CN221057464U - Fuel cell thermal management system - Google Patents
Fuel cell thermal management system Download PDFInfo
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- CN221057464U CN221057464U CN202322584106.8U CN202322584106U CN221057464U CN 221057464 U CN221057464 U CN 221057464U CN 202322584106 U CN202322584106 U CN 202322584106U CN 221057464 U CN221057464 U CN 221057464U
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- 239000000446 fuel Substances 0.000 title claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 153
- 239000004065 semiconductor Substances 0.000 claims abstract description 60
- 239000000498 cooling water Substances 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 238000005057 refrigeration Methods 0.000 claims description 20
- 238000001816 cooling Methods 0.000 abstract description 17
- 239000007789 gas Substances 0.000 description 28
- 238000007789 sealing Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Fuel Cell (AREA)
Abstract
The utility model discloses a fuel cell thermal management system, comprising: the water heat management system is arranged on the water inlet pipeline and the water return pipeline of the electric pile and comprises a water pump and a radiator, the radiator is arranged between the water inlet pipeline and the water return pipeline, the water pump is used for driving cooling water to circularly flow between the radiator and the electric pile, the water heat management system further comprises a semiconductor heat dissipation device, the semiconductor heat dissipation device comprises a semiconductor refrigerating sheet and a water heat exchange structure attached to the first side of the semiconductor refrigerating sheet, and the water heat exchange structure is arranged on the water return pipeline. When the electric pile normally works, the first side of the semiconductor refrigerating sheet refrigerates, cooling water from the water return pipeline enters the water heat exchange structure, and in the water heat exchange structure, the first side of the semiconductor refrigerating sheet absorbs heat released by the cooling water, so that the temperature of the cooling water is reduced, the cooling efficiency of the water heat management system is improved, and the cooling requirement of the electric pile in peak power can be met by the radiator with smaller volume.
Description
Technical Field
The utility model relates to the technical field of fuel cells, in particular to a fuel cell thermal management system.
Background
The fuel cell is considered to be a clean high-efficiency energy conversion device with wide application prospect due to the characteristics of high efficiency, no noise and no carbon emission. However, due to the limitations of electrochemical reactions, fuel cells are not able to fully convert the chemical energy of hydrogen into electrical energy, and existing large-scale commercial fuel cell stacks typically operate at less than 60% efficiency at rated power, with the remainder of the energy typically being dissipated as heat, so thermal management of the fuel cell is a non-negligible part of the fuel cell.
The fuel cell in the present stage generally adopts two heat sinks, namely water cooling and air cooling, however, the heat dissipation efficiency of the two heat dissipation modes is lower, and the peak power of the fuel cell generally needs to be considered in the heat dissipation matching process, so as to ensure that the fuel cell operates in a proper temperature range under each working condition. This results in an excessively large radiator volume, limiting the spread of fuel cell systems in spatially compact applications.
Disclosure of utility model
Aiming at the defects, the technical problems to be solved by the utility model are as follows: the fuel cell thermal management system with high heat dissipation efficiency is provided to solve the problem that the radiator is overlarge in size due to the fact that the radiator is required to adapt to high-power working conditions.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
A fuel cell thermal management system comprising: the water heat management system is arranged on a water inlet pipeline and a water return pipeline of the electric pile and comprises a water pump and a radiator, the radiator is arranged between the water inlet pipeline and the water return pipeline, the water pump is used for driving cooling water to circularly flow between the radiator and the electric pile, the water heat management system further comprises a semiconductor heat radiating device, the semiconductor heat radiating device comprises a semiconductor refrigerating sheet and a water heat exchange structure attached to the first side of the semiconductor refrigerating sheet, and the water heat exchange structure is arranged on the water return pipeline.
Preferably, the fuel cell thermal management system further comprises an air thermal management system, and the air thermal management system is arranged on an air inlet pipeline and an air outlet pipeline of the electric pile;
The semiconductor heat dissipation device comprises a gas heat exchange structure attached to the second side of the semiconductor refrigeration piece;
The air outlet pipeline is connected with the air inlet of the vortex tube, and the air outlet of the cold end of the vortex tube is connected with the air heat exchange structure.
Preferably, the water heat exchange structure comprises a water heat exchange cavity and water heat exchange fins arranged in the water heat exchange cavity, a water inlet and a water outlet of the water heat exchange cavity are connected to the water return pipeline, the water heat exchange fins are arranged on a water cavity shell of the water heat exchange cavity, and a first side of the semiconductor refrigeration piece is attached to the water cavity shell.
Preferably, the water cavity shell comprises a water cavity shell body and a water cavity patch, wherein the water cavity shell body and the water cavity patch are used for enclosing the water heat exchange cavity together, the water heat exchange fins are arranged on the water cavity patch, and the water cavity patch is attached to the first side of the semiconductor refrigeration piece.
Preferably, the gas heat exchange structure comprises a gas heat exchange cavity and gas heat exchange fins arranged in the gas heat exchange cavity, an air inlet of the gas heat exchange cavity is connected with an air outlet of a cold end of the vortex tube, the gas heat exchange fins are arranged on an air cavity shell of the gas heat exchange cavity, and a second side of the semiconductor refrigeration piece is attached to the air cavity shell.
Preferably, the air cavity shell comprises an air cavity shell body and an air cavity patch, wherein the air cavity shell body and the air cavity patch are used for enclosing the air heat exchange cavity together, the air heat exchange fins are arranged on the air cavity patch, and the air cavity patch is attached to the second side of the semiconductor refrigeration piece.
Preferably, an on-off valve is arranged between the air inlet of the gas heat exchange cavity, the air outlet of the cold end of the vortex tube and the air outlet pipeline.
Preferably, the air thermal management system comprises an air filter, a flowmeter, an air compressor and an inter-cooling humidifier which are sequentially arranged on the air inlet pipeline, and the inter-cooling humidifier is connected with the air outlet pipeline;
The on-off valve is arranged between the air inlet of the gas heat exchange cavity, the air outlet of the cold end of the vortex tube and the air outlet pipeline positioned at the downstream of the intercooling humidifier.
Preferably, a water cavity sealing groove is arranged at one end of the water cavity shell body, which is connected with the water cavity patch, and a water cavity sealing gasket is arranged in the water cavity sealing groove.
Preferably, one end of the air cavity shell body, which is connected with the air cavity patch, is provided with an air cavity sealing groove in which an air cavity sealing gasket is arranged.
After the technical scheme is adopted, the utility model has the beneficial effects that:
Because the water thermal management system also comprises a semiconductor heat dissipation device, the semiconductor heat dissipation device comprises a semiconductor refrigeration piece and a water heat exchange structure attached to the first side of the semiconductor refrigeration piece, and the water heat exchange structure is arranged on the water return pipeline. When the electric pile normally works, the first side of the semiconductor refrigerating sheet refrigerates, cooling water from the water return pipeline enters the water heat exchange structure, and in the water heat exchange structure, the first side of the semiconductor refrigerating sheet absorbs heat released by the cooling water, so that the temperature of the cooling water is reduced, the cooling efficiency of the water heat management system is improved, the requirement on a radiator is reduced, and the radiator with a smaller volume can meet the cooling requirement when the electric pile is at peak power.
Drawings
FIG. 1 is a schematic illustration of a fuel cell thermal management system of the present utility model;
FIG. 2 is a schematic cross-sectional view of the semiconductor heat spreader of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the structure of FIG. 2 in the direction A-A;
FIG. 4 is a schematic cross-sectional view of the vortex tube of FIG. 1;
In the figure: 1. a heat sink; 2. a semiconductor heat sink; 21. a semiconductor refrigeration sheet; 22. a water heat exchange structure; 221. a water chamber housing body; 222. a water inlet of the water cavity; 223. a water outlet of the water cavity; 224. water heat exchange fins; 225. a water cavity patch; 226. a water chamber gasket; 23. a gas heat exchange structure; 231. an air cavity housing body; 232. an air cavity air inlet; 233. an air outlet of the air cavity; 234. gas heat exchange fins; 235. an air cavity patch; 236. an air cavity sealing gasket; 3. a water pump; 4. a galvanic pile; 5. an intercooler humidifier; 6. an opening/closing valve; 7. a vortex tube; 71. a vortex tube air inlet; 72. a cold end air outlet; 73. a hot end air outlet; 8. an air compressor; 9. a flow meter; 10. an air filter; a. a water inlet pipeline; b. a water return line; c. an air intake line; d. and an air outlet pipeline.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1, a fuel cell thermal management system, comprising: the water heat management system is arranged on a water inlet pipeline a and a water return pipeline b of the electric pile 4, the water heat management system comprises a water pump 3 and a radiator 1, the radiator 1 is arranged between the water inlet pipeline a and the water return pipeline b, the water pump 3 is used for driving cooling water to circularly flow between the radiator 1 and the electric pile 4, the water heat management system further comprises a semiconductor heat radiator 2, the semiconductor heat radiator 2 comprises a semiconductor refrigerating sheet 21 and a water heat exchange structure 22 attached to the first side of the semiconductor refrigerating sheet 21, and the water heat exchange structure 22 is arranged on the water return pipeline b.
When the electric pile 4 works normally, the first side of the semiconductor refrigerating sheet 21 refrigerates, cooling water from the water return pipeline b enters the water heat exchange structure 22, and in the water heat exchange structure 22, the first side of the semiconductor refrigerating sheet 21 absorbs heat released by the cooling water, so that the temperature of the cooling water is reduced, the cooling efficiency of the water heat management system is improved, the requirement on a radiator is reduced, and the radiator with a smaller volume can meet the cooling requirement when the electric pile 4 has peak power.
As shown in fig. 4, the first side of the semiconductor cooling fin 21 is cooled and the second side thereof is heated, and the second side needs to be cooled to make the semiconductor cooling fin 21 work normally. The fuel cell thermal management system also comprises an air thermal management system, and the air thermal management system is arranged on the air inlet pipeline c and the air outlet pipeline d of the electric pile 4; the semiconductor heat dissipation device 2 comprises a gas heat exchange structure 23 attached to the second side of the semiconductor refrigeration sheet 21; the air outlet pipeline d is connected with a vortex tube air inlet 71 of the vortex tube 7, and a cold end air outlet 72 of the vortex tube 7 is connected with the gas heat exchange structure 23. The tail gas discharged by the electric pile 4 flows into the vortex tube 7 at a high speed, cold air flow is discharged from the cold end air outlet 72, the cold air flow enters the air heat exchange structure 23, heat released by the second side of the semiconductor refrigerating sheet 21 is absorbed, the semiconductor refrigerating sheet 21 is cooled, the semiconductor refrigerating sheet 21 is prevented from being burnt out, and the semiconductor refrigerating sheet 21 stably works for a long time. The hot end air outlet 73 of the vortex tube 7 is connected with a tail row system of the whole vehicle.
As shown in fig. 2 and 3, in the illustrated embodiment, the water heat exchange structure 22 includes a water heat exchange cavity and a water heat exchange fin 224 disposed in the water heat exchange cavity, a water cavity water inlet 222 and a water cavity water outlet 223 of the water heat exchange cavity are connected to the water return pipeline b, the water heat exchange fin 224 is disposed on a water cavity housing of the water heat exchange cavity, and a first side of the semiconductor refrigeration sheet 21 is attached to the water cavity housing. The water heat exchanging fins 224 absorb the heat of the cooling water to be transferred to the water chamber housing, and the semiconductor refrigerating fin 21 absorbs the heat released from the water chamber housing.
The water cavity shell comprises a water cavity shell body 221 and a water cavity patch 225, wherein the water cavity shell body 221 and the water cavity patch 225 are used for enclosing a water heat exchange cavity together, the water heat exchange fins 224 are integrally arranged on the water cavity patch 225, and the water cavity patch 225 is attached to the first side of the semiconductor refrigeration piece 21. One end of the water cavity shell body 221 connected with the water cavity patch 225 is provided with a water cavity sealing groove, and a water cavity sealing gasket 226 is arranged in the water cavity sealing groove.
The gas heat exchange structure 23 comprises a gas heat exchange cavity and gas heat exchange fins 234 arranged in the gas heat exchange cavity, an air cavity air inlet 232 of the gas heat exchange cavity is connected with a cold end air outlet 72 of the vortex tube 7, the gas heat exchange fins 234 are arranged on an air cavity shell of the gas heat exchange cavity, and a second side of the semiconductor refrigeration piece 21 is attached to the air cavity shell. The gas heat exchange fins 234 absorb heat released by the second side of the semiconductor refrigeration sheet 21, and the cold end air outlet 72 discharges cold air flow into the gas heat exchange cavity to cool the gas heat exchange fins 234, thereby reducing the temperature of the second side of the semiconductor refrigeration sheet 21. The air cavity air outlet 233 of the air heat exchange cavity is connected with a tail exhaust system of the whole vehicle.
The air cavity housing comprises an air cavity housing body 231 and an air cavity patch 235, wherein the air cavity housing body 231 and the air cavity patch 235 are used for enclosing the air heat exchange cavity together, the air heat exchange fins 234 are arranged on the air cavity patch 235, and the air cavity patch 235 is attached to the second side of the semiconductor refrigeration piece 21. The end of the air cavity housing body 231 connected with the air cavity patch 235 is provided with an air cavity sealing groove, and an air cavity sealing pad 236 is arranged in the air cavity sealing groove.
An opening and closing valve 6 is arranged between the air cavity air inlet 232, the cold end air outlet 72 and the air outlet pipeline d. The on-off valve 6 is a normally closed valve and is opened only at the time of cold start. When the system is in a cold start state, the on-off valve 6 is opened to change the flow direction of the semiconductor refrigerating sheet 21, the first side of the semiconductor refrigerating sheet 21 heats, the second side refrigerates, the heat generated by the first side is used for heating cooling water in the hydrothermal management system, cold start of the electric pile 4 is realized, cold air in the gas heat exchange cavity is taken away by cold air flow discharged by the cold end air outlet 72, and long-term operation of the semiconductor refrigerating sheet 21 is ensured. The use of the semiconductor refrigerating sheet 21 to heat the cooling water can reduce the use of the PTC heater, reduce the complexity of the cooling system, reduce the control difficulty, the cost and the parasitic power, and improve the reliability of the system.
Preferably, the air thermal management system comprises an air filter 10, a flowmeter 9, an air compressor 8 and an inter-cooling humidifier 5 which are sequentially arranged on an air inlet pipeline c, wherein the inter-cooling humidifier 5 is connected with an air outlet pipeline d; an on-off valve 6 is provided between the air chamber inlet 232 and the cold end outlet 72 and the outlet line d downstream of the intercooler humidifier 5.
In summary, the fuel cell thermal management system of the present utility model has the following advantages:
(1) When the electric pile works normally, the semiconductor refrigerating sheet reduces the temperature of cooling water in the water heat management system, greatly improves the cooling efficiency of the water heat management system on the electric pile, reduces the volume of a radiator and expands the application field of the fuel cell;
(2) When the charging pile works normally, tail gas discharged by the pile is fully utilized, and cold air flow is generated after the tail gas enters the vortex tube and cools the semiconductor refrigerating sheet, so that the semiconductor refrigerating sheet can work normally;
(3) By switching the refrigerating side and the heating side of the semiconductor refrigerating sheet, the low-temperature cold start of the fuel cell can be realized, the use of the PTC heater is reduced, the complexity of a cooling path is reduced, the control difficulty, the cost and the parasitic power are reduced, and the reliability of the system is improved.
The foregoing is illustrative of the best mode of carrying out the utility model, and is not presented in any detail as is known to those of ordinary skill in the art. The protection scope of the utility model is defined by the claims, and any equivalent transformation based on the technical teaching of the utility model is also within the protection scope of the utility model.
Claims (10)
1. A fuel cell thermal management system comprising: the water heat management system is arranged on a water inlet pipeline and a water return pipeline of the electric pile and comprises a water pump and a radiator, the radiator is arranged between the water inlet pipeline and the water return pipeline, and the water pump is used for driving cooling water to circularly flow between the radiator and the electric pile.
2. The fuel cell thermal management system of claim 1, further comprising an air thermal management system disposed on an air inlet line and an air outlet line of the stack;
The semiconductor heat dissipation device comprises a gas heat exchange structure attached to the second side of the semiconductor refrigeration piece;
The air outlet pipeline is connected with the air inlet of the vortex tube, and the air outlet of the cold end of the vortex tube is connected with the air heat exchange structure.
3. The fuel cell thermal management system of claim 2 wherein the water heat exchange structure comprises a water heat exchange cavity and water heat exchange fins disposed in the water heat exchange cavity, the water inlet and the water outlet of the water heat exchange cavity being connected to the water return line, the water heat exchange fins being disposed on a water cavity housing of the water heat exchange cavity, the semiconductor refrigeration sheet first side being attached to the water cavity housing.
4. The fuel cell thermal management system of claim 3 wherein the water chamber housing includes a water chamber housing body and a water chamber patch for collectively enclosing the water heat exchange chamber, the water heat exchange fins being disposed on the water chamber patch, the water chamber patch being in engagement with the first side of the semiconductor refrigeration sheet.
5. The fuel cell thermal management system of claim 4 wherein the gas heat exchange structure comprises a gas heat exchange cavity and gas heat exchange fins disposed in the gas heat exchange cavity, an air inlet of the gas heat exchange cavity is connected with an air outlet of the cold end of the vortex tube, the gas heat exchange fins are disposed on an air cavity housing of the gas heat exchange cavity, and the second side of the semiconductor refrigeration sheet is attached to the air cavity housing.
6. The fuel cell thermal management system of claim 5 wherein the air cavity housing comprises an air cavity housing body and an air cavity patch for collectively enclosing the air heat exchange cavity, the air heat exchange fins being disposed on the air cavity patch, the air cavity patch being bonded to the second side of the semiconductor refrigeration sheet.
7. The fuel cell thermal management system of claim 6 wherein an on-off valve is provided between the gas inlet of the gas heat exchange chamber and the cold end gas outlet of the vortex tube and the gas outlet line.
8. The fuel cell thermal management system according to claim 7 wherein the air thermal management system comprises an air filter, a flow meter, an air compressor, and an intercooler humidifier disposed in sequence in the air intake line, the intercooler humidifier being connected to the air outlet line;
The on-off valve is arranged between the air inlet of the gas heat exchange cavity, the air outlet of the cold end of the vortex tube and the air outlet pipeline positioned at the downstream of the intercooling humidifier.
9. The fuel cell thermal management system of claim 4 wherein a water cavity seal groove is provided in an end of the water cavity housing body connected to the water cavity patch, and a water cavity gasket is provided in the water cavity seal groove.
10. The fuel cell thermal management system according to claim 6 wherein a gas is provided in an end of the air cavity housing body connected to the air cavity patch with an air cavity seal groove, and an air cavity gasket is provided in the air cavity seal groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322584106.8U CN221057464U (en) | 2023-09-22 | 2023-09-22 | Fuel cell thermal management system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322584106.8U CN221057464U (en) | 2023-09-22 | 2023-09-22 | Fuel cell thermal management system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221057464U true CN221057464U (en) | 2024-05-31 |
Family
ID=91226385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322584106.8U Active CN221057464U (en) | 2023-09-22 | 2023-09-22 | Fuel cell thermal management system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221057464U (en) |
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2023
- 2023-09-22 CN CN202322584106.8U patent/CN221057464U/en active Active
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