CN218910479U - Photovoltaic solder strip horizontal tinning device - Google Patents

Abstract

The utility model discloses a horizontal tinning device for a photovoltaic solder strip, which comprises a wire feeding mechanism, a soldering flux mechanism, a horizontal tinning mechanism, a shaping mechanism and a water cooling mechanism which are sequentially arranged from left to right along the transmission direction of copper wires; the wire feeding mechanism is used for conveying copper wires, the soldering flux mechanism is used for coating soldering flux on the copper wires, the horizontal tinning mechanism is used for tinning the copper wires conveyed along the horizontal direction to form a tinned welding strip, the shaping mechanism is used for cooling and shaping the tinned welding strip which is just tinned, and the water cooling mechanism is used for cooling the tinned welding strip. Compared with the prior art solder strip tinning device, the technical scheme of the utility model adopts a horizontal mode to tin the copper wire, so that the copper wire immersed with tin liquid is horizontally output, thus the water cooling mode can be adopted, the contact area is large, the cooling efficiency is high, the cooling quality is high, and the size of equipment is greatly reduced.

Description

Photovoltaic solder strip horizontal tinning device

Technical Field

The utility model relates to the field of photovoltaic solder strip production equipment, in particular to a horizontal tinning device for a photovoltaic solder strip.

Background

The photovoltaic solder strip is also called as a tin-plated solder strip, is an important component of the photovoltaic module, and plays roles in connecting the battery piece and transmitting current. With the continuous innovation of the assembly technology, the specification of the welding strip is continuously reduced, and the specification of the current mainstream MBB circular welding strip is gradually reduced from 0.45mm to 0.20mm, so that the current mainstream MBB circular welding strip can be possibly switched to an SMBB welding strip with smaller specification in the future. At the production end, the sharp reduction of the specification reduces the single machine productivity of the equipment, and restricts the development of enterprises. Along with the continuous reduction of the specification, each large manufacturing enterprise usually compensates the loss of productivity through the speed improvement, but the tension fluctuation is large, the wire shaking problem, the cooling problem and the like seriously influence the quality of the welding strip in the existing welding strip tin plating process after the speed is increased. Therefore, research on innovative technologies is urgent to develop new technologies.

The traditional tinning mode in the photovoltaic solder strip industry is to press copper wires into tin liquid by using a wire pressing wheel/wire pressing plate, then vertically drag the copper wires upwards, control the hot dip tinning process of the thickness of a coating by using an air knife, and cool the solder strip in an air cooling mode after the tin liquid is led out by the solder strip. The method has the advantages of simple process, short flow and high efficiency. However, with the continuous improvement of the production speed, the technological defects of the method are gradually revealed: (1) Copper wire gets into the tin pond and upwards wears out after having walked around the line ball wheel and changes the direction, and the line ball wheel is usually not rotated, is static friction between copper line and the line ball wheel, and frictional force is big, and the slot on the line ball wheel should be worn and torn in long-term use, and the line ball board remains scaling powder and accumulates difficult clearance for a long time, leads to the wire rod to appear blocking the phenomenon, causes tension instability, and then causes the continuous shake of wire rod, and the shake will lead to tin-plating inhomogeneous. (2) The air cooling is indirect cooling, the heat exchange efficiency is low, the cooling distance is required to be lengthened under the high-speed running state of the wire rod, the wire rod shakes and the cooling is insufficient along with the quick lifting of equipment, especially after the equipment is accelerated to 300m/min, the quality of a welding strip is seriously affected, the overall yield of the welding strip is reduced, and the transmission of the tension of the wire rod is further not facilitated after the wire rod is cooled in a heightened mode.

Disclosure of Invention

In order to solve the technical problems, the utility model mainly aims to provide a horizontal tinning device for a photovoltaic solder strip, which aims to solve the technical problems of wire clamping, long cooling distance and low cooling efficiency in the traditional tinning process.

In order to achieve the above purpose, the present utility model adopts the following technical scheme.

A horizontal tinning device of a photovoltaic solder strip comprises a wire feeding mechanism, a soldering flux mechanism, a horizontal tinning mechanism, a shaping mechanism and a water cooling mechanism which are sequentially arranged from left to right along the transmission direction of copper wires; the wire feeding mechanism is used for conveying copper wires, the soldering flux mechanism is used for coating soldering flux on the copper wires, the horizontal tinning mechanism is used for tinning the copper wires conveyed along the horizontal direction to form a tinned welding strip, the shaping mechanism is used for cooling and shaping the tinned welding strip which is just tinned, and the water cooling mechanism is used for cooling the tinned welding strip.

Compared with the traditional tin plating mode, the copper wire after being immersed in the tin liquid is horizontally output, the tin coating amount on the surface of the copper wire is controlled by the die, and the copper wire is cooled for the first time by the shaping mechanism and then directly cooled by the water cooling mechanism. The contact places of the wires are rolling friction, the resistance is small, and the tension is stable and controllable, so that the tinning operation is performed under a high-speed state. The copper wire is horizontally tinned through the horizontal tinning mechanism, and the welding strip in a high-temperature state is directly subjected to heat exchange with water in a water cooling mode, so that the heat exchange efficiency is high, the temperature of the wire can be effectively reduced, the cooling efficiency is greatly improved, and the overall size of the equipment is reduced.

Further, the horizontal tinning mechanism comprises a lower tin bath, an upper tin bath arranged along the left-right direction is arranged above the lower tin bath, and the projection of the upper tin bath on the horizontal plane is positioned in the projection of the lower tin bath on the horizontal plane; the left side inner wall and the right side inner wall of the upper tin bath are respectively provided with a vertical die groove extending along the front-rear direction, a disc-shaped die is arranged in the die grooves, and a horizontal die hole is formed in the central axis of the disc-shaped die; the upper tin bath part is submerged under the liquid surface of the lower tin bath.

Preferably, the depth of the upper tin bath immersed in the lower tin bath is one third to one half of the height of the upper tin bath. The upper tin bath part is immersed into the lower tin bath, so that the upper tin bath can be insulated, and the temperature in the upper tin bath is stabilized within a certain range.

Further, the upper end of the lower tin bath is provided with a fixing frame, a tin pump is arranged on the fixing frame, a liquid inlet of the tin pump stretches into the lower liquid level of the lower tin bath, and a liquid outlet of the tin pump is positioned in the upper tin bath. By arranging the tin pump and the liquid level switch, the depth of the tin liquid in the tin feeding tank can be controlled, so that the depth of the tin liquid in the tin feeding tank is maintained in a range.

Further, in order to ensure that the temperature of the molten tin in the upper tin bath is maintained within an optimal tin plating temperature range, a first temperature controller and a first heating pipe are arranged on the side wall of the upper tin bath, and the first temperature controller is electrically connected with a control switch of the first heating pipe.

Further, the shaping mechanism comprises an annular air knife arranged along the left-right direction, the annular air knife comprises an outer die and an inner die, the left end of the outer die is a plane, the right end of the outer die is provided with a conical concave cavity facing to the left, the center of the outer die is provided with an outer die wire passing hole, the left end of the inner die is provided with a conical head facing to the left, the right end of the inner die is a plane, and the center of the inner die is provided with an inner die wire passing hole; the conical head of the inner mold is embedded into the conical concave cavity of the outer mold, a conical air channel is reserved between the conical concave cavity of the outer mold and the conical head, and the side wall of the outer mold is provided with an air inlet hole communicated with the conical air channel; the outer die wire passing holes of the annular air knife are close to the die holes of the disc-shaped die at the right end of the upper tin bath and are collinear.

And when the copper wire infiltrated with the molten tin is output from the die hole of the die and enters the outer die wire passing hole and passes through the inner die wire passing hole, the copper wire is subjected to circumferential circular blowing by high-pressure air to be primarily cooled, so that the infiltrated molten tin is quickly solidified. In order to make the molten tin immersed on the copper wire as uniform as possible, the annular air knife needs to be arranged at the outlet of the disc-shaped die close to the right end of the upper tin bath as much as possible.

Further, the distance between the outer die wire passing hole of the annular air knife and the die hole of the disk die at the right end of the upper tin bath is 3-10cm.

Further, the water cooling mechanism comprises a lower water tank and an upper water tank, wherein the projection of the upper water tank on the horizontal plane is positioned in the projection of the lower water tank on the horizontal plane, the upper water tank is arranged above the lower water tank, a first vertical wire passing wheel is arranged in the upper water tank, and the first wire passing wheel is immersed under the liquid level of the upper water tank; the left side wall of the upper water tank is provided with a wire inlet hole which is flush with the lowest point of the first wire passing wheel.

The tinned copper wire shaped by the shaping mechanism horizontally enters the upper water tank and is vertically led out upwards after passing through the first wire passing wheel, and the tinned copper wire can be fully contacted with water for heat exchange as the first wire passing wheel is completely under the water surface.

In order to stabilize the process, a second temperature controller and a second heating pipe are arranged in the lower water tank, and the second temperature controller is electrically connected with a control switch of the second heating pipe. The lower water tank is provided with a water pump fixing frame, the water pump fixing frame is provided with a water pump, a water inlet of the water pump extends into the lower water tank, and a water outlet of the water pump is positioned in the upper water tank. When the water temperature exceeds the required temperature range, the water pump is started to supplement cold water into the upper water tank, so that the water temperature in the upper water tank is maintained in an optimal temperature range. When the water temperature is lower than the required temperature range, the second heating pipe is started to heat the cooling water in the upper water tank.

Compared with the prior art solder strip tinning device, the technical scheme of the utility model adopts a horizontal mode to tin the copper wire, so that the copper wire immersed with tin liquid is horizontally output, thus the water cooling mode can be adopted, the contact area is large, the cooling efficiency is high, the cooling quality is high, and the size of equipment is greatly reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic overall process diagram of a photovoltaic solder strip horizontal tinning device of the present utility model;

FIG. 2 is a schematic view of a horizontal tinning mechanism in a photovoltaic solder strip horizontal tinning device;

FIG. 3 is a schematic perspective view of a tin bath in a horizontal tinning mechanism;

fig. 4 is a front view of the die in the horizontal tinning mechanism;

FIG. 5 is a schematic perspective view of the shaping mechanism;

FIG. 6 is a cross-sectional view of the annular air knife in the shaping mechanism;

fig. 7 is a perspective view of a water chiller mechanism.

In the above figures:

1. copper wires; 2. a wire feeding mechanism; 3. a flux mechanism;

4. a horizontal tinning mechanism; 401. a tin bath is arranged; 402. a tin bath is arranged; 403. a mold groove; 404. a disc-shaped mold;

5. a shaping mechanism; 501. an annular air knife; 5011. an outer mold; 5012. an inner mold; 5013. a conical air duct; 502. an air inlet hole;

6. a water cooling mechanism; 601. a lower water tank; 602. a water supply tank; 603. and the first wire passing wheel.

Detailed Description

In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings.

In the following description, specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than those herein described, and those skilled in the art may readily devise numerous other arrangements that do not depart from the spirit of the utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

Referring to fig. 1, a horizontal tinning device for a photovoltaic solder strip comprises a wire feeding mechanism 2, a soldering flux mechanism 3, a horizontal tinning mechanism 4, a shaping mechanism 5 and a water cooling mechanism 6 which are sequentially arranged from left to right along the transmission direction of a copper wire 1; the wire feeding mechanism 2 is used for conveying copper wires 1, the scaling powder mechanism 3 is used for coating scaling powder on the copper wires 1, the horizontal tinning mechanism 4 is used for tinning the copper wires 1 conveyed along the horizontal direction to form tinned strips, the shaping mechanism 5 is used for cooling and shaping the tinned strips which are just tinned, and the water cooling mechanism 6 is used for cooling the tinned strips.

The copper wires 1 immersed in the tin liquid in the traditional tin plating process are led out vertically upwards and only can be in an air cooling mode, so that the cooling distance is long, the equipment body is enlarged and becomes high, and the transmission of wire tension is not facilitated after heightened cooling.

Compared with the traditional tinning mode, in the embodiment, the copper wire 1 after being immersed in the tin liquid is horizontally output, the tin coating amount on the surface of the copper wire 1 is controlled by a die, and the copper wire is cooled for the first time by the shaping mechanism 5 and then enters the water cooling mechanism 6 for direct cooling. The contact places of the wires are rolling friction, the resistance is small, the tension is stable and controllable, and the tinning operation is carried out in a high-speed state. The copper wire 1 is horizontally tinned through the horizontal tinning mechanism 4, and the welding strip in a high-temperature state is directly subjected to heat exchange with water in a water cooling mode, so that the heat exchange efficiency is high, the temperature of the wire can be effectively reduced, the cooling efficiency is greatly improved, and the overall size of the equipment is reduced. In addition, the tinned copper wire enters the water cooling mechanism for cooling after the tin liquid is solidified, so that uneven tinning caused by shaking of the copper wire is avoided, and the tinning quality is higher.

Further, referring to fig. 2, the horizontal tin plating mechanism 4 includes a lower tin bath 401, an upper tin bath 402 disposed in a left-right direction is disposed above the lower tin bath 401, and a projection of the upper tin bath 402 on a horizontal plane is located within a projection of the lower tin bath 401 on the horizontal plane.

Referring to fig. 3 and 4, a vertical mold groove 403 extending along the front-rear direction is provided on the left inner wall and the right inner wall of the upper tin groove 402, a disc mold 404 is provided in the mold groove 403, and a horizontal mold hole is provided at the central axis of the disc mold 404; the upper tin bath 402 is partially submerged under the liquid surface of the lower tin bath 401.

Preferably, the depth of the upper tin bath 402 immersed in the lower tin bath 401 is one third to one half of the height of the upper tin bath 402. In this embodiment, the upper tin bath 402 is partially immersed in the lower tin bath 401, so that the upper tin bath 402 can be kept warm, and the temperature in the upper tin bath 402 can be stabilized within a certain range.

Further, a fixing frame is arranged at the upper end of the lower tin bath 401, a tin pump is arranged on the fixing frame, a liquid inlet of the tin pump extends into the lower liquid level of the lower tin bath 401, and a liquid outlet of the tin pump is positioned in the upper tin bath 402. In this embodiment, by providing the tin pump and the liquid level switch, the depth of the tin liquid in the upper tin bath 402 can be controlled, so that the depth of the tin liquid in the upper tin bath 402 is maintained within a range.

Further, referring to fig. 3, in order to ensure that the temperature of the tin solution in the upper tin bath 402 is maintained within an optimal tin plating temperature range, a first temperature controller and a first heating pipe are disposed on a side wall of the upper tin bath 402, and the first temperature controller is electrically connected with a control switch of the first heating pipe.

Further, referring to fig. 5 and 6, the shaping mechanism 5 includes an annular air knife 501 disposed along a left-right direction, the annular air knife 501 includes an outer die 5011 and an inner die 5012, a left end of the outer die 5011 is a plane, a right end is provided with a conical cavity facing to the left, an outer die wire passing hole is provided in the center of the outer die 5011, a left conical head is provided at the left end of the inner die 5012, a right end is a plane, and an inner die wire passing hole is provided in the center of the inner die 5012; the conical head of the inner die 5012 is embedded into the conical concave cavity of the outer die 5011, a conical air duct 5013 is reserved between the conical concave cavity of the outer die 5011 and the conical head, and an air inlet 502 communicated with the conical air duct 5013 is arranged on the side wall of the outer die 5011; the outer die wire holes of the annular air knife 501 are close to and collinear with the die holes of the disc-shaped die 404 at the right end of the upper tin bath 402.

In this embodiment, when the copper wire 1 infiltrated with the molten tin is output from the die hole of the die and then enters the outer die wire passing hole and passes through the inner die wire passing hole, the circumferential circular blowing is performed by high-pressure air to perform preliminary cooling, so that the infiltrated molten tin is quickly solidified. In order to make the molten tin that wets the copper wire 1 as uniform as possible, the annular air knife 501 needs to be disposed as close to the outlet of the disk-shaped die 404 at the right end of the upper tin bath 402 as possible. In this embodiment, only a specific embodiment of the annular air knife is provided, and in practice, other air knife forms may be adopted, and no matter what form the air knife is, the effect of the air knife is to make the tin liquid with strong fluidity just coming out of the die outlet solidify as soon as possible, and become difficult to flow.

Preferably, the distance between the outer die wire through hole of the annular air knife 501 and the die hole of the die at the right end of the upper tin bath 402 is 3-10cm. In this embodiment, 5cm is preferable.

Further, referring to fig. 7, the water cooling mechanism 6 includes a lower water tank 601 and an upper water tank 602, a projection of the upper water tank 602 on a horizontal plane is located in a projection of the lower water tank 601 on the horizontal plane, the upper water tank 602 is disposed above the lower water tank 601, a first vertical wire passing wheel 603 is disposed in the upper water tank 602, and the first wire passing wheel 603 is submerged under a liquid surface of the upper water tank 602; the left side wall of the upper water tank 602 is provided with a wire inlet hole which is flush with the lowest point of the first wire passing wheel 603.

In this embodiment, the tinned copper wire 1 shaped by the shaping mechanism 5 horizontally enters the upper water tank 602 and is led out vertically upwards after passing through the first wire passing wheel 603, and the tinned copper wire 1 can be fully contacted with water for heat exchange because the first wire passing wheel 603 is completely under the water surface.

In order to stabilize the process and the cooling efficiency, a second temperature controller and a second heating pipe are disposed in the lower water tank 601, and the second temperature controller is electrically connected with a control switch of the second heating pipe. The lower water tank 601 is provided with a water pump fixing frame, the water pump fixing frame is provided with a water pump, a water inlet of the water pump stretches into the lower water tank 601, and a water outlet of the water pump is positioned in the upper water tank 602. When the water temperature exceeds the required temperature range, the water pump is started to supplement cold water to the upper water tank 602, so that the water temperature in the upper water tank 602 is maintained in an optimal temperature range. When the water temperature is lower than the desired temperature range, the second heating pipe is activated to heat the cooling water in the upper water tank 602.

The traditional solder strip tinning device has the advantages that the copper wires are conveyed at a high speed after the direction of the copper wires is changed through the wire pressing wheel, the copper wires shake, non-solidified tin plating of tin liquid is uneven, and the tin-plated copper wires in the photovoltaic solder strip horizontal tinning device are initially cooled and solidified through the qualitative mechanism before entering the cooling mechanism, so that the situation that uneven tinning is caused by shake does not occur, the tinning quality is higher, the tinning efficiency is higher, and the size of cooling equipment is smaller.

While the utility model has been described in detail in this specification with reference to the general description and the specific embodiments thereof, it will be apparent to one skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the scope of the utility model as claimed.

Claims (9)

1. The horizontal tinning device for the photovoltaic solder strip is characterized by comprising a wire feeding mechanism (2), a soldering flux mechanism (3), a horizontal tinning mechanism (4), a shaping mechanism (5) and a water cooling mechanism (6) which are sequentially arranged from left to right along the transmission direction of a copper wire (1); wire feeding mechanism (2) are used for carrying copper wire (1), scaling powder mechanism (3) are used for coating scaling powder for copper wire (1), horizontal tinning mechanism (4) are used for the tinning of copper wire (1) along horizontal direction transmission form the tinning solder strip, shaping mechanism (5) are used for cooling the tinning solder strip that just plated tin and shape, water cooling mechanism (6) are used for cooling the tinning solder strip.

2. The photovoltaic solder strip horizontal tinning device according to claim 1, wherein the horizontal tinning mechanism (4) comprises a lower tin bath (401), an upper tin bath (402) arranged along the left-right direction is arranged above the lower tin bath (401), and the projection of the upper tin bath (402) on the horizontal plane is positioned in the projection of the lower tin bath (401) on the horizontal plane; the left side inner wall and the right side inner wall of the upper tin bath (402) are respectively provided with a vertical die groove (403) extending along the front-rear direction, a disc-shaped die (404) is arranged in the die grooves (403), and a horizontal die hole is formed in the central axis of the disc-shaped die (404); the upper tin bath (402) is partially submerged under the liquid surface of the lower tin bath (401).

3. The photovoltaic solder strip horizontal tinning device according to claim 2, wherein the upper tin bath (402) is submerged in the lower tin bath (401) to a depth of one third to one half of the height of the upper tin bath (402).

4. A photovoltaic solder strip horizontal tinning device according to claim 3, characterized in that the upper end of the lower tin bath (401) is provided with a fixing frame, a tin pump is arranged on the fixing frame, the liquid inlet of the tin pump extends into the liquid level of the lower tin bath (401), and the liquid outlet of the tin pump is positioned in the upper tin bath (402).

5. The photovoltaic solder strip horizontal tinning device according to claim 4, wherein the side wall of the upper tin bath (402) is provided with a first temperature controller and a first heating pipe, and the first temperature controller is electrically connected with a control switch of the first heating pipe.

6. The photovoltaic solder strip horizontal tinning device according to claim 5, wherein the shaping mechanism (5) comprises an annular air knife (501) arranged along the left-right direction, the annular air knife (501) comprises an outer die (5011) and an inner die (5012), the left end of the outer die (5011) is a plane, the right end is provided with a conical concave cavity facing to the left, the center of the outer die (5011) is provided with an outer die wire through hole, the left end of the inner die (5012) is provided with a conical head facing to the left, the right end is a plane, and the center of the inner die (5012) is provided with an inner die wire through hole; the conical head of the inner die (5012) is embedded into the conical concave cavity of the outer die (5011), a conical air channel (5013) is reserved between the conical concave cavity of the outer die (5011) and the conical head, and an air inlet (502) communicated with the conical air channel (5013) is arranged on the side wall of the outer die (5011); the outer die wire passing holes of the annular air knife (501) are close to the die holes of the right disc-shaped die (404) of the upper tin bath (402) and are collinear.

7. The photovoltaic solder strip horizontal tinning device according to claim 6, wherein the distance between the outer die wire hole of the annular air knife (501) and the die hole of the right disc die (404) of the upper tin bath (402) is 3-10cm.

8. The photovoltaic solder strip horizontal tinning device according to claim 7, characterized in that the water cooling mechanism (6) comprises a lower water tank (601) and an upper water tank (602), wherein the projection of the upper water tank (602) on the horizontal plane is positioned in the projection of the lower water tank (601) on the horizontal plane, the upper water tank (602) is arranged above the lower water tank (601), a first vertical wire passing wheel (603) is arranged in the upper water tank (602), and the first wire passing wheel (603) is immersed under the liquid surface of the upper water tank (602); the left side wall of the upper water tank (602) is provided with a wire inlet hole which is flush with the lowest point of the first wire passing wheel (603).

9. The photovoltaic solder strip horizontal tinning device according to claim 8, characterized in that a second temperature controller and a second heating pipe are arranged in the lower water tank (601), and the second temperature controller is electrically connected with a control switch of the second heating pipe; the water pump fixing frame is arranged on the lower water tank (601), the water pump is arranged on the water pump fixing frame, a water inlet of the water pump stretches into the lower water tank (601), and a water outlet of the water pump is positioned in the upper water tank (602).

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