CN219958174U - Horizontal CPU radiator structure - Google Patents
Horizontal CPU radiator structure Download PDFInfo
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- CN219958174U CN219958174U CN202320956821.7U CN202320956821U CN219958174U CN 219958174 U CN219958174 U CN 219958174U CN 202320956821 U CN202320956821 U CN 202320956821U CN 219958174 U CN219958174 U CN 219958174U
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- Prior art keywords
- fin group
- copper pipe
- overhanging
- heat
- heat conduction
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 97
- 229910052802 copper Inorganic materials 0.000 claims abstract description 97
- 239000010949 copper Substances 0.000 claims abstract description 97
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 60
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A horizontal CPU radiator structure relates to the technical field of radiators, and comprises an aluminum seat; a copper bottom; the heat conduction copper pipe group comprises a plurality of heat conduction copper pipes penetrating through the aluminum seat, each heat conduction copper pipe comprises a heat conduction copper pipe-aluminum seat contact part and a heat conduction copper pipe overhanging part, each heat conduction copper pipe-aluminum seat contact part is arranged in the aluminum seat side by side, each heat conduction copper pipe overhanging part comprises a first overhanging part and a second overhanging part which are arranged above the aluminum seat in a crossing way, and each first overhanging part and each second overhanging part respectively form an upper layer region and a lower layer region for heat dissipation; the upper fin group is arranged on the first overhanging part; the lower fin group is arranged on the second overhanging part; and the two groups of fans are respectively arranged on the upper fin group and the lower fin group and are used for blowing off heat on the upper fin group and the lower fin group. By adopting the technical scheme, the heat dissipation requirement can be met while the attractiveness is emphasized, the competitiveness of the product is improved, and the market popularization prospect is good.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a horizontal CPU radiator structure.
Background
The radiator consists of an aluminum seat, a copper bottom, a heat conducting copper pipe and radiating fins, and heat generated by the CPU is transferred into the heat conducting copper pipe from the copper bottom of the radiator and then transferred onto the radiating fins from the heat conducting copper pipe, so that the radiating effect is achieved. With the development of computer hardware technology, a higher aesthetic requirement is put on the appearance of a computer host. Wherein fan re-creation is an important means of beautifying the appearance of the host.
The radiator fan is usually mounted on a vertical plane where the fan is mounted on the edge of the radiator fin facing away from the copper bottom. The horizontal CPU radiator has the advantages that the radiating fins are perpendicular to the main board, so that the fan can be parallel to the main board and face the outer side of the case, and the effect of intuitively showing the recreating result of the fan to a user is achieved. And the air blown by the fan blows to the main board, so that heat on the main board can be taken away, and the service life of elements on the main board is prolonged.
At present, the structure of the existing horizontal radiator is relatively simple, and the quantity of heat conduction copper tubes in the radiator is small, so that the radiating effect is poor. It is necessary to provide a new horizontal radiator structure, which can satisfy the heat dissipation requirement while paying attention to the beauty.
Disclosure of Invention
The utility model aims to improve the phenomena that the number of heat conduction copper pipes in a horizontal radiator in the prior art is small, the heat radiation effect is poor and the attractive appearance is considered as a part, and provides a horizontal CPU radiator structure.
The technical scheme adopted by the utility model is as follows: a horizontal CPU heatsink structure comprising: the aluminum seat is arranged on the CPU; the copper bottom is arranged at the bottom side of the aluminum seat and is in butt joint with the CPU and used for transferring heat generated by the CPU; the heat conduction copper pipe group comprises a plurality of heat conduction copper pipes penetrating through the aluminum seat, wherein each heat conduction copper pipe comprises a heat conduction copper pipe-aluminum seat contact part and a heat conduction copper pipe overhanging part, each heat conduction copper pipe-aluminum seat contact part is arranged in the aluminum seat side by side, each heat conduction copper pipe overhanging part comprises a first overhanging part and a second overhanging part which are arranged above the aluminum seat in a crossing way, and each first overhanging part and each second overhanging part respectively form an upper layer region and a lower layer region for heat dissipation; the upper fin group is arranged on the first overhanging part and is positioned in the upper region; the lower fin group is arranged on the second overhanging part and is positioned in the lower area; and the two groups of fans are respectively arranged on the upper fin group and the lower fin group and are used for blowing off heat on the upper fin group and the lower fin group.
Further, the heat conduction copper pipe and the aluminum seat contact part comprise a first copper pipe arranged on two sides of the aluminum seat and a plurality of second copper pipe groups arranged between the two first copper pipes side by side, the two first copper pipes are symmetrically arranged on two sides of the aluminum seat, the second copper pipe groups comprise two second copper pipes, the sections of the two second copper pipes are respectively semi-elliptic in the left-right direction, and the two semi-elliptic in the left-right direction can be matched to form a complete ellipse.
Further, the first overhanging portion and the second overhanging portion are respectively communicated with the left end and the right end of the contact portion of the heat conduction copper pipe and the aluminum seat, the first overhanging portion extends obliquely upwards along the direction away from the aluminum seat and then is bent above the aluminum seat, and one end of the second overhanging portion away from the contact portion of the heat conduction copper pipe and the aluminum seat is bent between the aluminum seat and the first overhanging portion.
Further, the first extending part and the second extending part are respectively in interference penetrating manner in the upper fin group and the lower fin group.
Further, the upper layer fin group comprises a plurality of large heat dissipation fins which are vertically arranged, the lower layer fin group comprises a plurality of small heat dissipation fins which are vertically arranged, through holes for the first overhanging parts and the second overhanging parts to penetrate through are respectively formed in the large heat dissipation fins and the small heat dissipation fins, and heat dissipation gaps are respectively formed between the adjacent large heat dissipation fins and between the adjacent small heat dissipation fins.
Further, the upper layer fin group and the lower layer fin group further comprise a plurality of large connecting fins and small connecting fins which are vertically arranged, round holes for the first overhanging parts and the second overhanging parts to penetrate through are respectively formed in the large connecting fins and the small connecting fins, the large connecting fins are located in the middle of the upper layer fin group, and the small connecting fins are located in the middle of the lower layer fin group.
After the technical scheme is adopted, the utility model has the beneficial effects that: according to the utility model, the sections of the two second heat conduction pipes in the second heat conduction pipe group are made into two semi-ellipses in the left-right direction, so that more heat conduction copper pipes can be penetrated in an aluminum seat with a certain size, thereby improving the heat dissipation effect of the horizontal CPU heat sink, the first overhanging part and the second overhanging part are arranged above the aluminum seat in a crossing way to form an upper layer area and a lower layer area, and the upper layer fin group, the lower layer fin group and the fan are matched, so that the heat in the upper layer fin group and the lower layer fin group can be quickly blown away by the fan, thereby further improving the heat dissipation effect, the wind of the fan can be blown to a main board to dissipate heat for elements on the main board, prolonging the service life of the main board, simultaneously, the upper layer area and the lower layer area have certain three-dimensional aesthetic feeling, realizing importance on aesthetic feeling while meeting the heat dissipation requirement, and improving the competitive power of products, and having better market popularization prospect.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic view of the overall structure of the present embodiment;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is a schematic diagram showing the fit relationship between a heat conduction copper pipe and a copper bottom;
figure 4 is a cross-sectional view of a copper base for embodying a first copper tube and a second copper tube;
FIG. 5 is another view of the view of FIG. 1;
FIG. 6 is a display view of FIG. 5 with the fan removed;
fig. 7 is a schematic diagram for showing the mating relationship between the fan and the wire buckle.
Reference numerals illustrate: 10. an aluminum seat; 11. a copper bottom; 12. a mounting plate; 13. a bolt; 14. a mounting groove; 15. an abutment groove; 20. a heat conducting copper pipe; 21. a contact part of the heat conduction copper pipe and the aluminum seat; 211. a first copper tube; 212. a second copper tube; 22. an overhanging portion of the heat conducting copper pipe; 221. a first overhanging portion; 222. a second extension; 23. an upper layer region; 24. a lower layer region; 25. an upper fin group; 251. large heat dissipation fins; 26. a lower fin group; 261. small heat dissipation fins; 27. large connecting fins; 28. small connecting fins; 29. a fan; 30. a wire buckle; 31. a buckling groove.
Detailed Description
The utility model is described in further detail below with reference to fig. 1-7.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and those skilled in the art can make modifications to the present embodiment which do not contribute to the utility model as required after reading the present specification, but are protected by the patent laws within the scope of the appended claims.
The embodiment relates to a horizontal CPU radiator structure, referring to fig. 1 and 2, including an aluminum base 10 and a copper base 11 disposed at the bottom side of the aluminum base 10, wherein the aluminum base 10 is located above the CPU, the copper base 11 is welded and fixed at the bottom side of the aluminum base 10, the copper base 11 is abutted to the CPU, and the copper base 11 is used for transferring heat generated by the CPU. In addition, in order to facilitate the integral installation of the horizontal CPU radiator into the computer host, the aluminum base 10 is also provided with an installation plate 12, and both sides of the installation plate 12 are provided with bolts 13 for installation and fixation.
Referring to fig. 2 and 3, a mounting groove 14 is formed in the copper bottom 11, the mounting groove 14 penetrates through the left side and the right side of the copper bottom 11, a heat-conducting copper pipe set is penetrated in the mounting groove 14, an abutting groove 15 for being matched with the mounting groove 14 is formed in the aluminum base 10, and the heat-conducting copper pipe set, the aluminum base 10 and the copper bottom 11 are connected through welding, so that heat generated by a CPU is transferred to the copper bottom 11 and then transferred to the heat-conducting copper pipe set.
Referring to fig. 3 and 4, the heat conductive copper pipe group includes a plurality of heat conductive copper pipes 20 penetrating through the installation groove 12, the heat conductive copper pipes 20 include a heat conductive copper pipe and aluminum seat contact portion 21 and a heat conductive copper pipe overhanging portion 22, the heat conductive copper pipe and aluminum seat contact portion 21 includes two first copper pipes 211 disposed at both sides of the aluminum seat 10 and a plurality of second copper pipe groups disposed between the two first copper pipes 211 side by side, the two first copper pipes 211 are symmetrically disposed at both sides of the aluminum seat 10, and the cross sections of the two first copper pipes 211 are all circular. The second copper tube group comprises two second copper tubes 212, the sections of the two second copper tubes 212 are respectively half-ellipses in the left-right direction, and the two half-ellipses in the left-right direction can be matched to form a complete ellipse. Through the arrangement, more heat conduction copper pipes 20 can be arranged in the aluminum base 10 in a penetrating mode, and therefore the heat dissipation effect on the CPU is good.
The heat conducting copper pipe overhanging portion 22 comprises a first overhanging portion 221 and a second overhanging portion 222 which are arranged above the aluminum base 10 in a crossing way, wherein the first overhanging portion 221 and the second overhanging portion 222 are respectively communicated with the left end and the right end of the contact portion of the heat conducting copper pipe 20 and the aluminum base 10, the first overhanging portion 221 extends obliquely upwards along the direction away from the aluminum base 10 and then is bent above the aluminum base 10, and the end of the second overhanging portion 222, away from the contact portion of the heat conducting copper pipe 20 and the aluminum base 10, is bent upwards between the aluminum base 10 and the first overhanging portion 221, so that the first overhanging portion 221 and the second overhanging portion 222 can respectively form an upper layer region 23 and a lower layer region 24 for heat dissipation.
Referring to fig. 4 and 5, the first overhanging portion 221 and the second overhanging portion 222 are respectively provided with an upper fin set 25 and a lower fin set 26, the upper fin set 25 and the lower fin set 26 are respectively used for transferring heat on the first overhanging portion 221 and the second overhanging portion 222, the first overhanging portion 221 and the second overhanging portion 222 are respectively inserted into the upper fin set 25 and the lower fin set 26 in an interference manner, and the upper fin set 25 and the lower fin set 26 are respectively located in the upper area 23 and the lower area 24.
Referring to fig. 5 and 6, the upper fin group 25 includes a plurality of large heat dissipating fins 251 vertically disposed, the lower fin group 26 includes a plurality of small heat dissipating fins 261 vertically disposed, through holes for the first overhanging portion 221 and the second overhanging portion 222 to pass through are respectively formed on the large heat dissipating fins 251 and the small heat dissipating fins 261, and heat dissipating gaps are disposed between the adjacent large heat dissipating fins 251 and the adjacent small heat dissipating fins 261.
The upper fin set 25 and the lower fin set 26 further include a plurality of large connecting fins 27 and small connecting fins 28 which are vertically arranged, round holes for the first overhanging portion 221 and the second overhanging portion 222 to pass through are respectively formed in the large connecting fins 27 and the small connecting fins 28, the large connecting fins 27 are located in the middle of the upper fin set 25, and the small connecting fins 28 are located in the middle of the lower fin set 26. By arranging the large connecting fins 27 and the small connecting fins 28 in the middle of the upper fin group 25 and the lower fin group 26 respectively, the large connecting fins 27 and the small connecting fins 28 can form an installation area convenient for screwing the bolt 13 when the horizontal CPU radiator is installed in a computer host, so that the installation is simpler and more convenient.
Referring to fig. 5 and 7, in order to improve the heat dissipation efficiency of the upper fin group 25 and the lower fin group 26, fans 29 are disposed on the upper fin group 25 and the lower fin group 26, two fans 29 are fixedly installed on the top surfaces of the upper fin group 25 and the lower fin group 26, respectively, the two fans 29 are used for blowing heat on the upper fin group 25 and the lower fin group 26, respectively, and the two fans 29 are used for blowing air toward the heat dissipation gaps between the large heat dissipation fins 251 and the small heat dissipation fins 261, thereby improving the heat dissipation efficiency on the upper fin group 25 and the lower fin group 26.
In addition, the upper fin group 25 and the lower fin group 26 are each provided with a wire buckle 30 for fixing the fan 29. In the specific implementation process, the number of the wire buckles 30 arranged on the upper fin group 25 and the lower fin group 26 is two, the buckling grooves 31 are formed in the upper fin group 25 and the lower fin group 26, one side of the wire buckle 30 is hooked and matched with the fan 29, and the other side of the wire buckle 30 is buckled and fixed in the buckling grooves 31, so that the fan 29 is fixed.
The working principle of the utility model is approximately as follows: during heat dissipation, the cross sections of the two second copper pipes 212 in the second copper pipe group are made into two semi-ellipses in the left-right direction, so that more heat conduction copper pipes 20 can be arranged in the aluminum seat 10 with a certain size in a penetrating mode, the heat dissipation effect of the horizontal CPU heat radiator is improved, heat generated by the CPU can be transferred to the heat conduction copper pipe 20 group through the copper bottom 11 more quickly, the heat dissipation efficiency of the horizontal heat radiator is improved by arranging the first overhanging part 221 and the second overhanging part 222 above the aluminum seat 10 in a crossing mode, meanwhile, the upper fin group 25 and the lower fin group 26 are arranged on the first overhanging part 221 and the second overhanging part 222 in a penetrating mode, the two fans 29 are fixedly arranged on the upper fin group 25 and the lower fin group 26 respectively, and the heat transferred to the upper fin group 25 and the lower fin group 26 through the fans 29 is continuously blown in the upper fin group 26, the heat transferred to the upper fin group 25 and the lower fin group 26 can be quickly blown, the heat dissipation efficiency of the horizontal heat radiator is improved, the air of the fans 29 can be blown to the upper main board, the heat dissipation element is prolonged, the service life of the main board is prolonged, and the first overhanging part and the main board is more attractive, the heat dissipation requirements are met, and the two heat dissipation requirements are met, and the main board is also realized, and the heat dissipation requirements of the main board is attractive and the main board is achieved.
The above description is only for the purpose of illustrating the technical solution of the present utility model and not for the purpose of limiting the same, and other modifications and equivalents thereof by those skilled in the art should be included in the scope of the claims of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (6)
1. A horizontal CPU radiator structure, comprising:
an aluminum seat (10) arranged on the CPU;
the copper bottom (11) is arranged at the bottom side of the aluminum seat (10), is abutted with the CPU and is used for transferring heat generated by the CPU;
the heat conduction copper pipe group comprises a plurality of heat conduction copper pipes (20) penetrating through the aluminum seat (10), each heat conduction copper pipe (20) comprises a heat conduction copper pipe and aluminum seat contact part (21) and a heat conduction copper pipe overhanging part (22), each heat conduction copper pipe and aluminum seat contact part (21) are arranged in the aluminum seat (10) side by side, each heat conduction copper pipe overhanging part (22) comprises a first overhanging part (221) and a second overhanging part (222) which are arranged above the aluminum seat (10) in a crossing way, and each first overhanging part (221) and each second overhanging part (222) respectively form an upper layer region (23) and a lower layer region (24) for heat dissipation;
an upper fin group (25) disposed on the first overhanging portion (221), the upper fin group (25) being located in the upper region (23);
a lower fin set (26) disposed on the second extension (222), the lower fin set (26) being located within a lower region (24);
and the two groups of fans (29) are respectively arranged on the upper fin group (25) and the lower fin group (26) and are used for blowing off the heat on the upper fin group (25) and the lower fin group (26).
2. The horizontal CPU radiator structure according to claim 1, wherein the heat conducting copper pipe and aluminum base contact portion (21) includes a first copper pipe (211) disposed on two sides of the aluminum base (10) and a plurality of second copper pipe groups disposed between the two first copper pipes (211) side by side, the two first copper pipes (211) are symmetrically disposed on two sides of the aluminum base (10), the second copper pipe groups include two second copper pipes (212), the cross sections of the two second copper pipes (212) are respectively semi-ellipses in the left-right direction, and the two semi-ellipses in the left-right direction can be matched to form a complete ellipse.
3. The horizontal CPU radiator structure according to claim 1, wherein the first overhanging portion (221) and the second overhanging portion (222) are respectively connected to the left and right ends of the contact portion (21) between the heat conduction copper pipe and the aluminum base, the first overhanging portion (221) extends obliquely upward in a direction away from the aluminum base (10) and then bends over the aluminum base (10), and one end of the second overhanging portion (222) away from the contact portion (21) between the aluminum base (10) and the first overhanging portion (221) bends upward.
4. The horizontal CPU radiator structure according to claim 1, wherein the first extension portion (221) and the second extension portion (222) are respectively disposed in the upper fin group (25) and the lower fin group (26) in an interference manner.
5. The horizontal CPU radiator structure according to claim 1, wherein the upper fin group (25) includes a plurality of large heat dissipating fins (251) disposed vertically, the lower fin group (26) includes a plurality of small heat dissipating fins (261) disposed vertically, the large heat dissipating fins (251) and the small heat dissipating fins (261) are respectively provided with through holes for the first overhanging portion (221) and the second overhanging portion (222) to pass through, and heat dissipating gaps are disposed between the adjacent large heat dissipating fins (251) and between the adjacent small heat dissipating fins (261).
6. The horizontal CPU radiator structure according to claim 1, wherein the upper fin group (25) and the lower fin group (26) further include a plurality of large connecting fins (27) and small connecting fins (28) which are vertically arranged, round holes for the first overhanging portions (221) and the second overhanging portions (222) to pass through are respectively formed in the large connecting fins (27) and the small connecting fins (28), the large connecting fins (27) are located in the middle of the upper fin group (25), and the small connecting fins (28) are located in the middle of the lower fin group (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320956821.7U CN219958174U (en) | 2023-04-24 | 2023-04-24 | Horizontal CPU radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320956821.7U CN219958174U (en) | 2023-04-24 | 2023-04-24 | Horizontal CPU radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219958174U true CN219958174U (en) | 2023-11-03 |
Family
ID=88537654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320956821.7U Active CN219958174U (en) | 2023-04-24 | 2023-04-24 | Horizontal CPU radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219958174U (en) |
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2023
- 2023-04-24 CN CN202320956821.7U patent/CN219958174U/en active Active
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