CN111211084A - Wafer bearing device - Google Patents
Wafer bearing device Download PDFInfo
- Publication number
- CN111211084A CN111211084A CN202010053394.2A CN202010053394A CN111211084A CN 111211084 A CN111211084 A CN 111211084A CN 202010053394 A CN202010053394 A CN 202010053394A CN 111211084 A CN111211084 A CN 111211084A
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- China
- Prior art keywords
- wafer
- bearing
- relative
- susceptor
- limiting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Abstract
The invention provides a wafer bearing device, which comprises: a carrier tray; the limiting clamps are arranged around the bearing disc at intervals, the top ends of the limiting clamps protrude out of the bearing surface of the bearing disc, and at least one limiting clamp can move relative to the bearing disc in the direction parallel to the bearing surface of the bearing disc. The method has the advantages that the wafer position can still be ensured to be accurate under the condition that the detection system does not give an alarm, and the situation that the wafer is misplaced relative to the target position in the subsequent process or the wafer transferring process is avoided.
Description
Technical Field
The invention relates to the field of integrated circuit device manufacturing, in particular to a wafer bearing device.
Background
In an integrated circuit device manufacturing apparatus, a wafer carrier plays a very important role, which is generally used to hold a wafer for processing the wafer or for temporarily placing the wafer. If the wafer carried by the wafer carrying device deviates relative to the wafer carrying device, process deviation can be caused in the subsequent process, and yield loss is caused; or the wafer may be bumped and broken due to the offset of the wafer relative to the target position during the wafer transfer process using the robot.
Therefore, how to avoid the wafer from shifting relative to the wafer carrier is a problem that needs to be solved.
Disclosure of Invention
The present invention provides a wafer carrying device, which can correct the position of the wafer relative to the wafer carrying device.
In order to solve the above problems, the present invention provides a wafer carrying device, which includes: a carrier tray; the limiting clamps are arranged around the bearing disc at intervals, the top ends of the limiting clamps protrude out of the bearing surface of the bearing disc, and at least one limiting clamp can move relative to the bearing disc in the direction parallel to the bearing surface of the bearing disc.
Further, at least one limiting clamp is fixedly arranged relative to the bearing plate.
Further, the distance between the limiting clamp fixedly arranged relative to the bearing disc and the side face of the bearing disc is less than or equal to 0.5 cm.
Furthermore, the limiting clamps are arranged around the bearing plate at equal intervals.
Further, the wafer bearing device comprises three limiting clamps, wherein two limiting clamps are fixedly arranged relative to the bearing disc, and one limiting clamp can move relative to the bearing disc in the direction parallel to the bearing surface of the bearing disc.
Further, the wafer bearing device also comprises a driving device, and the driving device is used for driving the limiting clamp to move relative to the bearing disc.
Further, the driving device is an air cylinder.
Furthermore, a base is arranged on the surface of the bearing disc, which is opposite to the bearing surface, and the bottom end of the limiting clamp is arranged on the base.
Furthermore, a vacuum adsorption hole is formed in the bearing surface of the bearing disc.
Furthermore, at least one position sensor is arranged on the bearing surface of the bearing disc.
The invention has the advantages that the position of the wafer relative to the wafer bearing device is corrected by utilizing the movable limiting clamp, so that the accurate position of the wafer can still be ensured under the condition that the detection system does not give an alarm, and the condition that the wafer is dislocated relative to the target position in the subsequent process or the wafer transferring process is avoided.
Drawings
Fig. 1A and 1B are schematic top views illustrating a conventional wafer carrier apparatus carrying wafers;
FIG. 2 is a schematic side view of a wafer carrier apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a wafer carrier apparatus according to an embodiment of the present invention;
fig. 4A to 4D are schematic views illustrating an operation process of a wafer carrier according to an embodiment of the invention.
Detailed Description
The following describes in detail a specific embodiment of the wafer carrier apparatus according to the present invention with reference to the accompanying drawings.
When the conventional wafer carrying device is used for carrying wafers, the wafers are often dislocated relative to the target position in the subsequent process or the subsequent transfer process of the wafers, so that the yield of the semiconductor manufacturing process is affected. Through research, the inventor finds that the reason why the wafer is dislocated relative to the target position is that after the wafer is placed on the wafer bearing device, the wafer bearing device breaks vacuum or vibration generated in the movement process of the wafer bearing device can cause the wafer to deviate relative to the wafer bearing device, and the wafer is executed according to a normal process flow in a subsequent process or a subsequent transfer process of the wafer, and the wafer is not corrected, so that the wafer is dislocated relative to the target position.
Specifically, fig. 1A and 1B are schematic top views of a conventional wafer carrier device for carrying wafers, wherein fig. 1A is a schematic diagram of a wafer not being shifted relative to the wafer carrier device, and fig. 1B is a schematic diagram of a wafer being shifted relative to the wafer carrier device. Referring to fig. 1A and 1B, a sensor 101 is disposed on the wafer carrier 10, and when the wafer 11 covers all of the sensor 101, the detection system determines that the wafer 11 does not shift, and does not send an alarm, as shown in fig. 1A, the wafer does not shift relative to the wafer carrier, and covers all of the sensor 101, and the detection system does not send an alarm; as shown in fig. 1B, although the wafer 11 is shifted relative to the wafer carrier, the wafer covers all the sensors 101, and the detection system determines that the wafer 11 is not shifted and still does not send an alarm; then in the situation shown in fig. 1B, the subsequent process or wafer transfer is normally performed, resulting in a wafer being misaligned with respect to the target position.
In view of the above, the present invention provides a wafer carrier device, which can prevent the wafer from shifting relative to the wafer carrier device, thereby increasing the yield of semiconductor manufacturing process.
Fig. 2 is a schematic side view of an embodiment of a wafer carrier device of the present invention, and fig. 3 is a schematic top view of the wafer carrier device of the present invention. Referring to fig. 2 and 3, the wafer carrier device of the present invention includes a carrier plate 20 and a plurality of position-limiting clamps 21. It is understood that the modifications of the present invention do not relate to other structures of the wafer carrier, and therefore, the description of other structures of the wafer carrier is omitted here.
The susceptor 20 is used for carrying wafers. The susceptor 20 has a carrying surface 20A, and the wafer is placed on the carrying surface 20A. A vacuum suction hole (not shown) is formed in the carrying surface 20A of the carrying tray 20, and after the wafer is placed on the carrying surface 20A and the position of the wafer is adjusted, the wafer is sucked on the carrying surface 20A by vacuum suction through the vacuum suction hole, so that the wafer is fixed on the wafer carrying device.
Further, at least one position sensor 201 is disposed on the carrying surface 20A of the carrying tray 20. After the wafer is placed on the carrying surface 20A, the position sensor 201 is shielded by the wafer, if the position sensor 201 is not shielded, the detection system will send an alarm to prompt an operator that the wafer does not shield the position sensor, that is, the wafer deviates from the wafer carrying device, and if the position sensor 201 is shielded, the detection system will not send an alarm, that is, the default wafer does not deviate from the wafer carrying device.
The plurality of limiting clamps 21 are arranged around the bearing plate 20 at intervals. Further, a plurality of the limiting clamps 21 are arranged around the bearing plate 20 at equal intervals. In this embodiment, the wafer supporting apparatus includes three limiting clamps, and the limiting clamps 21 are respectively three vertexes of an equilateral triangle. It is understood that, in other embodiments of the present invention, the number of the limiting clamps 21 may also be other numbers, for example, four, five, etc., and the arrangement of the limiting clamps 21 may be an unequal interval arrangement.
The top end of the limit clamp 21 protrudes out of the carrying surface 20A of the carrying tray 20, that is, the limit clamp 21 is higher than the carrying surface 20A of the carrying tray 20, so that after the wafer is placed on the carrying surface 20A of the carrying tray 20, the limit clamp 21 can block the side surface of the wafer, that is, the limit clamp 21 can limit the wafer to move in a direction (such as the X direction in fig. 2) parallel to the carrying surface 20A.
At least one of the position-limiting clamps 21 is movable relative to the susceptor 20 in a direction parallel to the carrying surface 20A of the susceptor 20 (e.g., the X direction in fig. 2), that is, at least one of the position-limiting clamps 21 is a movable position-limiting clamp capable of moving away from or close to the wafer to correct the position of the wafer on the wafer carrier. Before the wafer is placed on the wafer bearing device, the limiting clamp 21 is moved to move in a direction away from the bearing disc 20 so as to provide a sufficient space for placing the wafer, after the wafer is placed on the wafer bearing device, the limiting clamp 21 is moved to move in a direction close to the bearing disc 20, if the wafer deviates relative to the wafer bearing device, in the moving process of the limiting clamp 21, the limiting clamp 21 can act on the side surface of the wafer to push the wafer to move, so that the position of the wafer on the wafer bearing device is adjusted. After the limiting clamp 21 touches the side wall of the carrying tray 20, or a preset distance is left from the side wall of the carrying tray 20, the limiting clamp 21 stops actuating.
The wafer bearing device utilizes the movable limiting clamp 21 to correct the position of the wafer relative to the wafer bearing device, so that the wafer can still be ensured to be accurate under the condition that the wafer covers all position sensors and the detection system does not give an alarm, and the condition that the wafer is dislocated relative to a target position in the subsequent process or the wafer transferring process is avoided.
After the position of the wafer on the wafer bearing device is corrected, the plurality of limiting clamps 21 are close to the wafer, for example, the distance between the limiting clamps 21 and the side wall of the wafer is less than or equal to 0.5 cm, the limiting clamps 21 can further prevent the wafer from moving in a large range, so that the wafer is stably arranged relative to the wafer bearing device, the relative position of the wafer and the wafer bearing device can be maintained in a subsequent process or a wafer transferring process, and the situation that the wafer is dislocated relative to a target position is avoided.
Further, the wafer carrying device further comprises a driving device 22. The driving device 22 is used for driving the limiting clamp 21 to move relative to the bearing plate 20. In this embodiment, the driving device 22 is an air cylinder, and the telescopic motion of a push rod of the air cylinder can drive the limiting clamp 21 to move in a direction away from or close to the bearing plate. The telescopic and force of the limiting clamp 21 can be controlled by changing the stroke and the air quantity of the air cylinder, so that the controllability of the movable limiting clamp 21 is realized. In other embodiments of the present invention, a driving device conventional in other fields may be used to control the movement of the position-limiting clamp 21.
Further, at least one of the position-limiting clamps 21 is fixedly disposed with respect to the carrier plate 20, that is, at least one of the position-limiting clamps 21 does not move with respect to the carrier plate 20. The fixed limiting clamp 21 can be used as a reference point for placing the wafer, so that the wafer is prevented from being excessively deviated during initial placement, and the wafer is prevented from being easily damaged when the movable limiting clamp 21 pushes the wafer. Further, the distance D between the limiting clamp 21 fixedly disposed relative to the susceptor 20 and the side surface of the susceptor 20 is less than or equal to 0.5 cm, and after the position of the wafer on the wafer carrying device is corrected, the distance between the limiting clamp 21 and the side wall of the wafer is less than or equal to 0.5 cm, so that the wafer is stably disposed relative to the wafer carrying device.
In this embodiment, the wafer carrying apparatus includes three limiting clamps 21A, 21B and 21C, wherein the limiting clamps 2121A and 21B are fixed to the carrier plate 20, and one limiting clamp 21C is capable of moving relative to the carrier plate 20 in a direction parallel to the carrying surface 20A of the carrier plate 20.
Further, a base 202 is disposed on a surface of the carrying tray 20 opposite to the carrying surface 20A, a bottom end of the position limiting clamp 21 is disposed on the base 202, and the base 202 is used for supporting the position limiting clamp 21. The position-limiting clamp 21 fixed relative to the carrier tray may be fixedly disposed on the base 202, and the position-limiting clamp 21 movable relative to the carrier tray 20 may be movably disposed on the base 202.
The wafer bearing device can correct the position of the wafer relative to the wafer bearing device, and the limiting clamp can maintain the position of the wafer on the wafer bearing device, so that the stability of the wafer is kept, and the situation that the subsequent wafer is staggered relative to the target position is avoided.
The working process of the wafer carrying device of the present invention is described below by taking the wafer carrying device including three limiting clamps 21A, 21B and 21C as an example, wherein the limiting clamps 21A and 21B are fixed clamps, and the limiting clamp 21C is a movable clamp.
Referring to fig. 4A, before the wafer is placed on the wafer carrier, the driving device 22 drives the position-limiting clamp 21C to move away from the carrier plate 0, so as to provide enough space for placing the wafer.
Referring to fig. 4B, a wafer 30 is placed on a wafer carrier, and the wafer 30 may be offset relative to the wafer carrier.
Referring to fig. 4C, the limiting clamp 21C is moved to move toward the direction close to the susceptor 20, and if the wafer 30 deviates from the wafer carrying device, the limiting clamp 21C can act on the side surface of the wafer to push the wafer 30 to move during the movement of the limiting clamp 21C.
Referring to fig. 4D, the limiting clamp 21C pushes the wafer 30 to move, and after the limiting clamp 21C touches the sidewall of the susceptor 20 or has a predetermined distance from the sidewall of the susceptor 20, the limiting clamp 21C stops operating, so as to achieve the purpose of adjusting the position of the wafer on the wafer carrier.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A wafer carrier device, comprising:
a carrier tray;
the limiting clamps are arranged around the bearing disc at intervals, the top ends of the limiting clamps protrude out of the bearing surface of the bearing disc, and at least one limiting clamp can move relative to the bearing disc in the direction parallel to the bearing surface of the bearing disc.
2. The wafer carrier device of claim 1, wherein at least one of the retention clamps is fixedly disposed relative to the susceptor.
3. The wafer carrier device of claim 2, wherein the spacing clamp fixed relative to the susceptor is less than or equal to 0.5 cm from the side of the susceptor.
4. The wafer carrier device of claim 1, wherein the retaining clamps are equally spaced around the susceptor.
5. The wafer carrier device of claim 1, wherein the wafer carrier device comprises three of the plurality of retention clamps, two of the plurality of retention clamps being fixedly disposed relative to the susceptor, one of the plurality of retention clamps being movable relative to the susceptor in a direction parallel to the susceptor surface of the susceptor.
6. The wafer carrier device of claim 1, further comprising a drive device for driving the limit clamp to move relative to the carrier platter.
7. The wafer carrier device of claim 6, wherein the drive device is a pneumatic cylinder.
8. The wafer carrier device as claimed in claim 1, wherein a pedestal is disposed on a surface of the carrier plate opposite to the carrying surface, and a bottom end of the position-limiting clamp is disposed on the pedestal.
9. The apparatus of claim 1, wherein the carrying surface of the carrying plate is provided with vacuum suction holes.
10. The wafer carrier device of claim 1, wherein the carrier surface of the carrier platter has at least one position sensor disposed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010053394.2A CN111211084A (en) | 2020-01-17 | 2020-01-17 | Wafer bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010053394.2A CN111211084A (en) | 2020-01-17 | 2020-01-17 | Wafer bearing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111211084A true CN111211084A (en) | 2020-05-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010053394.2A Pending CN111211084A (en) | 2020-01-17 | 2020-01-17 | Wafer bearing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111211084A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725136A (en) * | 2021-08-30 | 2021-11-30 | 长江存储科技有限责任公司 | Wafer alignment method, system, computer readable storage medium and processor |
| CN115938997A (en) * | 2023-03-15 | 2023-04-07 | 湖北江城芯片中试服务有限公司 | Wafer chuck and method for monitoring state of clamping piece |
| WO2023168663A1 (en) * | 2022-03-10 | 2023-09-14 | Innoscience (suzhou) Semiconductor Co., Ltd. | Wafer holder and operating method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20020084475A (en) * | 2001-05-02 | 2002-11-09 | 삼성전자 주식회사 | Wafer aligner and method for aligning wafer |
| KR20110025550A (en) * | 2009-09-04 | 2011-03-10 | 주식회사 휴템 | Apparatus for correcting position of wafer, wafer bonder and jig for wafer bonder |
| DE102016108788A1 (en) * | 2015-05-15 | 2016-11-17 | Suss Microtec Lithography Gmbh | Method of handling aligned wafer pairs |
| CN107529670A (en) * | 2016-06-24 | 2018-01-02 | 细美事有限公司 | Substrate board treatment and method |
| CN207529917U (en) * | 2017-10-19 | 2018-06-22 | 上海陛通半导体能源科技股份有限公司 | A kind of wafer clamping device |
-
2020
- 2020-01-17 CN CN202010053394.2A patent/CN111211084A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020084475A (en) * | 2001-05-02 | 2002-11-09 | 삼성전자 주식회사 | Wafer aligner and method for aligning wafer |
| KR20110025550A (en) * | 2009-09-04 | 2011-03-10 | 주식회사 휴템 | Apparatus for correcting position of wafer, wafer bonder and jig for wafer bonder |
| DE102016108788A1 (en) * | 2015-05-15 | 2016-11-17 | Suss Microtec Lithography Gmbh | Method of handling aligned wafer pairs |
| CN107529670A (en) * | 2016-06-24 | 2018-01-02 | 细美事有限公司 | Substrate board treatment and method |
| CN207529917U (en) * | 2017-10-19 | 2018-06-22 | 上海陛通半导体能源科技股份有限公司 | A kind of wafer clamping device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725136A (en) * | 2021-08-30 | 2021-11-30 | 长江存储科技有限责任公司 | Wafer alignment method, system, computer readable storage medium and processor |
| WO2023168663A1 (en) * | 2022-03-10 | 2023-09-14 | Innoscience (suzhou) Semiconductor Co., Ltd. | Wafer holder and operating method thereof |
| CN115938997A (en) * | 2023-03-15 | 2023-04-07 | 湖北江城芯片中试服务有限公司 | Wafer chuck and method for monitoring state of clamping piece |
| CN115938997B (en) * | 2023-03-15 | 2023-05-26 | 湖北江城芯片中试服务有限公司 | Wafer chuck and method for monitoring state of clamping piece |
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Application publication date: 20200529 |
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