CN221008221U - Heat abstractor for computer information technology - Google Patents
Heat abstractor for computer information technology Download PDFInfo
- Publication number
- CN221008221U CN221008221U CN202322865275.9U CN202322865275U CN221008221U CN 221008221 U CN221008221 U CN 221008221U CN 202322865275 U CN202322865275 U CN 202322865275U CN 221008221 U CN221008221 U CN 221008221U
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- fan
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- guide seat
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- 238000005516 engineering process Methods 0.000 title claims abstract description 20
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- 230000001105 regulatory effect Effects 0.000 claims description 20
- 229920000742 Cotton Polymers 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 230000009471 action Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 206010033799 Paralysis Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipating device for computer information technology, which comprises a case, an exhaust unit, a heat dissipating unit and a refrigerating unit, wherein the exhaust unit is arranged on the case, the heat dissipating unit is arranged on the case, the refrigerating unit is arranged on the case, and the exhaust unit comprises a front heat dissipating hole, a first mounting guide seat, a filter screen, a first fan, a rear heat dissipating hole, a second mounting guide seat and a second fan. The utility model relates to the technical field of information, in particular to a heat dissipation device for computer information technology, which effectively solves the problems of low heat dissipation efficiency and easy condensate water generation of traditional computer heat dissipation equipment, achieves the aim of targeted heat dissipation of key elements by arranging a semiconductor element to dissipate heat of a CPU, achieves the effect of vacuum state in a case by arranging an exhaust assembly to form a negative pressure air channel, reduces the condensate water generation during liquid nitrogen heat dissipation, and protects the computer element.
Description
Technical Field
The utility model relates to the technical field of information, in particular to a heat dissipation device for computer information technology.
Background
In the present era electronic computer has been deep into every aspect of social life and production, the human society has been promoted to walk into informationized era, with the help of electronic computer, data updating and processing ability have also realized leapfrog development, it is well known that high temperature is the biggest enemy of integrated circuit, when the temperature of computer chip is too high, its work processing ability will receive very big influence, can even lead to paralysis of whole computer work, and the heat abstractor for computer information technology is mostly fan heat dissipation, fan heat dissipation has the limitation, the effect can't satisfy the user's demand, and adopt water-cooling and liquid nitrogen heat dissipation mode's device, can reach rapid cooling's purpose, but can make the condensate water that produces in the air adhere to computer component, shortened computer life.
Disclosure of utility model
Aiming at the situation, in order to overcome the defects of the prior art, the heat dissipation device for the computer information technology provided by the utility model effectively solves the problems of low heat dissipation efficiency and easy condensate water generation of the traditional computer heat dissipation equipment, achieves the aim of targeted heat dissipation of key elements by arranging a semiconductor element to dissipate heat of a CPU, achieves the effect of vacuum state in a case by arranging an exhaust assembly, reduces the generation of condensate water during liquid nitrogen heat dissipation, and protects the computer element.
The technical scheme adopted by the utility model is as follows: the utility model provides a heat dissipating device for computer information technology, which comprises a case, an exhaust unit, a heat dissipating unit and a refrigerating unit, wherein the exhaust unit is arranged on the case, the heat dissipating unit is arranged on the case, the refrigerating unit is arranged on the case, the exhaust unit comprises a front heat dissipating hole, a first mounting guide seat, a filter screen, a first fan, a rear heat dissipating hole, a second mounting guide seat and a second fan, the front heat dissipating hole is fixedly connected to the side part of the case, the front heat dissipating hole plays a role of ventilation, the first mounting guide seat is fixedly connected to the front heat dissipating hole, the first mounting guide seat plays a role of bearing and fixing, the filter screen is fixedly connected to the first mounting guide seat, the first fan is fixedly connected to the filter screen, the rear heat dissipating hole is fixedly connected to the side part of the case, the second mounting guide seat plays a role of bearing and fixing, and the second fan is fixedly connected to the second mounting guide seat.
Preferably, the heat dissipation unit comprises a connecting column, a third installation guide seat, a third fan, a heat conduction aluminum sheet, a semiconductor wafer and heat insulation cotton, wherein the connecting column is fixedly connected to the upper portion of the chassis, the connecting column plays a fixed role, the third installation guide seat is fixedly connected to the connecting column, the third fan is fixedly connected to the third installation guide seat, the third fan plays a heat dissipation role, the heat conduction aluminum sheet is fixedly connected to the third fan, the heat conduction aluminum sheet plays a heat conduction role, the semiconductor wafer is fixedly connected to the heat conduction aluminum sheet, the semiconductor wafer plays a cooling role, and the heat insulation cotton is fixedly connected to the semiconductor wafer.
Preferably, in order to realize quick cooling's effect, refrigeration unit includes L type pipe, temperature regulating valve, heating panel, connecting pipe and liquid nitrogen container, L type pipe fixed connection is at quick-witted case lateral part, and L type pipe has played the effect that turns to and connect, temperature regulating valve fixed connection is in L type pipe one end, and temperature regulating valve has played the effect of opening and shutting the pipeline, heating panel fixed connection is at the temperature regulating valve other end, and the heating panel has played the effect of guide, connecting pipe fixed connection is at the L type pipe other end, liquid nitrogen container fixed connection is on the connecting pipe, and liquid nitrogen container has played the effect of storing liquid nitrogen.
Further, the front radiating hole is arranged between the filter screen and the first fan, the third fan is arranged between the first fan and the second fan, the heat conducting aluminum sheet is arranged between the semiconductor wafer and the third fan, and the temperature regulating valve is arranged between the radiating plate and the L-shaped guide pipe.
Further, the first installation guide seat is parallel to the front radiating hole, the rear radiating hole is perpendicular to the third installation guide seat, the connecting column is perpendicular to the chassis, the temperature regulating valve is perpendicular to the radiating plate, the semiconductor wafer is perpendicular to the heat insulation cotton, and the fan III is perpendicular to the heat conduction aluminum sheet.
Further, the machine case is rectangular, the first installation guide seat is rectangular, the second installation guide seat is rectangular, the third installation guide seat is rectangular, the semiconductor wafer is rectangular, and the heat insulation cotton is rectangular.
For realizing the effect of whole nimble operation, preceding louvre is equipped with a set of, the filter screen is equipped with two sets of, first installation guide seat is equipped with a set of, fan one is equipped with a set of, the back louvre is equipped with three sets of, the second installation guide seat is equipped with three sets of, fan two is equipped with three sets of, the spliced pole is equipped with two sets of, the semiconductor wafer is equipped with a set of, the temperature regulating valve is equipped with a set of.
The beneficial effects obtained by the utility model by adopting the structure are as follows: the heat dissipation device for the computer information technology has the advantages that the number of the first fans in the volleyball unit is smaller than that of the second fans, the air inflow is smaller than the air displacement, so that a negative pressure air passage is formed in the chassis, the heat dissipation efficiency is improved, the generation of condensed water during liquid nitrogen heat dissipation is reduced, the safety performance of the device is improved, and the release of liquid nitrogen can be controlled by the temperature regulating valve in the refrigerating unit according to temperature change, so that the device is more convenient.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a heat dissipating device for computer information technology according to the present utility model;
Fig. 2 is an exploded view of a heat dissipating device for computer information technology according to the present utility model.
Wherein, 1, a case, 2, an exhaust unit, 3, a heat radiating unit, 4, a refrigerating unit, 5, a front heat radiating hole, 6, a first installation guide seat, 7, a filter screen, 8, a first fan, 9, a rear heat radiating hole, 10, a second installation guide seat, 11 and a second fan, 12, a connecting column, 13, a third mounting guide seat, 14, a third fan, 15, a heat conducting aluminum sheet, 16, a semiconductor wafer, 17, heat insulation cotton, 18, an L-shaped guide pipe, 19, a temperature regulating valve, 20, a heat radiating plate, 21, a connecting pipe, 22 and a liquid nitrogen tank.
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 and 2, the technical scheme adopted by the utility model is as follows: the utility model provides a heat radiator for computer information technology, which comprises a case 1, an exhaust unit 2, a heat radiating unit 3 and a refrigerating unit 4, wherein the exhaust unit 2 is arranged on the case 1, the heat radiating unit 3 is arranged on the case 1, the refrigerating unit 4 is arranged on the case 1, the exhaust unit 2 comprises a front heat radiating hole 5, a first mounting guide seat 6, a filter screen 7, a first fan 8, a rear heat radiating hole 9, a second mounting guide seat 10 and a second fan 11, the front heat radiating hole 5 is fixedly connected to the side part of the case 1, the front heat radiating hole 5 plays a role in ventilation, the first mounting guide seat 6 is fixedly connected to the front heat radiating hole 5, the first mounting guide seat 6 plays a role in bearing and fixing, the filter screen 7 is fixedly connected to the first mounting guide seat 6, the first fan 8 is fixedly connected to the filter screen 7, the rear heat radiating hole 9 is fixedly connected to the side part of the case 1, the second mounting guide seat 10 plays a role in bearing and fixing, and the second mounting guide seat 11 is fixedly connected to the second mounting guide seat 10.
As shown in fig. 1 and 2, the heat dissipation unit 3 includes a connection post 12, a third installation guide seat 13, a third fan 14, a heat conduction aluminum sheet 15, a semiconductor wafer 16 and heat insulation cotton 17, the connection post 12 is fixedly connected to the upper portion of the chassis 1, the connection post 12 plays a fixed role, the third installation guide seat 13 is fixedly connected to the connection post 12, the third fan 14 is fixedly connected to the third installation guide seat 13, the third fan 14 plays a heat dissipation role, the heat conduction aluminum sheet 15 is fixedly connected to the third fan 14, the heat conduction aluminum sheet 15 plays a heat conduction role, the semiconductor wafer 16 is fixedly connected to the heat conduction aluminum sheet 15, the semiconductor wafer 16 plays a cooling role, and the heat insulation cotton 17 is fixedly connected to the semiconductor wafer 16.
As shown in fig. 1 and 2, in order to achieve the effect of rapid cooling, the refrigeration unit 4 includes an L-shaped conduit 18, a temperature adjusting valve 19, a heat dissipation plate 20, a connecting pipe 21 and a liquid nitrogen tank 22, wherein the L-shaped conduit 18 is fixedly connected to the side of the cabinet 1, the L-shaped conduit 18 has the functions of steering and connecting, the temperature adjusting valve 19 is fixedly connected to one end of the L-shaped conduit 18, the temperature adjusting valve 19 has the function of opening and closing a pipeline, the heat dissipation plate 20 is fixedly connected to the other end of the temperature adjusting valve 19, the heat dissipation plate 20 has the function of guiding, the connecting pipe 21 is fixedly connected to the other end of the L-shaped conduit 18, the liquid nitrogen tank 22 is fixedly connected to the connecting pipe 21, and the liquid nitrogen tank 22 has the function of storing liquid nitrogen.
As shown in fig. 1 and 2, the front heat dissipation hole 5 is disposed between the filter screen 7 and the first fan 8, the third fan 14 is disposed between the first fan 8 and the second fan 11, the heat conduction aluminum sheet 15 is disposed between the semiconductor wafer 16 and the third fan 14, and the temperature regulating valve 19 is disposed between the heat dissipation plate 20 and the L-shaped duct 18.
As shown in fig. 1 and 2, the first mounting guide seat 6 is parallel to the front heat dissipation hole 5, the rear heat dissipation hole 9 is perpendicular to the third mounting guide seat 13, the connecting column 12 is perpendicular to the chassis 1, the temperature regulating valve 19 is perpendicular to the heat dissipation plate 20, the semiconductor wafer 16 is perpendicular to the heat insulation cotton 17, and the third fan 14 is perpendicular to the heat conduction aluminum sheet 15.
As shown in fig. 1 and 2, the chassis 1 is rectangular, the first mounting guide 6 is rectangular, the second mounting guide 10 is rectangular, the third mounting guide 13 is rectangular, the semiconductor wafer 16 is rectangular, and the heat insulating cotton 17 is rectangular.
As shown in fig. 1 and 2, the front heat dissipation holes 5 are provided with one group, the filter screen 7 is provided with two groups, the first mounting guide 6 is provided with one group, the first fan 8 is provided with one group, the rear heat dissipation holes 9 are provided with three groups, the second mounting guide 10 is provided with three groups, the second fan 11 is provided with three groups, the connecting column 12 is provided with two groups, the semiconductor wafer 16 is provided with one group, and the temperature regulating valve 19 is provided with one group.
When the heat radiator is specifically used, the first fan 8 and the second fan 11 are started to be emptied, the air enters the case 1 from the front heat radiation hole 5 through the filter screen 7, then the air is discharged from the rear heat radiation hole 9, the exhaust speed is higher than the air inlet speed, a negative pressure air passage is formed in the case 1, the cold surface of the semiconductor wafer 16 faces the CPU, the temperature of the cold surface can be reduced when the semiconductor wafer 16 works, the cooling of the CPU is completed, the hot surface of the semiconductor wafer is tightly attached to the heat conducting aluminum sheet 15, heat is transferred to the heat conducting aluminum sheet 15, the third fan 14 runs to transfer the heat on the heat conducting aluminum sheet 15 into the air, then the air is discharged out of the case 1 under the action of the exhaust unit 2, when the temperature is overhigh, the temperature regulating valve 19 can be opened, liquid nitrogen flows into the L-shaped guide pipe 18 from the connecting pipe 21, finally the liquid nitrogen is released from the heat radiation plate 20 in the case 1, the cooling of the environment in the case 1 is completed, when the temperature is reduced, the temperature regulating valve 19 can be closed, and the liquid nitrogen stops discharging after the temperature is reduced, so that the use of the heat radiator for the whole computer information technology.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
The utility model and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the utility model as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present utility model.
Claims (7)
1. A heat abstractor for computer information technology is characterized in that: including quick-witted case, exhaust unit, heat dissipation unit and refrigerating unit, exhaust unit sets up on the machine case, the heat dissipation unit sets up on the machine case, refrigerating unit sets up on the machine case, exhaust unit includes preceding louvre, first installation guide, filter screen, fan one, back louvre, second installation guide and fan two, preceding louvre fixed connection is on quick-witted case lateral part, first installation guide fixed connection is on preceding louvre, filter screen fixed connection is on first installation guide, fan one fixed connection is on the filter screen, back louvre fixed connection is on quick-witted case lateral part, second installation guide fixed connection is on back louvre, fan two fixed connection is on the second installation guide.
2. A heat sink for computer information technology according to claim 1, wherein: the heat dissipation unit comprises a connecting column, a third installation guide seat, a third fan, a heat conduction aluminum sheet, a semiconductor wafer and heat insulation cotton, wherein the connecting column is fixedly connected to the upper portion of the chassis, the third installation guide seat is fixedly connected to the connecting column, the third fan is fixedly connected to the third installation guide seat, the heat conduction aluminum sheet is fixedly connected to the third fan, the semiconductor wafer is fixedly connected to the heat conduction aluminum sheet, and the heat insulation cotton is fixedly connected to the semiconductor wafer.
3. A heat sink for computer information technology according to claim 2, characterized in that: the refrigerating unit comprises an L-shaped guide pipe, a temperature regulating valve, a radiating plate, a connecting pipe and a liquid nitrogen tank, wherein the L-shaped guide pipe is fixedly connected to the side part of the case, the temperature regulating valve is fixedly connected to one end of the L-shaped guide pipe, the radiating plate is fixedly connected to the other end of the temperature regulating valve, the connecting pipe is fixedly connected to the other end of the L-shaped guide pipe, and the liquid nitrogen tank is fixedly connected to the connecting pipe.
4. A heat sink for computer information technology according to claim 3, wherein: the front radiating hole is arranged between the filter screen and the first fan, the third fan is arranged between the first fan and the second fan, the heat conducting aluminum sheet is arranged between the semiconductor wafer and the third fan, and the temperature regulating valve is arranged between the radiating plate and the L-shaped guide pipe.
5. The heat dissipating double-fuselage for computer information technology of claim 4, wherein: the first installation guide seat is parallel to the front radiating hole, the rear radiating hole is perpendicular to the third installation guide seat, the connecting column is perpendicular to the chassis, the temperature regulating valve is perpendicular to the radiating plate, the semiconductor wafer is perpendicular to the heat insulation cotton, and the fan III is perpendicular to the heat conduction aluminum sheet.
6. The heat dissipating device for computer information technology of claim 5, wherein: the machine case is rectangular, the first installation guide seat is rectangular, the second installation guide seat is rectangular, the third installation guide seat is rectangular, the semiconductor wafer is rectangular, and the heat insulation cotton is rectangular.
7. The heat dissipating double-fuselage for computer information technology of claim 6, wherein: the front cooling holes are formed in a group, the filter screen is formed in a two-group mode, the first installation guide seat is formed in a group, the first fan is formed in a group, the rear cooling holes are formed in three groups, the second installation guide seat is formed in three groups, the second fan is formed in three groups, the connecting column is formed in two groups, the semiconductor wafer is formed in a group, and the temperature regulating valve is formed in a group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322865275.9U CN221008221U (en) | 2023-10-25 | 2023-10-25 | Heat abstractor for computer information technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322865275.9U CN221008221U (en) | 2023-10-25 | 2023-10-25 | Heat abstractor for computer information technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221008221U true CN221008221U (en) | 2024-05-24 |
Family
ID=91114545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322865275.9U Active CN221008221U (en) | 2023-10-25 | 2023-10-25 | Heat abstractor for computer information technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221008221U (en) |
-
2023
- 2023-10-25 CN CN202322865275.9U patent/CN221008221U/en active Active
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