CN220999786U - Solder strip tinning device - Google Patents
Solder strip tinning device Download PDFInfo
- Publication number
- CN220999786U CN220999786U CN202322526937.XU CN202322526937U CN220999786U CN 220999786 U CN220999786 U CN 220999786U CN 202322526937 U CN202322526937 U CN 202322526937U CN 220999786 U CN220999786 U CN 220999786U
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- China
- Prior art keywords
- tin
- solder strip
- air knife
- wire
- mounting bracket
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 129
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 172
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 238000003825 pressing Methods 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000000903 blocking effect Effects 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims description 12
- 238000007747 plating Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
Abstract
The utility model provides a solder strip tinning device, comprising: the mounting bracket comprises a first end and a second end which are oppositely arranged, and the first end is provided with an air knife mounting bracket for mounting the air knife; the die bracket is connected with the mounting bracket; the tin shielding mold is arranged in the mold support, and is provided with a solder strip through hole for accommodating a tin-plated solder strip, and the solder strip through hole is used for aligning with the air knife; and the wire pressing plate is connected with the second end of the mounting bracket and comprises a wire inlet for inputting copper wires and a wire outlet for outputting tin-plated solder strips, and the wire outlet direction of the wire outlet is aligned with the solder strip through hole. According to the solder strip tinning device provided by the embodiment of the utility model, the tin blocking die is arranged, so that the redundant tin layer on the tin-plated solder strip can be removed, the tin carrying amount on the tin-plated solder strip is controlled, the redundant tin liquid can be prevented from splashing when the tin-plated solder strip passes through the air knife, the air hole is blocked, the air consumption is reduced, and meanwhile, the air knife is prevented from being damaged.
Description
Technical Field
The utility model relates to the technical field of photovoltaic equipment, in particular to a solder strip tin plating device.
Background
The photovoltaic solder strip is mainly applied to connection between photovoltaic module battery pieces and plays a role in conducting electricity and gathering electricity. The surface of the wire rod of the photovoltaic solder strip is plated with tin, in the tin plating process, the tin carrying amount of the tin plating solder strip is mainly adjusted by adjusting the wind pressure of the air knife, and in the high-speed tin plating process, the tin carrying amount on the copper wire rod is increased, and the wind pressure of the air knife is increased to control the tin carrying amount and the size of the tin plating solder strip. The increased wind pressure easily causes tin liquid to splash, so that the tin liquid blocks the air knife, and the size stability of the welding strip is reduced due to irregular splashing of the tin liquid, so that the diameters of the welding strip are inconsistent.
Disclosure of utility model
In view of the above, the present utility model provides a solder strip tinning device capable of improving dimensional stability while avoiding clogging of an air knife.
In order to solve the technical problems, the utility model adopts the following technical scheme:
The utility model provides a solder strip tinning device, comprising: mounting bracket, mould support, fender tin mould and line ball board. The mounting bracket comprises a first end and a second end which are oppositely arranged, and the first end is provided with an air knife mounting bracket for mounting the air knife; the die bracket is connected with the mounting bracket; the tin shielding mold is arranged in the mold support, and is provided with a solder strip through hole for accommodating the tin-plated solder strip, and the solder strip through hole is aligned with the air knife; the wire pressing plate is connected with the second end of the mounting bracket, a wire inlet used for inputting copper wires and a wire outlet used for outputting tin-plated solder strips are arranged on the wire pressing plate, and the wire outlet direction of the wire outlet is aligned with the solder strip through hole.
According to the solder strip tinning device, an un-tinned copper wire can penetrate into a wire inlet of a wire pressing plate, the device is moved into a tin pot, tinning is carried out in tin liquor, then the tinned copper wire is output from a wire outlet of the wire pressing plate to form a tinned solder strip, the tinned solder strip can enter a tin blocking die and pass through a solder strip through hole of the tin blocking die, and when the solder strip through hole of the tin blocking die passes through, the tin blocking die can remove redundant tin liquor, so that the air knife is prevented from being blocked by the tin liquor, and the dimensional stability of the tinned solder strip is improved.
In one embodiment of the utility model, the tin shielding mold is a conical mold, the conical part of the tin shielding mold is arranged towards the air knife mounting bracket, and the welding strip pass-through hole is arranged at one end of the tin shielding mold close to the air knife mounting bracket.
That is, the solder strip through hole is formed in the conical portion of the tin shielding mold, and the solder strip through hole is formed in the conical portion of the tin shielding mold, so that the superfluous tin liquid on the surface of the tin-plated solder strip can be effectively removed, and in addition, the conical mold can also avoid accumulation of the tin liquid on the surface of the solder strip through hole.
In one embodiment of the utility model, the bottom of the tin shielding mold is provided with an inward concave conical groove, the conical part of the conical groove is arranged towards the air knife mounting bracket, and the welding strip through hole is communicated with the conical groove. When the tin-plated solder strip enters the solder strip through the taper-shaped groove, the superfluous tin liquid on the surface of the tin-plated solder strip can be removed uniformly, and the tin-plated solder strip is prevented from carrying superfluous tin liquid.
In one embodiment of the utility model, the solder strip pass-through hole comprises a tin outlet hole close to the air knife and a tin inlet hole away from the air knife, and the solder strip tinning device further comprises: and lifting the assembly. The lifting assembly is connected with the mounting bracket and used for lowering or lifting the tin blocking die into or from the tin liquid, and the tin outlet of the tin blocking die is higher than the liquid level of the tin liquid. The height of the tin shielding mold can be controlled through the lifting assembly, so that the production progress is controlled.
In one embodiment of the utility model, when the tin shielding mold is lowered into the tin liquid, the tin outlet of the tin shielding mold is 2-4 mm higher than the liquid level of the tin liquid. The cross section area of the tin shielding mold exposed out of the tin liquid is small, so that the accumulation of the tin liquid on the surface of the tin shielding mold can be avoided, and the cleaning difficulty is reduced.
In one embodiment of the utility model, an outwardly extending mounting plate is formed on the bottom circumference of the tin shielding mold, and a plurality of mounting holes are formed in the mounting plate, and the tin shielding mold is connected with the mold support through the mounting holes.
In one embodiment of the utility model, the wire pressing plate is formed into a semicircular plate and comprises arc-shaped surfaces and straight surfaces which are connected end to end, wherein the arc-shaped surfaces are arranged away from the die support and used for pressing copper wires, and the wire pressing plate is connected with the second end of the mounting support through the straight surfaces.
In one embodiment of the present utility model, the solder strip tinning device further comprises: and a fixing plate. The fixed plate is arranged at the second end of the mounting bracket and is used for being connected with the straight surface of the line pressing plate. The fixing plate is provided with a mounting waist hole, the length direction of the mounting waist hole is parallel to the length direction of the straight surface, and the line pressing plate is arranged in the mounting waist hole in a penetrating mode through a fastener to be connected with the fixing plate.
The technical scheme of the utility model has at least one of the following beneficial effects:
According to the tin plating device for the tin plating belt, when the copper wires enter tin liquid for tin plating, the tin plating belt is formed by outputting the wire pressing plate, then the tin plating belt enters the air knife through the welding belt through hole of the tin blocking die, and the tin blocking die is arranged, so that the tin blocking die can remove redundant tin liquid on the tin plating belt when the tin plating belt passes through the welding belt through hole of the tin blocking die, and further, when the air knife is used for controlling the tin carrying amount on the tin plating belt, the air knife is prevented from being blocked by redundant tin liquid, and the dimensional stability of the tin plating belt is improved.
Drawings
FIG. 1 is a schematic diagram of a solder strip tinning device according to an embodiment of the present utility model;
FIG. 2 is a cross-sectional view of a tin shielding mold in a solder strip tin plating apparatus according to an embodiment of the present utility model;
fig. 3 is a top view of a tin shielding mold in a solder strip tin plating apparatus according to an embodiment of the utility model.
Reference numerals: 100. a mounting bracket; 110. an air knife mounting bracket; 120. a fixing plate; 121. mounting a waist hole; 200. a mold support; 300. a tin shielding mold; 301. copper wire; 302. plating tin solder strips; 310. welding the through holes; 320. a mounting plate; 321. a mounting hole; 400. a wire pressing plate; 410. a wire inlet; 420. a wire outlet; 500. and (5) a tin pot.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which are obtained by a person skilled in the art based on the described embodiments of the utility model, fall within the scope of protection of the utility model.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate a relative positional relationship, which changes accordingly when the absolute position of the object to be described changes.
A solder strip tin plating apparatus according to an embodiment of the present utility model will be described in detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a solder strip tin plating device according to an embodiment of the present utility model, and fig. 2 is a cross-sectional view of a tin shielding mold in the solder strip tin plating device according to the embodiment of the present utility model.
As shown in fig. 1 and 2, the solder strip tinning device includes a mounting bracket 100, a die bracket 200, a tin shielding die 300, and a wire pressing plate 400. Wherein the mounting bracket 100 includes a first end and a second end disposed opposite to each other, and the second end is provided with an air knife mounting bracket 110 for mounting an air knife. The mold bracket 200 is connected to the mounting bracket 100. The tin shielding mold 300 is disposed in the mold support 200, and the tin shielding mold 300 is provided with a solder strip through hole 310 for accommodating the solder strip 302, wherein the solder strip through hole 310 is used for aligning with an air knife, and the wire pressing plate 400 is connected with the second end of the mounting support 100 and comprises a wire inlet 410 for inputting a copper wire 301 and a wire outlet 420 for outputting the solder strip 302. As shown in fig. 1, the wire pressing plate 400 is positioned in the tin bath of the tin pot 500, i.e., still in the tin bath when the copper wire 301 is output from the outlet 420 to form the tin-plated solder strip 302. The wire pressing plate 400 is used to press the incoming copper wire 301 so that the copper wire 301 remains straight as it is output from the wire outlet 420 to form the solder strip 302. Wherein the wire outlet 420 is aligned with the solder strip aperture 310 in the wire outlet direction.
In one embodiment of the present utility model, the un-plated copper wire 301 may be threaded into the wire inlet 410 of the wire pressing plate 400, then the device is moved into the tin pot, the copper wire 301 may enter the wire pressing plate 400 from the wire inlet 410 during the tin plating process in the tin bath, be positioned and shaped by the wire pressing plate 400, and then be output from the wire outlet 420 to form the tin-plated solder strip 302, then the tin-plated solder strip 302 enters the tin shielding mold 300, and enters the air knife provided on the air knife mounting bracket 110 after passing through the solder strip through hole 310 of the tin shielding mold 300. When the tin-plated solder strip 302 passes through the solder strip through hole 310 of the tin shielding mold 300, on one hand, due to the blocking of the tin shielding mold 300, the redundant tin liquid on the tin-plated solder strip 302 can be removed, and when the tin-plated solder strip 302 continues to enter the air knife working area upwards, the phenomenon that the air knife air hole is blocked due to the fact that the redundant tin liquid on the tin-plated solder strip 302 splashes and splashes due to the increase of the air knife air pressure can be avoided, so that the failure rate of the air knife is reduced. Meanwhile, through the shaping effect of the solder strip through holes 310 and the adjustment of the air knife, the tin liquid on the tin-plated solder strip 302 is uniformly distributed, so that the dimensional stability of the tin-plated solder strip 302 is improved, and the size of the solder strip meets the design requirement.
As shown in fig. 2, in one embodiment of the present utility model, the tin shielding mold 300 is a tapered mold, the tapered portion of the tin shielding mold 300 is disposed toward the air knife mounting bracket 110, and the solder strip through hole 310 is disposed at an end of the tin shielding mold 300 toward the air knife mounting bracket 110.
The solder strip through hole 310 is provided at an end of the tin shielding mold 300 facing the air knife mounting bracket 110, that is, the solder strip through hole 310 is provided at a tapered portion of the tin shielding mold 300. By providing the solder strip through hole 310 at the taper portion of the tin shielding mold 300, the tin plating solder strip 302 can effectively remove the excessive tin liquid on the surface of the tin plating solder strip 302 after passing through the solder strip through hole 310. In addition, when the tinning speed is lower, the conical die can prevent tin drops from accumulating on the surface of the tin shielding die 300 after the tin drops fall, so that the cleaning difficulty is reduced.
Referring to fig. 2 and 3, fig. 3 is a top view of a tin shielding mold 300 in a solder strip tin plating apparatus according to an embodiment of the utility model. As shown in fig. 2 and 3, in one embodiment of the present utility model, the bottom of the tin shielding mold 300 is provided with an inwardly recessed tapered groove, the tapered portion of the tapered groove is disposed toward the air knife mounting bracket 110, and the solder strip through hole 310 is disposed in communication with the tapered groove.
Because the cross-sectional area of the conical groove is gradually decreased upwards, when the tin-plated solder strip 302 passes through the solder strip through hole 310, the excessive tin liquid on the surface of the tin-plated solder strip 302 can be uniformly removed by the solder strip through hole 310 and is extruded towards the center of the conical groove, so that the tin-plated solder strip 302 which does not enter the solder strip through hole 310 is contacted, and the tin-plated solder strip is shaped, so that the dimensional stability of the tin-plated solder strip 302 is improved while the excessive tin liquid is removed. In addition, since the walls of the tapered grooves are inclined downward (downward in fig. 2), the tin liquid removed by the solder strip through holes 310 can naturally drip under the action of gravity, and thus, waste of raw materials can be avoided.
As shown in fig. 1, in one embodiment of the utility model, the solder strip vent 310 includes a solder outlet proximate to the air knife and a solder inlet facing away from the air knife, and the solder strip tinning device further includes a lifting assembly. The lifting assembly is connected with the mounting bracket 100, and is used for lowering the tin shielding mold 300 into the tin pot 500 for containing tin liquid or lifting the tin shielding mold 300 from the tin pot 500, and in the lowering process, the tin outlet of the tin shielding mold 300 is higher than the liquid level of the tin liquid. The height of the tin shielding mold 300 is controlled by the lifting assembly, thereby controlling the production progress.
In addition, when the tin shielding mold 300 is lowered into the tin liquid, the tin outlet of the tin shielding mold 300 is 2-4 mm higher than the liquid level of the tin liquid, and the tin shielding mold 300 has small cross-sectional area exposing the tin liquid, so that accumulation of the tin liquid on the surface of the tin shielding mold 300 can be avoided, and the cleaning difficulty is reduced.
As shown in fig. 1, in one embodiment of the present utility model, a mounting plate 320 extending outward is formed at the bottom circumference of a tin-blocking mold 300, and a plurality of mounting holes 321 are provided on the mounting plate 320, and the tin-blocking mold 300 is connected to a mold frame 200 through the mounting holes 321. Thereby, the connection strength between the tin-plated mold 300 and the mold frame 200 is improved.
As shown in fig. 1, in one embodiment of the present utility model, the wire pressing plate 400 is formed as a semicircular plate including arc-shaped surfaces and flat surfaces connected end to end, the arc-shaped surfaces being disposed away from the die holder 200 for pressing the solder strip copper wire 301, and the wire pressing plate 400 being connected to the second end of the mounting bracket 100 through the flat surfaces. By compressing the copper wire 301, the copper wire 301 is kept straight when being output from the wire outlet 420 to form the tin-plated solder strip 302, thereby improving the dimensional stability of the tin-plated solder strip 302.
In one embodiment of the present utility model, the solder strip tinning device further comprises: a fixing plate 120. The fixing plate 120 is disposed at the second end of the mounting bracket 100 and is connected to the flat surface of the pressing line plate 400. The fixing plate 120 is provided with a mounting waist hole 121, the length direction of the mounting waist hole 121 is parallel to the length direction of the straight surface, and the line pressing plate 400 is penetrated in the mounting waist hole 121 by a fastener to be connected with the fixing plate 120. Thereby, on the one hand, the connection strength between the wire pressing plate 400 and the mounting bracket 100 is improved. On the other hand, the position of the wire pressing plate 400 can be adjusted by adjusting the position of the fastener in the mounting waist hole 121, so that the tin-plated solder strip 302 output from the wire outlet 420 can be sufficiently aligned with the solder strip through hole 310.
The following describes in detail the operation of reducing the amount of tin in a tin-plated solder ribbon by using the solder ribbon tin plating apparatus according to the embodiment of the present utility model with reference to the accompanying drawings.
As shown in fig. 1 to 3, before the tin plating starts, the copper wire 301 to be tin plated can be threaded into the wire pressing plate 400 from the wire inlet 410, and after the copper wire 301 is threaded into the copper wire, the position of the wire pressing plate 400 is adjusted through the waist hole on the fixing plate 120, so that the wire outlet 420 is aligned with the solder strip through hole 310 of the tin shielding mold 300 and the center position of the air knife on the air knife mounting bracket 110. Then the mounting bracket is controlled to descend by the lifting component, the wire pressing plate 400 and the tin shielding die 300 are lowered into the tin liquid of the tin pot 500, and the tin outlet of the tin shielding die 300 is 2-4 mm higher than the liquid level of the tin liquid. After that, the device can be controlled to start up, the copper wire 301 is tinned in tin liquid, and the tin-plated solder strip 302 is formed by outputting from the wire outlet 420 of the wire pressing plate 400, the tin-plated solder strip 302 enters the solder strip through holes 310 aligned with the wire outlet 420, and the solder strip through holes 310 can remove the excessive tin liquid on the tin-plated solder strip 302. When the tin-plated solder strip 302 continues to enter the air knife working area upwards, the phenomenon that the air knife air holes are blocked due to the fact that redundant tin liquid on the tin-plated solder strip 302 splashes due to the fact that the air knife air pressure is increased can be avoided, and therefore the failure rate of the air knife is reduced. Meanwhile, through the shaping effect of the solder strip through holes 310 and the adjustment of the air knife, the tin liquid on the tin-plated solder strip 302 is uniformly distributed, so that the dimensional stability of the tin-plated solder strip 302 is improved, and the size of the solder strip meets the design requirement.
According to the solder strip tinning device provided by the utility model, the redundant tin liquid on the tinning solder strip 302 can be removed, so that when the air knife is used for controlling the tin quantity on the tinning solder strip 302, the redundant tin liquid is prevented from splashing to block the air holes of the air knife, the failure rate of the air knife is reduced, and the dimensional stability of the tinning solder strip 302 is also improved.
The foregoing is a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model and are intended to be comprehended within the scope of the present utility model.
Claims (9)
1. A solder strip tinning device, comprising:
the mounting bracket comprises a first end and a second end which are oppositely arranged, and the first end is provided with an air knife mounting bracket for mounting an air knife;
the die bracket is connected with the mounting bracket;
The tin shielding die is arranged in the die support, a welding strip through hole for accommodating a tin-plated welding strip is arranged on the tin shielding die, and the welding strip through hole is aligned with the air knife;
The wire pressing plate is connected with the second end of the mounting bracket, the wire pressing plate is provided with a wire inlet used for inputting copper wires and a wire outlet used for outputting the tinned welding strip, and the wire outlet direction of the wire outlet is aligned with the welding strip through hole.
2. The solder strip tinning device of claim 1, wherein the tin shielding mold is a conical mold, a conical portion of the tin shielding mold is arranged towards the air knife mounting bracket, and the solder strip pass-through hole is arranged at one end of the tin shielding mold, which is close to the air knife mounting bracket.
3. The solder strip tinning device according to claim 2, wherein the bottom of the tin shielding mold is provided with an inwardly recessed conical groove, the conical portion of the conical groove is arranged towards the air knife mounting bracket, and the solder strip through hole is communicated with the conical groove.
4. A solder strip tinning device according to any one of claims 1 to 3, wherein the solder strip pass-through comprises a solder outlet close to the air knife and a solder inlet facing away from the air knife,
The solder strip tinning device further comprises:
And the lifting assembly is connected with the mounting bracket and used for lowering or lifting the tin blocking die into or from tin liquid, and the tin outlet of the tin blocking die is higher than the liquid level of the tin liquid.
5. The solder strip tinning device of claim 4, wherein the tin outlet of the tin shielding mold is 2-4 millimeters above the level of the tin liquid when the tin shielding mold is lowered into the tin liquid.
6. A solder strip tinning device according to any one of claims 1 to 3, wherein an outwardly extending mounting plate is formed on the bottom periphery of the tin shielding die, a plurality of mounting holes are provided in the mounting plate, and the tin shielding die is connected to the die holder through the mounting holes.
7. A solder strip tinning device according to any one of claims 1 to 3, wherein the wire-pressing plate is formed as a semicircular plate comprising an arcuate face and a planar face in end-to-end relationship, the arcuate face being disposed away from the die support for compressing the copper wire, the wire-pressing plate being connected to the second end of the mounting support by the planar face.
8. The solder strip tinning device of claim 7, further comprising:
And the fixing plate is arranged at the second end of the mounting bracket and is used for being connected with the straight surface of the line pressing plate.
9. The solder strip tinning device of claim 8, wherein the fixing plate is provided with a mounting waist hole, the length direction of the mounting waist hole is parallel to the length direction of the straight surface, and the wire pressing plate is penetrated in the mounting waist hole by a fastener to be connected with the fixing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322526937.XU CN220999786U (en) | 2023-09-15 | 2023-09-15 | Solder strip tinning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322526937.XU CN220999786U (en) | 2023-09-15 | 2023-09-15 | Solder strip tinning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220999786U true CN220999786U (en) | 2024-05-24 |
Family
ID=91120455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322526937.XU Active CN220999786U (en) | 2023-09-15 | 2023-09-15 | Solder strip tinning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220999786U (en) |
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2023
- 2023-09-15 CN CN202322526937.XU patent/CN220999786U/en active Active
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