CN221037801U - Semiconductor vacuum gauge system and semiconductor device using same - Google Patents
Semiconductor vacuum gauge system and semiconductor device using same Download PDFInfo
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- CN221037801U CN221037801U CN202322806228.7U CN202322806228U CN221037801U CN 221037801 U CN221037801 U CN 221037801U CN 202322806228 U CN202322806228 U CN 202322806228U CN 221037801 U CN221037801 U CN 221037801U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000002955 isolation Methods 0.000 claims abstract description 29
- 238000010894 electron beam technology Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 44
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model provides a semiconductor vacuum gauge system and semiconductor equipment applied to the same, wherein the vacuum gauge system comprises: at least two vacuum gauges mounted on a sidewall of the vacuum chamber; the isolation boxes are positioned in the vacuum chambers, and one end of each vacuum gauge is positioned in each isolation box; and the valve is arranged on the outer wall of the isolation box. The utility model can improve the detection precision of the semiconductor vacuum machine and increase the production efficiency of the vacuum machine.
Description
Technical Field
The utility model relates to the field of semiconductor equipment, in particular to a semiconductor vacuum gauge system and semiconductor equipment applied to the same.
Background
In the process of manufacturing the semiconductor chip, a vacuum environment required by the processing of the semiconductor chip is generated by a vacuum machine. In the vacuum cavity of the vacuum machine, a vacuum gauge is respectively arranged in the main cavity and the lens barrel cavity. Under the condition that the vacuum gauge is damaged or the value is wrongly read, the vacuum machine station gives out a software alarm, so that the semiconductor chip cannot be processed continuously. Under the condition that the vacuum machine station gives an alarm, the operation of replacing the vacuum gauge is needed, and the vacuum breaking condition can occur when the vacuum gauge is replaced, namely, the semiconductor chip in the vacuum machine station is subjected to air backflow after the vacuum breaking, so that the semiconductor chip is scrapped. After the vacuum gauge is replaced, a vacuumizing operation is required, and a great deal of time is consumed. Therefore, there is a need for improvement.
Disclosure of utility model
In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a semiconductor vacuum gauge system and a semiconductor device using the same, which are used for solving the problem that the vacuum gauge is damaged and cannot be processed normally.
To achieve the above and other related objects, the present utility model provides a semiconductor vacuum gauge system comprising:
at least two vacuum gauges mounted on a sidewall of the vacuum chamber;
The isolation boxes are positioned in the vacuum chambers, and one end of each vacuum gauge is positioned in each isolation box; and
And the valve is arranged on the outer wall of the isolation box.
In one embodiment of the present utility model, the vacuum chamber includes a main chamber and a barrel chamber, the main chamber and the barrel chamber are connected, at least two vacuum gauges are installed in the main chamber, and at least two vacuum gauges are installed in the barrel chamber.
In one embodiment of the present utility model, a vacuum pump is installed at a side wall of the barrel portion chamber and a side wall of the main chamber.
In one embodiment of the utility model, at least two of the vacuum gauges are mounted within the main chamber at a location on one side of the vacuum pump.
In one embodiment of the present utility model, at least two of the vacuum gauges are respectively installed at both side positions of the vacuum pump in the barrel section chamber.
The present utility model proposes a semiconductor device comprising:
A main chamber;
A lens barrel chamber connected to the main chamber;
An electron gun chamber connected to the barrel chamber; and
The electron beam emitted by the electron gun chamber irradiates onto a wafer in the main chamber through the lens barrel chamber;
a vacuum gauge system disposed within the main chamber, the vacuum gauge system comprising:
At least two vacuum gauges mounted on a sidewall of the main chamber;
An isolation box located in the main chamber, one end of each vacuum gauge being located in the isolation box; and
And the valve is arranged on the outer wall of the isolation box.
In one embodiment of the present utility model, the semiconductor device further includes:
The wafer carrying chamber is connected with the main chamber and is positioned at one side of the main chamber; and
And the wafer loading main body is connected with the wafer carrying chamber, the wafer carrying chamber is positioned between the main chamber and the wafer loading main body, and the wafer is conveyed into the main chamber through the wafer loading main body and the wafer carrying chamber.
In one embodiment of the utility model, the bottom of the main chamber, the bottom of the wafer handling chamber and the bottom of the wafer loading body are on the same plane.
In one embodiment of the present utility model, the electron beam emitted from the electron gun chamber is located in a vertical direction and irradiates onto the wafer in the main chamber through the lens barrel chamber.
In one embodiment of the present utility model, the semiconductor apparatus further includes a blower filter connected to the wafer handling chamber, the blower filter being located at one side of the wafer handling chamber.
As described above, in the semiconductor vacuum gauge system and the semiconductor device using the same according to the present utility model, at least two vacuum gauges are provided in a vacuum chamber, and in the case that one vacuum gauge is damaged, the vacuum degree in the vacuum chamber can be detected by the other vacuum gauge. In addition, in the case that one vacuum gauge is damaged, the valve of the isolation box where the damaged vacuum gauge is positioned can be closed. The isolation box separates the damaged vacuum gauge from the vacuum chamber, namely, under the condition that the vacuum machine is not stopped, the replacement and maintenance of the damaged vacuum gauge can be realized, the detection precision of the semiconductor vacuum machine can be improved, and the production efficiency of the vacuum machine can be increased.
Drawings
Fig. 1 is a schematic view showing a structure of a semiconductor device according to the present utility model.
Fig. 2 shows still another structural schematic diagram of a semiconductor device of the present utility model.
Description of element numbers:
10. A main chamber; 20. a barrel portion chamber; 30. an electron gun chamber; 31. an electron gun; 40. a wafer handling chamber; 50. a wafer loading body; 60. a fan filter; 70. a vacuum gauge; 80. a vacuum pump; 90. an isolation box; 100. a valve; 110. and (3) a wafer.
Detailed Description
Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. It is also to be understood that the terminology used in the examples of the utility model is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the utility model. The test methods in the following examples, in which specific conditions are not noted, are generally conducted under conventional conditions or under conditions recommended by the respective manufacturers.
It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are not intended to be critical to the essential characteristics of the utility model, but are intended to fall within the spirit and scope of the utility model. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the utility model may be practiced.
Referring to fig. 1 and 2, the present utility model provides a semiconductor vacuum gauge system and a semiconductor device using the same, which can be applied to the field of manufacturing semiconductors, such as the field of manufacturing display screens, the field of manufacturing light-emitting diodes (LEDs), the field of wafer packaging, and the like. The utility model can be particularly applied to the ion implantation device of the semiconductor, can detect the vacuum degree in the semiconductor equipment, and avoids the occurrence of software alarm under the condition that the semiconductor equipment is damaged or the vacuum gauge is wrongly read. The utility model improves the production efficiency of the semiconductor equipment.
Referring to FIG. 1, in one embodiment, a semiconductor vacuum gauge system is provided that may include a vacuum gauge 70, an isolation box 90, and a valve 100. Within one vacuum chamber, at least two vacuum gauges 70 may be installed, and the vacuum gauges 70 may be installed on the side walls of the vacuum chamber. For example, when the vacuum chamber is a main chamber 10 (main chamber) or a column chamber (column) 20, the main chamber 10 and the column chamber 20 may be adjacently disposed, the column chamber 20 is used to process an electron beam emitted from the electron chamber 30 (gun), and the processed electron beam is irradiated onto the wafer 110 inside the main chamber 10, so as to perform an ion implantation process on the wafer. At least two vacuum gauges 70 may be installed in the main chamber 10, or at least two vacuum gauges 70 may be installed in the barrel chamber 20. The isolation box 90 may be installed in each vacuum chamber, and the isolation box 90 may be installed in both the main chamber 10 and the barrel chamber 20. The vacuum gauge 70 is detachably attached to the side wall of the isolation box 90. One end of each vacuum gauge 70 for detecting the vacuum degree may be located in the isolation box 90. The isolation box 90 may have a valve 100 mounted thereon, the valve 100 may be located on an outer wall of the isolation box 90, and the valve 100 may place the outer wall of the isolation box 90 in an open or closed state. When the valve 100 is opened, the vacuum gauge 70 in the isolation box 90 can detect the vacuum degree in the vacuum chamber. When the valve 100 is closed, the vacuum gauge 70 inside the isolation box 90 is isolated from the vacuum chamber, the vacuum gauge 70 cannot detect the vacuum degree in the vacuum chamber, and the vacuum gauge 70 can be maintained and replaced in the event that the vacuum gauge 70 is damaged.
Referring to fig. 1, in one embodiment, in the main chamber 10 or the barrel chamber 20, when the vacuum values read by the two vacuum gauges 70 are normal, it is determined that the main chamber 10 is in a normal operation environment. In the case where the two vacuum gauges 70 read the vacuum value abnormally, it is determined that the main chamber 10 is in an abnormal operating environment. Wherein, the vacuum numerical reading is normal, which refers to the reading in the normal working state relative to the main chamber 10 or the barrel chamber 20 of the vacuum gauge system. Abnormal vacuum readings refer to readings in abnormal operating conditions with respect to the main chamber 10 or barrel chamber 20 of the vacuum gauge system. When one vacuum gauge 70 reads the vacuum value normally and the other vacuum gauge 70 reads the vacuum value abnormally, it can be judged that the main chamber 10 is in the normal operation environment, and one vacuum gauge 70 is damaged.
Referring to fig. 1, in one embodiment, in the case that there is an abnormality in the vacuum gauge 70 reading vacuum value in the main chamber 10 or the barrel chamber 20, the faulty vacuum gauge 70 may be replaced. The valve 100 is set to be in a closed state, at this time, the vacuum gauge 70 is isolated by the valve 100, and the inside of the main chamber 10 or the inside of the barrel chamber 20 is still in a vacuum state, so that the vacuum gauge 70 isolated by the valve 100 can be replaced. Typically, one of the vacuum gauges 70 is considered to be replaced. If both vacuum gauges 70 are in normal reading after the replacement of the vacuum gauge 70, then this indicates that a repair has been made. If the reading of one vacuum gauge 70 is normal after the replacement of the vacuum gauge 70, the other vacuum gauge 70 can be replaced if the reading of the other vacuum gauge 70 is abnormal. The utility model can realize the replacement and maintenance of the damaged vacuum gauge 70 without stopping the vacuum machine, can improve the detection precision of the vacuum degree in the semiconductor vacuum machine, and can increase the production efficiency of the vacuum machine.
Referring to fig. 1, in one embodiment, the present utility model provides a semiconductor device that may include a main chamber 10, a barrel chamber 20, an electron gun chamber 30, and a vacuum gauge system. Wherein the main chamber 10 may be connected with the barrel chamber 20, and the barrel chamber 20 may be located between the main chamber 10 and the electron gun chamber 30. The electron gun chamber 30 may be connected to the barrel chamber 20, and the electron beam emitted from the electron gun chamber 30 is irradiated onto the wafer 110 inside the main chamber 10 after being processed by the barrel chamber 20. For example, the electron beam emitted from the electron gun chamber 30 is directed in the vertical direction, and is processed by the barrel chamber 20, and then irradiated onto the wafer 110 inside the main chamber 10. Specifically, the electron gun 31 in the electron gun chamber 30 is for emitting an electron beam, and an angular shift may occur after the electron beam is emitted from the electron gun chamber 30. In the main chamber 10, in order to realize the electron beam vertical irradiation of the wafer 110, a barrel chamber 20 may be provided between the electron gun chamber 30 and the main chamber 10. The barrel chamber 20 may change the trajectory of the electron beam emitted from the electron gun chamber 30 so that the electron beam in the main chamber 10 can vertically irradiate the surface of the wafer 110 to perform the inspection of the wafer 110.
Referring to fig. 1, in one embodiment, the main chamber 10 and the barrel chamber 20 are both provided with a vacuum pump 80, and the vacuum pump 80 can realize a vacuum pumping state of the main chamber 10 and the barrel chamber 20. On the side wall of the main chamber 10, two vacuum gauges 70 may be located at the same side position of the vacuum pump 80. On the side wall of the barrel portion chamber 20, two vacuum gauges 70 may be located at both side positions of the vacuum pump 80, i.e., one vacuum gauge 70 is located at one side position of the vacuum pump 80 and the other vacuum gauge 70 may be located at the other side position of the vacuum pump 80.
Referring to fig. 1, in one embodiment, a semiconductor apparatus may further comprise a wafer handling chamber 40, a wafer loading body 50. The wafer handling chamber 40 is connected to the main chamber 10, for example, the wafer handling chamber (handler) 40 may be located at a side position of the main chamber 10. A wafer loading body (L/P) 50 may be coupled to the wafer handling chamber 40. The wafer handling chamber 40 may be positioned between the main chamber 10 and the wafer loading body 50. The wafer loading body 50 may be used as a window for ingress and egress of wafers 110. The bottom of the wafer loading body 50, the bottom of the wafer handling chamber 40, and the bottom of the main chamber 10 may be on the same plane, and the wafer 110 may be transferred into the main chamber 10 through the wafer loading body 50, the wafer handling chamber 40, and waiting for subsequent inspection. The semiconductor device may further include a Fan Filter Unit (FFU) 60, and the Fan Filter 60 may be connected to the wafer handling chamber 40. The fan filter 60 is a modular terminal blower with filtering efficiency. The blower filter 60 may be installed at a side of the wafer handling chamber 40 near the electron gun chamber 30.
Referring to fig. 2, in one embodiment, the present invention provides a semiconductor device that may include a main chamber 10, a barrel chamber 20, an electron gun chamber 30, a wafer handling chamber 40, a wafer loading body 50, a blower filter 60, a vacuum gauge 70, and a vacuum pump 80. Compared with the technical solution in fig. 1, the semiconductor device in fig. 2 does not include the isolation box 90 and the valve 100, so the semiconductor device in fig. 2 can improve the fault tolerance of the vacuum degree detection in the vacuum chamber, but does not have the convenience of replacing the vacuum gauge 70.
In summary, the present utility model provides a semiconductor vacuum gauge system and a semiconductor device using the same, wherein at least two vacuum gauges are disposed in a vacuum chamber, and when one vacuum gauge is damaged, the vacuum degree in the vacuum chamber can be detected by the other vacuum gauge. The utility model can improve the detection precision of the semiconductor equipment and increase the production efficiency of the semiconductor equipment. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A semiconductor vacuum gauge system, comprising:
at least two vacuum gauges mounted on a sidewall of the vacuum chamber;
The isolation boxes are positioned in the vacuum chambers, and one end of each vacuum gauge is positioned in each isolation box; and
And the valve is arranged on the outer wall of the isolation box.
2. The semiconductor vacuum gauge system of claim 1, wherein the vacuum chamber comprises a main chamber and a barrel chamber, the main chamber and the barrel chamber being connected, at least two of the vacuum gauges being mounted within the main chamber, at least two of the vacuum gauges being mounted within the barrel chamber.
3. The semiconductor vacuum gauge system according to claim 2, wherein a vacuum pump is mounted to a side wall of the barrel chamber and a side wall of the main chamber.
4. A semiconductor vacuum gauge system according to claim 3, wherein at least two of said vacuum gauges are mounted within said main chamber at a location on one side of said vacuum pump.
5. A semiconductor vacuum gauge system according to claim 3, wherein at least two of said vacuum gauges are mounted in said barrel section chamber at respective side positions of said vacuum pump.
6. A semiconductor device, characterized by comprising:
A main chamber;
A lens barrel chamber connected to the main chamber;
An electron gun chamber connected to the barrel chamber; and
The electron beam emitted by the electron gun chamber is irradiated onto a wafer in the main chamber after being processed by the lens barrel chamber;
a vacuum gauge system disposed within the main chamber, the vacuum gauge system comprising:
At least two vacuum gauges mounted on a sidewall of the main chamber;
An isolation box located in the main chamber, one end of each vacuum gauge being located in the isolation box; and
And the valve is arranged on the outer wall of the isolation box.
7. The semiconductor device according to claim 6, wherein the semiconductor device further comprises:
The wafer carrying chamber is connected with the main chamber and is positioned at one side of the main chamber; and
And the wafer loading main body is connected with the wafer carrying chamber, the wafer carrying chamber is positioned between the main chamber and the wafer loading main body, and the wafer is conveyed into the main chamber through the wafer loading main body and the wafer carrying chamber.
8. The semiconductor apparatus of claim 7, wherein a bottom of the main chamber, a bottom of the wafer handling chamber, and a bottom of the wafer loading body are located on a same plane.
9. The semiconductor apparatus according to claim 6, wherein the electron beam emitted from the electron gun chamber is directed in a vertical direction and is irradiated onto the wafer inside the main chamber after being processed by the barrel chamber.
10. The semiconductor device of claim 7, further comprising a blower filter coupled to the wafer handling chamber, the blower filter being located on a side of the wafer handling chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322806228.7U CN221037801U (en) | 2023-10-18 | 2023-10-18 | Semiconductor vacuum gauge system and semiconductor device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322806228.7U CN221037801U (en) | 2023-10-18 | 2023-10-18 | Semiconductor vacuum gauge system and semiconductor device using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221037801U true CN221037801U (en) | 2024-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322806228.7U Active CN221037801U (en) | 2023-10-18 | 2023-10-18 | Semiconductor vacuum gauge system and semiconductor device using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221037801U (en) |
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2023
- 2023-10-18 CN CN202322806228.7U patent/CN221037801U/en active Active
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