CN208753724U - A kind of full-inorganic VCSEL device - Google Patents
A kind of full-inorganic VCSEL device Download PDFInfo
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- CN208753724U CN208753724U CN201821621614.1U CN201821621614U CN208753724U CN 208753724 U CN208753724 U CN 208753724U CN 201821621614 U CN201821621614 U CN 201821621614U CN 208753724 U CN208753724 U CN 208753724U
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Abstract
The utility model provides a kind of full-inorganic VCSEL device, full-inorganic VCSEL device includes pedestal and VCSEL chip, it is equipped with bowl on the base, VCSEL chip is located in bowl and is electrically connected with pedestal, the glass cover-plate of sealing VCSEL chip is equipped in bowl, one is pass through laser welding or solder bond for the connection type of glass cover-plate and bowl, using laser welding packaging method when, first pre-welding, Laser Welding one or more solder joint is used on metal frame, glass cover-plate is fixed in bowl, metal frame and bowl are welded together with laser again, when passing through solder bond, first in bowl surface coated with solder, glass cover-plate is placed in bowl again, then pedestal is placed in progress baking-curing in oven or reflow ovens keeps glass cover-plate closely coupled with bowl, with the utility model VCSEL device, air-tightness is good, high reliablity.
Description
Technical field
The utility model belongs to the encapsulation field of semiconductor laser, and in particular to a kind of full-inorganic VCSEL device.
Background technique
With the development of science and technology laser technology has obtained significant progress, laser technology using more and more extensive, laser
It generally can be divided into Solid State Laser, gas laser and semiconductor laser etc., be with gallium arsenide semiconductor material in semiconductor laser
The vertical cavity surface emitting laser (i.e. VCSEL) of foundation development is used as a kind of new laser, due to small in size, round
Output facula, single longitudinal mode output, threshold current it is small, cheap, easy of integration be large area array the advantages that, be widely used in light
The fields such as communication, light network, optical storage, VCSEL can be used to transmit data in fiber optic network high speed, compare traditional cable
System can transmit bigger data volume, the especially development recently as 3D sensing technology, 3D sensing at faster speed
Key is 3D camera in technology, and 3D camera mainly increases " infrared light supply+optical module+infrared biography on traditional camera
The parts such as sensor ", wherein the part of most critical is infrared light supply, and the 3D camera technology of actively perceive is usually using infrared light
Target is detected, traditional 3D sensor-based system generally uses LED as infrared light supply, but since LED does not have resonant cavity, leads to light
Shu Gengjia diverging, it is very poor in terms of coupling, and VCSEL is dominant in all directions in accuracy, miniaturization, low-power consumption, reliability
In the case where, so existing common 3D camera system is generally used VCSEL.
Since VCSEL chip is very sensitive to environment temperature, humidity, pernicious gas and pollutant, so VCSEL chip is past
Toward the encapsulation for needing high-air-tightness, application No. is 201710672726.3, date of publication is in the patent document of 2017.12.19
A kind of VCSEL manufacturing process of SMD small-sized encapsulated is disclosed, the method for packaging V CSEL chip is to place light window glass
On the SMD cavity for sealing VCSEL chip, optical window sealing is fixed on metal framework using the technique of parallel soldering and sealing, in parallel
Soldering and sealing is also known as parallel seam welding, and parallel soldering and sealing belongs to electric resistance welding, and electrode is rotated while mobile by electrode wheel, in certain pressure
It is discontinuously powered between electrode under power, the document is contacted due to existing between electrode and light window glass and light window glass and metal framework
Resistance, welding current will generate joule's heat energy at the two resistance, and make to be partially formed between light window glass and metal framework molten
Melt state, form solder joint after solidification, to light window glass and metal framework be welded together, since electrode wheel is needed in welding
It rolls, and can equally generate joule's heat energy between electrode wheel and light window glass and make electrode foot wheel abrasion, therefore electrode wheel uses
Service life is short, needs to be replaced frequently, and electrode wheel is in contact with light window glass and metal frame in electric resistance welding, to be easily damaged
The welded parts such as optical window；In addition, being realized and being connected by windowpane and metal frame welding, thus base due to using parallel soldering and sealing
The wider connectivity of metal layer is more secured on plate, but metal layer is wider on substrate, then welding procedure side is larger, corresponding glass
Optical window can become smaller, and light emission rate reduces.
Summary of the invention
To solve problems of the prior art, the utility model provides a kind of full-inorganic VCSEL device and its encapsulation
Method, solving the problems, such as VCSEL device, reliability is not high when packaged, can generate vulnerable part, improve VCSEL device stability and
Reliability.
In order to achieve the above objectives, the utility model provides a kind of full-inorganic VCSEL device, including pedestal and VCSEL core
Piece is equipped with bowl on the base, and bowl top surface is equipped with metal layer, and VCSEL chip is located in bowl and is electrically connected with pedestal, in bowl
Cup is equipped with the glass cover-plate of sealing VCSEL chip, and glass cover-plate includes glass and metal frame, the flatness < 0.1mm of glass,
Be bonded and be combined together by solder bond or metal oxide between glass and metal frame, in metal frame and bowl metal layer it
Between welded together by Laser Welding.
The flatness of arrangement above, glass is smaller, and the influence to the laser angle of injection is smaller, and VCSEL chip issues
Laser reflected and reflect fewer, the loss of laser is smaller；One is welded on by Laser Welding between metal frame and bowl
It rises, laser welding is connected by multiple solder joints, and weld seam is secured, and the technique edges for welding the small laser welding in region formed are small, energy
The volume of VCSEL device is reduced, VCSEL device is pushed to develop toward micromation direction；Laser weld is secured, and air-tightness is more
Good, high reliablity, stability are good；And it does not need not needing periodically more using vulnerable part as electrode wheel using laser welding
Electrode wheel is changed, production cost can be reduced and improves production efficiency, full-inorganic VCSEL device does not use organic material, it is therefore prevented that has
Machine material is bad and to be unsuitable for VCSEL device severe in high temperature and humidity etc. due to performances such as heat resistance, air-tightness and reliabilities
The shortcomings that working under environment.Have the advantages that high reliablity, air-tightness are high using the VCSEL device that laser welding process encapsulates,
It is suitble to use under circumstances.
Further, the glass is equipped with light diffusion layer, or light diffusing sheet is equipped between VCSEL chip and glass,
By setting light diffusing sheet and light diffusion layer, the light uniformization that VCSEL chip issues can be distributed.
Further, the difference between glass cover-plate and metal frame between thermal expansion coefficient is less than 10%, due to glass cover
The difference between thermal expansion coefficient between plate and metal frame can be prevented less than 10% due between glass cover-plate and metal frame
Thermal expansion coefficient has big difference and causes metal frame expanded by heating that glass cover-plate is caused to damage.
Further, more than two solder joints are formed by laser welding between the metal frame and bowl, in adjacent welds
Overlapping portion is formed between the heart, the floor space of overlapping portion is the 50%-70% of single solder joint floor space, is set since solder joint is overlapped
It sets, so that the solder joint formed forms even closer weld-ring, the hermetic seal of inorganic VCSEL devices can be improved in this way.
The utility model also provides a kind of full-inorganic VCSEL device, including pedestal and VCSEL chip, is equipped on the base
Bowl, VCSEL chip are located in bowl and are electrically connected with pedestal, and the glass cover-plate of sealing VCSEL chip, glass are equipped in bowl
The flatness < 0.1mm of glass cover board, passes through solder bond between glass cover-plate and bowl.The flatness of glass is better, to injection
Laser angle influence it is smaller, and the laser that VCSEL chip issues is reflected and reflects fewer, and the loss of laser is got over
Between small glass and bowl use solder welding, it is therefore prevented that organic solder due to performances such as heat resistance, air-tightness and reliabilities not
It is good and VCSEL device is made to be unsuitable for the shortcomings that working under the adverse circumstances such as high temperature and humidity；Arrangement above is simple, efficiently, can
It leans on, applies pressure without additional when solder solidification.Glass cover-plate and bowl pass through solder bond formation airtight cavity, air-tightness
It is good.Have the advantages that air-tightness is good, high reliablity using the VCSEL device of this structure.
Further, the glass cover-plate is the glass cover-plate equipped with metal layer, between the glass cover-plate and bowl
Equipped with the pre- solder joint formed by laser prewelding.It, can be by Laser Welding by glass cover after metal layer is set on glass cover-plate
Plate pre-fixes in bowl, and the glass cover-plate when pedestal to be placed in baking-curing in oven or reflow ovens is prevented to be in unconfined
State and be subjected to displacement in bowl so that influence glass cover-plate be securely fixed in bowl.
Further, the glass cover-plate is the glass cover-plate equipped with metal frame, between the glass cover-plate and bowl
Equipped with the pre- solder joint formed by laser prewelding.By the edge of glass be arranged metal frame formed glass cover-plate, metal frame with
Bowl is pre-fixed by laser welding realization, is prevented when pedestal to be placed in baking-curing in oven or reflow ovens at glass cover-plate
It is subjected to displacement in bowl in unconfined state and then influences glass cover-plate and be fixed in bowl, while metal frame can ensure that
The adequate thickness of laser pre-welding, prevent due on glass cover-plate metal layer it is too thin so as to cause the welding is not firm the problem of hair
It is raw.
Further, it is equipped with light diffusion layer on the glass, or is equipped with light between VCSEL chip and glass and spreads
Piece.By setting light diffusion layer and light diffusing sheet, the light uniformization that VCSEL chip issues can be redistributed.
Further, the difference between glass cover-plate, solder and bowl top surface between thermal expansion coefficient is less than
10%, it can be prevented in this way since metal layer expanded by heating leads to the generation of glass cover-plate damaged condition in bowl.
Further, the coating thickness of solder is 0.02~0.5mm in bowl, prevents solder is blocked up solder is caused to overflow in this way
Out or solder too it is thin lead to not uniformly coat result in cavity so that influence welding effect difference situation generation.
Detailed description of the invention
Fig. 1 uses the structural representation of plane hard glass for full-inorganic VCSEL device a kind of in the utility model embodiment 1
Figure.
Fig. 2 uses the structural schematic diagram of glass lens for full-inorganic VCSEL device a kind of in the utility model embodiment 1.
Fig. 3 uses the structural representation of plane hard glass for full-inorganic VCSEL device a kind of in the utility model embodiment 2
Figure.
Fig. 4 uses the structural schematic diagram of glass lens for full-inorganic VCSEL device a kind of in the utility model embodiment 2.
Fig. 5 uses the structural representation of plane hard glass for full-inorganic VCSEL device a kind of in the utility model embodiment 3
Figure.
Fig. 6 uses the structural schematic diagram of glass lens for full-inorganic VCSEL device a kind of in the utility model embodiment 3.
Specific embodiment
Invention is described in further details with reference to the accompanying drawings and detailed description.
Embodiment 1
As depicted in figs. 1 and 2, a kind of full-inorganic VCSEL device, including pedestal 1a, open up groove on pedestal 1a and are formed
Bowl 2a or the box dam being arranged on pedestal 1a form bowl 2a, and VCSEL chip 3a, VCSEL chip 3a is arranged in bowl 2a
It is electrically connected with pedestal 1a.
Glass 4a and metal frame 5a are combined together to form glass by solder bond or metal oxide bonding pattern
Cover board, wherein solder bond uses solder welding between glass 4a and metal frame 5a, and metal oxide bonding is i.e. by glass
The metal material of the upper metal material of 4a and metal frame 5a carry out welding；Glass 4a is plane hard glass or glass lens, glass
The flatness < 0.1mm of 4a, under vacuum or inert gas or neutral liquid environment, inert gas can be nitrogen etc., neutral
Liquid is liquid of the pH value close to 7；Glass cover-plate is placed on bowl 2a, metal frame 5a and bowl 2a are then passed through into laser
Weldering welds together.
The flatness of glass 4a is better, and the influence to the laser angle of injection is smaller, and VCSEL chip 3a sending is sharp
Light is reflected and reflects fewer, and the loss of laser is smaller；Glass 4a is preferred transmitance > 90% of infrared band light, thoroughly
It is higher to cross rate, amount of light is more；And difference < 10% between the thermal expansion coefficient between glass 4a and metal frame 5a, matching envelope
It connects just reliable.
In laser welding process, laser is beaten on metal frame 5a, and the thermal conductivity and specific heat capacity difference of the two work as metal
When frame 5 is excited the moment thermal shock of photocoagulation, metal frame 5a expanded by heating, and heat is conducted to glass 4a, triangular heat is swollen
Swollen coefficient difference is smaller, mutually pulls that power is smaller, and glass 4a is less susceptible to rupture；When in use, difference of thermal expansion coefficients is smaller,
In temperature change, the internal stress of three kinds of materials is smaller, thus between three to pull power smaller, be less susceptible to occur combining to lose
Effect, reliability are higher；The outer dimension of glass 4a should be less than or the outer dimension equal to bowl 2a.
For the light uniformization distribution for issuing VCSEL chip 3a, light diffusion layer is set on the bottom surface of glass 4a, or
Light diffusing sheet 6a is set between VCSEL chip 3a and glass 4a, and light diffusing sheet 6a is fixed in bowl, and Fig. 1, which is illustrated, to be provided with
The structure of light diffusing sheet.
In the present embodiment, metal layer is aluminium, copper, gold, silver, iron or their alloy or kovar alloy；The metal frame
For aluminium, copper, gold, silver, iron or their alloy or kovar alloy.
Full-inorganic VCSEL device does not use organic material, it is therefore prevented that organic material is due to heat resistance, air-tightness and reliability
Etc. performances it is bad and VCSEL device is made to be unsuitable for the shortcomings that working under the adverse circumstances such as high temperature and humidity；Using laser welding work
The VCSEL device of skill encapsulation has the advantages that high reliablity, air-tightness are high, is suitble to use under circumstances.
The packaging method of the corresponding full-inorganic VCSEL device of embodiment 1, comprising the following steps:
S1, pretreatment: including preparing VCSEL chip 3a, being provided with the pedestal 1a of bowl 2a and equipped with the bowl of metal layer
2a, the bowl 2a equipped with metal layer can be by, by physical method evaporated metal layer, preparing in electrochemical process on bowl 2a
Thick metal layers eventually form metal layer, are also possible to for bowl 2a being made of metal material, to have metal layer on bowl 2a；
Glass cover-plate is made, glass 4a is bonded with metal frame 5a by solder bond or metal oxide, glass 4a and metal frame are made
Matched seal, the flatness < 0.1mm of glass 4a are formed between 5a；
S2, VCSEL chip 3a is fixed in bowl 2a；
S3, under vacuum or inert gas or neutral liquid environment, vacuum environment i.e. carry out vacuumize process, inert gas
Can be nitrogen etc., neutral liquid be pH value close to 7 liquid；Glass cover-plate is placed on bowl 2a；
S4, laser pre-welding use Laser Welding one or more solder joint on the metal frame 5a of glass cover-plate, and solder joint is in glass
Periphery is uniformly distributed, and symmetrical relative to glass cover-plate 51, and glass cover-plate is fixed on bowl 2a.Laser pre-welding is adopted
The laser exported with impulse form, main technological parameter are as follows: peak power is 50~200W；Mean power is 3-15W；Laser
Device focal position is that distance is soldered face ± 5mm；Speed > 1mm/s；
S5, laser welding are welded together the metal frame 5a of glass cover-plate and bowl 2a with laser.Laser welding uses
The laser of impulse form output, main technological parameter are as follows: peak power is 50~200W；Mean power is 3-15W；Laser
Focal position is that distance is soldered face ± 5mm；Speed > 1mm/s.Laser welding process can form rule between metal frame and bowl
Solder joint then, and more than two solder joints are formed by laser welding between the metal frame and bowl, for example be boss shape, it is adjacent
Form overlapping portion between solder joint center, the floor space of overlapping portion be answer>0% and<100% single solder joint floor space, and
It is best between 50%~70%, due to the overlapped setting of solder joint, so that the solder joint formed forms even closer weld-ring, in this way
The hermetic seal of inorganic VCSEL devices can be improved.
In the present embodiment, metal layer is aluminium, copper, gold, silver, iron or their alloy or kovar alloy；The metal frame
For aluminium, copper, gold, silver, iron or their alloy or kovar alloy.
The packaging method of the present embodiment, the purpose of laser pre-welding is pre-fixed glass cover-plate in bowl 2a in step S4
On, in case there is warpage or cracking in glass cover-plate when next step welding sequence；The good reliability of welding；Step S5 uses Laser Welding
It connects, laser welding process makes glass cover-plate and bowl 2a form a closed cavity, and laser welding process can be in metal
The solder joint of formation rule between frame 5a and bowl 2a, and adjacent each solder joint is overlapped, the area of lap answer>0% and<
The molten bath of the 100% single solder joint of solder joint area has certain overlapping, and air-tightness is good, thus the stability and reliability of product
It is high；It is welded again by laser pre-welding and laser, so that glass cover-plate is fixed in advance on bowl 2a, thus when laser welds again
Only need the welding region of very little that the connection of glass cover-plate Yu bowl 2a can be realized, the technique edges of welding are smaller, corresponding optical window
It can become larger, light emission rate can become larger.
Embodiment 2
As shown in Figure 3 and Figure 4, a kind of full-inorganic VCSEL device, including pedestal 1b, open up groove on pedestal 1b and are formed
Box dam bowl 2b is arranged in bowl 2b on pedestal 1b, and VCSEL chip 3b, VCSEL chip 3b and pedestal are arranged in bowl 2b
1b electrical connection.
Glass cover-plate 4b be monolithic glass structure, the glass cover-plate equipped with metal layer or the glass cover-plate equipped with metal frame,
Glass is plane hard glass or glass lens in flatness the < 0.1mm, glass cover-plate 4b of glass cover-plate, in vacuum or inertia
Under gas, inert gas can be nitrogen etc.；Glass cover-plate 4b is placed on bowl 2b, then by glass cover-plate 4b and bowl
For 2b by solder bond, solder is brazing metal, metal and inorganic matter mixed solder or sintering elargol.The plane of glass cover-plate 4b
It is better to spend, and the influence to the laser angle of injection is smaller, and the laser of VCSEL chip 3b sending is reflected and what is reflected gets over
Few, the loss of laser is smaller；Glass cover-plate 4b is preferred transmitance > 90% of infrared band light.Glass cover-plate 4b, solder and bowl
Difference between the thermal expansion coefficient of cup 2b is less than 10%, since difference of thermal expansion coefficients is little between glass, solder and bowl,
It realizes glass cover-plate 4b, solder, the matched coefficients of thermal expansion between bowl 2b three, prevents bowl expanded by heating from damaging glass.
For the light uniformization distribution for issuing VCSEL chip 3b, light diffusion layer is set on the bottom surface of glass cover-plate 4b,
Or light diffusing sheet 6b is set between VCSEL chip 3b and glass cover-plate 4b, light diffusing sheet 6a is fixed in bowl.
Full-inorganic VCSEL device does not use organic material, it is therefore prevented that organic material is due to heat resistance, air-tightness and reliability
Etc. performances it is bad and VCSEL device is made to be unsuitable for the shortcomings that working under the adverse circumstances such as high temperature and humidity；By the way that pedestal 1b is set
The method that baking-curing connection glass 4b and bowl 2b is carried out in oven or reflow ovens is simple, efficient and reliable, solder solidification
Shi Wuxu additionally applies pressure；Glass 4b and bowl 2b forms airtight cavity by solder bond, and air-tightness is good.Using this knot
The VCSEL device of structure has the advantages that air-tightness is good, high reliablity.
The packaging method of the corresponding full-inorganic VCSEL device of embodiment 2, comprising the following steps:
S1, pretreatment: including the pedestal 1b for preparing VCSEL chip 3b, being provided with bowl 2b；Preparation glass cover-plate 4b, glass
Glass cover board 4b is monolithic glass structure, the glass cover-plate equipped with metal layer or the glass cover-plate equipped with metal frame, wherein glass cover
The flatness < 0.1mm of plate, glass cover-plate are plane hard glass or glass lens；
S2, VCSEL chip 3b is fixed in bowl 2b；
S3, in the surface bowl 2b coated with solder, solder-coated with a thickness of 0.02~0.5mm；
S4, under vacuum or inert gas environment, vacuum environment carries out vacuumize process, and inert gas can be nitrogen
Deng glass cover-plate 4b is placed on bowl 2b；
S5, by pedestal 1b be placed in oven or reflow ovens carry out baking-curing keep glass cover-plate and bowl 2b closely coupled.
The heating rate of oven or reflow ovens is controlled in 1~20 DEG C/S；Rate of temperature fall is controlled in 1~5 DEG C/S；Base in oven or reflow ovens
Peak temperature≤340 DEG C of seat.
The packaging method of the present embodiment, in step S3 in bowl 2b surface coated with solder, if in the too thin technique of solder
Solder uniformity relatively difficult to achieve, cavity easy to form；If solder is too thick to be easy to cause spilling, solder selects gold in the present embodiment
Belong to solder, metal inorganic substance mixed solder or sintering elargol；Under vacuum or inert gas, glass cover-plate is placed on bowl
On, convenient for being formed in glass cover-plate and bowl sealing space as vacuum environment, prevent in sealing space there are oxygen so as to cause
The oxidation of material in sealing space；Baking-curing connection glass is carried out by the way that pedestal to be placed in oven or reflow ovens in step S5
Glass cover board and the method for bowl 2b are simple, efficient and reliable, apply pressure without additional when solder solidification；Glass cover-plate and bowl
2b by solder bond formed airtight cavity, air-tightness is good, using this packaging method VCSEL device have air-tightness it is good, can
The advantage high by property, stability is good.
Embodiment 3
As shown in Figure 5 and Figure 6, a kind of full-inorganic VCSEL device, including pedestal 1b, open up groove on pedestal 1b and are formed
Box dam bowl 2b is arranged in bowl 2b on pedestal 1b, and VCSEL chip 3b, VCSEL chip 3b and pedestal are arranged in bowl 2b
1b electrical connection.
Glass cover-plate 4b is the glass cover-plate equipped with metal layer or the glass cover-plate equipped with metal frame, the plane of glass cover-plate
< 0.1mm is spent, glass is plane hard glass or glass lens in glass cover-plate 4b, and the present embodiment is the glass equipped with metal frame
Cover board, the glass cover-plate equipped with metal layer is directly that metal layer is equipped on the bottom surface of glass cover-plate, in vacuum or inert gas
Under, inert gas can be nitrogen etc.；Glass cover-plate 4b is placed on bowl 2b, then passes through laser on glass cover-plate 4b
Weldering forms more than one pre- solder joint, and then by glass cover-plate 4b and bowl 2b by solder bond, solder is brazing metal, metal
With inorganic matter mixed solder or sintering elargol.Pre- solder joint is formed by first passing through Laser Welding on glass cover-plate 4b, so as to have
Glass cover-plate 4b drift on bowl 2b is prevented to effect, so that glass cover-plate 4b is securely fixed on bowl 2b, glass cover-plate
The flatness of 4b is better, and the influence to the laser angle of injection is smaller, and the laser that VCSEL chip 3b is issued is reflected and reflected
That falls is fewer, and the loss of laser is smaller；Glass cover-plate 4b is preferred transmitance > 90% of infrared band light.Glass cover-plate 4b, weldering
Difference between material and the thermal expansion coefficient of bowl 2b is less than 10%, due to coefficient of thermal expansion differences between glass, solder and bowl
Not less, glass cover-plate 4b, solder, the matched coefficients of thermal expansion between bowl 2b three are realized, prevents bowl expanded by heating from damaging
Bad glass.
For the light uniformization distribution for issuing VCSEL chip 3b, light diffusion layer is set on the bottom surface of glass cover-plate 4b,
Or light diffusing sheet 6a is set between VCSEL chip 3b and glass cover-plate 4b, light diffusing sheet 6a is fixed in bowl.
Full-inorganic VCSEL device does not use organic material, it is therefore prevented that organic material is due to heat resistance, air-tightness and reliability
Etc. performances it is bad and VCSEL device is made to be unsuitable for the shortcomings that working under the adverse circumstances such as high temperature and humidity；By the way that pedestal 1b is set
The method that baking-curing connection glass 4b and bowl 2b is carried out in oven or reflow ovens is simple, efficient and reliable, solder solidification
Shi Wuxu additionally applies pressure；Glass 4b and bowl 2b forms airtight cavity by solder bond, and air-tightness is good.Using this knot
The VCSEL device of structure has the advantages that air-tightness is good, high reliablity.
Another packaging method of the corresponding full-inorganic VCSEL device of embodiment 3, comprising the following steps:
S1, pretreatment: including the pedestal 1b for preparing VCSEL chip 3b, being provided with bowl 2b；Preparation glass cover-plate 4b, this
In embodiment, glass cover-plate 4b is the glass cover-plate provided with metal layer or the glass cover-plate provided with metal frame, glass cover-plate
The flatness < 0.1mm of 4b；
S2, VCSEL chip 3b is fixed in bowl 2b；
S3, in the surface bowl 2b coated with solder, solder-coated with a thickness of 0.02~0.5mm；
S4, under vacuum or inert gas environment, vacuum environment carries out vacuumize process, and inert gas can be nitrogen
Deng glass cover-plate 4b is placed on bowl 2b；
S4.1, laser pre-welding use Laser Welding one or more solder joint on glass cover-plate 4b, and solder joint is in glass cover-plate 4b
Periphery is uniformly distributed, and symmetrical relative to glass cover-plate 4b, and glass cover-plate 4b is fixed on bowl 2b.Laser pre-welding
The laser exported using impulse form, main technological parameter are as follows: peak power is 50~200W；Mean power is 3-15W；Swash
Light device focal position is that distance is soldered face ± 5mm；Speed > 1mm/s；
S5, by pedestal 1b be placed in oven or reflow ovens carry out baking-curing make the close phase of glass cover-plate 4b and bowl 2b
Even.The heating rate of oven or reflow ovens is controlled in 1~20 DEG C/S；Rate of temperature fall is controlled in 1~5 DEG C/S；Oven or reflow ovens
Peak temperature≤340 DEG C of interior pedestal.
The packaging method of the present embodiment, in step S3 in bowl 2b surface coated with solder, if in the too thin technique of solder
Solder uniformity relatively difficult to achieve, cavity easy to form；If solder is too thick to be easy to cause spilling, solder selects gold in the present embodiment
Belong to solder, metal and inorganic matter mixed solder or sintering elargol；Under vacuum or inert gas, glass cover-plate 4b is placed on bowl
On cup, convenient for make glass cover-plate 4b and bowl sealing space formed vacuum environment, prevent in sealing space there are oxygen to
Lead to the oxidation of material in sealing space；By laser pre-welding in step S4.1, glass cover-plate 4b is pre-fixed in bowl 2b
On, prevent the glass cover-plate 4b when pedestal 1b is placed in baking-curing in oven or reflow ovens to be in unconfined state and glass
Drift occurs in bowl for cover board and then influence glass cover-plate is securely fixed in bowl, by the way that pedestal to be placed in step S5
The method that baking-curing connection glass cover-plate 4b and bowl 2b is carried out in oven or reflow ovens is simple, efficient and reliable, and solder is solid
Apply pressure without additional when change；Glass cover-plate 4b and bowl 2b forms airtight cavity by solder bond, and air-tightness is good, uses
This packaging method can simplify production technology, save production cost, improve production efficiency, the VCSEL produced using this packaging method
Device has the advantages that good air-tightness, high reliablity, stability are good.
Claims (10)
1. a kind of full-inorganic VCSEL device, including pedestal and VCSEL chip, it is characterised in that: be equipped with bowl, bowl on the base
Cup top surface is equipped with metal layer, and VCSEL chip is located in bowl and is electrically connected with pedestal, and sealing VCSEL chip is equipped in bowl
Glass cover-plate, glass cover-plate includes glass and metal frame, and the flatness < 0.1mm of glass passes through between glass and metal frame
Solder bond or metal oxide bonding pattern are combined together, and are welded between metal layer by Laser Welding on metal frame and bowl
Together.
2. a kind of full-inorganic VCSEL device according to claim 1, it is characterised in that: be equipped with light on the glass and expand
Layer is dissipated, or is equipped with light diffusing sheet between VCSEL chip and glass.
3. a kind of full-inorganic VCSEL device according to claim 1, it is characterised in that: between glass cover-plate and metal frame
Difference between thermal expansion coefficient is less than 10%.
4. a kind of full-inorganic VCSEL device according to claim 1, it is characterised in that: between the metal frame and bowl
More than two solder joints are formed by laser welding, form overlapping portion between adjacent welds center, the floor space of overlapping portion is single
The 50%-70% of solder joint floor space.
5. a kind of full-inorganic VCSEL device, including pedestal and VCSEL chip, it is characterised in that: it is equipped with bowl on the base,
VCSEL chip is located in bowl and is electrically connected with pedestal, and the glass cover-plate of sealing VCSEL chip, glass cover are equipped in bowl
The flatness < 0.1mm of plate, passes through solder bond between glass cover-plate and bowl.
6. a kind of full-inorganic VCSEL device according to claim 5, it is characterised in that: the glass cover-plate is equipped with gold
The glass cover-plate for belonging to layer is equipped with the pre- solder joint formed by laser prewelding between the glass cover-plate and bowl.
7. a kind of full-inorganic VCSEL device according to claim 5, it is characterised in that: the glass cover-plate is equipped with gold
The glass cover-plate for belonging to frame is equipped with the pre- solder joint formed by laser prewelding between the glass cover-plate and bowl.
8. a kind of full-inorganic VCSEL device according to claim 5, it is characterised in that: be equipped with light on the glass and expand
Layer is dissipated, or is equipped with light diffusing sheet between VCSEL chip and glass.
9. a kind of full-inorganic VCSEL device according to claim 5, it is characterised in that: the glass cover-plate, solder and bowl
Difference between cup top surface between thermal expansion coefficient is less than 10%.
10. a kind of full-inorganic VCSEL device according to claim 5, it is characterised in that: the coating thickness of solder in bowl
For 0.02~0.5mm.
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| CN201821621614.1U CN208753724U (en) | 2018-09-30 | 2018-09-30 | A kind of full-inorganic VCSEL device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119886A (en) * | 2018-09-30 | 2019-01-01 | 广州市鸿利秉光电科技有限公司 | A kind of full-inorganic VCSEL device and its packaging method |
| CN112838015A (en) * | 2020-12-31 | 2021-05-25 | 联晶智能电子有限公司 | Semiconductor packaging method and semiconductor device |
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2018
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119886A (en) * | 2018-09-30 | 2019-01-01 | 广州市鸿利秉光电科技有限公司 | A kind of full-inorganic VCSEL device and its packaging method |
| CN109119886B (en) * | 2018-09-30 | 2024-05-03 | 广州市鸿利秉一光电科技有限公司 | All-inorganic VCSEL device and packaging method thereof |
| CN112838015A (en) * | 2020-12-31 | 2021-05-25 | 联晶智能电子有限公司 | Semiconductor packaging method and semiconductor device |
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