 extends into the flat part 2 and is correspondingly communicated with more than two negative pressure holes 4 one by one through more than two pore channels 6;
As shown in fig. 3, the duct 6 is in a straight-line segment shape, that is, the duct 6 is a shortest straight-line channel between the negative pressure holes 4 corresponding to the duct 6 and the front end of the main cavity 5, so that the duct length of the negative pressure hole 4 located right in front of the main cavity 5 on the flat portion 2 is shortest, and the duct 6 corresponding to the negative pressure hole 4 located on the side surface of the front portion of the main cavity 5 is in a diagonal shape;
As shown in fig. 4, the surface of the welding head main body 1 is provided with more than two equally spaced negative pressure holes 4 which are arranged in the same straight line, the more than two negative pressure holes 4 are arranged on the surface of the welding head main body 1 in a central symmetry manner, namely, the negative pressure hole 4 positioned in the center coincides with the central axis of the main cavity 5, the rest negative pressure holes 4 are respectively and symmetrically arranged at two sides of the negative pressure hole 4 positioned in the center, the inner diameter of the pore channel 6 is adapted to the inner diameter of the negative pressure hole 4 and is far smaller than the inner diameter of the main cavity 5;
In this example, the surface of the welding head main body 1 is provided with a negative pressure groove 7 for accommodating one or two or three negative pressure holes in a region corresponding to the negative pressure hole 4, more than two negative pressure grooves 7 are arranged, the more than two negative pressure grooves 7 are symmetrically arranged according to the negative pressure hole in the center, and the negative pressure acting area is increased by arranging the negative pressure grooves 7, so that the adsorption force of the chip to be treated is enhanced.
According to the utility model, the negative pressure adsorption is realized by changing the negative pressure cavity structure in the welding main body, so that the negative pressure holes are communicated with the main cavity through the pore canal with the inner diameter far smaller than that of the main cavity, the problem that the flatness of a welding interface is poor due to the fact that the cavity in the front of the welding head main body is hollow and the heat transferred to the surface of the chip to be processed by the welding head main body is uneven under the action of negative pressure and the pressure cannot be uniformly transferred to the surface of the chip to be processed due to the difference of conducting mediums is solved.
Compared with the prior art, the utility model has the advantages of reasonable structure, simple and convenient operation, stable adsorption, high flatness of a welding interface and the like.
Claims (6)
1. The utility model provides a thermosonic flip bonding tool, is equipped with the bonding tool main part, and the bonding tool main part comprises the column part that is located the front end and is located the rear portion, and the negative pressure hole is seted up on the column part surface of bonding tool main part, sets up the negative pressure chamber that is linked together with the negative pressure hole in the bonding tool main part, and the negative pressure chamber still links to each other with outside negative pressure equipment, a serial communication port, the negative pressure chamber includes the bar main cavity body that sets up along the column part axis, and main cavity body front end extends to in the column part, and communicates with more than two negative pressure holes one-to-one through more than two pore ways.
2. The thermosonic flip bonding tool according to claim 1, wherein the duct is in a straight-line segment shape, that is, the duct is a shortest straight-line channel between the negative pressure holes corresponding to the duct and the front end of the main cavity, the length of the duct of the negative pressure hole located right in front of the main cavity on the flat portion is shortest, and the duct of the negative pressure hole located on the front side of the main cavity is in a diagonal shape.
3. The thermosonic flip bonding tool according to claim 1, wherein the surface of the bonding tool body is provided with more than two equally spaced negative pressure holes arranged in a same straight line, and the more than two negative pressure holes are arranged on the surface of the bonding tool body in a central symmetry manner.
4. A thermosonic flip bonding tool according to claim 3, wherein the centrally located negative pressure hole coincides with the central axis of the main cavity, and the remaining negative pressure holes are symmetrically disposed on both sides of the centrally located negative pressure hole, respectively, and the inner diameter of the hole channel is adapted to the inner diameter of the negative pressure hole and is substantially smaller than the inner diameter of the main cavity.
5. A thermosonic flip bonding horn according to claim 1, characterized in that a negative pressure groove for accommodating one or two or three negative pressure holes is provided in the surface of the horn body in the area where the negative pressure holes are provided.
6. The thermosonic flip bonding tool of claim 5, wherein more than two negative pressure grooves are provided, the more than two negative pressure grooves being symmetrically disposed about a central negative pressure hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323119499.1U CN221110265U (en) | 2023-11-20 | 2023-11-20 | Thermosonic flip bonding welding head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323119499.1U CN221110265U (en) | 2023-11-20 | 2023-11-20 | Thermosonic flip bonding welding head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221110265U true CN221110265U (en) | 2024-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323119499.1U Active CN221110265U (en) | 2023-11-20 | 2023-11-20 | Thermosonic flip bonding welding head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221110265U (en) |
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2023
- 2023-11-20 CN CN202323119499.1U patent/CN221110265U/en active Active
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