CN211879771U - Semiconductor laser device easy to package - Google Patents
Semiconductor laser device easy to package Download PDFInfo
- Publication number
- CN211879771U CN211879771U CN202020796022.4U CN202020796022U CN211879771U CN 211879771 U CN211879771 U CN 211879771U CN 202020796022 U CN202020796022 U CN 202020796022U CN 211879771 U CN211879771 U CN 211879771U
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- carrier seat
- soldering tin
- trapezoidal platform
- plate
- semiconductor laser
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Abstract
The utility model discloses an easily packaged semiconductor laser device, wherein a plurality of pins are arranged on two sides of a tube shell, a chip, a carrier seat and a refrigeration plate are sequentially arranged in the tube shell from top to bottom, the refrigeration plate is welded with the bottom surface of the inner side of the tube shell through a soldering tin sheet, the carrier seat is welded with the refrigeration plate through a soldering tin sheet, and the chip is embedded on the carrier seat; carrier seat one end is connected with trapezoidal platform, is provided with perpendicular slot between trapezoidal platform and the carrier seat, and trapezoidal platform is the right trapezoid structure, and the inclined plane of trapezoidal platform sets up down, and the soldering tin piece is kept away from to trapezoidal platform lower part, and trapezoidal platform middle part still is provided with horizontal slot. The utility model provides a carrier seat one end is connected with trapezoidal platform, utilizes inclined plane, perpendicular slot and the horizontal slot of trapezoidal platform for the heat that produces during soldering tin can not directly transmit to the casing through vertically apart from, effectively reduces the contact of carrier seat and pipe casing, slows down heat transfer, makes the heat can effectively concentrate melting glass solder.
Description
Technical Field
The utility model relates to a laser device field, concretely relates to semiconductor laser device of easily encapsulating.
Background
Semiconductor laser device usually needs the chip carrier to carry out the device encapsulation, and the packaging process needs carry out optical fiber coupling, makes encapsulation glass melt and shaping through the mode of heating, because the heat that produces is very big at the in-process of coupling, and heat transfer is rapid, and current carrier structure makes the heat run off in a large number and influence the shaping of soldering tin piece, easily leads to other parts also to take place the phenomenon of melting and produce the chip and shift, and coupling time overlength leads to the device yield low easily simultaneously.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to a semiconductor laser device that is easy to package.
In order to realize the technical purpose, the utility model discloses a scheme is: a semiconductor laser device easy to package comprises a tube shell, wherein the middle part of the tube shell is of a cavity structure, one end of the tube shell is provided with a connecting pipe orifice, a plurality of pins are arranged on two sides of the tube shell, a chip, a carrier seat and a refrigerating plate are sequentially arranged in the tube shell from top to bottom, the refrigerating plate is welded with the bottom surface of the inner side of the tube shell through a soldering tin sheet, the carrier seat is also welded with the refrigerating plate through the soldering tin sheet, and the chip is embedded on the carrier seat;
the soldering tin soldering device is characterized in that one end of the carrier seat is connected with a trapezoid table, a vertical groove is formed between the trapezoid table and the carrier seat, the trapezoid table is of a right-angle trapezoid structure, the inclined surface of the trapezoid table is arranged downwards, the lower portion of the trapezoid table is far away from a soldering tin sheet, and a horizontal groove is further formed in the middle of the trapezoid table.
Preferably, the refrigeration plate is of a double-layer plate-shaped structure, and a plurality of partition plates are arranged in the middle of the refrigeration plate.
Preferably, the bottom of the pipe shell is provided with a connecting plate, the head of the connecting plate is provided with a positioning notch, and the tail of the connecting plate is provided with a positioning hole.
The utility model has the advantages that: the utility model provides a carrier seat one end is connected with trapezoidal platform, utilizes inclined plane, perpendicular slot and the horizontal slot of trapezoidal platform for the heat that produces during soldering tin can not directly transmit to the casing through vertically apart from, effectively reduces the contact of carrier seat and pipe casing, slows down heat transfer, makes the heat can effectively concentrate melting glass solder. Compared with the prior art, the method and the device can reduce the process control difficulty, improve the qualification rate of finished products and effectively improve the reliability of the products.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention;
FIG. 3 is an exploded view of the present invention;
fig. 4 is a sectional view of the present invention.
1. A tube housing; 2. connecting the pipe orifices; 3. a pin; 4. a chip; 5. a carrier base; 6. a refrigeration plate; 7. soldering tin pieces; 8. a trapezoidal table; 9. a vertical trench; 10. a horizontal groove; 11. a partition plate; 12. a connecting plate; 13. a positioning notch; 14. and (7) positioning the holes.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-4, a semiconductor laser device easy to package according to a specific embodiment of the present invention includes a tube housing 1, wherein the middle of the tube housing 1 is a cavity structure, a connecting pipe orifice 2 is disposed at one end of the tube housing 1, a plurality of pins 3 are further disposed at two sides of the tube housing 1, a chip 4, a carrier seat 5 and a refrigerating plate 6 are sequentially mounted in the tube housing 1 from top to bottom, the refrigerating plate 6 is welded to the bottom surface of the inner side of the tube housing 1 through a soldering tin sheet 7, the carrier seat 5 is welded to the refrigerating plate 6 through the soldering tin sheet 7, and the surface of the carrier seat is not subjected to spray plating, so as to prevent the soldering tin sheet from permeating upwards, and the chip 4 is embedded in the carrier seat 5;
because heat transmission is very fast, in order to slow down heat transfer, make heat ability centralized control again simultaneously, carrier seat 5 one end is connected with trapezoidal platform 8, be provided with perpendicular slot 9 between trapezoidal platform 8 and the carrier seat 5, trapezoidal platform 8 is the right angle trapezium structure, and the inclined plane of trapezoidal platform 8 sets up downwards, and soldering tin 7 is kept away from to trapezoidal platform 8 lower part, trapezoidal platform 8 middle part still is provided with horizontal slot 10. The inclined plane, the vertical groove and the horizontal groove of the trapezoidal table form a three-groove structure, the inclined plane groove can reduce the contact area of the carrier seat and the soldering tin, so that heat is transferred backwards, and the phenomenon that a large amount of heat is accumulated below the soldering tin to cause solder remelting is avoided; the vertical grooves and the horizontal grooves can slow down the heat transfer speed, so that the glass solder can be heated more effectively by the heat generated by the thin film resistor, the coupling efficiency of the device is improved, and the process time is shortened; and the trapezoidal platform structure of the carrier seat is favorable for observing the flowing condition of the solder at the bottom of the carrier seat after the carrier seat is packaged, thereby ensuring the packaging reliability.
In order to make the cooling effect better, the refrigeration plate 6 is a double-layer plate-shaped structure, and a plurality of partition plates 11 are arranged in the middle of the refrigeration plate 6 to accelerate heat dissipation.
In order to facilitate the installation of the pipe shell, the bottom of the pipe shell 1 is provided with a connecting plate 12, the head and the tail of the connecting plate are provided with corresponding positioning structures, so that the connecting plate is convenient to connect and install, the head of the connecting plate 12 is provided with a positioning notch 13, and the tail of the connecting plate 12 is provided with a positioning hole 14.
The utility model provides a carrier seat one end is connected with trapezoidal platform, utilizes inclined plane, perpendicular slot and the horizontal slot of trapezoidal platform for the heat that produces during soldering tin can not directly transmit to the casing through vertically apart from, effectively reduces the contact of carrier seat and pipe casing, slows down heat transfer, makes the heat can effectively concentrate melting glass solder.
The above, only do the preferred embodiment of the present invention, not used to limit the present invention, all the technical matters of the present invention should be included in the protection scope of the present invention for any slight modification, equivalent replacement and improvement of the above embodiments.
Claims (3)
1. The utility model provides an easily semiconductor laser device of encapsulation, includes the pipe casing, pipe casing middle part is the cavity structure, pipe casing one end is provided with the connecting pipe mouth, its characterized in that: the tube shell is internally provided with a plurality of pins, a chip, a carrier seat and a refrigerating plate are sequentially arranged in the tube shell from top to bottom, the refrigerating plate is welded with the bottom surface of the inner side of the tube shell through a soldering tin sheet, the carrier seat is also welded with the refrigerating plate through the soldering tin sheet, and the chip is embedded on the carrier seat;
the soldering tin soldering device is characterized in that one end of the carrier seat is connected with a trapezoid table, a vertical groove is formed between the trapezoid table and the carrier seat, the trapezoid table is of a right-angle trapezoid structure, the inclined surface of the trapezoid table is arranged downwards, the lower portion of the trapezoid table is far away from a soldering tin sheet, and a horizontal groove is further formed in the middle of the trapezoid table.
2. A semiconductor laser device easy to package as claimed in claim 1, characterized in that: the refrigeration plate is of a double-layer plate-shaped structure, and a plurality of partition plates are arranged in the middle of the refrigeration plate.
3. A semiconductor laser device easy to package as claimed in claim 1, characterized in that: the pipe shell body bottom is provided with the connecting plate, the connecting plate prelude is provided with the location notch, the connecting plate afterbody is provided with the locating hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020796022.4U CN211879771U (en) | 2020-05-14 | 2020-05-14 | Semiconductor laser device easy to package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020796022.4U CN211879771U (en) | 2020-05-14 | 2020-05-14 | Semiconductor laser device easy to package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211879771U true CN211879771U (en) | 2020-11-06 |
Family
ID=73234262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020796022.4U Active CN211879771U (en) | 2020-05-14 | 2020-05-14 | Semiconductor laser device easy to package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211879771U (en) |
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2020
- 2020-05-14 CN CN202020796022.4U patent/CN211879771U/en active Active
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