CN220913619U - Heat radiation structure of CPU radiator - Google Patents

Heat radiation structure of CPU radiator Download PDF

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Publication number
CN220913619U
CN220913619U CN202322899328.9U CN202322899328U CN220913619U CN 220913619 U CN220913619 U CN 220913619U CN 202322899328 U CN202322899328 U CN 202322899328U CN 220913619 U CN220913619 U CN 220913619U
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heat dissipation
radiating
base
cpu
plane
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CN202322899328.9U
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陈杭彬
陈纯彬
谢晓漫
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Jieyang Fengying Technology Co ltd
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Jieyang Fengying Technology Co ltd
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Abstract

The utility model relates to the technical field of radiators, in particular to a radiating structure of a CPU radiator, which comprises a radiating base, radiating fins and radiating pipes, wherein a mounting cavity is arranged in the radiating base, two ends of each radiating pipe respectively penetrate through the mounting cavity and are connected with the radiating base, the radiating fins are respectively assembled on two ends of each radiating pipe, at least two sides of a connecting part of each radiating pipe and the radiating base are arranged in a plane, and at least two parts of the radiating pipes positioned in the radiating base are arranged into square structures, so that two adjacent groups of radiating pipes are mutually attached through planes arranged on two sides of each radiating pipe.

Description

Heat radiation structure of CPU radiator
Technical Field
The utility model relates to the technical field of radiators, in particular to a radiating structure of a CPU radiator.
Background
The CPU radiator is mainly used for radiating heat of the CPU, a large amount of heat can be generated in the working process of the CPU of the computer, the dead halt caused by heating of the computer can be avoided by timely radiating the heat, the CPU can be protected from being burnt, and the radiator plays a decisive role in the stable operation of the CPU.
In order to improve the heat dissipation performance of the radiator, the CPU radiator is usually provided with a plurality of groups of radiating pipes, the plurality of groups of radiating pipes are sequentially arranged along the mounting cavity of the heat dissipation base, the radiating pipes of the existing CPU radiator are of a round structure, the transverse length of the bottom formed by the plurality of groups of radiating pipes which are sequentially arranged is larger than that of the CPU of the computer, the left side and the right side of the radiating pipe group usually exceed the core heating area of the CPU area of the main board, the radiating area is relatively dispersed, the heat dissipation effect exerted by the left side and the right side of the radiating pipe group is relatively poor, and heat dissipation resource waste is caused, so that the existing CPU radiator needs to be further improved.
Disclosure of Invention
The utility model aims to provide a heat dissipation structure of a CPU heat sink, which is designed for solving at least one technical problem in the background art.
In order to achieve the above purpose, the present utility model adopts the following scheme: the utility model provides a heat radiation structure of CPU radiator, includes heat dissipation base, fin and cooling tube, be provided with the installation cavity in the heat dissipation base, the both ends of cooling tube pass the installation cavity respectively and are connected with the heat dissipation base, the fin is assembled respectively on the both ends of cooling tube, the both sides of cooling tube and the part that is connected with the heat dissipation base are plane setting at least.
The heat dissipation base comprises an upper heat dissipation base and a lower heat dissipation base, wherein an upper groove is formed in the upper heat dissipation base, a lower groove is formed in the lower heat dissipation base, and the upper heat dissipation base and the lower heat dissipation base are relatively combined to form an installation cavity.
Wherein, two adjacent groups the cooling tube is laminated mutually through setting up the plane on one cooling tube side and setting up the plane on another cooling tube side and laminating mutually in proper order and arrange the setting.
Wherein, the radiating pipe is provided with lower plane portion with radiating base looks junction portion one side down at least.
The bottom surface of the lower radiating seat lower groove is arranged in a plane, and the lower plane part of the radiating pipe is attached to the bottom surface of the lower radiating seat lower groove.
Wherein, the radiating pipe is provided with upper plane portion with the one side that the radiating base is connected up at least.
The bottom surface of the upper radiating seat upper groove is arranged in a plane, and the upper plane part of the radiating tube is attached to the bottom surface of the upper radiating seat upper groove.
Wherein the straight section of the radiating pipe is square or rectangular.
Wherein, the lateral length of upper recess phase-match the lateral length of lower recess.
The planes arranged on the two side surfaces of the radiating pipe are respectively arranged in a manner of being perpendicular to the bottom surface of the lower groove of the radiating base or are arranged in a manner of being perpendicular to each other.
The radiator has the advantages that the part of the radiating pipes positioned in the radiating base is of the square structure, so that two adjacent groups of radiating pipes are mutually attached through the planes arranged on the two sides of the radiating pipes, the transverse length of the radiating bottom surface formed by the plurality of groups of radiating pipes which are sequentially arranged can be further reduced.
Drawings
FIG. 1 is a schematic perspective view of a heat dissipating structure of a CPU heat sink;
FIG. 2 is a schematic top view of a heat dissipating structure of a CPU heat sink;
FIG. 3 is a schematic cross-sectional view of A-A of FIG. 2;
FIG. 4 is a schematic perspective view of a radiator;
Fig. 5 is a schematic perspective view of a radiating pipe;
fig. 6 is a left-view structural schematic diagram of a radiating pipe;
FIG. 7 is a schematic cross-sectional view of B-B of FIG. 6;
FIG. 8 is a schematic perspective view of a heat dissipation base;
FIG. 9 is a schematic diagram of a front view of a heat dissipation base;
the components in the drawings are marked as follows:
1-a heat dissipation base; 11-mounting a cavity; 12-an upper heat dissipation seat; 13-a lower heat dissipation seat; 14-upper groove; 15-a lower groove; 2-heat sink; 3-radiating pipes; 31-lower planar portion; 32-upper planar portion.
Detailed Description
Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so as to provide an intuitive and visual understanding of each technical feature and overall solution of the present utility model, but are not to be construed as limiting the scope of the present utility model.
In the description of the present utility model, if an orientation description such as "upper", "lower", "front", "rear", "left", "right", etc. is referred to, it is merely for convenience of description and simplification of the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the utility model. When a feature is referred to as being "disposed," "secured" or "connected" to another feature, it can be directly disposed, secured or connected to the other feature or it can be indirectly disposed, secured or connected to the other feature.
In the description of the present utility model, if "a number" is referred to, it means one or more, if "a number" is referred to, it means two or more, if "greater than", "less than", "exceeding" is referred to, it is to be understood that the number is not included, and if "above", "below", "within" is referred to, it is understood that the number is included. If reference is made to "first", "second" it is to be understood as being used for distinguishing technical features and not as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Furthermore, unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Examples: as shown in fig. 1-9, a heat dissipation structure of a CPU heat dissipation device includes a heat dissipation base 1, heat dissipation fins 2 and heat dissipation tubes 3, wherein a mounting cavity 11 is provided in the heat dissipation base 1, two ends of the heat dissipation tubes 3 respectively pass through the mounting cavity 11 and are connected with the heat dissipation base 1, the heat dissipation fins 2 are respectively assembled on two ends of the heat dissipation tubes 3, two sides of a connection portion of the heat dissipation tubes 3 at least with the heat dissipation base 1 are arranged in a plane, two adjacent groups of heat dissipation tubes are mutually attached through the planes arranged on two sides of the heat dissipation tubes, and the transverse length of a heat dissipation bottom surface formed by a plurality of groups of heat dissipation tubes arranged in sequence can be further reduced, so that the heat dissipation tubes are concentrated in a core heat generation area of a CPU area of a motherboard, the heat dissipation functions of the plurality of groups of heat dissipation tubes can be exerted, and the heat dissipation performance of the heat dissipation device is improved.
The heat dissipation base 1 comprises an upper heat dissipation base 12 and a lower heat dissipation base 13, wherein an upper groove 14 is formed in the upper heat dissipation base 12, a lower groove 15 is formed in the lower heat dissipation base 13, the upper heat dissipation base 12 and the lower heat dissipation base 13 are oppositely combined to form an installation cavity 11, and the heat dissipation base plays a role in heat conduction.
The upper radiating seat is arranged on two sides of the upper groove, and the lower radiating seat is embedded in the yielding parts of the upper radiating seat.
The heat dissipation pipes are arranged in a laminated mode sequentially to form a heat dissipation bottom surface.
The left end face of the radiating tube is a left plane portion, the right end face of the radiating tube is a right plane portion, and two adjacent groups of radiating tubes are arranged in a mutually-attached mode through the left plane portion and the right plane portion.
The inner left side face and the inner right side face of the installation cavity are arranged in a plane, the left plane portion of the radiating tube is attached to the inner left side face of the installation cavity, and the right plane portion of the radiating tube is attached to the inner right side face of the installation cavity.
Wherein, two adjacent groups the cooling tube 3 is laminated mutually and is arranged in proper order through setting up the plane on its cooling tube 3 side and setting up the plane on another cooling tube 3 side and laminating mutually, for the cooling tube concentrates more in the core heating zone of mainboard CPU region, can further reduce the horizontal length of the radiating bottom surface that the cooling tube that the multiunit arranged in proper order formed, makes multiunit cooling tube homoenergetic play the heat dissipation function, improves the heat dispersion of radiator.
Wherein, the lower plane part 31 is arranged on at least the downward surface of the part of the radiating tube 3 connected with the radiating base 1.
The bottom surface of the lower groove 15 of the lower heat dissipation seat 13 is arranged in a plane, and the lower plane portion 31 of the heat dissipation tube 3 is attached to the bottom surface of the lower groove 15 of the lower heat dissipation seat 13, so that the bottom surface of the heat dissipation tube is more concentrated in a core heat generation area of the CPU area, and the contact area with the core heat generation area is larger, and the heat dissipation performance is improved.
Wherein, the upper plane part 32 is arranged on at least one surface of the radiating pipe 3 which is connected with the radiating base 1 and faces upwards.
The bottom surface of the upper groove 14 of the upper heat dissipation seat 12 is disposed in a plane, and the upper plane portion 32 of the heat dissipation tube 3 is disposed in a fitting manner with the bottom surface of the upper groove 14 of the upper heat dissipation seat 12.
The straight section of the radiating pipe 3 is square or rectangular, so that the radiating pipe is more concentrated in a core heating area of a CPU area of the main board, and the radiating performance of the radiator is improved.
Wherein the lateral length of the upper groove 14 matches the lateral length of the lower groove 15.
The planes arranged on the two side surfaces of the radiating pipe 3 are respectively arranged in a manner of being perpendicular to the bottom surface of the lower groove 15 of the radiating base 1 or in a manner of being perpendicular to each other, so that the radiating pipe is more concentrated in a core heating area of a CPU area of the main board, and the radiating performance of the radiator is improved.
According to the radiator, the radiating pipes are at least partially arranged in the radiating base and are of square structures, so that two adjacent groups of radiating pipes are mutually attached through planes arranged on two sides of the radiating pipes, the transverse length of the radiating bottom surface formed by the plurality of groups of radiating pipes which are sequentially arranged can be further reduced.
While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a heat radiation structure of CPU radiator, includes heat dissipation base, fin and cooling tube, be provided with the installation cavity in the heat dissipation base, the both ends of cooling tube pass the installation cavity respectively and are connected with the heat dissipation base, the fin is assembled respectively on the both ends of cooling tube, its characterized in that: the radiating pipes are arranged on the two side surfaces of the connecting part of the radiating base at least in a plane.
2. The heat dissipation structure of a CPU heat sink as claimed in claim 1, wherein: the heat dissipation base comprises an upper heat dissipation base and a lower heat dissipation base, wherein an upper groove is formed in the upper heat dissipation base, a lower groove is formed in the lower heat dissipation base, and the upper heat dissipation base and the lower heat dissipation base are oppositely combined to form an installation cavity.
3. The heat dissipation structure of a CPU heat sink as claimed in claim 1, wherein: two adjacent groups of radiating pipes are sequentially laminated and arranged through the lamination of a plane arranged on one radiating pipe side surface and a plane arranged on the other radiating pipe side surface.
4. The heat dissipation structure of a CPU heat sink as claimed in claim 2, wherein: the radiating pipe is provided with a lower plane part at least on the downward face of the connecting part of the radiating pipe and the radiating base.
5. The heat dissipation structure of a CPU heat sink as claimed in claim 4, wherein: the bottom surface of lower radiating seat lower recess is the plane setting, the lower plane portion of cooling tube sets up with the laminating mutually of the bottom surface of lower radiating seat lower recess.
6. The heat dissipation structure of a CPU heat sink as claimed in claim 2, wherein: the radiating pipe is provided with an upper plane part at least on the upward side of the connecting part of the radiating base.
7. The heat dissipation structure of a CPU heat sink as defined in claim 6, wherein: the bottom surface of last radiating seat upper groove is the plane setting, the upper plane portion of cooling tube sets up with the laminating mutually of the bottom surface of last radiating seat upper groove.
8. The heat dissipation structure of a CPU heat sink as claimed in claim 1, wherein: the straight section of the radiating pipe is square or rectangular.
9. The heat dissipation structure of a CPU heat sink as claimed in claim 2, wherein: the transverse length of the upper groove is matched with that of the lower groove.
10. A heat dissipation structure of a CPU heat sink according to any one of claims 1 to 9, wherein: the planes arranged on the two side surfaces of the radiating pipe are respectively arranged in a manner of being perpendicular to the bottom surface of the lower groove of the radiating base or are arranged in a manner of being perpendicular to each other.
CN202322899328.9U 2023-07-12 2023-10-27 Heat radiation structure of CPU radiator Active CN220913619U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202321829199 2023-07-12
CN202321829199X 2023-07-12

Publications (1)

Publication Number Publication Date
CN220913619U true CN220913619U (en) 2024-05-07

Family

ID=90912424

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322899328.9U Active CN220913619U (en) 2023-07-12 2023-10-27 Heat radiation structure of CPU radiator

Country Status (1)

Country Link
CN (1) CN220913619U (en)

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