CN221102015U - Wafer edge detection device - Google Patents
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- CN221102015U CN221102015U CN202323097016.2U CN202323097016U CN221102015U CN 221102015 U CN221102015 U CN 221102015U CN 202323097016 U CN202323097016 U CN 202323097016U CN 221102015 U CN221102015 U CN 221102015U
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- 238000003708 edge detection Methods 0.000 title claims abstract description 9
- 238000001514 detection method Methods 0.000 claims abstract description 74
- 238000007689 inspection Methods 0.000 claims description 15
- 210000001503 joint Anatomy 0.000 claims description 2
- 238000013519 translation Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 83
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The utility model relates to a wafer edge detection device, which comprises a detection camera, a positioning frame, an auxiliary frame and a driving part, wherein the detection camera comprises a first camera for detecting a wafer notch, a second camera for detecting the edge outline of a wafer, the positioning frame is provided with a positioning area, and the wafer is horizontally positioned in the positioning area; the auxiliary frame comprises a first frame body and a second frame body which are circumferentially arranged around the positioning area, wherein the first frame body is provided with a laser sensor for wafer edge finding and diameter detection; the first camera and the second camera are respectively arranged on the second frame body. On one hand, the utility model realizes the automatic translation of the wafer between the detection components, reduces the contact between the mechanical arm and the wafer, and greatly reduces the probability of the stress damage of the wafer; on the other hand, the wafer is synchronously subjected to edge searching and diameter detection, and is automatically translated to continuously detect the notch and the edge profile, so that the operation is simple, the time consumption is short, and the detection efficiency is effectively improved.
Description
Technical Field
The utility model belongs to the field of semiconductor equipment, and particularly relates to a wafer edge detection device.
Background
A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.
Currently, edge inspection of wafers is required after edge grinding and polishing. Conventional measurement devices generally include a diameter measurement tool, a edge finder, a first camera and a second camera for detecting a notch and an outer contour of a wafer edge, respectively, and first, a inspector detects a diameter of the wafer using the measurement tool; and finally, the wafer after calibration is sequentially placed on detection stations corresponding to the first camera and the second camera by a manipulator for detection.
However, in the actual detection process, there are the following drawbacks:
1. When the wafer is sequentially detected on each detection station, the manipulator is required to repeatedly pick and place and move the wafer, and in the process, the probability of wafer breakage caused by the wafer clamping by the manipulator is high;
2. the operation is complicated, the detection time is long, and the detection efficiency is low.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provide an improved wafer edge detection device.
In order to solve the technical problems, the utility model adopts the following technical scheme:
The wafer edge detection device comprises a detection camera, wherein the detection camera comprises a first camera for detecting a wafer notch, a second camera for detecting the edge outline of the wafer, a positioning frame, an auxiliary frame and a driving part, wherein a positioning area is formed on the positioning frame, and the wafer is horizontally positioned in the positioning area; the auxiliary frame comprises a first frame body and a second frame body which are circumferentially arranged around the positioning area, wherein the first frame body is provided with a laser sensor for wafer edge finding and diameter detection; the first camera and the second camera are respectively arranged on the second frame body; the driving part drives the positioning frame to translate between the first frame body and the second frame body or rotate around the center line of the positioning area, and when the wafer is detected, the wafer moves from the edge to the first frame body and synchronously rotates to search for edge calibration and diameter detection, and the wafer translates from the edge to the second frame body and sequentially detects the notch and the edge profile of the wafer.
According to one specific and preferred aspect of the utility model, the positioning frame is provided with a plurality of support ends, a positioning area is formed between the plurality of support ends, and the wafer is supported on the plurality of support ends during positioning. Here, the positioning operation is simple.
Preferably, each support end is formed with a bevel extending obliquely inward from top to bottom, against which the wafer abuts from the edge. Here, the contact area between the wafer and the support end can be effectively reduced, and the abrasion can be reduced.
Specifically, the locating rack includes the frame plate, around the central line circumference array distribution's of frame plate a plurality of support arms, wherein the upper end of every support arm forms the support tip, and the central line of frame plate and the central line coincidence setting of location district.
According to still another specific implementation and preferred aspect of the present utility model, a detection space is formed on the second frame body, wherein the detection space is opened toward one side of the positioning frame, and the wafer is inserted into the detection space from the edge during detection, and the first camera and the second camera detect the edge of the wafer respectively. Here, can avoid the interference of external factor to camera detection process, be favorable to promoting the detection accuracy.
Preferably, the second frame body comprises a vertical frame seat extending vertically and a horizontal frame seat fixedly connected to the vertical frame seat and extending horizontally, wherein a detection space is formed on the horizontal frame seat, a first detection port is formed on the horizontal frame seat from the top, a second detection port is formed on one side of the horizontal frame seat, the first camera is fixedly arranged on the vertical frame seat, and a lens of the first camera is in butt joint with the first detection port downwards; the second camera is fixed on the transverse stand, and the lens of the second camera is butted with the second detection port to one side. The wafer notch and edge profile detection device is simple to install and convenient for detecting wafer notch and edge profile by the first camera and the second camera.
Specifically, the second frame body further comprises a first stop block and a second stop block which are respectively and movably connected to the transverse frame seat, wherein the first stop block can horizontally move to block or open a lens of the first camera; the second stopper is vertically movable to block or open a lens of the second camera. Here, the lens of the camera is covered by the stop block, so that the lens of the camera can be protected in a non-use state, the service life of the camera is prolonged, and the maintenance and replacement cost is reduced.
Further, a first light source vertically aligned with the lens of the first camera is arranged below the transverse frame seat, a second light source horizontally aligned with the lens of the second camera is arranged on one side far away from the second camera, and when the detection is carried out, a light path emitted by the first light source is upwards perpendicular to the wafer, and a light path emitted by the second light source is tangential to the edge of the wafer. Here, can increase light to the wafer to detect the position at the testing process to be favorable to promoting the definition that the camera shot, thereby improve the detection accuracy.
According to still another specific implementation and preferred aspect of the present utility model, the first frame body is disposed at the right side of the positioning frame, and the second frame body is disposed at the rear side of the positioning frame; the driving part drives the positioning frame to translate left and right, translate back and forth and rotate around a central line in the vertical direction. Here, the positioning frame translation path is simple.
Preferably, the drive member is a four-axis platform. In some embodiments, the four-axis platform can drive the positioning frame to translate left and right, translate back and forth, translate up and down and rotate around the vertical central line, so that the flexibility of wafer movement is improved and the requirements of different detection positions are met on the premise that the notch position in wafer translation is not deviated.
Due to the implementation of the technical scheme, compared with the prior art, the utility model has the following advantages:
The wafer edge measuring device in the prior art has the defects that the probability of breakage is high, the detection time is long and the efficiency is low due to the fact that a mechanical arm is required to repeatedly take and place the wafer between detection stations, and the wafer edge measuring device has the defects that the wafer is damaged due to external force; on the other hand, the wafer is synchronously subjected to edge searching and diameter detection, and is automatically translated to continuously detect the notch and the edge profile, so that the operation is simple, the time consumption is short, and the detection efficiency is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a wafer edge inspection apparatus according to the present utility model;
FIG. 2 is a schematic view (partially omitted) of a wafer edge inspection apparatus according to another embodiment of the present utility model;
wherein: 1. detecting a camera; 11. a first camera; 12. a second camera;
2. a positioning frame; 20. a frame plate; 21. a support arm; 210. a support end; q, positioning area;
3. an auxiliary frame; 31. a first frame body; 310. a laser sensor; 32. a second frame body; 320. a longitudinal stand; 321. a transverse frame seat; j. a detection space; k1, a first detection port; k2, a second detection port; y 1, a first light source; y2, a second light source; 322. a first stopper; 323. a second stopper;
4. A driving part;
Y, wafer.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature. It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
As shown in fig. 1 and 2, the wafer edge inspection apparatus of the present embodiment includes an inspection camera 1, a positioning frame 2, an auxiliary frame 3, and a driving part 4.
Specifically, the inspection camera 1 includes a first camera 11 for inspecting the notch of the wafer Y, and a second camera 12 for inspecting the outline of the edge of the wafer Y, and the notch is inspected by making the notch of the edge of the wafer Y right against the lens of the first camera 11; the edge of the wafer Y is moved to a position tangential to the center line of the lens of the second camera 11, and then the wafer Y rotates to realize the detection of the outer contour of the edge of the wafer. The first camera 11 and the second camera 12 are both existing devices, and the structure and the working principle thereof are not described in detail herein, but are also clearly applicable.
In this example, the positioning frame 2 includes a horizontal frame plate 20, a plurality of support arms 21 circumferentially arrayed around the center line of the frame plate 20, and the driving unit 4 is connected to the positioning frame 2 and drives the positioning frame 2 to translate left and right, translate back and forth, translate up and down, and rotate around the vertical center line.
Specifically, each support arm 21 is detachably connected to the frame plate 20, and the upper end portion of each support arm 21 forms a support end portion 210, wherein a positioning area q matched with the wafer Y is formed between the plurality of support end portions 210, and the wafer Y is supported on the plurality of support end portions 210 to be horizontally positioned in the positioning area q; meanwhile, each supporting end 210 is formed with a slope extending obliquely inwards from top to bottom, and when the wafer Y is positioned, the wafer Y is abutted against the slope from the edge; the centerline of the shelf 20 coincides with the centerline of the positioning region q.
In this example, the auxiliary frame 3 includes a first frame body 31 and a second frame body 32 circumferentially disposed around the positioning area q, wherein the first frame body 31 is disposed on the right side of the positioning frame 2, and the second frame body 32 is disposed on the rear side of the positioning frame 2.
Specifically, the first frame 31 is provided with a laser sensor 310 for detecting the edge and diameter of the wafer, the laser sensor 310 has a detection notch for passing the edge of the wafer, the wafer is inserted into the detection notch from the edge, and during the rotation of the wafer, the laser sensor 310 can determine the position of the notch at the edge of the wafer and the diameter of the wafer. The laser sensor 310 is of the prior art, and the structure and operation thereof are not described in detail herein, but may be implemented clearly.
For convenience of implementation, the first camera 11 and the second camera 12 are respectively disposed on the second frame 32; the second frame 32 has a detection space j formed therein, wherein the detection space j is opened toward one side of the positioning frame 2, and the first camera 11 and the second camera 12 are inserted into the detection space j from the edge to detect the edge of the wafer during the detection.
Specifically, the second frame 32 includes a vertical extending longitudinal frame 320, and a horizontal frame 321 fixedly connected to the longitudinal frame 320 and extending horizontally, where a detection space j is formed on the horizontal frame 321, a first detection opening k 1 is formed on the horizontal frame from the top, a second detection opening k2 is formed on one side of the horizontal frame, the first camera 11 is fixedly disposed on the longitudinal frame 320, and a lens of the first camera 12 is docked with the first detection opening k 1 downward; the second camera 12 is fixed on the lateral mount 321, and the lens of the second camera 12 is docked to the second detection port k2 to one side. The second frame 32 further comprises a first stop block 322 and a second stop block 323 which are respectively and movably connected to the transverse frame base 320, wherein the first stop block 322 can horizontally move to block or open the lens of the first camera 11; the second stopper 323 can vertically move to block or open the lens of the second camera 12, and both the first stopper 322 and the second stopper 323 are linearly reciprocated by a cylinder.
For further convenient implementation, a first light source y 1 vertically aligned with the lens of the first camera 11 is arranged below the transverse frame 321, a second light source y2 horizontally aligned with the lens of the second camera 12 is arranged on one side far away from the second camera 12, during detection, a light path emitted by the first light source y 1 is upward vertical to the wafer, and a light path emitted by the second light source y2 is tangential to the edge of the wafer.
In addition, the driving part 4 adopts a four-axis platform and is communicated with the laser sensor 310, the first camera 11 and the second camera 12 in a communication way so as to realize linkage; the four-axis platform is the prior art.
Specifically, the positioning frame 2 is connected to the top of the four-axis platform to realize horizontal translation, front-to-back translation, up-to-down translation and rotation around a vertical center line, wherein under the driving of the driving component 4, the wafer moves from the edge to the first frame 31 and synchronously rotates to search for edge calibration and diameter detection, and the wafer translates from the edge to the second frame 32 and sequentially detects the wafer notch and edge profile.
In summary, after the wafer edge detection device is adopted, the wafer is placed on the locating frame by manpower or a mechanical arm so that the wafer is located in the locating area, under the drive of the driving component, the locating frame drives the wafer to translate from the edge to the first frame body, the laser sensor synchronously carries out edge searching and diameter detection, then the locating frame drives the wafer to translate from the edge to the second frame body, and the first camera and the second camera sequentially detect the notch and the edge outline of the wafer, so compared with the prior art, the wafer edge detection device disclosed by the utility model realizes automatic translation of the wafer among detection components, reduces the contact between the mechanical arm and the wafer, and greatly reduces the probability of stressed breakage of the wafer; on the other hand, the wafer is synchronously subjected to edge searching and diameter detection, and is automatically translated to continuously detect the notch and the edge profile, so that the operation is simple, the time consumption is short, and the detection efficiency is effectively improved; in the third aspect, the contact area between the wafer and the supporting end can be effectively reduced, and the abrasion is reduced; in the fourth aspect, through the detection space, interference of external factors on the detection process of the camera can be avoided, and the detection accuracy is improved; in a fifth aspect, the lens of the camera is covered by the stop block, so that the lens of the camera can be protected in a non-use state, the service life of the camera is prolonged, and the maintenance and replacement cost is reduced; in the sixth aspect, light can be added to a part to be detected of the wafer in the detection process, so that the shooting definition of the camera is improved, and the detection accuracy is improved; in a seventh aspect, the four-axis platform can drive the positioning frame to translate left and right, translate back and forth, translate up and down and rotate around the vertical center line, so that the flexibility of wafer movement is improved and the requirements of different detection positions are met on the premise that the notch position in wafer translation is not offset.
The present utility model has been described in detail with the purpose of enabling those skilled in the art to understand the contents of the present utility model and to implement the same, but not to limit the scope of the present utility model, and all equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. The utility model provides a wafer edge detection device, its includes detects the camera, detect the camera including detecting the first camera of wafer breach, detect the second camera of wafer edge profile, its characterized in that: the detection device further comprises a positioning frame, an auxiliary frame and a driving part, wherein a positioning area is formed on the positioning frame, and a wafer is horizontally positioned in the positioning area; the auxiliary frame comprises a first frame body and a second frame body which are circumferentially arranged around the positioning area, and a laser sensor for detecting the edge finding and the diameter of the wafer is arranged on the first frame body; the first camera and the second camera are respectively arranged on the second frame body; the driving part drives the positioning frame to translate between the first frame body and the second frame body or rotate around the center line of the positioning area, and when the wafer is detected, the wafer moves from the edge to the first frame body and synchronously rotates to search for edge calibration and diameter detection, and the wafer translates from the edge to the second frame body and sequentially detects wafer gaps and edge contours.
2. The wafer edge inspection apparatus of claim 1, wherein: the locating frame is provided with a plurality of supporting end parts, the locating areas are formed among the supporting end parts, and the wafer is supported on the supporting end parts during locating.
3. The wafer edge inspection apparatus of claim 2, wherein: and each supporting end part is provided with an inclined plane which extends obliquely inwards from top to bottom, and the wafer is abutted against the inclined plane from the edge.
4. A wafer edge inspection apparatus according to claim 2 or 3, wherein: the locating frame comprises a frame plate and a plurality of supporting arms distributed in a circumferential array around the central line of the frame plate, wherein the upper end part of each supporting arm forms the supporting end part, and the central line of the frame plate is overlapped with the central line of the locating area.
5. The wafer edge inspection apparatus of claim 1, wherein: the second frame body is provided with a detection space, wherein the detection space is opened towards one side of the positioning frame, during detection, a wafer is inserted into the detection space from the edge, and the first camera and the second camera detect the edge of the wafer respectively.
6. The wafer edge inspection apparatus of claim 5, wherein: the second frame body comprises a vertical frame seat which extends vertically and a horizontal frame seat which is fixedly connected to the vertical frame seat and extends horizontally, wherein the horizontal frame seat is provided with a detection space, a first detection opening is formed in the top of the horizontal frame seat, a second detection opening is formed in one side of the horizontal frame seat, the first camera is fixedly arranged on the vertical frame seat, and a lens of the first camera is in butt joint with the first detection opening downwards; the second camera is fixed on the transverse stand, and the lens of the second camera is butted with the second detection port towards one side.
7. The wafer edge inspection apparatus of claim 6, wherein: the second frame body further comprises a first stop block and a second stop block which are respectively and movably connected to the transverse frame seat, wherein the first stop block can horizontally move to block or open a lens of the first camera; the second stopper is vertically movable to block or open a lens of the second camera.
8. The wafer edge inspection apparatus according to claim 6 or 7, wherein: the light source device comprises a first camera, a second camera, a transverse frame, a first light source, a second light source, a light path, a wafer and a second light source, wherein the first light source is vertically aligned with a lens of the first camera, the second light source is horizontally aligned with the lens of the second camera, the light path emitted by the first light source is upwards perpendicular to the wafer during detection, and the light path emitted by the second light source is tangential to the edge of the wafer.
9. The wafer edge inspection apparatus of claim 1, wherein: the first frame body is arranged on the right side of the positioning frame, and the second frame body is arranged on the rear side of the positioning frame; the driving part drives the positioning frame to horizontally move left and right, horizontally move back and forth and rotate around a central line in the vertical direction.
10. The wafer edge inspection apparatus of claim 9, wherein: the driving part adopts a four-axis platform.
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| CN202323097016.2U CN221102015U (en) | 2023-11-16 | 2023-11-16 | Wafer edge detection device |
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| CN202323097016.2U CN221102015U (en) | 2023-11-16 | 2023-11-16 | Wafer edge detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118408952A (en) * | 2024-07-01 | 2024-07-30 | 高视科技(苏州)股份有限公司 | Detection device for detecting edge of silicon-based substrate module, system and method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118408952A (en) * | 2024-07-01 | 2024-07-30 | 高视科技(苏州)股份有限公司 | Detection device for detecting edge of silicon-based substrate module, system and method thereof |
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