CN210075895U - Cabinet composite heat management system with loop heat pipes and cross-flow fan additionally arranged on server - Google Patents

Abstract

A cabinet composite heat management system with loop heat pipes and cross-flow fans is additionally arranged on a server, and belongs to the field of efficient heat dissipation of data centers. The utility model discloses a radiating mode that loop heat pipe and cross-flow fan combine has solved the server heat accumulation problem in the computer lab. The method mainly comprises the following steps: the system comprises a first server (1-1), a first main board (2-1), a first loop heat pipe evaporation section (3-1), a first loop heat pipe steam pipeline (4-1), a first loop heat pipe liquid pipeline (5-1), a first loop heat pipe condensation section (6-1), a server cabinet (7), a slit air opening (8), a cross-flow fan (9), a first loop heat pipe heat exchanger (10-1) and the like. The utility model discloses a calorific capacity of mainboard in the loop heat pipe derives server, introduces the outside air through cross-flow fan and takes away the heat, has reduced the local focus in the server, and reinforcing heat transfer performance has improved the system security nature.

Description

Cabinet composite heat management system with loop heat pipes and cross-flow fan additionally arranged on server

Technical Field

The utility model relates to a server installs loop heat pipe and cross-flow fan's compound thermal management system of rack additional belongs to the high-efficient heat dissipation field of data center.

Background

The data center becomes an important component in national economic development, and is a main support for promoting the informatization and digitization of national science and technology industry. With the vigorous development of the communication industry in China, the electronic computers and the integration degree are higher and higher, the heat dissipation capacity of a data center cabinet is increased day by day, and local overheating is easy to generate, so that great potential safety hazards are brought, and the safety of the data center is endangered; in addition, the existing air conditioners are all machine room integral air conditioners, the problem of temperature accumulation is solved by controlling the integral temperature of the machine room, and the problem that the utilization rate of the air conditioners is not high and the energy consumption is overlarge is solved for eliminating hot spots in the server.

Aiming at the problems, the basic solution that can be adopted is to focus the processing object to a single cabinet from a machine room, and directly and accurately solve the problem of overheating of the server in the cabinet. In recent years, research on a data room air flow organization regulating and optimizing system is greatly advanced, and related technologies emerge for practical application of a data room cooling system. Patent CN201521067250 proposes a data center cabinet capable of accurately adjusting airflow organization, in which a vertical adjustable blocking cutoff guide plate is arranged below an overhead floor, but the phenomenon of uneven heat dissipation of cabinets at different positions can only be improved, and local hot spots of servers cannot be improved by penetrating into the cabinets; patent CN108571792A provides a data computer lab nature cooling system and control method thereof, and this patent is at data computer lab inside setting up cold passageway, adopts air heat exchanger to carry out parallel countercurrent flow heat transfer, though can reduce the energy consumption, still adopts traditional whole air conditioning method, equally can not solve the interior heat dissipation problem of rack high-efficiently, and its energy consumption reduction degree is also relatively limited.

Compared with the prior patent achievement, the utility model has the advantages that the loop heat pipe heat exchanger is utilized to accurately act on the server in the cabinet, the local hot spot of the main board can be effectively eliminated, and the heat exchange efficiency is improved; the cross flow fan can provide a cold source for the loop heat pipe, so that heat is effectively led out, and the heat efficiency of the device is improved.

Disclosure of Invention

The utility model aims at providing a server installs loop heat pipe and cross-flow fan's compound thermal management system of rack additional.

The cabinet composite heat management system with the loop heat pipes and the cross-flow fan additionally arranged on the server comprises a first server (1-1), a second server (1-2), a third server (1-3), a fourth server (1-4), a fifth server (1-5), a first main board (2-1), a second main board (2-2), a third main board (2-3), a fourth main board (2-4), a fifth main board (2-5), a first loop heat pipe evaporation section (3-1), a second loop heat pipe evaporation section (3-2), a third loop heat pipe evaporation section (3-3), a fourth loop heat pipe evaporation section (3-4), a fifth loop heat pipe evaporation section (3-5), a first loop heat pipe steam pipeline (4-1), a second loop heat pipe steam pipeline (4-2), A third loop heat pipe steam pipeline (4-3), a fourth loop heat pipe steam pipeline (4-4), a fifth loop heat pipe steam pipeline (4-5), a first loop heat pipe liquid pipeline (5-1), a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4), a fifth loop heat pipe liquid pipeline (5-5), a first loop heat pipe condensation section (6-1), a second loop heat pipe condensation section (6-2), a third loop heat pipe condensation section (6-3), a fourth loop heat pipe condensation section (6-4), a fifth loop heat pipe condensation section (6-5), a server cabinet (7), a slit air port (8), a cross-flow fan (9), a first loop heat pipe heat exchanger (10-1), A second loop heat pipe heat exchanger (10-2), a third loop heat pipe heat exchanger (10-3), a fourth loop heat pipe heat exchanger (10-4) and a fifth loop heat pipe heat exchanger (10-5);

wherein, a first loop heat pipe exchanger (10-1), a second loop heat pipe exchanger (10-2), a third loop heat pipe exchanger (10-3), a fourth loop heat pipe exchanger (10-4) and a fifth loop heat pipe exchanger (10-5) are respectively arranged in the first server (1-1), the second server (1-2), the third server (1-4) and the fifth server (1-5);

the server comprises a first main board (2-1), a second main board (2-2), a third main board (2-3), a fourth main board (2-4) and a fifth main board (2-5), wherein the first loop heat pipe evaporation section (3-1), the second loop heat pipe evaporation section (3-2), the third loop heat pipe evaporation section (3-3), the fourth loop heat pipe evaporation section (3-4) and the fifth loop heat pipe evaporation section (3-5) are located inside the server (1), and are respectively attached to the first main board (2-1), the second main board (2-2), the third main board (2-3), the fourth main board (2-4) and the upper surface of the fifth main board (2-5), and the first loop heat pipe evaporation section (3-1), the second loop heat pipe evaporation section (3-2), the third loop heat pipe evaporation section (3-3), Outlets of a fourth loop heat pipe evaporation section (3-4) and a fifth loop heat pipe evaporation section (3-5) are respectively connected with inlets of a first loop heat pipe steam pipeline (4-1), a second loop heat pipe steam pipeline (4-2), a third loop heat pipe steam pipeline (4-3), a fourth loop heat pipe steam pipeline (4-4) and a fifth loop heat pipe steam pipeline (4-5), outlets of the first loop heat pipe steam pipeline (4-1), the second loop heat pipe steam pipeline (4-2), the third loop heat pipe steam pipeline (4-3), the fourth loop heat pipe steam pipeline (4-4) and the fifth loop heat pipe steam pipeline (4-5) are respectively connected with a first loop condensation heat pipe section (6-1), a second loop heat pipe condensation section (6-2), Inlets of a third loop heat pipe condensation section (6-3), a fourth loop heat pipe condensation section (6-4) and a fifth loop heat pipe condensation section (6-5) are connected, outlets of the first loop heat pipe condensation section (6-1), the second loop heat pipe condensation section (6-2), the third loop heat pipe condensation section (6-3), the fourth loop heat pipe condensation section (6-4) and the fifth loop heat pipe condensation section (6-5) are respectively connected with an inlet of a first loop heat pipe liquid pipeline (5-1), a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4) and a fifth loop heat pipe liquid pipeline (5-5), and the first loop heat pipe liquid pipeline (5-1) is connected with an inlet of the first loop heat pipe liquid pipeline (5-1), Outlets of a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4) and a fifth loop heat pipe liquid pipeline (5-5) are respectively connected with inlets of a first loop heat pipe evaporation section (3-1), a second loop heat pipe evaporation section (3-2), a third loop heat pipe evaporation section (3-3), a fourth loop heat pipe evaporation section (3-4) and a fifth loop heat pipe evaporation section (3-5);

the first main plate (2-1), the first loop heat pipe evaporation section (3-1), the first loop heat pipe steam pipeline (4-1) and the front half part of the first loop heat pipe liquid pipeline (5-1) are positioned inside the first server (1-1), and the first loop heat pipe steam pipeline (4-1), the rear half part of the first loop heat pipe liquid pipeline (5-1) and the first loop heat pipe condensation section (6-1) are positioned outside the first server (1-1);

the second main plate (2-2), the second loop heat pipe evaporation section (3-2), the second loop heat pipe steam pipeline (4-2) and the front half part of the second loop heat pipe liquid pipeline (5-2) are positioned inside the second server (1-2), and the second loop heat pipe steam pipeline (4-2), the rear half part of the second loop heat pipe liquid pipeline (5-2) and the second loop heat pipe condensation section (6-2) are positioned outside the second server (1-2);

the third main plate (2-3), the third loop heat pipe evaporation section (3-3), the third loop heat pipe steam pipeline (4-3) and the first half part of the third loop heat pipe liquid pipeline (5-3) are positioned inside the third server (1-3), and the third loop heat pipe steam pipeline (4-3), the second half part of the third loop heat pipe liquid pipeline (5-3) and the third loop heat pipe condensation section (6-3) are positioned outside the third server (1-3);

the fourth main board (2-4), the fourth loop heat pipe evaporation section (3-4), the fourth loop heat pipe steam pipeline (4-4) and the front half part of the fourth loop heat pipe liquid pipeline (5-4) are positioned inside the fourth server (1-4), and the fourth loop heat pipe steam pipeline (4-4), the rear half part of the fourth loop heat pipe liquid pipeline (5-4) and the fourth loop heat pipe condensation section (6-4) are positioned outside the fourth server (1-4);

the fifth mainboard (2-5), the fifth loop heat pipe evaporation section (3-5), the fifth loop heat pipe steam pipeline (4-5) and the front half part of the fifth loop heat pipe liquid pipeline (5-5) are positioned inside the fifth server (1-5), and the fifth loop heat pipe steam pipeline (4-5), the rear half part of the fifth loop heat pipe liquid pipeline (5-5) and the fifth loop heat pipe condensation section (6-5) are positioned outside the fifth server (1-5);

the first server (1-1), the second server (1-2), the third server (1-3), the fourth server (1-4) and the fifth server (1-5) are located in a server cabinet (7), the slit air openings (8) are located in the front half portions of two side faces of the server cabinet (7), and the cross-flow fan (9) is located in front of the right side of the server cabinet (7).

When the first server (1-1) works, heat is generated on the first main board (2-1), the heat is transferred to the first loop heat pipe evaporation section (3-1) from the first main board (2-1), the working medium is evaporated on the outer surface of a capillary core of the first loop heat pipe evaporation section (3-1), the generated steam flows into the first loop heat pipe steam pipeline (4-1), passes through the first loop heat pipe condensation section (6-1), the heat is taken away by the cross-flow fan (9) in the first loop heat pipe condensation section (6-1), is condensed into liquid and is subcooled, and the capillary core of the first loop heat pipe evaporation section (3-1) is replenished with the backflow liquid through the first loop heat pipe liquid pipeline (5-1), so that a cycle is completed;

when the second server (1-2) works, heat is generated on the second main board (2-2), the heat is transferred to the second loop heat pipe evaporation section (3-2) from the second main board (2-2), the working medium is evaporated on the outer surface of a capillary core of the second loop heat pipe evaporation section (3-2), the generated steam flows into the second loop heat pipe steam pipeline (4-2), passes through the second loop heat pipe condensation section (6-2), the heat is taken away by a cross-flow fan (9) in the second loop heat pipe condensation section (6-2), the steam is condensed into liquid and is subcooled, and the capillary core of the second loop heat pipe evaporation section (3-2) is replenished with the backflow liquid through the second loop heat pipe liquid pipeline (5-2), so that a cycle is completed;

when the third server (1-3) works, heat is generated on the third main board (2-3), the heat is transferred to the third loop heat pipe evaporation section (3-3) from the third main board (2-3), the working medium is evaporated on the outer surface of a capillary core of the third loop heat pipe evaporation section (3-3), the generated steam flows into the third loop heat pipe steam pipeline (4-3), passes through the third loop heat pipe condensation section (6-3), the heat is taken away by the cross-flow fan (9) in the third loop heat pipe condensation section (6-3), is condensed into liquid and is subcooled, and the capillary core of the third loop heat pipe evaporation section (3-3) is replenished with the backflow liquid through the third loop heat pipe liquid pipeline (5-3), so that a cycle is completed;

when the fourth server (1-4) works, heat is generated on the fourth main board (2-4), the heat is transferred from the fourth main board (2-4) to the fourth loop heat pipe evaporation section (3-4), the working medium is evaporated on the outer surface of a capillary core of the fourth loop heat pipe evaporation section (3-4), the generated steam flows into the fourth loop heat pipe steam pipeline (4-4), passes through the fourth loop heat pipe condensation section (6-4), the heat is taken away by the cross-flow fan (9) at the fourth loop heat pipe condensation section (6-4), is condensed into liquid and is subcooled, and the returned liquid supplies the capillary core of the fourth loop heat pipe evaporation section (3-4) through the fourth loop heat pipe liquid pipeline (5-4) to complete a cycle;

when the fifth server (1-5) works, heat is generated on the fifth main board (2-5), the heat is transferred from the fifth main board (2-5) to the fifth loop heat pipe evaporation section (3-5), the working medium is evaporated on the outer surface of a capillary core of the fifth loop heat pipe evaporation section (3-5), the generated steam flows into the fifth loop heat pipe steam pipeline (4-5), passes through the fifth loop heat pipe condensation section (6-5), the heat is taken away by the cross-flow fan (9) at the fifth loop heat pipe condensation section (6-5), is condensed into liquid and is subcooled, and the capillary core of the fifth loop heat pipe evaporation section (3-5) is replenished with the backflow liquid through the fifth loop heat pipe liquid pipeline (5-5), so that a cycle is completed;

after the first loop heat pipe heat exchanger (10-1), the second loop heat pipe heat exchanger (10-2), the third loop heat pipe heat exchanger (10-3), the fourth loop heat pipe heat exchanger (10-4) and the fifth loop heat pipe heat exchanger (10-5) can be automatically started without additional power, the first loop heat pipe heat exchanger (10-1), the second loop heat pipe heat exchanger (10-2), the third loop heat pipe heat exchanger (10-3), the fourth loop heat pipe heat exchanger (10-4) and the fifth loop heat pipe heat exchanger (10-5) are started, the first main board (2-1), the second main board (2-2), the third main board (2-3), the fourth main board (2-4) and the fifth main board (2-5) generate heat which is generated by the first loop heat pipe evaporation section (3-1), The second loop heat pipe evaporation section (3-2), the third loop heat pipe evaporation section (3-3), the fourth loop heat pipe evaporation section (3-4) and the fifth loop heat pipe evaporation section (3-5) are transmitted to the first loop heat pipe condensation section (6-1), the second loop heat pipe condensation section (6-2), the third loop heat pipe condensation section (6-3), the fourth loop heat pipe condensation section (6-4) and the fifth loop heat pipe condensation section (6-5), and the heat dissipation process is circulated all the time;

the cross-flow fan (9) is used for providing power for cold air, the cold air is sent into the first server (1-1), the second server (1-2), the third server (1-3), the fourth server (1-4) and the fifth server (1-5) from a data center cold channel through the slit air opening (8), heat of the first loop heat pipe condensation section (6-1), the second loop heat pipe condensation section (6-2), the third loop heat pipe condensation section (6-3), the fourth loop heat pipe condensation section (6-4) and the fifth loop heat pipe condensation section (6-5) is taken away, and then the heat is transmitted to the outside through the data center air conditioning system.

The first loop heat pipe heat exchanger (10-1), the second loop heat pipe heat exchanger (10-2), the third loop heat pipe heat exchanger (10-3), the fourth loop heat pipe heat exchanger (10-4) and the fifth loop heat pipe heat exchanger (10-5) are respectively composed of a first loop heat pipe evaporation section (3-1), a second loop heat pipe evaporation section (3-2), a third loop heat pipe evaporation section (3-3), a fourth loop heat pipe evaporation section (3-4), a fifth loop heat pipe evaporation section (3-5), a first loop steam pipeline (4-1), a second loop steam pipeline (4-2), a third loop heat pipe steam pipeline (4-3), a fourth loop steam pipeline (4-4), a fifth loop steam pipeline (4-5), The liquid cooling system comprises a first loop heat pipe liquid pipeline (5-1), a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4), a fifth loop heat pipe liquid pipeline (5-5), a first loop heat pipe condensation section (6-1), a second loop heat pipe condensation section (6-2), a third loop heat pipe condensation section (6-3), a fourth loop heat pipe condensation section (6-4) and a fifth loop heat pipe condensation section (6-5).

The cross flow fan (9) has uniform air outlet and can provide drive for cold air to enter the first server (1-1), the second server (1-2), the third server (1-3), the fourth server (1-4) and the fifth server (1-5).

The air outlet quantity is controlled by using the strip slit air opening (8), and the air direction and the air flow organization in the server cabinet (7) are changed.

Working media in the first loop heat pipe heat exchanger (10-1), the second loop heat pipe heat exchanger (10-2), the third loop heat pipe heat exchanger (10-3), the fourth loop heat pipe heat exchanger (10-4) and the fifth loop heat pipe heat exchanger (10-5) can be selected from R21, R113 and ethanol.

Drawings

Fig. 1 is a structure diagram of the cabinet with the cross flow fan of the present invention.

Reference designations in FIG. 1: 1-1, a first server, 1-2, a second server, 1-3, a third server, 1-4, a fourth server, 1-5, a fifth server, 7, a server cabinet, 8, a slotted air port and 9, a cross-flow fan.

Fig. 2 is a structural diagram of the loop heat pipe exchanger and the main board of the present invention.

Reference number designation in figure 2: 1-1, 1-2, a second server, 1-3, a third server, 1-4, a fourth server, 1-5, a fifth server, 2-1, a first main board, 2-2, a second main board, 2-3, a third main board, 2-4, a fourth main board, 2-5, a fifth main board, 3-1, a first loop heat pipe evaporation section, 3-2, a second loop heat pipe evaporation section, 3-3, a third loop heat pipe evaporation section, 3-4, a fourth loop heat pipe evaporation section, 3-5, a fifth loop heat pipe evaporation section, 4-1, a first loop heat pipe vapor pipeline, 4-2, a second loop heat pipe vapor pipeline, 4-3, a third loop heat pipe vapor pipeline, 4-4, a fourth loop heat pipe vapor pipeline, 4-5 parts of a fifth loop heat pipe steam pipeline, 5-1 parts of a first loop heat pipe liquid pipeline, 5-2 parts of a second loop heat pipe liquid pipeline, 5-3 parts of a third loop heat pipe liquid pipeline, 5-4 parts of a fourth loop heat pipe liquid pipeline, 5-5 parts of a fifth loop heat pipe liquid pipeline, 6-1 parts of a first loop heat pipe condensation section, 6-2 parts of a second loop heat pipe condensation section, 6-3 parts of a third loop heat pipe condensation section, 6-4 parts of a fourth loop heat pipe condensation section, 6-5 parts of a fifth loop heat pipe condensation section, 7 parts of a server cabinet, 8 parts of a slotted air port, 9 parts of a cross-flow fan, 10-1 parts of a first loop heat pipe heat exchanger, 10-2 parts of a second loop heat pipe heat exchanger, 10-3 parts of a third loop heat pipe heat exchanger, 10-4 parts of a fourth loop heat pipe heat exchanger, 10-5, a fifth loop heat pipe exchanger.

Detailed Description

As shown in the figures 1 and 2, the cabinet composite heat management system with the servers provided with the loop heat pipes and the cross-flow fan mainly comprises 1-1.1.a first server, 1-2.a second server, 1-3.a third server, 1-4.a fourth server, 1-5.a fifth server, 2-1.a first main board, 2-2.a second main board, 2-3.a third main board, 2-4.a fourth main board, 2-5.a fifth main board, 3-1.a first loop heat pipe evaporation section, 3-2.a second loop heat pipe evaporation section, 3-3.a third loop heat pipe evaporation section, 3-4.a fourth loop heat pipe evaporation section, 3-5.a fifth loop heat pipe evaporation section, 4-1.a first loop heat pipe steam pipeline, 4-2.a second loop heat pipe steam pipeline, 4-3, a third loop heat pipe vapor pipeline, 4-4, a fourth loop heat pipe vapor pipeline, 4-5, a fifth loop heat pipe vapor pipeline, 5-1, a first loop heat pipe liquid pipeline, 5-2, a second loop heat pipe liquid pipeline, 5-3, a third loop heat pipe liquid pipeline, 5-4, a fourth loop heat pipe liquid pipeline, 5-5, a fifth loop heat pipe liquid pipeline, 6-1, a first loop heat pipe condensation section, 6-2, a second loop heat pipe condensation section, 6-3, a third loop heat pipe condensation section, 6-4, a fourth loop heat pipe condensation section, 6-5, a fifth loop heat pipe condensation section, 7, a server cabinet, 8, a slit air port, 9, a cross-flow fan, 10-1, a first loop heat pipe heat exchanger, 10-2, a second loop heat pipe heat exchanger, 10-3, 10-4, 10-5 and a fifth loop heat pipe exchanger.

When the first server 1-1 works, heat is generated on the first main board 2-1, the heat is transferred from the first main board 2-1 to the first loop heat pipe evaporation section 3-1, the working medium is evaporated on the outer surface of a capillary core of the first loop heat pipe evaporation section 3-1, the generated steam flows into a first loop heat pipe steam pipeline 4-1, passes through the first loop heat pipe condensation section 6-1, the heat is taken away by a cross-flow fan 9 in the first loop heat pipe condensation section 6-1, is condensed into liquid and is subcooled, and the returned liquid supplies the capillary core of the first loop heat pipe evaporation section 3-1 through the first loop heat pipe liquid pipeline 5-1 to complete a cycle;

when the second server 1-2 works, heat is generated on the second main board 2-2 and is transferred to the second loop heat pipe evaporation section 3-2 from the second main board 2-2, working media are evaporated on the outer surface of a capillary core of the second loop heat pipe evaporation section 3-2, generated steam flows into a second loop heat pipe steam pipeline 4-2 and passes through the second loop heat pipe condensation section 6-2, heat is taken away by a cross-flow fan 9 in the second loop heat pipe condensation section 6-2 and is condensed into liquid and is subcooled, and the capillary core of the second loop heat pipe evaporation section 3-2 is replenished by the backflow liquid through the second loop heat pipe liquid pipeline 5-2, so that a cycle is completed;

when the third server 1-3 works, heat is generated on the third main board 2-3, the heat is transferred to the third loop heat pipe evaporation section 3-3 from the third main board 2-3, the working medium is evaporated on the outer surface of a capillary core of the third loop heat pipe evaporation section 3-3, the generated steam flows into a vapor pipeline 4-3 of the third loop heat pipe, passes through the third loop heat pipe condensation section 6-3, the heat is taken away by a cross-flow fan 9 in the third loop heat pipe condensation section 6-3, the vapor is condensed into liquid and is subcooled, and the capillary core of the third loop heat pipe evaporation section 3-3 is replenished with the backflow liquid through the third loop heat pipe liquid pipeline 5-3, so that a cycle is completed;

when the fourth server 1-4 works, heat is generated on the fourth main board 2-4, the heat is transferred from the fourth main board 2-4 to the fourth loop heat pipe evaporation section 3-4, the working medium is evaporated on the outer surface of a capillary core of the fourth loop heat pipe evaporation section 3-4, the generated steam flows into a steam pipeline 4-4 of the fourth loop heat pipe, passes through the fourth loop heat pipe condensation section 6-4, the heat is taken away by a cross-flow fan 9 at the fourth loop heat pipe condensation section 6-4, is condensed into liquid and is subcooled, and the returned liquid supplies the capillary core of the fourth loop heat pipe evaporation section 3-4 through the fourth loop heat pipe liquid pipeline 5-4 to complete a cycle;

when the fifth server 1-5 works, heat is generated on the fifth main board 2-5, the heat is transferred from the fifth main board 2-5 to the fifth loop heat pipe evaporation section 3-5, the working medium is evaporated on the outer surface of a capillary core of the fifth loop heat pipe evaporation section 3-5, the generated steam flows into a steam pipeline 4-5 of the fifth loop heat pipe, passes through the fifth loop heat pipe condensation section 6-5, the heat is taken away by a cross-flow fan 9 at the fifth loop heat pipe condensation section 6-5, is condensed into liquid and is subcooled, and the returned liquid supplies the capillary core of the fifth loop heat pipe evaporation section 3-5 through the fifth loop heat pipe liquid pipeline 5-5 to complete a cycle;

after the first loop heat pipe heat exchanger 10-1, the second loop heat pipe heat exchanger 10-2, the third loop heat pipe heat exchanger 10-3, the fourth loop heat pipe heat exchanger 10-4 and the fifth loop heat pipe heat exchanger 10-5 are started automatically without additional power, the heat generated by the first loop heat pipe heat exchanger 10-1, the second loop heat pipe heat exchanger 10-2, the third loop heat pipe heat exchanger 10-3, the fourth loop heat pipe heat exchanger 10-4 and the fifth loop heat pipe heat exchanger 10-5 flows from the first loop heat pipe evaporation section 3-1, the second loop heat pipe evaporation section 3-2 and the third loop heat pipe evaporation section 3-3, The fourth loop heat pipe evaporation section 3-4 and the fifth loop heat pipe evaporation section 3-5 are transmitted to the first loop heat pipe condensation section 6-1, the second loop heat pipe condensation section 6-2, the third loop heat pipe condensation section 6-3, the fourth loop heat pipe condensation section 6-4 and the fifth loop heat pipe condensation section 6-5, and the heat dissipation process is circulated all the time;

the cross-flow fan 9 is used for providing power for cold air, the cold air is sent into the first server 1-1, the second server 1-2, the third server 1-3, the fourth server 1-4 and the fifth server 1-5 from the data center cold channel through the slit air opening 8, heat of the first loop heat pipe condensation section 6-1, the second loop heat pipe condensation section 6-2, the third loop heat pipe condensation section 6-3, the fourth loop heat pipe condensation section 6-4 and the fifth loop heat pipe condensation section 6-5 is taken away, and then the heat is transferred to the outside through the data center air conditioning system.

The device is suitable for the field of heat exchange of any data machine room, the heat generated by the main plate in the machine cabinet is led out and removed by utilizing the method of combining the loop heat pipe heat exchanger with the cross-flow fan, the heat exchange efficiency is higher, and the cooling effect is better.

Claims (5)

1. The rack composite heat management system with the loop heat pipes and the cross-flow fan additionally arranged on the server is characterized in that:

the system is characterized by comprising a first server (1-1), a second server (1-2), a third server (1-3), a fourth server (1-4), a fifth server (1-5), a first main board (2-1), a second main board (2-2), a third main board (2-3), a fourth main board (2-4), a fifth main board (2-5), a first loop heat pipe evaporation section (3-1), a second loop heat pipe evaporation section (3-2), a third loop heat pipe evaporation section (3-3), a fourth loop heat pipe evaporation section (3-4), a fifth loop heat pipe evaporation section (3-5), a first loop heat pipe steam pipeline (4-1), a second loop heat pipe steam pipeline (4-2), a third loop heat pipe steam pipeline (4-3), A fourth loop heat pipe steam pipeline (4-4), a fifth loop heat pipe steam pipeline (4-5), a first loop heat pipe liquid pipeline (5-1), a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4), a fifth loop heat pipe liquid pipeline (5-5), a first loop heat pipe condensation section (6-1), a second loop heat pipe condensation section (6-2), a third loop heat pipe condensation section (6-3), a fourth loop heat pipe condensation section (6-4), a fifth loop heat pipe condensation section (6-5), a server cabinet (7), a slotted air opening (8), a cross-flow fan (9), a first loop heat pipe heat exchanger (10-1), a second loop heat pipe heat exchanger (10-2), A third loop heat pipe heat exchanger (10-3), a fourth loop heat pipe heat exchanger (10-4) and a fifth loop heat pipe heat exchanger (10-5);

wherein, a first loop heat pipe exchanger (10-1), a second loop heat pipe exchanger (10-2), a third loop heat pipe exchanger (10-3), a fourth loop heat pipe exchanger (10-4) and a fifth loop heat pipe exchanger (10-5) are respectively arranged in the first server (1-1), the second server (1-2), the third server (1-4) and the fifth server (1-5);

the server comprises a first main board (2-1), a second main board (2-2), a third main board (2-3), a fourth main board (2-4) and a fifth main board (2-5), wherein the first loop heat pipe evaporation section (3-1), the second loop heat pipe evaporation section (3-2), the third loop heat pipe evaporation section (3-3), the fourth loop heat pipe evaporation section (3-4) and the fifth loop heat pipe evaporation section (3-5) are located inside the server (1), and are respectively attached to the first main board (2-1), the second main board (2-2), the third main board (2-3), the fourth main board (2-4) and the upper surface of the fifth main board (2-5), and the first loop heat pipe evaporation section (3-1), the second loop heat pipe evaporation section (3-2), the third loop heat pipe evaporation section (3-3), Outlets of a fourth loop heat pipe evaporation section (3-4) and a fifth loop heat pipe evaporation section (3-5) are respectively connected with inlets of a first loop heat pipe steam pipeline (4-1), a second loop heat pipe steam pipeline (4-2), a third loop heat pipe steam pipeline (4-3), a fourth loop heat pipe steam pipeline (4-4) and a fifth loop heat pipe steam pipeline (4-5), outlets of the first loop heat pipe steam pipeline (4-1), the second loop heat pipe steam pipeline (4-2), the third loop heat pipe steam pipeline (4-3), the fourth loop heat pipe steam pipeline (4-4) and the fifth loop heat pipe steam pipeline (4-5) are respectively connected with a first loop condensation heat pipe section (6-1), a second loop heat pipe condensation section (6-2), Inlets of a third loop heat pipe condensation section (6-3), a fourth loop heat pipe condensation section (6-4) and a fifth loop heat pipe condensation section (6-5) are connected, outlets of the first loop heat pipe condensation section (6-1), the second loop heat pipe condensation section (6-2), the third loop heat pipe condensation section (6-3), the fourth loop heat pipe condensation section (6-4) and the fifth loop heat pipe condensation section (6-5) are respectively connected with an inlet of a first loop heat pipe liquid pipeline (5-1), a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4) and a fifth loop heat pipe liquid pipeline (5-5), and the first loop heat pipe liquid pipeline (5-1) is connected with an inlet of the first loop heat pipe liquid pipeline (5-1), Outlets of a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4) and a fifth loop heat pipe liquid pipeline (5-5) are respectively connected with inlets of a first loop heat pipe evaporation section (3-1), a second loop heat pipe evaporation section (3-2), a third loop heat pipe evaporation section (3-3), a fourth loop heat pipe evaporation section (3-4) and a fifth loop heat pipe evaporation section (3-5);

the first main plate (2-1), the first loop heat pipe evaporation section (3-1), the first loop heat pipe steam pipeline (4-1) and the front half part of the first loop heat pipe liquid pipeline (5-1) are positioned inside the first server (1-1), and the first loop heat pipe steam pipeline (4-1), the rear half part of the first loop heat pipe liquid pipeline (5-1) and the first loop heat pipe condensation section (6-1) are positioned outside the first server (1-1);

the second main plate (2-2), the second loop heat pipe evaporation section (3-2), the second loop heat pipe steam pipeline (4-2) and the front half part of the second loop heat pipe liquid pipeline (5-2) are positioned inside the second server (1-2), and the second loop heat pipe steam pipeline (4-2), the rear half part of the second loop heat pipe liquid pipeline (5-2) and the second loop heat pipe condensation section (6-2) are positioned outside the second server (1-2);

the third main plate (2-3), the third loop heat pipe evaporation section (3-3), the third loop heat pipe steam pipeline (4-3) and the first half part of the third loop heat pipe liquid pipeline (5-3) are positioned inside the third server (1-3), and the third loop heat pipe steam pipeline (4-3), the second half part of the third loop heat pipe liquid pipeline (5-3) and the third loop heat pipe condensation section (6-3) are positioned outside the third server (1-3);

the fourth main board (2-4), the fourth loop heat pipe evaporation section (3-4), the fourth loop heat pipe steam pipeline (4-4) and the front half part of the fourth loop heat pipe liquid pipeline (5-4) are positioned inside the fourth server (1-4), and the fourth loop heat pipe steam pipeline (4-4), the rear half part of the fourth loop heat pipe liquid pipeline (5-4) and the fourth loop heat pipe condensation section (6-4) are positioned outside the fourth server (1-4);

the fifth mainboard (2-5), the fifth loop heat pipe evaporation section (3-5), the fifth loop heat pipe steam pipeline (4-5) and the front half part of the fifth loop heat pipe liquid pipeline (5-5) are positioned inside the fifth server (1-5), and the fifth loop heat pipe steam pipeline (4-5), the rear half part of the fifth loop heat pipe liquid pipeline (5-5) and the fifth loop heat pipe condensation section (6-5) are positioned outside the fifth server (1-5);

the first server (1-1), the second server (1-2), the third server (1-3), the fourth server (1-4) and the fifth server (1-5) are located in a server cabinet (7), the slit air openings (8) are located in the front half portions of two side faces of the server cabinet (7), and the cross-flow fan (9) is located in front of the right side of the server cabinet (7).

2. The cabinet composite heat management system with the loop heat pipes and the cross-flow fan additionally arranged on the server as claimed in claim 1, is characterized in that:

the first loop heat pipe heat exchanger (10-1), the second loop heat pipe heat exchanger (10-2), the third loop heat pipe heat exchanger (10-3), the fourth loop heat pipe heat exchanger (10-4) and the fifth loop heat pipe heat exchanger (10-5) are respectively composed of a first loop heat pipe evaporation section (3-1), a second loop heat pipe evaporation section (3-2), a third loop heat pipe evaporation section (3-3), a fourth loop heat pipe evaporation section (3-4), a fifth loop heat pipe evaporation section (3-5), a first loop steam pipeline (4-1), a second loop steam pipeline (4-2), a third loop heat pipe steam pipeline (4-3), a fourth loop steam pipeline (4-4), a fifth loop steam pipeline (4-5), The liquid cooling system comprises a first loop heat pipe liquid pipeline (5-1), a second loop heat pipe liquid pipeline (5-2), a third loop heat pipe liquid pipeline (5-3), a fourth loop heat pipe liquid pipeline (5-4), a fifth loop heat pipe liquid pipeline (5-5), a first loop heat pipe condensation section (6-1), a second loop heat pipe condensation section (6-2), a third loop heat pipe condensation section (6-3), a fourth loop heat pipe condensation section (6-4) and a fifth loop heat pipe condensation section (6-5).

3. The cabinet composite heat management system with the loop heat pipes and the cross-flow fan additionally arranged on the server as claimed in claim 1, is characterized in that:

the cross flow fan (9) has uniform air outlet and can provide drive for cold air to enter the first server (1-1), the second server (1-2), the third server (1-3), the fourth server (1-4) and the fifth server (1-5).

4. The cabinet composite heat management system with the loop heat pipes and the cross-flow fan additionally arranged on the server as claimed in claim 1, is characterized in that:

the air outlet quantity is controlled by using the strip slit air opening (8), and the air direction and the air flow organization in the server cabinet (7) are changed.

5. The cabinet composite heat management system with the loop heat pipes and the cross-flow fan additionally arranged on the server as claimed in claim 1, is characterized in that:

working media in the first loop heat pipe heat exchanger (10-1), the second loop heat pipe heat exchanger (10-2), the third loop heat pipe heat exchanger (10-3), the fourth loop heat pipe heat exchanger (10-4) and the fifth loop heat pipe heat exchanger (10-5) can be selected from R21, R113 and ethanol.

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