CN112721418A - Screen printing non-mesh-junction screen plate and application thereof in aspect of conductive paste screen printing - Google Patents
Screen printing non-mesh-junction screen plate and application thereof in aspect of conductive paste screen printing Download PDFInfo
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- 238000007650 screen-printing Methods 0.000 title claims abstract description 112
- 238000007639 printing Methods 0.000 claims abstract description 39
- 239000002002 slurry Substances 0.000 claims abstract description 11
- 229920000728 polyester Polymers 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 25
- 229910052710 silicon Inorganic materials 0.000 claims description 25
- 239000010703 silicon Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 16
- 229910000831 Steel Inorganic materials 0.000 claims description 12
- 239000010959 steel Substances 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 27
- 229910052709 silver Inorganic materials 0.000 abstract description 27
- 239000004332 silver Substances 0.000 abstract description 27
- 229910021419 crystalline silicon Inorganic materials 0.000 abstract description 2
- 239000004642 Polyimide Substances 0.000 description 40
- 229920001721 polyimide Polymers 0.000 description 40
- 238000012360 testing method Methods 0.000 description 26
- 238000002474 experimental method Methods 0.000 description 20
- 239000004816 latex Substances 0.000 description 15
- 229920000126 latex Polymers 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 8
- 238000001000 micrograph Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000001878 scanning electron micrograph Methods 0.000 description 5
- 239000011267 electrode slurry Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- -1 silver-aluminum Chemical compound 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2200/00—Printing processes
- B41P2200/40—Screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/12—Screens
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/50—Screen printing machines for particular purposes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention relates to a non-mesh screen printing plate, in particular to a screen printing non-mesh screen printing plate and application thereof in screen printing of conductive paste, belonging to the field of crystalline silicon solar cells. A screen printing screen plate without screen knots for screen printing comprises a hollow frame body, a hollow polyester plate fixed in the hollow frame body, and a screen which is fixed with the hollow polyester plate by a connecting assembly and covers a hollow area, wherein a PI film layer is arranged on the printing surface of the screen, a plurality of openings for conductive slurry to pass through are arranged on the PI film layer, and the width of each opening is within the range of 16-18 microns. The invention also provides application of the non-screen-junction screen printing plate in screen printing of conductive paste, which aims at improving utilization efficiency of the silver paste and effectively reducing ineffective use of the silver paste.
Description
Technical Field
The invention relates to a non-mesh screen printing plate, in particular to a screen printing non-mesh screen printing plate and application thereof in screen printing of conductive paste, belonging to the field of crystalline silicon solar cells.
Background
The surface electrode of the conventional silicon solar cell is formed on a silicon substrate by conducting screen printing, drying and sintering on conductive slurry. The scraper extrudes the electrode slurry, the electrode slurry presents a reverse rolling state by means of the relative motion of the scraper face and the screen cloth, when the slurry moves to the electrode pattern area of the screen not blocked by the net film, the slurry penetrates through the meshes downwards to contact with a printing substrate (silicon wafer), and along with the forward movement of the scraper, the screen behind the scraper returns upwards due to the tension and the distance from the screen, so that the slurry is separated from the screen and attached to the printing substrate, and the purpose of printing is achieved. After sintering, the two-dimensional electrode grid line grid pattern is connected with the silicon wafer, so that a conductive socket from the P-N junction to an external load is formed.
The general silicon solar electrode slurry comprises silver paste, aluminum paste and silver-aluminum paste. Of these, silver paste is the most significant non-silicon cost, accounting for more than about 50% of the non-silicon cost. The utilization efficiency of the silver paste is improved, and the waste of the silver paste is reduced.
The electrode grid lines play a role in collecting and transmitting current on the surface of the solar cell. The smaller the resistance of the electrode grid lines, the larger the current, and the higher the cell generation efficiency. Because the line resistance of the grid line is determined by the thinnest place on the current channel, if the height and the width of the grid line are uneven and the amplitude is very large, the waste of silver consumption is caused. Under the condition of the same silver consumption, if the grid line is more even, the line resistance can be reduced, so that the silver paste with the same consumption can exert larger electrical performance, and the use efficiency of the electrode silver paste is improved. In addition, in order to improve the conversion efficiency of the solar cell, the shielding of the electrode grid lines from sunlight should be reduced as much as possible, and the electrode grid lines after printing should be as narrow as possible. Therefore, on the premise of the same silver consumption or cost, the printed electrode grid line needs to be as narrow and high as possible, and the grid line is flat and small in fluctuation.
The latex film silk screen is generally adopted in the prior printing process, but the common latex film silk screen has smaller tension, so that the situation of breaking the screen is easily caused under the strong extrusion of a scraper in the high-speed printing process, the production cost is high, and the production efficiency is reduced because the silk screen needs to be frequently replaced. The silk screen adopting the Polyimide (PI) film has the characteristics of large tension and strong recovery capability, well solves the problem of screen breakage, greatly prolongs the service life of the screen printing plate and reduces the production cost. Currently, PI film non-mesh screen printing plates are widely used in industry. However, in use, the electrode grid lines printed by the PI film non-mesh screen printing with a screen opening of 20 μm or more are prone to generate problems of broken lines, uneven line shapes and the like, and the use efficiency of electrode silver paste is affected, and the conversion efficiency of the battery is also affected.
Disclosure of Invention
The invention aims to provide a screen printing screen without mesh knots, which can promote thick film conductive paste to form superfine and smooth grid lines through PI film printing, so that the electrical property of a silicon solar cell is improved.
The invention also provides application of the non-screen-junction screen printing plate in screen printing of conductive paste, which aims at improving utilization efficiency of the silver paste and effectively reducing ineffective use of the silver paste.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a screen printing screen plate without screen knots for screen printing comprises a hollow frame body, a hollow polyester plate fixed in the hollow frame body, and a screen which is fixed with the hollow polyester plate by a connecting assembly and covers a hollow area, wherein a PI film layer is arranged on the printing surface of the screen, a plurality of openings for conductive slurry to pass through are arranged on the PI film layer, and the width of each opening is within the range of 16-18 microns.
At present, the problem that how to form superfine and smooth grid lines by PI film non-mesh screen printing plate screen printing needs to be solved. According to past experience, the problem of broken lines in printing needs to be solved by enlarging the opening of the screen printing plate in the conventional situation, and the problem is also verified from the use of the latex film and the screen printing plate with the net knot. The inventor tests and verifies that the opening formed by the PI film on the non-mesh screen printing plate and used for the conductive slurry to pass through is found unexpectedly that when the width of the opening is within the range of 16-18 microns, the printed grid line can be smoother, and the size fluctuation is small, so that the same or even higher electrical property is kept, the silver paste consumption of a single solar cell is reduced, and the use efficiency of the silver paste is improved; the technical effect breaks through the idea that the larger the opening size for the conductive paste on the screen printing plate is, the more conductive grid lines with small amplitude and high quality are formed.
Preferably, the length of the opening is 125-210 mm. The length of the opening is generally selected according to design requirements.
Preferably, the thickness of the PI film layer is 5-15 μm.
Preferably, the total thickness of the gauze body and the PI film layer is 20-35 μm.
Preferably, the gauze body is a steel wire mesh, and the mesh number of the steel wire mesh is 325-520 meshes.
Preferably, the diameter of the gauze body is 11-16 μm.
A printing device containing the screen printing plate without the net knots.
The application of the screen printing plate without the screen junction in the aspect of screen printing of conductive paste.
A screen printing process of conductive paste by using the screen-junction-free screen printing plate comprises the following steps:
s1, placing the silicon wafer plated with the silicon nitride film on the table top of a printing machine, placing the screen printing plate without the net knots above the silicon wafer, namely the position of the screen printing plate of the machine table, and adjusting the distance between the screen printing plate and the silicon wafer to ensure that the screen printing plate is just contacted with the silicon wafer;
s2, installing a scraper on the machine, placing the slurry between the scraper and the screen printing plate, setting the printing speed at 300-500mm/S and the printing pressure at 30-60N, and printing the graph;
and S3, drying and sintering the printed silicon wafer.
Compared with the prior art, the invention has the outstanding advantages that: the silver paste consumption is saved, and the utilization efficiency of the silver paste is improved. In the prior art, a screen printing plate with openings of 22-24 microns is generally adopted, the width of a grid line obtained by printing is wider, the wider grid line can shield the incident sunlight, the light absorption rate is reduced, and the linear fluctuation of the grid line in industrial production is larger. The electrical performance of the battery is mainly determined by the shortest and narrowest grid lines, so that the parts of the grid lines beyond the shortest and narrowest grid lines contribute extremely limited to the electrical performance. According to the invention, the non-mesh screen printing plate with the opening width of 16-18 microns is adopted, so that the grid line obtained by printing is smoother and has small fluctuation, the silver paste consumption of a single solar cell is reduced on the basis of keeping the same or even higher electrical performance, and the use efficiency of the silver paste is improved.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of one embodiment of a screen printing plate without mesh knots for screen printing provided by the invention;
FIG. 2 is a schematic cross-sectional view of a screen printing plate without mesh knots for screen printing according to the present invention;
FIG. 3 is a schematic view of a portion of the enlarged structure at A in FIG. 1;
description of reference numerals: the device comprises a hollow frame body 1, a hollow polyester plate 2, a gauze body 3, a PI film layer 4 and an opening 5;
FIG. 4 is a grid line electron microscope image (600 times) obtained by experiment 1 in the PI film non-mesh-junction screen printing plate grid line height amplitude fluctuation test along with the opening, wherein A, B, C, D are respectively opening grid lines of 16 μm, 18 μm, 20 μm and 22 μm, the upper left is a top view of the height of the grid line, the lower left is a grid line height fluctuation image, and the right is a top view of the width of the grid line;
FIG. 5 is a grid line electron microscope image (600 times) obtained by experiment 2 in the PI film non-mesh-junction screen printing plate grid line height amplitude fluctuation test along with the opening, wherein A, B, C, D are respectively opening grid lines of 16 μm, 18 μm, 20 μm and 22 μm, the upper left is a top view of the height of the grid line, the lower left is a grid line height fluctuation image, and the right is a top view of the width of the grid line;
FIG. 6 is a grid line electron microscope image (600 times) obtained by experiment 3 in the PI film non-mesh-junction screen printing plate grid line height amplitude fluctuation test along with the opening, wherein A, B, C are respectively 14 μm, 16 μm and 18 μm opening grid lines, the upper left is a top view of the grid line height, the lower left is a grid line height fluctuation image, and the right is a top view of the grid line width;
FIG. 7 is a grid line electron microscope image (600 times) obtained by experiment 1 in the latex film non-mesh screen printing plate grid line height fluctuation test along with the opening of comparative example 1, wherein A, B, C are respectively 18 μm, 20 μm and 26 μm opening grid lines, the upper left is a top view of the grid line height, the lower left is a grid line height fluctuation image, and the right is a top view of the grid line width;
FIG. 8 is a grid line electron microscope image (600 times) obtained by experiment 2 in the latex film non-mesh screen printing plate grid line height fluctuation test according to comparative example 1 and the fluctuation test of the opening, wherein A, B, C are respectively opening grid lines with the sizes of 18 μm, 20 μm and 26 μm, the upper left is a top view of the grid line height, the lower left is a grid line height fluctuation graph, and the right is a top view of the grid line width;
FIG. 9 is a grid line electron microscope image (600 times) obtained by the fluctuation test of the grid line height of the latex film screen mesh screen plate with openings in comparative example 2 of the invention, wherein A, B, C, D are respectively the grid lines with openings of 24 μm, 26 μm, 28 μm and 30 μm, the upper left is a top view of the grid line height, the lower left is a grid line height fluctuation image, and the right is a top view of the grid line width;
fig. 10 is a grid line electron microscope image (600 times) obtained by the fluctuation test of the grid line height of the PI film screen mesh screen printing plate with the opening in comparative example 3 of the invention, wherein A, B, C, D, E are respectively the grid lines with openings of 24 μm, 26 μm, 28 μm, 30 μm and 32 μm, the upper left is a top view of the grid line height, the lower left is a grid line height fluctuation graph, and the right is a top view of the grid line width.
Detailed Description
The technical solution of the present invention will be further specifically described below by way of specific examples. It is to be understood that the practice of the invention is not limited to the following examples, and that any variations and/or modifications may be made thereto without departing from the scope of the invention.
In the present invention, all parts and percentages are by weight, unless otherwise specified, and the equipment and materials used are commercially available or commonly used in the art. The methods in the following examples are conventional in the art unless otherwise specified.
The core of the invention is to provide a screen printing screen without net knots, the structure diagram of one specific embodiment of which is shown in fig. 1, fig. 2 and fig. 3, which is called as a first specific embodiment, the screen comprises a hollow frame 1, a hollow polyester plate 2 fixed in the hollow frame 1, and a screen fixed with the hollow polyester plate 2 by a connecting component and covering the hollow area, the printing surface of the screen is provided with a PI film layer 4, the PI film layer 4 is provided with a plurality of openings 5 (simplified and expressed as "openings of the screen printing screen without net knots" in the following test verification), through which conductive paste passes, and the width of each opening is within the range of 16 μm to 18 μm.
Typically, the opening length is 125-210 mm. The thickness of the PI film layer 4 is 5-15 μm, and the total thickness of the gauze body 3 and the PI film layer 4 is 20-35 μm. The gauze body 3 is a steel wire mesh, the mesh number of the steel wire mesh is 325-520 meshes, and the wire diameter is 11-16 mu m.
In addition to the first embodiment, the structure of the screen printing non-mesh-junction screen plate is further improved to obtain the second embodiment, and the difference between the present embodiment and the above embodiments is that the width of each opening is 16 μm. The opening length is 156 mm. The thickness of the PI film layer 4 is 8 μm, and the total thickness of the gauze body 3 and the PI film layer 4 is 28 μm. The gauze body 3 is a steel wire mesh, the mesh number of the steel wire mesh is 430 meshes, and the wire diameter is 13 mu m.
In addition to the first embodiment, the structure of the screen printing non-mesh-junction screen plate is further improved to obtain a third embodiment, and the difference between the third embodiment and the first embodiment is that the width of each opening is 16 μm. The opening length is 200 mm. The thickness of the PI film layer 4 is 10 μm, and the total thickness of the gauze body 3 and the PI film layer 4 is 30 μm. The gauze body 3 is a steel wire mesh, the mesh number of the steel wire mesh is 350 meshes, and the wire diameter is 15 mu m.
In addition to the first embodiment, the structure of the screen printing non-mesh-junction screen plate is further improved to obtain a fourth embodiment, and the difference between the present embodiment and the above embodiments is that the width of each opening is 16 μm. The length of the opening is 125 mm. The thickness of the PI film layer 4 is 15 μm, and the total thickness of the gauze body 3 and the PI film layer 4 is 35 μm. The gauze body 3 is a steel wire mesh, the mesh number of the steel wire mesh is 500 meshes, and the wire diameter is 11 mu m.
In addition to the second embodiment, the structure of the screen printing non-mesh-junction screen plate is further improved to obtain the fifth embodiment, and the difference between the second embodiment and the first embodiment is that the width of each opening is 18 μm.
In addition to the second embodiment, the structure of the screen printing non-mesh-junction screen plate is further improved to obtain the sixth embodiment, and the difference between the present embodiment and the above embodiments is that the width of each opening is 17 μm.
In the above embodiments, the parameters of the opening length, the film thickness, the total thickness and the mesh number of the screen can be adjusted according to the application requirements.
Another core of the present invention is to provide a printing apparatus for screen printing of conductive paste, which includes the screen without mesh knots according to the first embodiment.
The invention also provides an application of the non-screen-junction screen printing plate in screen printing of conductive paste. The application is specifically described by the following examples or test examples.
Application example 1
A screen printing process of conductive paste by using the screen-junction-free screen printing plate comprises the following steps:
s1, placing the silicon wafer plated with the silicon nitride film on the table top of a printing machine, placing the screen printing plate without the net knots above the silicon wafer, namely the position of the screen printing plate of the machine table, and adjusting the distance between the screen printing plate and the silicon wafer to ensure that the screen printing plate is just contacted with the silicon wafer;
s2, installing a scraper on the machine, placing the slurry between the scraper and the screen printing plate, setting the printing speed at 300-500mm/S and the printing pressure at 30-60N, and printing the graph;
s3, the printed silicon slice is sent to a drying oven to be dried,
s4, turning over the dried silicon wafer, and repeating S1, S2 and S3;
and S5, feeding the silicon wafers with the front and back surfaces printed into a sintering furnace for sintering.
First, PI film non-mesh-junction screen printing plate grid line height amplitude fluctuation test along with opening
To verify the effect, the inventor carried out a PI film non-mesh-junction screen printing contrast experiment with different openings, which specifically comprises the following steps:
the specific process comprises the following steps: the PI film is a non-net-junction screen printing plate, is 430 meshes, has a line diameter of 13 mu m, a film thickness of 8 mu m and a total thickness of 28 mu m; printing speed 400m/s, pressure 45N.
The data obtained in test 1 are shown in Table 1. The SEM image (600 times) of the grid lines obtained in experiment 1 is shown in FIG. 4, wherein A, B, C, D are the open grid lines of 16 μm, 18 μm, 20 μm and 22 μm respectively. The top left of the figure is the top view of the height of the grid lines, the bottom left is the fluctuation graph of the height of the grid lines, and the right is the top view of the width of the grid lines (the same below).
TABLE 1
Note: height amplitude is (highest height-lowest height)/lowest height, and width amplitude is (maximum width-minimum width)/minimum width (same below).
According to the data in table 1, the amplitude fluctuation of the grid lines is reduced along with the reduction of the openings of the PI film mesh-free screen printing plate, meanwhile, the conversion efficiency of the battery piece under the opening of 16 micrometers is improved, the wet weight (the silver consumption of a single battery) is reduced, and the purposes of improving the use efficiency of the silver paste and improving the conversion efficiency of the battery are achieved.
The data obtained in test 2 are shown in Table 2. Experiment 2 uses different silver pastes to verify the results, and other experimental conditions are the same as experiment one. The SEM image (600 times) obtained in experiment 2 is shown in FIG. 5.
TABLE 2
As can be seen from the data in table 2, the height amplitude and the width amplitude of the gate line obtained by different silver pastes using different opening screen printing methods show the same variation trend as that of test 1.
The data obtained in test 3 are shown in Table 3. The SEM image (600 times) obtained in experiment 3 is shown in FIG. 6.
TABLE 3
From the test results in table 3, it can be seen that the grid lines have large fluctuation and the minimum height of the grid lines is close to 4 μm when a smaller screen with 14 μm openings is selected. In large-scale production application, the height of the grid line has points lower than 4 mu m, and the reject ratio of products can be greatly improved, so that the mesh-free screen printing plate with openings below 14 mu m has no practical significance.
The size of the openings of the non-mesh screen is set to be 16-18 μm for optimum selection.
Comparative example 1 fluctuation test of height of grid line of latex film non-mesh screen printing plate along with opening
In order to verify whether the conclusion (when the opening of the screen is set to be 16-18 μm, the grid line obtained by printing is smoother and has small fluctuation) is suitable for the latex film non-net-knot screen, the inventor performs a fluctuation test of the height of the grid line of the latex film non-net-knot screen along with the opening, and detects the size and fluctuation of the obtained grid line when the opening of the screen is 18 μm, 20 μm and 26 μm respectively.
the specific process comprises the following steps: the latex film is a non-net-bonded screen printing plate, 400 meshes, 16 mu m of wire diameter, 13 mu m of film thickness and 38 mu m of total thickness; the printing speed was 400m/s and the pressure was 60N.
The data obtained for run 1 and run 2 are shown in tables 4 and 5, respectively. The sem images (600 x) obtained in experiment 1 and experiment 2 are shown in fig. 7 and fig. 8, respectively.
TABLE 4
TABLE 5
According to the test results, the larger the opening of the latex film non-net-junction screen plate is, the smaller the amplitude is, and the higher the grid line quality is. The conclusion is opposite to that obtained under the PI film screen printing plate without net knots; this conclusion is in accordance with what is known in the prior art.
Comparative example 2 fluctuation test of height of grid line of latex film screen mesh screen along with opening
In order to verify whether the conclusion (when the opening of the screen is set to be 16-18 μm, the grid line obtained by printing is smoother and has small fluctuation) is suitable for the screen with the screen knots of the latex film, the inventor performs a fluctuation test of the height of the grid line of the screen with the screen knots along with the opening, and detects the size and fluctuation of the grid line when the opening of the screen is 24 μm, 26 μm, 28 μm and 30 μm respectively.
The specific process comprises the following steps: the latex film is provided with a net-knot screen plate, 430 meshes, 13 mu m of wire diameter, 8 mu m of film thickness and 28 mu m of total thickness; printing speed 400m/s, pressure 45N. The results are shown in Table 6, and the SEM image (600 times) obtained is shown in FIG. 9.
TABLE 6
The comparative experiment was designed with screen openings selected between 24 μm and 30 μm, since the inking of the screen with screen knots is worse. It can be seen from the test results in table 6 that the larger the screen opening, the smaller the amplitude, and the higher the grid line quality. The conclusion is opposite to that obtained under the condition that the PI film has no net knots; this conclusion is in accordance with what is known in the prior art.
In the experiment, the lowest line height of the grid line is generally lower, and the opening of the latex film with the net-knot screen plate is generally more than 30 micrometers in large-scale production application.
Comparative example 3, fluctuation test of grid line height of PI film screen printing plate with net knots along with opening
In order to verify whether the conclusion (when the opening of the screen is set to be 16-18 μm, the grid line obtained by printing is smoother and has small fluctuation) is applicable to the PI film screen with the net knots, the inventor performs a fluctuation test of the height of the grid line of the PI film screen with the net knots along with the opening, and detects the sizes and the fluctuation of the grid line when the opening of the screen is 24 μm, 26 μm, 28 μm, 30 μm and 32 μm respectively.
The specific process comprises the following steps: the PI film is provided with a net-knot screen plate, 430 meshes, 13-micron line diameter, 8-micron film thickness and 28-micron total thickness; printing speed 400m/s, pressure 45N. The test results are shown in Table 7, and the obtained SEM image (600 times) is shown in FIG. 10.
TABLE 7
For the PI film screen printing plate with the mesh knots, the larger the opening is, the smaller the amplitude is, and the higher the grid line quality is. The conclusion is opposite to that obtained under the condition that the PI film has no net knots; this conclusion is in accordance with what is known in the prior art.
In conclusion, when the opening of the PI film non-mesh-junction screen printing plate is changed within the size range of 16-18 microns, the PI film non-mesh-junction screen printing plate has the advantages of reducing the amplitude of grid lines, reducing the using amount of silver paste and improving the conversion efficiency of a battery. Similarly, the conductive paste silk-screen printing process of the non-screen-junction screen printing plate can reduce the use amount of the silver paste and improve the conversion efficiency of the battery.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The screen printing non-mesh-junction screen printing plate and the application thereof in the aspect of conductive paste screen printing are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (9)
1. The utility model provides a screen printing does not have net knot half tone, half tone include cavity framework (1), be fixed in cavity polyester board (2) in cavity framework (1), fix and cover the gauze in cavity region with hollow polyester board (2) with the help of coupling assembling, its characterized in that: the printing surface of the gauze is provided with a PI film layer (4), the PI film layer (4) is provided with a plurality of openings (5) for the conductive slurry to pass through, and the width of each opening is within the range of 16-18 mu m.
2. The screen printing screen-bonding-free plate according to claim 1, wherein: the opening length is 125-210 mm.
3. The screen printing screen-bonding-free plate according to claim 1, wherein: the thickness of the PI film layer (4) is 5-15 μm.
4. The screen printing screen-bonding-free plate according to claim 1, wherein: the total thickness of the gauze body (3) and the PI film layer (4) is 20-35 μm.
5. The screen printing screen-bonding-free plate according to claim 1, wherein: the gauze body (3) is a steel wire mesh, and the mesh number of the steel wire mesh is 325-520 meshes.
6. The screen printing screen-bonding-free plate according to claim 1, wherein: the wire diameter of the gauze body (3) is 11-16 mu m.
7. A printing apparatus comprising the knotless screen of claim 1.
8. Use of the non-screen-junction screen printing plate of claim 1 in screen printing of conductive pastes.
9. A screen printing process using the conductive paste of the screen-bond-free printing plate of claim 1, characterized in that the process comprises the steps of:
s1, placing the silicon wafer plated with the silicon nitride film on the table top of a printing machine, placing the screen printing plate without the net knots above the silicon wafer, namely the position of the screen printing plate of the machine table, and adjusting the distance between the screen printing plate and the silicon wafer to ensure that the screen printing plate is just contacted with the silicon wafer;
s2, installing a scraper on the machine, placing the slurry between the scraper and the screen printing plate, setting the printing speed at 300-500mm/S and the printing pressure at 30-60N, and printing the graph;
and S3, drying and sintering the printed silicon wafer.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113665232A (en) * | 2021-08-23 | 2021-11-19 | 包头市山川圣阳热能科技有限公司 | Silver paste silk screen printing plate, electrothermal film manufacturing method and electrothermal film |
| CN115534502A (en) * | 2021-06-30 | 2022-12-30 | 晶科能源(海宁)有限公司 | Screen printing screen, forming method of solar cell electrode and solar cell |
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2020
- 2020-12-23 CN CN202011537784.3A patent/CN112721418A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115534502A (en) * | 2021-06-30 | 2022-12-30 | 晶科能源(海宁)有限公司 | Screen printing screen, forming method of solar cell electrode and solar cell |
| CN115534502B (en) * | 2021-06-30 | 2024-05-28 | 晶科能源(海宁)有限公司 | Screen printing screen, method for forming solar cell electrode and solar cell |
| CN113665232A (en) * | 2021-08-23 | 2021-11-19 | 包头市山川圣阳热能科技有限公司 | Silver paste silk screen printing plate, electrothermal film manufacturing method and electrothermal film |
| CN113665232B (en) * | 2021-08-23 | 2022-09-02 | 包头市山川圣阳热能科技有限公司 | Silver paste silk screen printing plate, electrothermal film manufacturing method and electrothermal film |
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