KR20060127663A - Robot arm with particle detecting sensor in semiconductor equipment - Google Patents

Robot arm with particle detecting sensor in semiconductor equipment Download PDF

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Publication number
KR20060127663A
KR20060127663A KR1020050048908A KR20050048908A KR20060127663A KR 20060127663 A KR20060127663 A KR 20060127663A KR 1020050048908 A KR1020050048908 A KR 1020050048908A KR 20050048908 A KR20050048908 A KR 20050048908A KR 20060127663 A KR20060127663 A KR 20060127663A
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South Korea
Prior art keywords
robot arm
pork
laser diode
arm
wafer
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KR1020050048908A
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Korean (ko)
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홍성웅
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삼성전자주식회사
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Priority to KR1020050048908A priority Critical patent/KR20060127663A/en
Publication of KR20060127663A publication Critical patent/KR20060127663A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Abstract

A robot arm having a particle sensor of a semiconductor device is provided to improve a yield of a wafer by preventing defects of a process. An arm(11) has a predetermined length. A pork(12) is installed at an end of the arm. The pork directly contacts with a wafer. The pork includes one side pork(13) and another side pork(14), which are spaced apart from each other. A particle sensor is installed at an end of the pork. A laser diode(15) is installed at the one side pork as a light emitting device. A beam stop(16) is installed at the another side pork and receives a laser beam emitted by the laser diode. A beam detector(17) is installed between the laser diode and the beam stop. When the laser beam irradiated by the laser diode is refracted by particles in air, the beam detector absorbs the refracted laser beam to calculate an amount of light.

Description

반도체 설비의 파티클 센서를 갖는 로봇암{ROBOT ARM WITH PARTICLE DETECTING SENSOR IN SEMICONDUCTOR EQUIPMENT}ROBOT ARM WITH PARTICLE DETECTING SENSOR IN SEMICONDUCTOR EQUIPMENT}

도 1은 본 발명에 따른 반도체 설비의 구성도;1 is a block diagram of a semiconductor facility in accordance with the present invention;

도 2는 본 발명에 따른 트랜스퍼 모듈의 로봇암의 구성을 도시한 도면.2 is a view showing the configuration of a robot arm of the transfer module according to the present invention.

본 발명은 반도체 설비의 트랜스퍼 모듈(transfer module)에 관한 것으로서, 특히 웨이퍼(wafer)를 이재시키기 위한 로봇암(robot arm)의 단부에 파티클 센서(particle sensor)를 설치하여 설비 주변의 고청정 환경 조성에 기여할 수 있도록 구성되는 반도체 설비의 파티클 센서를 갖는 로봇암에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer module of a semiconductor facility. Particularly, a particle sensor is installed at an end of a robot arm for transferring a wafer to create a high clean environment around the facility. A robotic arm having a particle sensor of a semiconductor facility configured to contribute to the present invention.

통상적으로, 반도체 설비는 다수의 챔버를 포함하고 있다. 예를 들어, 웨이퍼와 같은 피처리물에 일정 두께의 막을 형성하거나 이온등을 주입하기 위한 공정 챔버(process chamber)와, 상기 공정 챔버 내부로 웨이퍼를 이송하기 위하여 상기 트랜스퍼 챔버의 주변에 설치되는 이재 로봇을 포함하는 트랜스퍼 챔버(transfer chamber), 상기 트랜스퍼 챔버를 통하여 웨이퍼를 이송하기 전에 공정 챔버의 분위기로 예비 분위기 형성을 위한 로드락 챔버, 공정 후에 잔존하는 부산물을 제거하기 위하여 일정 온도하에서 일정 시간 동안 웨이퍼를 보관하는 사이드 스토리지(sides storage)등을 포함한다. 상술한 챔버들은 통상적으로 서로 연동되도록 가깝게 설치되어 있으며, 웨이퍼는 로드락 챔버에서 트랜스퍼 챔버를 통하여 공정 챔버에서 공정을 수행하고 사이드 스토리지로 순차적으로 이송되도록 구성되어 있다.Typically, semiconductor equipment includes a number of chambers. For example, a process chamber for forming a film of a predetermined thickness or implanting ions or the like into a workpiece such as a wafer, and a transfer material installed around the transfer chamber to transfer the wafer into the process chamber. Transfer chamber including a robot, a load lock chamber for forming a preliminary atmosphere into the atmosphere of the process chamber before transferring the wafer through the transfer chamber, for a predetermined time under a certain temperature to remove the by-products remaining after the process Side storage for storing wafers and the like. The above-mentioned chambers are typically installed in close proximity to each other, and the wafer is configured to perform a process in a process chamber through a transfer chamber in a load lock chamber and sequentially transfer to side storage.

한편, 상술한 바와 같이 구성되는 각 설비들간의 웨이퍼를 이송시키기 위한 트랜스퍼 모듈(transfer module)은 소정의 구동 모터에 의해 일정 방향으로 유동할 수 있는 다관절 로봇암(robot)를 포함하고 있다. 따라서, 상기 로봇암이 각 챔버간을 이동하면서 웨이퍼를 공정챔버, 로드락 챔버등으로 로딩 또는 언로딩시키게 되는 것이다.On the other hand, the transfer module (transfer module) for transferring the wafer between the respective devices configured as described above includes a multi-joint robot arm that can flow in a predetermined direction by a predetermined drive motor. Therefore, the robot arm moves between each chamber to load or unload the wafer into the process chamber, the load lock chamber, and the like.

그러나 상술한 바와 같이, 종래의 로봇암은 반도체 설비에서 가장 많이 유동하기 때문에 파티클이 발생할 여지가 많음에도 불구하고, 단순히 웨이퍼를 이송시키는 역할만 할 뿐, 여타 기능, 특히 파티클을 감지하기 위한 기능은 전무하다 할 것이다. However, as described above, despite the fact that the conventional robot arm flows the most in the semiconductor equipment, there is much room for particles to be generated. Will do nothing.

상기와 같은 문제점을 해결하기 위하여 안출된 것으로써 본 발명의 목적은 로봇암의 단부에 파티클 센서를 설치하여 로봇암의 이송중 또는 로봇암이 위치된 곳에서의 파티클 정도를 측정하여 공정 불량에 따른 사고를 미연에 방지할 수 있도 록 구성되는 반도체 설비의 파티클 센서를 갖는 로봇암을 제공하는데 있다.In order to solve the above problems, an object of the present invention is to install a particle sensor at the end of the robot arm to measure the degree of particles during the robot arm transfer or where the robot arm is located according to the process failure The present invention provides a robot arm having a particle sensor of a semiconductor device configured to prevent an accident in advance.

본 발명의 다른 목적은 반도체 설비 중 가장 파티클 발생 여지가 큰 로봇암의 단부에 파티클 센서를 부착하여 고청정 환경하에서 공정을 수행하도록 구성되는 반도체 설비의 파티클 센서를 갖는 로봇암을 제공하는데 있다.It is another object of the present invention to provide a robot arm having a particle sensor of a semiconductor facility configured to attach a particle sensor to an end of the robot arm having the greatest particle generation potential in a semiconductor facility to perform a process in a high clean environment.

본 발명의 다른 목적은 별도의 파티클 측정을 위한 장비를 사용하여 정기적으로 검사를 하지 않더라도 수시로 설비의 파티클 정도를 모니터링할 수 있도록 구성되는 반도체 설비의 파티클 센서를 갖는 로봇암을 제공하는데 있다.Another object of the present invention is to provide a robot arm having a particle sensor of a semiconductor device configured to monitor the particle degree of the facility from time to time, even if not regularly inspected using equipment for separate particle measurement.

상술한 바와 같은 목적을 해결하기 위하여 안출된 것으로서, 본 발명은 웨이퍼 이송을 위하여 암(arm)의 단부에 두 개의 갈라진 포크를 갖는 반도체 설비의 트랜스퍼 모듈의 로봇암에 있어서, 상기 로봇암의 포크 중 어느 한 곳에 레이저 다이오드를 설치하고, 나머지 포크의 상기 레이저 다이오드와 대향되는 부분에 빔 스톱을 설치하여 상기 레이저 다이오드에서 조사된 레이저 빔이 상기 빔 스톱에 수광되도록 함을 특징으로 한다.In order to solve the above object, the present invention is a robot arm of a transfer module of a semiconductor device having two forks at the end of the arm (arm) for wafer transfer, of the fork of the robot arm The laser diode may be installed at one place, and a beam stop may be installed at a portion of the remaining fork opposite to the laser diode so that the laser beam irradiated from the laser diode is received at the beam stop.

이하 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다. 그리고, 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the case where it is determined that the gist of the present invention may be unnecessarily obscured, the detailed description thereof will be omitted.

도 1은 본 발명에 따른 반도체 설비의 구성도로써, 반도체 증착 설비를 도시하고 있다. 그러나 이에 국한되지 않으며, 트랜스퍼 모듈이 사용되는 각종 반도체 설비에 모두 적용 가능할 것이다.1 is a schematic diagram of a semiconductor installation according to the present invention, which illustrates a semiconductor deposition facility. However, the present invention is not limited thereto, and it may be applicable to all kinds of semiconductor facilities in which a transfer module is used.

도 1에 도시한 바와 같이, 반도체 설비는 다수의 공정 챔버(121, 122, 123)와 상기 공정 챔버(121, 122, 123) 주변에 설치되는 트랜스퍼 챔버(110)와 로드락 챔버(130) 및 사이드 스토리지(150)를 포함한다.As shown in FIG. 1, the semiconductor facility includes a plurality of process chambers 121, 122, and 123, a transfer chamber 110 and a load lock chamber 130 installed around the process chambers 121, 122, and 123. Side storage 150.

상기 공정 챔버(121, 122, 123)는 도면에 도시한 바와 같이 3개가 설치되어 있으나, 이에 국한되지 않으며, 공간이 허여되고 필요시 그 이상 설치되어도 무방할 것이다. 상기 트랜스퍼 챔버(110)는 공정 챔버내에 피처리물인 웨이퍼를 로딩 또는 언로딩하기 위한 로봇암(도 2의 10)을 갖는 트랜스퍼 모듈(131)을 포함할 것이다. 예를 들어, 상기 로봇암(10)은 로드락 챔버(130)내의 웨이퍼를 공정 챔버(121, 122, 123)로 이송하거나, 공정후 공정 챔버내의 웨이퍼를 사이드 스토리지(150)로 이송하게 될 것이다.Three process chambers 121, 122, and 123 are provided as shown in the drawings, but the present invention is not limited thereto, and the process chambers 121, 122, and 123 may be installed more than necessary. The transfer chamber 110 may include a transfer module 131 having a robot arm (10 in FIG. 2) for loading or unloading a wafer to be processed into a process chamber. For example, the robot arm 10 may transfer the wafer in the load lock chamber 130 to the process chambers 121, 122, and 123, or transfer the wafer in the process chamber to the side storage 150 after the process. .

도 2는 본 발명에 따른 트랜스퍼 모듈의 로봇암의 구성을 도시한 도면으로써, 로봇암(10)은 일정 길이의 암(arm)(11)과, 암(11)의 단부에 설치되어 직접 웨이퍼와 접촉되는 포크(12)를 포함한다. 상기 포크(12)는 두갈래로 갈라져서 형성되어 있으며, 상기 일측 포크(13)와 타측 포크(14)는 일정 거리 D를 갖는다.2 is a view showing the configuration of the robot arm of the transfer module according to the present invention, the robot arm 10 is a arm (11) of a predetermined length (arm), the end of the arm (11) is installed directly on the wafer and A fork 12 in contact. The fork 12 is divided into two, and the one fork 13 and the other fork 14 have a predetermined distance D.

도 2에 도시한 바와 같이, 본 발명에 따른 파티클 감지 센서가 상기 포크의 단부에 설치된다. 즉, 상기 포크(12) 중 일측 포크(13)에 발광 소자로써 레이저 다이오드(laser diode)(15)가 설치될 것이며, 타측 포크(14)에 상기 레이저 다이오드(15)에서 발광된 레이저 빔을 수광할 수 있는 빔 스톱(beam stop)(16)이 설치될 것이다. 따라서, 상기 레이저 다이오드(15)와 빔 스톱(16)은 상기 포크(12)에서 일직 선상으로 대향되게 설치하는 것이 바람직할 것이다. 또한, 상기 레이저 다이오드(15)와 빔 스톱(16)의 사이에는 소정의 빔 디텍터(beam detector)(17)가 설치되는데, 상기 레이저 다이오드(15)에서 조사된 레이저 빔이 공기중의 파티클에 의해 굴절되었을 경우 이를 흡수하여 광량을 산출하기 위함이다. 따라서, 산출된 광량을 근거하여 공기중의 파티클 수를 측정할 수 있으며, 이로 인하여 파티클의 과다 현상에 의한 공정 불량을 미연에 방지할 수 있을 것이다.As shown in Figure 2, the particle detection sensor according to the present invention is installed at the end of the fork. That is, a laser diode 15 may be installed as a light emitting element in one fork 13 of the forks 12, and the laser beam emitted from the laser diode 15 may be received by the other fork 14. A beam stop 16 may be installed that can. Accordingly, the laser diode 15 and the beam stop 16 may be installed to face the straight line in the fork 12. In addition, a predetermined beam detector 17 is installed between the laser diode 15 and the beam stop 16. The laser beam irradiated from the laser diode 15 is caused by particles in the air. This is to calculate the amount of light by absorbing it when it is refracted. Therefore, the number of particles in the air can be measured based on the calculated amount of light, thereby preventing the process defect due to the excessive phenomenon of particles.

분명히, 청구항들의 범위내에 있으면서 이러한 실시예들을 변형할 수 있는 많은 방식들이 있다. 다시 말하면, 이하 청구항들의 범위를 벗어남 없이 본 발명을 실시할 수 있는 많은 다른 방식들이 있을 수 있는 것이다.Apparently, there are many ways to modify these embodiments while remaining within the scope of the claims. In other words, there may be many other ways in which the invention may be practiced without departing from the scope of the following claims.

본 발명은 반도체 설비 중 가장 많이 외부에서 유동하는 로봇암의 단부에 파티클 센서를 설치하기 때문에 공정 중 파티클 과잉 현상에 따른 공정 불량을 미연에 방지할 수 있으며, 결과적으로 웨이퍼 수율을 향상시킬 수 있는 효과가 있다.In the present invention, since the particle sensor is installed at the end of the robot arm that flows the most in the semiconductor equipment, it is possible to prevent the process defect due to the excessive particle phenomenon during the process, and as a result, the wafer yield can be improved. There is.

Claims (2)

웨이퍼 이송을 위하여 암(arm)의 단부에 두 개의 갈라진 포크를 갖는 반도체 설비의 트랜스퍼 모듈의 로봇암에 있어서,In a robot arm of a transfer module of a semiconductor installation having two forks at the end of an arm for wafer transfer, 상기 로봇암의 포크 중 어느 한 곳에 레이저 다이오드를 설치하고;Installing a laser diode at any one of the forks of the robot arm; 나머지 포크의 상기 레이저 다이오드와 대향되는 부분에 빔 스톱을 설치하여 상기 레이저 다이오드에서 조사된 레이저 빔이 상기 빔 스톱에 수광되도록 함을 특징으로 하는 반도체 설비의 파티클 센서를 갖는 로봇암.And a beam stop provided at a portion of the remaining fork opposite the laser diode so that the laser beam irradiated from the laser diode is received at the beam stop. 제 1항에 있어서,The method of claim 1, 상기 레이저 다이오드와 빔 스톱 사이의 포크가 시작되는 부분에는 파티클에 의해 굴절된 광량을 흡수할 수 있는 빔 디텍터가 더 설치됨을 특징으로 하는 반도체 설비의 파티클 센서를 갖는 로봇암.And a beam detector capable of absorbing the amount of light refracted by the particles at a portion at which the fork between the laser diode and the beam stop starts.
KR1020050048908A 2005-06-08 2005-06-08 Robot arm with particle detecting sensor in semiconductor equipment KR20060127663A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101958192B1 (en) * 2017-12-19 2019-03-18 (주)에스티글로벌 Wafer Processing Apparatus Having Particle Sensor
CN114256048A (en) * 2020-09-25 2022-03-29 中微半导体设备(上海)股份有限公司 Plasma reaction device, method and mechanical arm

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101958192B1 (en) * 2017-12-19 2019-03-18 (주)에스티글로벌 Wafer Processing Apparatus Having Particle Sensor
CN114256048A (en) * 2020-09-25 2022-03-29 中微半导体设备(上海)股份有限公司 Plasma reaction device, method and mechanical arm
CN114256048B (en) * 2020-09-25 2024-04-05 中微半导体设备(上海)股份有限公司 Plasma reaction device, method and mechanical arm

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