KR20140037428A - Transfer robot inspection method of apparatus for processing substrate - Google Patents

Transfer robot inspection method of apparatus for processing substrate Download PDF

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Publication number
KR20140037428A
KR20140037428A KR1020120103332A KR20120103332A KR20140037428A KR 20140037428 A KR20140037428 A KR 20140037428A KR 1020120103332 A KR1020120103332 A KR 1020120103332A KR 20120103332 A KR20120103332 A KR 20120103332A KR 20140037428 A KR20140037428 A KR 20140037428A
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KR
South Korea
Prior art keywords
robot
test
substrate
processing apparatus
substrate processing
Prior art date
Application number
KR1020120103332A
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Korean (ko)
Inventor
임성민
정영훈
Original Assignee
세메스 주식회사
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Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020120103332A priority Critical patent/KR20140037428A/en
Publication of KR20140037428A publication Critical patent/KR20140037428A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0095—Means or methods for testing manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1674—Programme controls characterised by safety, monitoring, diagnostic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A method of inspecting a transport robot of a substrate processing apparatus of the present invention comprises: setting a test operation parameter of the transport robot; Setting an operation criterion of a test operation parameter; And a step of checking a malfunction or a failure of the robot by operating the carrier robot in accordance with the test operation parameter if the process is in progress in the substrate processing apparatus or even if the idle time satisfies the operation criterion.

Description

[0001] The present invention relates to a transfer robot inspection method for a substrate processing apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a method of inspecting a carrying robot of a substrate processing apparatus.

BACKGROUND ART [0002] In recent semiconductor manufacturing facilities, a plurality of chamber stations for each unit process are integrated. In particular, semiconductor manufacturers and equipment manufacturers introduced integrated clustering tools or inline facilities to efficiently handle unit processes in order to maintain competitiveness, increase wafer flexibility, increase flexibility for production of multiple products, and shorten manufacturing time. .

Such a semiconductor manufacturing facility is provided with a plurality of transport robots for transporting a substrate, and checking for malfunctions (malfunctions and faults) with respect to these transport robots is checked by manual or aging in a state where the equipment is down .

As described above, in order to carry out the inspection process for the transport robot, the FOUP for testing is loaded on the load port every time, and the user must manually set the process process for the inspection process. At this time, if all of the load ports of the substrate processing apparatus are in operation, the operation of the substrate processing apparatus must be stopped in order to load the test loader. do.

Embodiments of the present invention are to provide a method of inspecting a carrying robot of a substrate processing apparatus which can minimize a decrease in facility operation rate due to an inspecting process of a carrying robot.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of controlling a transfer robot, comprising: setting a test operation parameter of the transfer robot; Setting an operation criterion of the test operation parameter; And a step of operating the carrying robot in accordance with the test operation parameter to check for malfunction or failure of the robot when the process is in progress or the idle time satisfies the operation criterion in the substrate processing apparatus. An inspection method can be provided.

In addition, the operation reference includes a case where the predetermined time or the idle time is greater than the operation time of the test operation parameter, and the transport robot operates using the test substrate previously loaded on the substrate processing apparatus.

According to the present invention, the conveying robot can be checked during the equipment idle time or the process progress to prevent the accident caused by the defect of the conveying robot, thereby preventing the facility operation rate from being lowered and the substrate breakage accident being prevented in advance.

According to the present invention, it is possible to determine the abnormality of the conveying robot at a certain point in time during the process or the idle time, thereby shortening the maintenance time and improving the productivity.

According to the present invention, it is possible to promptly check whether there is an abnormality in the transport robot by using the test substrate that has been loaded in advance in the inspection process of the transport robot.

1 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2 is a flowchart for explaining a method of inspecting a carrying robot using the substrate processing apparatus of Fig. 1;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following, the wafer is described as an example of the substrate, but the technical idea and scope of the present invention are not limited thereto.

1, the substrate processing apparatus 100 includes an index 110, a load lock chamber 120, a carry section 130, four process chambers 150 connected to the carry section 130, (20), and a controller (200).

The index 110 is disposed in front of the substrate processing apparatus 100. The index 110 may be an interface called an equipment front end module (EFEM), which is frequently used in recent 300 mm wafer transfer apparatuses. The index 110 includes a load port 114 for opening and closing the cover of the storage container 10 on which the storage container 10 on which the substrates are mounted is placed and an atmospheric transfer robot 116 operated at atmospheric pressure.

A plurality of load ports 114 may be provided, and each of the storage containers 10 is loaded in the load port 114. As an example, the plurality of load ports 114 may include a first load port 114a to a third load port 114c. The index 110 conveys the unprocessed substrates stored in the load port 114 while the storage container 10 and the test storage container 20 are loaded or proceeds to store the processed substrates.

The storage container 10 is a carrier for a general lot for production and is seated on the load port by means of a logistics automation device (for example, OHT, AGV, RGV). A plurality of storage containers may be provided, each of which houses a plurality of substrates. A plurality of substrates can be stacked in a vertical direction in the storage container. To this end, a plurality of slots (or supports) for accommodating a plurality of substrates are vertically arranged in the storage container. For example, a typical example of a storage container is a front open unified pod (FOUP; aka carrier).

The test storage container 20 accommodates test substrates and can be loaded into at least one of the three load ports. The test storage container 20 can be provided at various positions of the substrate processing apparatus 100. [ In the first embodiment, the test container 20 is loaded in the third load port 114c.

The atmospheric conveying robot 116 is operable to convey the substrate between the load port 114 and the load lock chamber 120. The atmospheric pressure conveying robot 116 takes out a single substrate in a single operation from the storage container 10 placed in the load port 114 and the test storage container 20 to bring it into the cassette 122 of the load lock chamber 120 And a robot having a single arm structure that can be used. The atmospheric conveying robot 116 installed in the index 110 may use various robots used in a conventional semiconductor manufacturing process in addition to the single arm structure shown in this embodiment. For example, a robot having an arm of a double blade structure capable of handling two substrates as one arm, a robot having two or more arms, or a robot employing them in combination can be used.

It is preferable that the test substrate is used for the inspection process of the atmospheric conveying robot 116 and the test container 20 is loaded on the load port having the lowest priority. However, the test container 20 may be provided on the side of the index, not the load port.

The load lock chamber 120 is connected to the index 110 by one gate valve 180 and the other is connected to the first transfer chamber 132a of the carry section 130 by the other gate valve 180 . The load lock chamber 120 forms a vacuum atmosphere which is the same as (close to) the first transfer chamber 132a at the time when the transfer robot 140 of the first transfer chamber 132a loads or unloads the substrate, 110 to the index 110 or to transfer the already processed substrate to the index 110, it is switched to the atmospheric pressure state. That is, the load lock chamber 120 maintains the pressure while crossing the vacuum state and the atmospheric pressure state in order to prevent the atmospheric pressure state of the first transfer chamber 132a from being changed. The load lock chamber 120 has a cassette on which the substrates temporarily wait.

In the present embodiment, the first transfer chamber 132a and the second transfer chamber 132b are arranged in series with each other. The structure will be described as an example. Each of the first transfer chamber 132a and the second transfer chamber 132b is provided with a vacuum transfer robot 140 necessary for transferring a substrate and two process chambers 150 are connected to both sides of the transfer chamber via a gate valve 180 . Since transferring (transfer) of the substrate between the vacuum transfer robot 140 is not performed directly between the first transfer chamber 132a and the second transfer chamber 132b, the first transfer chamber 132a, And two buffer stages 142 and 144 are provided. Any one of the first and second buffer stages 142 and 144 may be loaded with a test substrate. The test substrate loaded on the buffer stage can be used in the inspection process of the vacuum transport robot 140.

Each of the process chambers 150 is a chamber for performing a process process on the substrate. For example, each process chamber 150 can process a substrate using a process liquid. At this time, in each of the process chambers 150, generally, cleaning and drying are performed before and after the process, and cleaning is carried out to remove contaminants on the surface of the substrate. In addition, the process chambers 150 may be configured to sequentially perform the substrate processing process. The process chamber 150 is composed of the second to fourth process chambers.

The controller 200 may be implemented as a CATIA Data Management (CDM) system, a personal computer, or a workstation, for example, to sequentially process the substrates stored in the plurality of storage containers 10, (100).

The controller 200 is connected to the index 110, the transfer unit 130 and the process chamber 150 and controls operations of the index 110, the transfer unit 130, the process chamber 150, , Recovery and transfer, and controls the operation of the process chambers 150 to perform the substrate processing process.

In addition, the controller 200 sets and stores a plurality of parameters for driving the atmospheric pressure conveying robot 116 and the vacuum conveying robot 140 so as to proceed with the substrate processing process. The controller 200 sets and stores test operation parameters for checking the abnormality of the atmospheric conveying robot 116 and the vacuum conveying robot 140 (inspection process), and sets the operation criteria of the test operation parameters do. The controller 200 can check the operation of the carrying robot by the test operation parameters to verify the abnormality. The test operation parameters may include the position, operation, time, and the number of repetition of the transport robot for abnormality check.

Here, the operation criterion may include an idle time point and a specific time point. The idle time point performs the operation of the transport robot by the test operation parameter when the idle time during which the operation is stopped for a predetermined time is greater than the operation time of the transport robot by the test operation parameter. Particularly, during the idle time point, the process is continuously performed on the substrates, the operation is stopped for a predetermined time due to the equipment inspection performed on a regular basis, the inspection due to the sudden abnormality occurrence, Chamber down), the idle time is determined and the inspection process of the transport robot is automatically performed by the test operation parameter.

The specific time is set to a specific time in 24 hours, and the inspection process of the carrying robot by the test operation parameter is performed at that time. For example, a specific time point can be set to a point at which the work amount is temporarily reduced, such as an alternate shift time of the worker.

Fig. 2 is a flowchart for explaining a method of inspecting a carrying robot using the substrate processing apparatus of Fig. 1;

Referring to FIG. 2, the inspection method of the transport robot includes steps of setting a test operation parameter s110, an operation reference setting step s120, a process step s130, an operation criterion step s140, s150).

The test operation parameter setting step (s110) sets the parameters including the position, operation, time, and the number of repetitions for checking the abnormality of the carrying robot. These test operation parameters are set and stored by the controller.

The operation reference setting step s120 sets a criterion for determining whether or not to perform the operation of the transport robot set in the test operation parameter, and the operation criterion is set and stored by the controller 200. [ The operating criteria may include an idle time point and a specific time point. The idle time point performs the operation of the transport robot by the test operation parameter when the idle time during which the operation is stopped for a predetermined time is greater than the operation time of the transport robot by the test operation parameter. In addition, a specific time point is set at a time point at which the work amount is temporarily reduced, such as the time when the worker alternates in 24 hours, and the operation of the transfer robot is performed by the test operation parameter.

In the processing step s130, the processing steps are sequentially performed with respect to the substrates. If the operation standard is satisfied in the processing step, the carrying robot inspection step is performed by the test operation parameters (s140 to s150).

In the conveying robot inspecting step, the atmospheric conveying robot carries out the inspecting process by pulling out the test board from the test receptacle 20 seated on the load port, and the vacuum conveying robot is moved to any one of the first and second buffer stages 142 and 144 The test substrate is taken out and the inspection process is performed. At this time, it is easy to verify whether there is an abnormality in the transport robot by setting the test substrate to be used always to use the test substrate located in the same slot.

The controller 200 can check the operation of the carrying robot by the test operation parameters to verify the abnormality.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. It will be possible.

110: index 120: load lock chamber
130: Carrier section 150: Process chamber
200: controller

Claims (2)

A method for inspecting a carrying robot of a substrate processing apparatus, comprising:
Setting a test operation parameter of the transport robot;
Setting an operation criterion of the test operation parameter; And
And a step of checking the malfunction or failure of the robot by operating the carrying robot in accordance with the test operation parameter if the operation standard is met even if the process is in progress or idle time in the substrate processing apparatus Way. The method according to claim 1,
The operating criteria
Wherein the predetermined time or the idle time is greater than the operation time of the test operation parameter,
Wherein the transport robot operates using a test substrate previously loaded on the substrate processing apparatus.
KR1020120103332A 2012-09-18 2012-09-18 Transfer robot inspection method of apparatus for processing substrate KR20140037428A (en)

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KR1020120103332A KR20140037428A (en) 2012-09-18 2012-09-18 Transfer robot inspection method of apparatus for processing substrate

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Application Number Priority Date Filing Date Title
KR1020120103332A KR20140037428A (en) 2012-09-18 2012-09-18 Transfer robot inspection method of apparatus for processing substrate

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KR20140037428A true KR20140037428A (en) 2014-03-27

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160053341A (en) * 2014-11-03 2016-05-13 세메스 주식회사 Method and apparatus for treating substrate
CN105922287A (en) * 2016-05-27 2016-09-07 中国电力科学研究院 Movement function experimental method of substation intelligent patrol robots
CN107515605A (en) * 2017-07-12 2017-12-26 上海斐讯数据通信技术有限公司 A kind of AGV dolly navigation methods and systems based on ultrasonic ranging
WO2020029727A1 (en) * 2018-08-08 2020-02-13 上海交通大学 Fault monitoring and diagnosis system for port freight electric agv

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160053341A (en) * 2014-11-03 2016-05-13 세메스 주식회사 Method and apparatus for treating substrate
CN105922287A (en) * 2016-05-27 2016-09-07 中国电力科学研究院 Movement function experimental method of substation intelligent patrol robots
CN107515605A (en) * 2017-07-12 2017-12-26 上海斐讯数据通信技术有限公司 A kind of AGV dolly navigation methods and systems based on ultrasonic ranging
CN107515605B (en) * 2017-07-12 2020-12-18 台州智奥通信设备有限公司 AGV (automatic guided vehicle) navigation method and system based on ultrasonic ranging
WO2020029727A1 (en) * 2018-08-08 2020-02-13 上海交通大学 Fault monitoring and diagnosis system for port freight electric agv

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