CN221081566U - Electric heating control panel based on coating heat dissipation between boards - Google Patents
Electric heating control panel based on coating heat dissipation between boards Download PDFInfo
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- CN221081566U CN221081566U CN202322343283.7U CN202322343283U CN221081566U CN 221081566 U CN221081566 U CN 221081566U CN 202322343283 U CN202322343283 U CN 202322343283U CN 221081566 U CN221081566 U CN 221081566U
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- heat dissipation
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- electrothermal
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 71
- 238000000576 coating method Methods 0.000 title claims abstract description 37
- 239000011248 coating agent Substances 0.000 title claims abstract description 35
- 238000005485 electric heating Methods 0.000 title claims abstract description 19
- 238000012545 processing Methods 0.000 claims abstract description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 7
- 238000013461 design Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- Central Heating Systems (AREA)
Abstract
The utility model discloses an electrothermal control board based on coating heat dissipation among boards, which is used for controlling an electrothermal blanket, and comprises a board body, a wireless signal processing module, a master control module and a silicon controlled rectifier connecting part; the wireless signal processing module, the master control module and the silicon controlled rectifier connecting part are sequentially arranged on the upper surface of the board body, one end of the silicon controlled rectifier connecting part is electrically connected with the master control module, and the other end of the silicon controlled rectifier connecting part is connected with an electric blanket to be controlled through an electric blanket control wire; the silicon controlled connecting part comprises a supporting rod and a connecting piece, the supporting rod is fixedly connected with the plate body and supports the connecting piece, a gap is formed between the connecting piece and the plate body, a radiating layer is coated on part of the surface between the plate body and the connecting piece, and an electric blanket control wire is fixed on the plate body through the connecting piece and is connected into the master control module. The electric heating control board disclosed by the utility model realizes the heat dissipation function of the electric heating control board in a mode of coating and dissipating heat between boards, and the silicon controlled rectifier connecting part and the electric blanket control wire realize accurate control of the electric blanket.
Description
Technical Field
The utility model relates to the technical field of electric heating equipment, in particular to an electric heating control board based on coating and heat dissipation between boards.
Background
The heat dissipation of the control board in the electrothermal product controller is an important technical problem. With the continued development of electronic devices, the density of components and power consumption on the control board are increasing, which results in a large amount of heat being generated by the control board. If the heat is not effectively dissipated, the temperature of the control board may rise, possibly resulting in reduced performance, shortened life and even failure of the components, thereby affecting the stability and reliability of the overall electrothermal product.
Disclosure of utility model
The embodiment of the utility model provides an electric heating control board based on inter-board coating heat dissipation, which aims to solve the problem that an electric blanket control device in the prior art is overheated to damage a functional device.
The embodiment of the utility model discloses an electrothermal control board based on coating heat dissipation among boards, which is used for controlling an electrothermal blanket, and comprises a board body, a wireless signal processing module, a master control module and a silicon controlled rectifier connecting part; the wireless signal processing module, the master control module and the silicon controlled rectifier connecting part are sequentially arranged on the upper surface of the plate body, one end of the silicon controlled rectifier connecting part is electrically connected with the master control module, and the other end of the silicon controlled rectifier connecting part is connected with an electric blanket to be controlled through an electric blanket control wire; the controllable silicon connecting part comprises a supporting rod and a connecting piece, the supporting rod is fixedly connected with the plate body and supports the connecting piece, a gap is formed between the connecting piece and the plate body, a radiating layer is coated on part of the surface between the plate body and the connecting piece, and the electric blanket control wire is fixed on the plate body through the connecting piece and is connected into the master control module.
Further, the supporting rod forms an inclination angle of 25-35 degrees with the upper surface of the plate body.
Further, the heat dissipation layer comprises a top heat dissipation layer, and the top heat dissipation layer is made of tin materials.
Further, the controllable silicon connecting part comprises a first connecting part and a second connecting part, the electric blanket control line comprises a first control line and a second control line, the first connecting part is connected with the first control line, the second connecting part is connected with the second control line, and the first control line and the second control line are respectively connected with two different electric blankets to be controlled.
Further, the wireless signal processing module is electrically connected with the master control module through the MCU control module.
Further, the heat dissipation layer comprises a bottom heat dissipation layer, the bottom heat dissipation layer is made of copper materials, and the bottom heat dissipation layer is in direct contact with the plate body and is used for coating the top heat dissipation layer.
Further, one end of the supporting rod is fixedly arranged on the upper surface of the plate body through welding.
Further, the electric heating control panel also comprises a power module, and the power module is electrically connected with the wireless signal processing module and the MCU control module through the master control module and is used for inputting electric energy of an external power supply.
The electric blanket control board realizes the heat dissipation function of the electric blanket control board in a way of coating and dissipating heat between boards, and realizes the remote control and management of the whole system through the wireless signal processing module and the master control module. Meanwhile, the accurate control of the electric blanket is realized through the silicon controlled rectifier connecting part and the electric blanket control line.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of an overall structure of an electrothermal control board based on coating heat dissipation between boards according to an embodiment of the present utility model;
Fig. 2 is a front schematic view of the overall structure of an electrothermal control board based on coating heat dissipation between boards according to an embodiment of the present utility model.
Reference numerals:
1. a plate body; 2. a wireless signal processing module; 3. a master control module; 4. a silicon controlled rectifier connection portion; 5. a support rod; 6. a connecting piece; 7. a heat dissipation layer; 8. an MCU control module; 9. a power module; 41. a first connection portion; 42. a second connecting portion; 10. a first control line; 11. and a second control line.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As shown in fig. 1 to 2, the electric heating control board based on the inter-board coating heat dissipation provided in the present embodiment is used for controlling an electric blanket, and the electric heating control board includes a board body 1, a wireless signal processing module 2, a master control module 3 and a thyristor connecting portion 4; the wireless signal processing module 2, the master control module and the silicon controlled rectifier connecting part 4 are sequentially arranged on the upper surface of the board body 1, one end of the silicon controlled rectifier connecting part 4 is electrically connected with the master control module 3, and the other end is connected with an electric blanket to be controlled through an electric blanket control wire; the silicon controlled rectifier connecting portion 4 comprises a supporting rod 5 and a connecting piece 6, the supporting rod 5 is fixedly connected with the plate body 1 and supports the connecting piece 6, a gap is formed between the connecting piece 6 and the plate body 1, a radiating layer 7 is coated on the part of the surface between the plate body 1 and the connecting piece 6, and an electric blanket control wire is fixed on the plate body 1 through the connecting piece 6 and is connected with the general control module 3.
In practical use, such an electrothermal control board based on inter-board coating heat dissipation is used for controlling an electrothermal blanket, and the electrothermal control board includes a main body structure as the whole electrothermal control board for supporting and fixing other components. And the component is arranged on the upper surface of the board body 1 and is used for processing the transmission and the reception of wireless signals. The wireless signal processing module 2 is connected with the upper surface of the board body 1 and is responsible for overall control of the whole system. One end of the part is connected with the master control module 3, and the other end is connected with an electric blanket to be controlled through an electric blanket control wire. The supporting rod 5 is fixedly connected to the plate body 1 and plays a role in supporting the connecting piece 6. A gap is formed between the connection member 6 and the board body 1, and a part of the surface of the connection member 6 is coated with a heat dissipation layer 7. Is fixed on the board body 1 through a connecting piece 6 and is connected with the master control module 3 for connecting and controlling the electric blanket to be controlled. Copper has good heat conducting property, and the copper coating can increase the heat conducting speed and the heat radiating efficiency. In the design of the electrothermal control panel, a copper coating can be selectively applied to the key heat dissipation part, such as the surface of a radiator or the heat dissipation fins. The copper coating may increase the efficiency of heat transfer from the heat sink member to the heat sink, thereby improving overall heat dissipation. The tin coating has excellent heat conduction performance and plasticity, and is suitable for use in contact interfaces. A thin tin coating is coated on the contact surface of the radiator and a radiating element (such as a chip or a circuit board), so that the tiny gap and the uneven surface can be filled, the contact thermal resistance is reduced, and the heat transfer efficiency is improved. The design of these material coatings should be chosen according to the specific circumstances and require verification and testing in practical applications. Before the application of the coating, it is necessary to ensure surface cleaning in order to obtain optimal heat dissipation properties. In addition, attention is paid to the durability and stability of the material coating to ensure that it does not fall off or otherwise adversely affect during long-term use.
In summary, the connection of the electric blanket control line with the board body 1 and the heat dissipation layer 7 can effectively lead out the heat in the board body of the control board, the design key of the heat lead-out through the control line is to utilize the way of coating and dissipating heat between boards to conduct the local and whole simultaneous heat dissipation of the electric blanket, the remote control and management of the whole system are realized through the wireless signal processing module 2 and the master control module 3, and meanwhile, the accurate control of the electric blanket is realized through the thyristor connecting part 4 and the electric blanket control line.
Further, the supporting bar 5 forms an inclination angle of 25-35 degrees with the upper surface of the board body 1.
Specifically, the support bar 5 forms an inclination angle of 25-35 degrees with the upper surface of the board body 1. This design may have various purposes and effects, and the inclined support bar 5 may improve the heat dissipation effect. Through the slope, form bigger clearance between electric heat control panel and the connecting piece 6, increased the heat dissipation space, be favorable to heat dissipation layer 7 full play effect, improve entire system's radiating efficiency. The inclined support bar 5 can give an aesthetic feeling to the person, and increase the design feeling and aesthetic value of the product.
Further, the heat dissipation layer 7 includes a top heat dissipation layer 7, and the top heat dissipation layer 7 is made of tin material.
Specifically, the heat dissipation layer 7 includes a top heat dissipation layer 7, and the top heat dissipation layer 7 is made of a tin material. Tin has good heat conducting property, and can effectively conduct heat from the electric heating control panel to the environment, so that the heat dissipation efficiency of the whole system is improved. Tin has a high melting point and oxidation resistance, can be kept stable in a high-temperature environment, and can not be deformed or damaged due to long-time use. The tin material is relatively light, is easy to process and install on the top heat dissipation layer 7, does not increase much weight, and is convenient for carrying and using the product.
Further, the thyristor connecting portion 4 includes a first connecting portion 41 and a second connecting portion 42, the electric blanket control line includes a first control line 10 and a second control line 11, the first connecting portion 41 is connected with the first control line 10, the second connecting portion 42 is connected with the second control line 11, and the first control line 10 and the second control line 11 are respectively connected with two different electric blankets to be controlled.
Specifically, in the embodiment, the first connecting portion 41 includes two identical components, the inclination angle between the support rod 5 of the first connecting portion 41 and the plate body 1 is smaller than the inclination angle between the support rod 5 of the second connecting portion 41 and the plate body 1, and the connecting plate of the second connecting portion 41 is pressed on the upper portion of the connecting portion of the second connecting portion 41, and similarly, the second connecting portion 42 is also in the above mode.
Further, the wireless signal processing module 2 is electrically connected with the master control module 3 through the MCU control module 8.
Specifically, the wireless signal processing module 2 is electrically connected with the master control module 3 through the MCU control module 8. The wireless signal processing module 2 is responsible for processing the transmission and the reception of wireless signals, and can transmit the received wireless signals to the master control module 3 for further processing through being electrically connected with the master control module 3. The MCU control module 8 is a micro controller unit that can control and process data from the wireless signal processing module 2 by a program and communicate with the general control module 3. The system can analyze and decode the received data and send control instructions to the master control module 3 according to the need so as to realize the control of the whole system. By connecting the wireless signal processing module 2 with the MCU control module 8, integration of wireless communication and data processing functions is achieved. The integrated design makes the whole system more compact and efficient, and simplifies the circuit layout and connection mode.
Further, the heat dissipation layer 7 includes a bottom heat dissipation layer 7, the bottom heat dissipation layer 7 is made of copper material, and the bottom heat dissipation layer 7 is in direct contact with the board body 1 and is used for coating the top heat dissipation layer 7.
Specifically, the heat dissipation layer 7 further includes a bottom heat dissipation layer 7, and the bottom heat dissipation layer 7 is made of a copper material. The bottom heat sink layer 7 is in direct contact with the board body 1 and is used to coat the top heat sink layer 7. This design may bring several advantages: copper is an excellent heat conductive material with excellent heat conductive properties. The bottom heat dissipation layer 7 is made of copper materials and is in direct contact with the plate body 1, so that heat can be conducted from the electric heating control plate to the heat dissipation layer 7 more effectively, and the heat dissipation efficiency of the whole system is improved. The bottom heat dissipation layer 7 is in direct contact with the board body 1, and can provide a larger contact area and a more uniform heat dissipation distribution. This helps to disperse the heat evenly, avoiding localized overheating and hot spot formation. Copper has higher strength and stability, can keep the stability of shape and performance in the long-time use process, and is not easy to deform or damage. This helps to improve the reliability and lifetime of the heat sink layer 7.
Further, one end of the support rod 5 is fixedly provided on the upper surface of the plate body 1 by welding.
Specifically, one end of the support rod 5 is fixedly provided to the upper surface of the plate body 1 by welding. This design brings several advantages: by fixing the support bar 5 to the upper surface of the board body 1 by welding, a firm support can be provided. This helps to maintain the stability of the plate body 1 and the robustness of the overall structure, reducing looseness or vibration during use. The support rod 5 is directly welded on the plate body 1, so that the space can be saved to the greatest extent. This design avoids the use of other connectors 6 or brackets, thereby reducing the overall volume and simplifying the assembly process. Welding is a powerful fixing method that creates a very strong connection between the support bar 5 and the plate body 1. Welding can provide greater strength and stability relative to other means of attachment such as threading or adhesives.
Further, the electric heating control board further comprises a power module 9, and the power module 9 is electrically connected with the wireless signal processing module 2 and the MCU control module 8 through the master control module 3 and is used for inputting electric energy of an external power supply.
Specifically, the electric heating control board further comprises a power module 9, and the power module is electrically connected with the wireless signal processing module 2 and the MCU control module 8 through the master control module 3 and is used for inputting electric energy of an external power supply. The power module 9 is responsible for taking power from an external power input and supplying a stable power to the other modules of the electric heating control board. This ensures that the whole system gets enough power during operation to make each functional module work normally. By electrically connecting the power supply module 9 with the general control module 3, the wireless signal processing module 2 and the MCU control module 8, the overall circuit structure can be simplified. This design avoids the need for separate power supplies for each module, reduces the number of cables and components used, and improves the reliability and ease of maintenance of the system. By using an external power supply to supply the electric energy of the electric heating control panel, the proper power supply type and voltage level can be selected according to actual requirements. The design can meet different power supply requirements in different application scenes, and a more flexible power supply selection scheme is provided.
The utility model discloses an electrothermal control board based on coating heat dissipation among boards, which comprises a board body 1, a wireless signal processing module 2, a master control module 3 and a silicon controlled rectifier connecting part 4; the wireless signal processing module 2, the master control module and the silicon controlled rectifier connecting part 4 are sequentially arranged on the upper surface of the board body 1, one end of the silicon controlled rectifier connecting part 4 is electrically connected with the master control module 3, and the other end is connected with an electric blanket to be controlled through an electric blanket control wire; the silicon controlled rectifier connecting portion 4 comprises a supporting rod 5 and a connecting piece 6, the supporting rod 5 is fixedly connected with the plate body 1 and supports the connecting piece 6, a gap is formed between the connecting piece 6 and the plate body 1, a radiating layer 7 is coated on the part of the surface between the plate body 1 and the connecting piece 6, and an electric blanket control wire is fixed on the plate body 1 through the connecting piece 6 and is connected with the general control module 3. A thin tin coating is coated on the contact surface of the radiator and a radiating element (such as a chip or a circuit board), so that the tiny gap and the uneven surface can be filled, the contact thermal resistance is reduced, and the heat transfer efficiency is improved. The design of these material coatings should be chosen according to the specific circumstances and require verification and testing in practical applications. Before the application of the coating, it is necessary to ensure surface cleaning in order to obtain optimal heat dissipation properties. In addition, attention is paid to the durability and stability of the material coating to ensure that it does not fall off or otherwise adversely affect during long-term use. The design realizes the heat dissipation function of the electric heating control panel by the way of coating and heat dissipation among boards, and realizes the remote control and management of the whole system by the wireless signal processing module 2 and the master control module 3. Meanwhile, the accurate control of the electric blanket is realized through the silicon controlled rectifier connecting part 4 and the electric blanket control line.
The present utility model is not limited to the above embodiments, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the present utility model, and these modifications and substitutions are intended to be included in the scope of the present utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (8)
1. An electrothermal control board based on coating heat dissipation between boards for controlling an electrothermal blanket, which is characterized by comprising:
the device comprises a board body, a wireless signal processing module, a master control module and a silicon controlled rectifier connecting part;
The wireless signal processing module, the master control module and the silicon controlled rectifier connecting part are sequentially arranged on the upper surface of the plate body, one end of the silicon controlled rectifier connecting part is electrically connected with the master control module, and the other end of the silicon controlled rectifier connecting part is connected with an electric blanket to be controlled through an electric blanket control wire;
The controllable silicon connecting part comprises a supporting rod and a connecting piece, the supporting rod is fixedly connected with the plate body and supports the connecting piece, a gap is formed between the connecting piece and the plate body, a radiating layer is coated on part of the surface between the plate body and the connecting piece, and the electric blanket control wire is fixed on the plate body through the connecting piece and is connected into the master control module.
2. The board-to-board coating heat dissipation based electric heating control board according to claim 1, wherein the support bar forms an inclination angle of 25-35 degrees with the upper surface of the board body.
3. The board-to-board coating heat dissipation based electrothermal control board of claim 1, wherein the heat dissipation layer comprises a top heat dissipation layer made of tin material.
4. The electrothermal control board based on the inter-board coating heat dissipation according to claim 2, wherein the silicon controlled rectifier connecting portion comprises a first connecting portion and a second connecting portion, the electrothermal blanket control line comprises a first control line and a second control line, the first connecting portion is connected with the first control line, the second connecting portion is connected with the second control line, and the first control line and the second control line are respectively connected with two different electrothermal blankets to be controlled.
5. The board-to-board coating heat dissipation-based electrothermal control board of claim 1, wherein the wireless signal processing module is electrically connected with the master control module through an MCU control module.
6. An electrothermal control board based on coating heat dissipation between boards according to claim 3, wherein the heat dissipation layer comprises a bottom heat dissipation layer made of copper material, the bottom heat dissipation layer being in direct contact with the board body and used to coat the top heat dissipation layer.
7. The electrothermal control board based on the inter-board coating heat dissipation according to claim 2, wherein one end of the support rod is fixedly arranged on the upper surface of the board body through welding.
8. The electric heating control board based on the inter-board coating heat dissipation according to claim 5, further comprising a power module, wherein the power module is electrically connected with the wireless signal processing module and the MCU control module through a master control module and is used for inputting electric energy of an external power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322343283.7U CN221081566U (en) | 2023-08-30 | 2023-08-30 | Electric heating control panel based on coating heat dissipation between boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322343283.7U CN221081566U (en) | 2023-08-30 | 2023-08-30 | Electric heating control panel based on coating heat dissipation between boards |
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| Publication Number | Publication Date |
|---|---|
| CN221081566U true CN221081566U (en) | 2024-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322343283.7U Active CN221081566U (en) | 2023-08-30 | 2023-08-30 | Electric heating control panel based on coating heat dissipation between boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221081566U (en) |
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2023
- 2023-08-30 CN CN202322343283.7U patent/CN221081566U/en active Active
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