CN117340411A - Thermosonic flip bonding welding head for multi-size materials and application thereof - Google Patents
Thermosonic flip bonding welding head for multi-size materials and application thereof Download PDFInfo
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- CN117340411A CN117340411A CN202311543218.7A CN202311543218A CN117340411A CN 117340411 A CN117340411 A CN 117340411A CN 202311543218 A CN202311543218 A CN 202311543218A CN 117340411 A CN117340411 A CN 117340411A
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
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- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
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Abstract
The invention relates to the technical field of thermosonic flip-chip welding equipment, in particular to a thermosonic flip-chip bonding welding head for multi-size materials which can adapt to different specifications of materials to be processed without changing the welding head, and is used for efficiently and stably completing thermosonic flip-chip bonding welding.
Description
Technical field:
the invention relates to the technical field of thermosonic flip-chip bonding equipment, in particular to a thermosonic flip-chip bonding welding head for multi-size materials, which can adapt to different specifications of materials to be processed, does not need to replace the welding head and can efficiently and stably finish thermosonic flip-chip bonding welding, and application thereof.
The background technology is as follows:
thermosonic flip chip technology is an advanced interconnect technology for the optoelectronic field with high performance that enables convenient electrical and mechanical interconnection between chips or between chips and carriers through bumps. With the development of miniaturization and light weight of products and the increase of the number of I/O terminals, the traditional lead bonding and solder ball flip packaging technology cannot meet the requirement of high density, and the development of gold bump hot spot ultrasonic flip chip bonding of chips brings hopes for high density packaging in the radio frequency field. As shown in figure 1, in the working process, the chip positioned on the upper layer needs to be flipped over by 180 degrees and then flipped over on the lower layer chip, so that the bumps of the upper layer chip are aligned with the corresponding bonding pads of the lower layer chip, then pressure, heating and ultrasonic energy are applied to the chip, so that the bump metal and the bonding pads are inlaid, and meanwhile, the oxidation layer on the bonding interface is destroyed, so that attractive force between atoms reaches the bonding standard. In the bonding process, the output direction of pressure is vertical to the bonding surface, and the output direction of ultrasonic energy is reciprocating back and forth along the bonding surface, so that in order to ensure bonding reliability, the upper layer of chip and the lower layer of chip are required to be stably fixed in the bonding process, otherwise, position deviation can be generated to directly influence the bonding effect, and under the premise of fixing and stabilizing a bonding part, the bonding quality of a product is ensured by precisely controlling ultrasonic energy, pressure and temperature of ultrasonic bonding flip-chip welding.
In the prior art, a negative pressure hole is formed in a welding head for thermosonic flip-chip welding, materials to be processed are stably absorbed through negative pressure and pressed to a bonding surface, and as the vacuum absorption holes fixedly arranged on a welding head part and the structure of the vacuum absorption holes cannot adapt to the materials to be processed with various sizes, before bonding chips with different sizes, the welding head which is adaptive to the sizes of the materials needs to be replaced, the welding head is always in a high-temperature state (150-200 ℃) in the operation process, the welding head can be replaced when the temperature of the welding head is replaced due to the thermal expansion between the welding head and different materials of a welding head fixing mechanism, the welding head must be reduced to normal temperature, and the temperature cannot be forcedly and rapidly reduced in the cooling process, so that the stress in the metal material can be increased, and cracking is easy to occur. Under the condition of rapid cooling, the cooling speed of the metal material is too high, so that the brittleness of the metal material is easily increased, the load bearing capacity of the metal material is reduced, the strength and toughness balance of the welding head are directly influenced, and the service life and the use effect of the welding head are reduced. In addition, after the new welding head is replaced, the levelness of the new welding head is required to be subjected to debugging calibration confirmation through a special testing instrument (the required tolerance of the levelness of the welding head is less than 3 um), and then the levelness of the welding head and the surface of the material to be welded is required to be subjected to debugging confirmation, so that a great deal of time and labor are consumed, and at least more than 2 hours are required for replacing the welding head once due to the reasons.
The invention comprises the following steps:
aiming at the defects and shortcomings in the prior art, the invention provides the thermosonic flip bonding welding head for the multi-size materials, which has the advantages of reasonable structure, simple and convenient assembly and capability of obviously improving the working efficiency on the premise of ensuring the bonding stability, and the application thereof.
The invention is achieved by the following measures:
the thermosonic inverted bonding welding head for the multi-size materials is provided with a welding head main body, the surface of the welding head main body is provided with more than two negative pressure holes which are arranged along a straight line, the negative pressure holes are communicated with a negative pressure cavity in the welding head main body, and the negative pressure cavity is connected with external negative pressure treatment equipment to keep the negative pressure state of the negative pressure cavity and the negative pressure holes.
The welding head comprises a front-end flat main body and a back-end cylindrical part, wherein the flat main body and the cylindrical part are of an integrated structure and are made of metal materials, the front side of the flat main body is provided with negative pressure holes and negative pressure grooves, the negative pressure cavity comprises a main cavity body coaxially arranged with the cylindrical part, the rear end of the main cavity body penetrates through the tail end of the cylindrical part, the front end of the main cavity body extends into the flat main body, the front end of the main cavity body is respectively communicated with more than two channels, the more than two channels are in one-to-one correspondence with more than two negative pressure holes so as to realize the communication of the negative pressure cavity and the negative pressure holes, and further, the channels are of straight-line segments, namely, the channels are the shortest straight channels between the front ends of the main cavity body and the negative pressure holes corresponding to the channels, so that the channels of the negative pressure holes positioned right in front of the flat main body are shortest in length, the channels corresponding to the negative pressure holes positioned on the front side of the main cavity body are of oblique lines, the channels are enabled to be input into the main cavity body through external negative pressure equipment through the structure, the channels are respectively communicated with more than two channels, the channels are directly acted on the corresponding negative pressure holes of the main cavity body through the negative pressure equipment, and the negative pressure channels are not communicated with the negative pressure holes, and the signal arrays are not uniform, and the signal are not welded at the front-end surface negative pressure stability, and the signal is not uniform, and the signal is caused, and the problem is avoided, and the signal is caused by the signal that the signal is welded at the front and the front-end surface and the negative pressure side.
The negative pressure groove is arranged at the central position of the welding head main body, and further, the negative pressure groove is arranged at the main cavity of the negative pressure cavity.
The invention is further provided with more than two negative pressure grooves on the surface of the welding head main body, and the negative pressure grooves are used for grouping more than two negative pressure holes which are arranged along a straight line, so that one or two or three negative pressure holes fall into the same negative pressure groove, and when the welding head is in operation, the negative pressure suction force is further improved by utilizing the gathering effect of the negative pressure grooves.
The maximum width of the negative pressure groove is required to be less than 50% of the width of the narrowest chip which can be bonded by the equipment, and the length is required to ensure that the actual contact area between the welding head and the chip to be welded is not less than 70%, so as to ensure the uniformity of the pressure of the welding head acting on the chip surface and the stability of ultrasonic output
The invention preferably arranges 7-hole negative pressure holes on the surface of the welding head at equal intervals along a straight line, wherein the central hole position of the 7-hole negative pressure holes is arranged in the center of the welding head, the other 6 holes are symmetrically arranged on two sides of the central hole position, four negative pressure grooves are also arranged in a central symmetry manner, the negative pressure holes at two ends respectively fall into the first negative pressure groove and the fourth negative pressure groove, and the four negative pressure holes between the central hole position and the edge hole position fall into the second groove and the third groove.
According to the invention, the negative pressure cavity and the pore canal structure are arranged in the welding main body, so that the pressure and the negative pressure effect on the welding head main body are applied to different negative pressure holes at the front part of the welding head main body stably, and the surface of the chip to be processed maintains good flatness when the chip to be processed is adsorbed, so that the ultrasonic signals applied subsequently can be transmitted to each salient point of the chip to be processed uniformly, and the stability of flip chip bonding is improved; in addition, through reasonable design collocation of the negative pressure hole and the negative pressure groove of the bonding head bonding area, the same bonding head main body can adapt to chips to be bonded with different sizes, the equipment machine adjusting time can be greatly reduced, the machine adjusting time is effectively shortened, and the operation efficiency is improved.
The invention provides application of a thermosonic flip bonding welding head for multi-size materials, which is characterized by being used for realizing flip bonding of chips.
According to the invention, an effective bonding area is determined according to the size of the material to be bonded, so that the material to be bonded is preferentially opposite to the negative pressure groove with large area, sufficient adsorption force is ensured when chips are adsorbed, corresponding program files are only required to be called when the chips with different sizes are switched, and then normal production can be started after confirming the material, bonding position and bonding effect used by a new product, and the working of cooling replacement, horizontal debugging and the like of the corresponding part of a welding head of the equipment are not required, so that the machine-hour is effectively shortened and the labor is saved.
Description of the drawings:
fig. 1 is a schematic diagram of the thermosonic flip-chip bonding principle.
Fig. 2 is a schematic structural view of the front end of a conventional thermosonic flip-chip bonding tool.
Fig. 3 is a cross-sectional view of a prior art thermosonic flip bonding tool.
Fig. 4 is a schematic view of a construction of the present invention.
Fig. 5 is a schematic view of the surface structure of the bonding tool of fig. 4.
Fig. 6 is a cross-sectional view of a bonding tool body according to the present invention.
Fig. 7 is a schematic structural diagram of a chip to be soldered according to an embodiment of the invention.
Reference numerals: the welding head comprises a welding head main body 1, a plane cavity 2, a pore canal 3, a main cavity 4, a negative pressure hole 5, a chip 6 to be welded, a bump 7 on the chip, a flat main body 8 at the front end and a negative pressure groove 9.
The specific embodiment is as follows:
the invention will be further described with reference to the drawings and examples.
In the thermal ultrasonic flip-chip welding process, as shown in fig. 1, 2 and 3, an ultrasonic signal and a downward pressure are simultaneously applied to a welding plane by a welding head main body 1 to enable parts to be welded to be in close contact along a welding interface, in order to ensure the reliability of flip-chip welding, materials to be welded on the upper side need to be tightly connected with the welding head, and dislocation is caused once the materials fall off, therefore, in the prior art, a T-shaped negative pressure cavity is formed in the welding head main body 1 through negative pressure action, as shown in fig. 3, the front end of the T-shaped negative pressure cavity is respectively communicated with a negative pressure hole 5, the rear end of the T-shaped negative pressure cavity is connected with external negative pressure equipment, the negative pressure adsorption force is released by the negative pressure hole 5, an upper chip to be welded is adsorbed on the welding head main body 1, and the fact that, the negative pressure cavity in the prior art comprises a strip-shaped main cavity body arranged along the central axis of the columnar part of the welding head main body 1 and a plane cavity body 2 communicated with the strip-shaped main cavity body 4 and parallel to a welding plane, wherein the plane cavity body 2 is positioned at the front end of the main cavity body 4 and is arranged closer to the negative pressure holes 5, more than two negative pressure holes 5 are arranged at the outer side of the plane cavity body 2 at equal intervals and are respectively communicated with the plane cavity body 2 through equal-length pore channels 3, and undeniably, the existence of the plane cavity body 2 can play a role in stabilizing airflow and arranging airflow, and more than two negative pressure holes 5 can be communicated with the negative pressure cavity through the equal-length pore channels 3 through the arrangement of the plane cavity body 2, so that the uniformity of the negative pressure attractive force of each negative pressure hole 5 is ensured as much as possible, wherein the plane cavity body 2 is a cavity body with the depth of 12mm and the width slightly larger than the length of the negative pressure hole array;
obviously, the prior art aims to realize reliable suction of a chip to be welded through uniform negative pressure attractive force, however, the research team of the application finds that the cavity structure of the welding head main body 1 in the prior art causes the front end of the welding head main body 1 to be greatly damaged, because welding equipment heats welding workpieces from the lower side of a welding plane and a welding joint simultaneously as shown in the attached drawing 1 in the process of thermosonic flip-chip welding, heat can be conducted to the welding head main body 1, the cavity structure of the welding main body in the prior art causes inconsistent heat conduction of the front end of the whole welding head, the heating of the chip contacted with the front end of the welding head main body 1 is inconsistent after the negative pressure treatment is overlapped, the flatness of the chip is reduced due to the expansion and contraction characteristics of materials, namely the chip to be welded is raised, partial areas are raised or recessed, and in the subsequent welding process, welding pressure and ultrasonic energy cannot be uniformly conducted to each gold bump on the chip to be welded, so that the welding quality is poor; in addition, for chips of different specifications, the prior art requires replacement of the bonding tool body 1 of different specifications;
in order to solve the problems, as shown in fig. 4, the welding head is provided with a welding head main body 1, the surface of the welding head main body 1 is provided with more than two negative pressure holes 5 which are arranged along a straight line, the negative pressure holes 5 are communicated with a negative pressure cavity in the welding head main body, the negative pressure cavity is connected with external negative pressure treatment equipment to keep the negative pressure state of the negative pressure cavity and the negative pressure holes 5, the surface of the welding head main body 1 is also provided with a negative pressure groove 9 corresponding to the arrangement area of the negative pressure holes 5, at least one negative pressure hole 5 falls into the negative pressure groove 9, and the negative pressure action area is effectively increased by arranging the negative pressure groove 9, so that the adsorption stability of a chip to be welded is improved;
in addition, in order to ensure that the subsequent ultrasonic signals, pressure and heat can be uniformly applied to a welding plane, the problem of poor flatness of the existing chip to be welded is also to be overcome, a negative pressure cavity structure which is different from the prior art is arranged in the welding joint 1, the negative pressure cavity structure comprises a main cavity body 4 coaxially arranged with a cylindrical part 10 of the welding joint 1, the rear end of the main cavity body 4 penetrates through the tail end of the cylindrical part, the front end of the main cavity body 4 extends into a flat main body 8 at the front end of the welding joint 1, the negative pressure cavity structure also comprises more than two pore channels 3 which are positioned in the flat main body 8 and are respectively communicated with the front end of the main cavity body 4, and the more than two pore channels 3 are respectively in one-to-one correspondence with more than two negative pressure holes 5 so as to realize the communication of the negative pressure cavity and the negative pressure holes 5;
through the negative pressure cavity structure which is obviously different from the prior art, in the negative pressure treatment process, air flow is quickly guided to the main cavity body 4 along the negative pressure hole 5 and guided out along the rear end of the main cavity body 4, negative pressure formed at the negative pressure hole 5 is amplified (the negative pressure contact area is increased) through the action of the negative pressure groove 9, and the heat and ultrasonic signals and welding pressure are not required to be transmitted in multiple media due to the existence of the large-volume planar cavity body 2 at the front end of the welding joint 1 (the signals in the prior art are required to be transmitted to a workpiece through the welding joint 1 and the cavity structure respectively), so that the bonding quality of a chip is effectively improved;
furthermore, the negative pressure groove 9 is offset from the setting position of the negative pressure cavity (namely the main cavity 4) in the welding main body, and the depth of the negative pressure groove 9 is not more than 2mm, so that the problems of too fast heat dissipation or uneven ultrasonic signals, pressure and heat transfer caused by the cavity of the welding joint main body are avoided due to the superposition of the negative pressure effect of the negative pressure groove 9 and the negative pressure effect at the position of the main cavity 4, the flatness of the welding chip is further improved, and the bonding quality is ensured.
In the negative pressure structure, the pore canal 3 is in a straight line segment shape, namely, the pore canal 3 is the shortest straight line channel between the negative pressure holes 5 corresponding to the pore canal and the front end of the main cavity 4, so that the pore canal 3 of the negative pressure hole 5 positioned right in front of the main cavity on the flat main body has the shortest length, and the pore canal corresponding to the negative pressure hole 5 positioned on the side surface of the front part of the main cavity 4 is in a slant line shape.
The surface of the welding head main body 1 is provided with more than two negative pressure grooves 9, and the welding head main body is used for grouping more than two negative pressure holes 5 which are arranged along a straight line, so that one or two or three negative pressure holes fall into the same negative pressure groove 9, and when the welding head is in operation, as the negative pressure groove 9 and the negative pressure holes 5 arranged in the negative pressure groove 9 form an airflow necking, the negative pressure attractive force can be further improved, and the suction effect on a chip is improved.
The maximum width of the negative pressure groove 9 is required to be less than 50% of the width of the narrowest chip which can be bonded by the equipment, and the length is required to ensure that the actual contact area between the welding head and the chip to be welded is not less than 70%, so as to ensure the uniformity of the pressure of the welding head acting on the surface of the chip and the stability of ultrasonic output.
Examples:
the embodiment provides a thermosonic inverted bonding welding head suitable for multi-size materials, which is provided with a welding head main body 1, wherein the surface of the welding head main body 1 is provided with more than two negative pressure holes 5 which are arranged along a straight line, the negative pressure holes 5 are communicated with a negative pressure cavity in the welding head main body, the negative pressure cavity is connected with external negative pressure treatment equipment to keep the negative pressure states of the negative pressure cavity and the negative pressure holes 5, 7-hole negative pressure holes 5 are arranged on the surface of the welding head at equal intervals along the straight line, the central hole position of the 7-hole negative pressure holes 5 is arranged in the center of the welding head, the other 6 holes are symmetrically arranged on two sides of the central hole position and are symmetrically provided with four negative pressure grooves 9, the four negative pressure grooves are arranged in a central symmetry mode, the negative pressure holes at two ends respectively fall into a first negative pressure groove and a fourth negative pressure groove, and the four negative pressure holes between the central hole position and an edge hole position fall into a second negative pressure groove and a third negative pressure groove respectively according to each two groups;
in this example, a negative pressure cavity structure is arranged in the welding joint 1, the negative pressure cavity structure includes a main cavity 4 coaxially arranged with a cylindrical portion of the welding joint 1, a rear end of the main cavity 4 penetrates through a tail end of the cylindrical portion, a front end of the main cavity extends into a flat main body at a front end of the welding joint 1, the negative pressure cavity structure further includes more than two pore channels 3 which are positioned in the flat main body and are respectively communicated with the front end of the main cavity 4, and the more than two pore channels 3 are respectively in one-to-one correspondence with more than two negative pressure holes 5 so as to realize communication between the negative pressure cavity and the negative pressure holes 5;
in the embodiment, the negative pressure groove 9 is offset from the setting position of the negative pressure cavity (i.e. the main cavity 4) in the welding main body, and the depth of the negative pressure groove 9 is 0.1-1.15mm, so that the problems that the heat is too fast to dissipate or the ultrasonic signal, pressure and heat transfer are uneven due to the cavity of the welding joint main body due to the superposition of the negative pressure effect of the negative pressure groove 9 and the negative pressure effect at the position of the main cavity 4 are avoided, the flatness of the welding chip is further improved, and the bonding quality is ensured;
in this example, the two sides of the central negative pressure hole 5 are symmetrically provided with side negative pressure holes 5 which are arranged at equal intervals, and it is worth emphasizing that the negative pressure grooves 9 which are symmetrically arranged at two sides of the central negative pressure hole 5 in this example extend to two sides along the position far away from the central negative pressure hole 5, so that a space exists between the negative pressure grooves 9 at two sides of the central negative pressure hole 5, and the space can further weaken the non-uniformity influence of the main cavity 4 in the negative pressure cavity on the welding joint;
in the negative pressure structure, the duct 3 is in a straight line segment shape, that is, the duct 3 is a shortest straight line channel between the negative pressure holes 5 corresponding to the duct and the front end of the main cavity 4, so that the duct 3 of the negative pressure hole 5 positioned right in front of the main cavity on the flat main body has shortest length, and the duct corresponding to the negative pressure hole 5 positioned on the side surface of the front part of the main cavity 4 is in a slant line shape;
the maximum width of the negative pressure groove 9 is required to be less than 50% of the width of the narrowest chip which can be bonded by the equipment, and the length is required to ensure that the actual contact area between the welding head and the chip to be welded is not less than 70%, so as to ensure the uniformity of the pressure of the welding head acting on the surface of the chip and the stability of ultrasonic output;
the influence of the width of the negative pressure groove 9 on the chip adsorption force in this example is examined as follows:
wherein the adsorption force F is obtained by formula (1), f=p xa (1), wherein F represents the adsorption force, P represents the vacuum degree, a represents the adsorption area, and the vacuum degree P represents the gas pressure in the vacuum environment, and the data can be read by the vacuum gauge on the apparatus.
Experiments show that: when the width dimension of the negative pressure groove 9 is larger than 50% of the width of the chip, unstable combination of the chip and the welding head can occur in the actual bonding process, and poor sliding of the chip position (the chip needs to slide along a welding interface in the welding process) can occur; when the direct contact area A between the welding head and the chip surface is smaller than 70%, poor bonding strength is lower and partial bonding points fail in the actual bonding process;
in the working process, the effective bonding area is determined according to the size of the material to be bonded, so that the material to be bonded is preferentially opposite to the negative pressure groove with large area, the sufficient adsorption force is ensured when the chip is adsorbed, then after confirming the material, bonding position and bonding effect used for a new product and normal production can be started, the corresponding part of the welding head of the equipment is not required to be subjected to the working procedures of cooling, replacement, horizontal debugging and the like, the machine adjustment working hour is effectively shortened, and the labor is saved.
The welding head internal structure designed in the embodiment has the inclined pore canal 3 with an angle, the hollow area in the cavity is reduced through the design, the stability of the ultrasonic and pressure acting on the surface of the chip is guaranteed to the greatest extent, meanwhile, the suction effect is guaranteed, meanwhile, the internal temperature of the welding head is balanced (Kong Changju is small and can delay the loss of temperature), and the uniformity of the temperature transmitted to the surface of the chip by the welding head is guaranteed.
Claims (9)
1. The thermosonic inverted bonding welding head for the multi-size materials is provided with a welding head main body, the surface of the welding head main body is provided with more than two negative pressure holes which are arranged along a straight line, the negative pressure holes are communicated with a negative pressure cavity in the welding head main body, and the negative pressure cavity is connected with external negative pressure treatment equipment to keep the negative pressure state of the negative pressure cavity and the negative pressure holes.
2. The thermosonic flip bonding welding head for multi-size materials according to claim 1, wherein the welding head main body is composed of a flat main body positioned at the front end and a cylindrical part positioned at the back of the flat main body, the flat main body and the cylindrical part are of an integrated structure and are made of metal materials, the front side of the flat main body is provided with a negative pressure hole and a negative pressure groove, the negative pressure cavity comprises a main cavity body coaxially arranged with the cylindrical part, the rear end of the main cavity body penetrates through the tail end of the cylindrical part, the front end of the main cavity body extends into the flat main body, the front end of the main cavity body is respectively communicated with more than two pore channels, and the more than two pore channels are in one-to-one correspondence with the more than two negative pressure holes so as to realize the communication between the negative pressure cavity and the negative pressure hole.
3. The thermosonic flip bonding tool for multi-size materials according to claim 2, wherein the duct is in a straight line segment shape, that is, the duct is a shortest straight line channel between the negative pressure holes corresponding to the duct and the front end of the main cavity, so that the length of the duct of the negative pressure hole positioned right in front of the main cavity on the flat main body is shortest, and the duct corresponding to the negative pressure hole positioned on the side surface of the front part of the main cavity is in a slant shape.
4. A thermosonic flip bonding horn for multi-sized materials according to claim 1, wherein the negative pressure groove is disposed offset from a central location of the horn body.
5. A thermosonic flip bonding horn for multi-size materials according to claim 1, wherein said negative pressure groove is disposed offset from a main cavity of said negative pressure chamber.
6. The thermosonic flip bonding tool for multi-size materials according to claim 1, wherein more than two negative pressure grooves are arranged on the surface of the tool body, and the tool is used for grouping more than two negative pressure holes arranged along a straight line, so that one or two or three negative pressure holes fall into the same negative pressure groove.
7. The thermosonic flip bonding tool for multi-dimensional objects of claim 1, wherein the negative pressure groove has a maximum width less than 50% of the width of the narrowest die that can be bonded by the apparatus and a length such that the actual contact area between the tool and the die to be bonded is no less than 70%.
8. The thermosonic flip bonding tool for multi-size materials according to claim 1, wherein 7 holes are arranged on the surface of the tool at equal intervals along a straight line, wherein the central hole position of the 7 holes is arranged at the center of the tool, the other 6 holes are symmetrically arranged at two sides of the central hole position, four negative pressure grooves are also symmetrically arranged at the center, wherein the negative pressure holes at two ends respectively fall into the first negative pressure groove and the fourth negative pressure groove, and the four negative pressure holes between the central hole position and the edge hole position fall into the second and the third grooves.
9. An application of a thermosonic flip-chip bonding tool for multi-size materials as described above, comprising: according to the size of the materials to be bonded, an effective bonding area is determined, so that the materials to be bonded are preferentially opposite to the negative pressure groove with large area, sufficient adsorption force is ensured when chips are adsorbed, corresponding program files are only required to be called when the chips with different sizes are switched, then normal production can be started after confirming the materials, bonding positions and bonding effects used by new products, and the corresponding parts of a welding head of equipment are not required to be subjected to cooling replacement, horizontal debugging and the like, so that the machine-hour is effectively shortened and the labor is saved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311543218.7A CN117340411A (en) | 2023-11-20 | 2023-11-20 | Thermosonic flip bonding welding head for multi-size materials and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311543218.7A CN117340411A (en) | 2023-11-20 | 2023-11-20 | Thermosonic flip bonding welding head for multi-size materials and application thereof |
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| Publication Number | Publication Date |
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| CN117340411A true CN117340411A (en) | 2024-01-05 |
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| CN202311543218.7A Pending CN117340411A (en) | 2023-11-20 | 2023-11-20 | Thermosonic flip bonding welding head for multi-size materials and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117340411A (en) |
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2023
- 2023-11-20 CN CN202311543218.7A patent/CN117340411A/en active Pending
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