KR101133660B1 - Apparatus for correcting position of wafer, wafer bonder and jig for wafer bonder - Google Patents

Abstract

Wafer position calibration apparatus according to an embodiment of the present invention is installed on the jig and the jig in which the wafer having a flat zone formed on one side is mounted so as to quickly and easily correct the position of the wafer, And a pressing member having a first guide pin in contact with the flat zone and a flexible tip movably mounted relative to the wafer and pushing the wafer.

Wafer, Flat Zone, Positioning, Calibration, Flexible Tip

Description

A wafer positioning device, a wafer bonder, and a jig for a wafer bonder {APPARATUS FOR CORRECTING POSITION OF WAFER, WAFER BONDER AND JIG FOR WAFER BONDER}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a wafer positioning device, a wafer bonder, and a jig for a wafer bonder. More particularly, the present invention relates to a wafer bonder with an improved structure for mounting a position correction device and a guide pin, and a wafer bonder. It's about the jig.

Today, the trend in the electronics industry is to make products that are lighter, smaller, faster, more versatile, higher in performance and more reliable at lower cost. One important technology that enables this is the package technology, and thus, one of the packages developed recently is a stack chip package.

The stacked chip package is a semiconductor package in which semiconductor chips are stacked three-dimensionally on a package substrate, thereby achieving high integration, and having excellent responsiveness to light and thin reduction of semiconductor products. Such stacked chip packages are fabricated at the chip level or wafer level.

However, when manufacturing a stacked chip package at the chip level, because the known good good die (KGD) is used, the reliability of the completed stacked chip package is excellent, while the manufacturing process is long. Because of this, productivity of the laminated chip package is lowered.

On the other hand, when manufacturing a stacked chip package at the wafer level, since the wafer is bonded to form a stacked chip package, the time required for the manufacturing process is shortened, thereby improving productivity of the stacked chip package. The wafer stack package technology is applied to various fields, such as a light emitting diode (LED) as well as a semiconductor chip.

When bonding the wafer, the adhesive melts at high heat and pressure in the vacuum chamber.

In the case of bonding the wafer inside the vacuum chamber, it is most important to align the wafer in the set position. However, it is not easy to align the wafer in a predetermined position inside the chamber to maintain the vacuum state.

Conventionally, the structure of aligning the wafer by tapping the wafer has been proposed, but it is difficult to rotate the wafer only by tapping the wafer, which causes a problem that the wafer cannot be bonded at a set position. In addition, there is a problem that takes a long time to align the wafer.

In addition, if the wafer is not aligned to the set position, a defect occurs in the bonded chips.

And the guide pin for supporting the wafer protrudes above the wafer, in order to apply sufficient pressing force to the wafer during the bonding process, the pressing force should be applied to the wafer without being disturbed by the guide pin.

To this end, conventionally, a structure is proposed in which a wafer is clamped and pressed except for a portion where the clamp is installed. However, such a structure has a problem that it is not possible to pressurize the portion in which the clamp is installed, and it is difficult to apply a uniform pressing force due to the force acting on the clamp.

Even when pressing the wafer using a jig having a shape corresponding to the wafer shape, there is a problem in that the pressing force is not properly transmitted to the edge of the wafer.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a wafer position calibration apparatus capable of quickly and accurately correcting the position of a wafer.

In addition, another object of the present invention is to provide a wafer bonder that can apply a stable pressing force to the wafer.

According to an embodiment of the present invention, a wafer position correcting apparatus includes a jig in which a wafer having a flat zone formed on one side thereof is mounted, a first guide pin installed on the jig, and contacting the flat zone, and the And a pressing member having a flexible tip movably installed relative to the wafer and pushing the wafer.

The pressing member may include a first flexible tip and a second flexible tip spaced apart from the first flexible tip, and the point where the first flexible tip and the wafer meet is referred to as P1 and the second flexible tip. The point where the tip meets the wafer is called P2. When the center of the wafer is called O1, the angle where the line L1 connects O1 to P1 and the line L2 connects O1 to P1 is θ, and θ is 60. It may be from 90 ° to 90 °.

The pressing member may include a third flexible tip disposed below the first flexible tip and a fourth flexible tip disposed below the second flexible tip, wherein the jig is installed in the vacuum chamber. Can be.

It may further include a second guide pin installed on the jig and in contact with the curved portion connecting the end of the flat zone, the wafer position correction device further comprises a transfer unit for moving the pressing member relative to the wafer. can do. The transfer unit may include a base disposed below the jig, a rail fixed on the base, and a trolley movably installed along the rail, and the pressing member may be connected to the trolley.

The base may further include a base disposed below the jig and a rail fixed on the base, and the pressing member may be installed to be movable along the rail.

According to another embodiment of the present invention, a wafer bonder may include a lower jig on which a wafer having a flat zone is formed on one side, a guide pin installed on the lower jig via an elastic member and contacting the wafer, and the lower jig. And an upper jig arranged to pressurize the wafers to attach the wafers.

A groove is formed in the lower jig, the elastic member may be inserted into the groove, and the elastic member may be formed of a spring.

In addition, the wafer bonder may further include a pressing member having two flexible tips that are movably installed with respect to the wafer and push the wafer.

In the wafer bonder jig according to another embodiment of the present invention, a groove is formed on an upper surface of the jig, and the jig is installed on the jig through an elastic member inserted into the groove and the elastic member, and the side surface of the wafer. And a guide pin in contact with the.

According to the present invention as described above it is possible to quickly and accurately correct the position of the wafer. In addition, a stable pressing force can be applied to the entire wafer during wafer bonding.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

1 is a plan view of a wafer position calibration apparatus according to a first embodiment of the present invention, and FIG. 2 is a side view of a wafer position calibration apparatus according to a first embodiment of the present invention.

Referring to FIGS. 1 and 2, the position correcting apparatus 100 according to the present embodiment includes a jig 150 on which the wafer 112 is mounted, a jig 150 mounted on the jig 150, and a flat surface of the wafer 112. A pressing member having a first guide pin 151 in contact with the zone 112a and a flexible tip 135 movably installed relative to the wafers 112 and 114 and pushing the wafers 112 and 114. 130).

In the present description, the wafers 112 and 114 are concepts including various types of wafers such as semiconductor chip wafers, LED wafers, and solar cell wafers.

Jig 150 is made of a substantially circular plate shape, it may be made of SiC. In addition, the jig 150 is formed with a guide groove 158 so that the pressing member 130 can enter.

Six wafers 112 and 114 are installed in the jig 150, three wafers 112 are installed in the upper part, and three wafers 114 are installed in the lower part so as to face the wafer 112 installed in the upper part. .

In the present exemplary embodiment, six wafers are installed in the jig 150 for convenience. However, the present invention is not limited thereto, and only one wafer may be installed in the jig 150.

The upper wafer 112 installed on the upper side is formed with a flat zone 112a having a planar structure on one side thereof, and both ends of the flat zone 112a are connected to an arc-shaped curved portion to have a substantially rounded disc shape. In addition, the lower wafer 114 provided below also has a flat zone and a curved portion.

The first guide pin 151 is installed on the jig 150 to contact the flat zone 112a. In addition, the first guide pin 151 is installed at the center side of the jig to support the flat zone 112a so that the flat zone 112a is located at the center side of the jig 150. Accordingly, the wafers 112 and 114 are installed on the jig so that the flat zone 112a faces the center of the jig 150.

In addition, a second guide pin 153 is provided to support the curved portion. Two second guide pins 153 are provided to be in contact with one wafer 112 to support the outside of the curved portion.

Since the wafers 112 and 114 are stacked in the vertical direction with the adhesive layer 116 interposed therebetween, the six wafers 112 and 114 are stacked two by one, so as to pressurize the three wafers 112 and 114. Three pressing members 130 are installed.

As shown in FIG. 3, the pressing member 130 includes a head part 131 and a support part 132 installed at one end of the head part 131, and flexible tips 135 and 136 fixed to the support part 132. 137, 138).

Four flexible tips 135, 136, 137, and 138 are installed at each head 131, and the pressing member 130 is formed of a first flexible tip 135 and a pressing member that presses the upper wafer 112. It has a second flexible tip 136 spaced laterally apart from the first flexible tip 135. In addition, the pressing member 130 has a third flexible tip 137 for pressing the lower wafer 114 and a fourth flexible tip 138 spaced laterally apart from the third flexible tip 137. . The third flexible tip 137 is disposed below the first flexible tip 135 and the fourth flexible tip is disposed below the second flexible tip.

In the present exemplary embodiment, two wafers 112 and 114 are stacked and four flexible tips 135, 136, 137 and 138 are installed in the head 131, but the present invention is limited thereto. It is not. Therefore, two flexible tips may be installed in the head, and each flexible tip may press together the wafer disposed above and the wafer disposed below. In addition, one wafer may be disposed, and two flexible tips may be installed in the head portion.

The flexible tips 135, 136, 137, and 138 are made of metal having elasticity, and in particular, may be made of stainless steel, titanium, or the like.

The wafer position calibration apparatus 100 according to the present embodiment further includes a transfer part 120 for moving the pressing member 130 with respect to the wafer. The transfer part 120 includes a base 121 disposed below the jig 150, a rail 123 fixed on the base 121, and a trolley 125 installed on the rail.

The pressing member 130 is installed to be movable relative to the wafers 112 and 114 on the base 121, and the base 121 has a structure in which three plates are conformally connected. The base 121 may be fixed to the bottom of the vacuum chamber.

And the rail 123 is provided in each board, and the trolley | bogie 125 which moves along the guide rail 123 is provided on the rail 123. As shown in FIG. In addition, the trolley 125 is fixed to the transfer bar 128 for supporting the pressing member 130. Accordingly, the pressing member 130 may move forward or backward with respect to the wafers 112 and 114.

In order to bond the wafers 112 and 114, the two wafers 112 and 114 must be pressed in a precisely mounted position. When the wafers 112 and 114 are initially mounted on the jig 150, the wafers are pressed. There is a problem that the (112, 114) is not in close contact with the guide pins (151, 153). In addition, when bonding the wafers as well as applying the wafers to an automated process, it is necessary to accurately position the wafers to minimize defects.

The jig according to the present embodiment may be installed in the vacuum chamber. In order to bond the wafers 112 and 114, the jig should be pressurized to a high temperature and a high pressure in the vacuum chamber. However, since the wafers 112 and 114 may be shaken in the process of moving the wafers 112 and 114 into the vacuum chamber, it is necessary to correct the positions of the wafers 112 and 114 in the vacuum chamber.

As shown in FIG. 4A, when the flat zone 112a of the wafer 112 is not in close contact with the two first guide pins 151, the pressing member 130 is advanced toward the wafer 112. The flexible tips 135 and 136 are deformed while pushing the wafer 112. At this time, the wafer 112 should rotate due to the flexible tips 135 and 136. The flexible tips 135 and 136 are elastically deformed so that an appropriate pressure can be applied to the wafer 112.

In the present description, a description will be given based on a plan view, and the first flexible tip 135 and the second flexible tip 136 installed at the top will be described mainly, but the third flexible tip 137 and the fourth flexible installed at the bottom thereof will be described. Sex tip 138 also acts the same as flexible tips 135 and 136 installed thereon.

The point where the first flexible tip 135 meets the wafer 112 is P1, the point where the second flexible tip 136 meets the wafer 112 is called P2, and the center of the wafer 112 is called O1, and P1 When the angle between the line segment L1 that follows O1 and the line segment L2 that follows O1 in P2 is θ, θ is comprised between 60 ° and 90 °. If θ is smaller than 60 degrees, there is a problem that the wafer 112 does not rotate properly because the moment acting on the wafer 112 is small. If θ is larger than 90, the pressing force is increased through the flexible tips 135 and 136. There is a problem that can not be properly delivered to the wafer (112).

In the case of non-flexible tips, the wafer 112 can only be moved forward by pushing the wafer 112 in one direction, and there is a problem that it is difficult to rotate. When one tip comes into contact with the wafer, the pressing member moves forward. It does not push the wafer in one direction.

 However, in the case of the flexible tips 135 and 136, when the flexible tip 135 corresponding to the portion in contact with the first guide pin 151 is deformed, the flexible tips 135 and 136 may not be in contact with the first guide pin 151. The corresponding flexible tip 136 can push the wafer 112 to easily rotate the wafer 112. That is, since the force acting on the flexible tip 136 acts only in one direction away from the center of the wafer 112, the wafer 112 can be easily rotated.

In the case of tapping the wafer as in the prior art, the wafer is impacted to cause the wafer to move. In this case, it is not clear in which direction the wafer is moved, but it is difficult to rotate the wafer due to the frontal impact. There is a problem that is difficult to correct the position of the wafer.

5 is a schematic block diagram illustrating a wafer bonder according to a second embodiment of the present invention, and FIG. 6 is a partial cross-sectional view illustrating a lower jig of the wafer bonder according to the second embodiment of the present invention.

Referring to FIGS. 5 and 6, the wafer bonder 200 according to the present embodiment includes a vacuum chamber 220 having a space therein and a lower jig 210 in which wafers 212 and 214 are mounted. ) And a transfer member 260 for transferring the upper jig 240 and the upper jig 240 disposed to face the lower jig 210, and a lower heating block disposed below the lower jig 210 and generating heat. An upper heating block 270 disposed on the top 230 and the upper jig 240.

The vacuum chamber 220 has a substantially rectangular parallelepiped shape and has a space in which the lower jig 210 and the upper jig 240 are inserted. In addition, the vacuum chamber 220 is installed in connection with a vacuum pump (not shown) to keep the interior in a vacuum state.

The lower jig 210 has a substantially plate shape, and a plurality of wafers 212 and 214 are mounted on the lower jig 210.

The lower jig 210 is inserted into and installed in the guide pin 251 for contacting the wafers 181 and 182 to guide the wafers 212 and 214 to a set position and the groove 216 formed in the lower jig 210. And an elastic member 253 for supporting 251.

As illustrated in FIG. 6, the guide pin 251 is installed on the lower jig 210 through the elastic member 253 to contact the side surfaces of the wafers 181 and 182. The lower jig 210 has a groove 216 formed therein, and an elastic member 253 formed of a spring is installed in the groove 216.

In the present embodiment, the elastic member 253 is illustrated as being made of a spring, but the present invention is not limited thereto, and the elastic member 253 may have various structures such as an elastic polymer.

Guide pin 251 is formed in a substantially cylindrical shape. In addition, the guide pin 251 is inserted into the groove 216 to abut the elastic member 253 disposed below. The elastic member 253 has a smaller diameter than the guide pin 251 and supports the guide pin 251 below.

Between the wafers 212, 214 is an adhesive 216 for bonding the wafers 212, 214, wherein the adhesive 216 is disposed on the opposite side of the wafers 212, 214, Au or Au / Sn. The adhesive 216 may be installed on all or part of the opposing sides of the wafers 212, 214.

A plurality of upper jig 240 is installed on the lower jig 210, and a transfer part 260 is installed on each upper jig 240 to individually press and bond the wafers 212 and 214. Since the thicknesses of the wafers 212 and 214 may be different from each other, each upper jig 240 presses the respective wafers 212 and 214.

In the servo motor 268 connected to the upper jig 240, the upper jig 240 moves toward the lower jig 210 by rotation, and at this time, the wafers 212 and 214 are bonded to each other.

When lowering the upper jig 240 to bond the wafers 212 and 214, the guide pin 251 is pressed by the upper jig 240. When the guide pin 251 is pressurized, pressure is transmitted to the elastic member 253 so that the elastic member 253 may contract and thus the guide pin 251 may move downward. Accordingly, even a portion adjacent to the guide pin 251 may be stably bonded by applying sufficient pressing force without being disturbed by the guide pin 251.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Of course.

1 is a plan view illustrating a wafer position calibration apparatus according to a first embodiment of the present invention.

2 is a side view showing a wafer position calibration apparatus according to a first embodiment of the present invention.

3 is a perspective view showing a pressing member according to the first embodiment of the present invention.

4A and 4B are views for explaining a process of calibrating a wafer position using a wafer position calibration apparatus according to a first embodiment of the present invention.

5 is a partial cross-sectional view showing a lower jig of the wafer bonder according to the second embodiment of the present invention.

6 is a schematic diagram illustrating a wafer bonder according to a second embodiment of the present invention.

-Explanation of symbols for the main parts of the drawing-

100: wafer position correction apparatus 112, 114: wafer

112a: flat zone

116: adhesive layer 120: transfer portion

121: base 123: rail

125: bogie 128: transfer bar

130: pressure member 131: head portion

132: support 135: first flexible tip

136: second flexible tip 137: third flexible tip

138: fourth flexible tip 150: jig

151: first guide pin 153: second guide pin

200: wafer bonder 252: housing

253: elastic member

Claims (13)

A jig in which a wafer having a flat zone formed on a side thereof is mounted; A first guide pin installed on the jig and in contact with the flat zone; And A pressing member movably installed with respect to the wafer and pushing the wafer and having a flexible tip that is elastically deformable in a lateral direction; Including, And the pressing member includes a first flexible tip and a second flexible tip spaced apart from the first flexible tip. delete The method according to claim 1, The point where the first flexible tip meets the wafer is P1, the point where the second flexible tip meets the wafer is called P2, and the center of the wafer is called O1, and the line segment L1 that connects O1 to P1 and O1 that connects O1 to P2. When the angle where L2 meets is θ, Wherein θ is from 60 ° to 90 °. The method according to claim 1, And the pressing member includes a third flexible tip disposed below the first flexible tip and a fourth flexible tip disposed below the second flexible tip. The method according to claim 1, And the jig is installed in a vacuum chamber. The method according to claim 1, And a second guide pin installed on the jig and contacting the arc portion connecting the end of the flat zone. A jig in which a wafer having a flat zone formed on a side thereof is mounted; A first guide pin installed on the jig and in contact with the flat zone; And A pressing member movably installed with respect to the wafer and pushing the wafer and having a flexible tip that is elastically deformable in a lateral direction; Including, The pressing member includes a head portion, a support portion installed at one end of the head portion, a first flexible tip fixed to the support portion, and a second flexible tip disposed laterally spaced from the first flexible tip, And a transfer unit configured to move the pressing member with respect to the wafer. 8. The method of claim 7, And the transfer part includes a base disposed below the jig, a rail fixed on the base, and a bogie provided to be movable along the rail, wherein the pressing member is connected to the bogie. A lower jig on which a wafer on which a flat zone is formed is mounted; A guide pin installed in the lower jig via an elastic member so as to be movable in the vertical direction and in contact with the wafer; And An upper jig disposed opposite the lower jig to pressurize the wafer; Including, A groove formed in the lower jig, and the elastic member is inserted into the groove. delete The method of claim 9, The elastic member is a wafer bonder is a spring. The method of claim 9, And a pressing member having two flexible tips movably mounted relative to the wafer and pushing the wafer. In the wafer bonder jig in which the wafer is mounted on the upper surface, Grooves are formed on the upper surface of the jig, The jig is a jig for wafer bonder including a guide pin which is installed on the jig via the elastic member so as to be movable in the vertical direction and the elastic member inserted into the groove and abuts the side of the wafer.

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