CN220858486U - High-frequency high-speed PCB substrate positioning device - Google Patents
High-frequency high-speed PCB substrate positioning device Download PDFInfo
- Publication number
- CN220858486U CN220858486U CN202322285424.4U CN202322285424U CN220858486U CN 220858486 U CN220858486 U CN 220858486U CN 202322285424 U CN202322285424 U CN 202322285424U CN 220858486 U CN220858486 U CN 220858486U
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- China
- Prior art keywords
- pcb
- plate
- shell
- wall
- main body
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- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of PCB substrates and discloses a high-frequency high-speed PCB substrate positioning device which comprises a PCB main body, wherein a positioning assembly is clamped on the outer wall of the PCB main body, a heat dissipation assembly is attached to the bottom of the PCB main body, the positioning assembly comprises a shell, a vortex groove disc is rotatably arranged in the shell, a plug rod is slidably arranged on the inner wall of the shell, and a clamping plate is fixedly arranged at one end of the plug rod. This high-frequency high-speed PCB base plate positioner, through at first placing the PCB board main part at the dryer top, and the position between two curb plates, then rotate the turning handle for the turning handle drives bevel gear and rotates, and bevel gear drives the whirlpool dish and rotate, and the whirlpool dish passes through the cylinder and drives the inserted bar and slide inside the shell, then splint carry out the centre gripping to the PCB board main part, can accomplish the location and the installation of PCB board main part, has avoided using the screw, convenient location and installation, can be convenient for follow-up dismantlement and maintenance change simultaneously.
Description
Technical Field
The utility model relates to the technical field of PCB substrates, in particular to a high-frequency high-speed PCB substrate positioning device.
Background
The PCB, namely a printed circuit board, is one of important parts in the electronic industry, almost every electronic device only needs to have electronic components such as an integrated circuit, and the printed circuit board is used for electrically interconnecting all the components, and consists of an insulating bottom plate, connecting wires and bonding pads for assembling and welding the electronic components.
Chinese patent CN216057930U discloses a high-frequency high-speed PCB substrate positioning device for a medical ventilator, when the present utility model is used, a PCB substrate can be inserted into two sliding grooves, and then positioning screws are screwed into screw holes on the two sliding grooves, wherein the length of the two sliding grooves is greater than the side length of the PCB substrate, the sliding grooves can completely wrap the left and right sides of the PCB substrate, complete the preliminary positioning of the PCB substrate, simultaneously clamp the left and right sides of the PCB substrate, and can avoid curling the four corners and the left and right sides of the PCB substrate.
1. Above-mentioned patent adopts a plurality of screws to fix a position, need loosen the screw repeatedly when dismantling, and efficiency is very poor, can not realize quick assembly disassembly.
2. The above patent uses a fan to dissipate heat in the aspect of heat dissipation, but the fan only increases the air flow speed, and the heat dissipation effect is poor, so that the heat dissipation aspect can be improved.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a high-frequency high-speed PCB substrate positioning device, which solves the problem that quick disassembly and assembly cannot be realized.
The utility model provides the following technical scheme: the high-frequency high-speed PCB substrate positioning device comprises a PCB main body, wherein a positioning assembly is clamped on the outer wall of the PCB main body, and a heat dissipation assembly is attached to the bottom of the PCB main body;
The positioning assembly comprises a shell, a vortex groove disc is rotatably arranged in the shell, an inserting rod is slidably arranged on the inner wall of the shell, a clamping plate is fixedly arranged at one end of the inserting rod, a cylinder is fixedly arranged on one side of the inserting rod, side plates are attached to two sides of the PCB main body, a rotating handle is rotatably arranged in the shell, a bevel gear is fixedly arranged at one end of the rotating handle, and a bevel gear is meshed with the outer wall of the bevel gear.
The preferred technical scheme is as follows: the cylindrical outer wall slides and is in the vortex groove of the vortex groove disc, and the clamping plate is clamped on the outer wall of the PCB main body.
According to the scheme, the clamping block is driven to clamp the PCB main body under the belt of the vortex groove disc through the vortex groove disc rotating cylinder.
The preferred technical scheme II is as follows: the number of the side plates is two, and the two side plates are attached to two sides of the PCB main body.
According to the scheme, the PCB main board is limited to be in two directions through the side plates.
The preferred technical scheme III: the other end of the inserted link, which is far away from the clamping plate, is fixed with a limiting plate, and the length of the limiting plate of the clamping plate is greater than that of the inserted link.
According to the scheme, the inserting rod can be prevented from being separated from the inside of the shell through the limiting plate.
The preferred technical scheme is as follows: the bevel gear is fixedly arranged on one side of the vortex groove disc, and the outer wall of the rotating handle is sleeved with a rubber sleeve.
This scheme can, through the rubber sleeve can be convenient rotate the turning handle.
The preferable technical scheme is as follows: the heat dissipation assembly comprises a mounting plate, the mounting plate is fixedly mounted at the bottom of the shell, an air duct is fixedly mounted at one end of the mounting plate, a semiconductor heat dissipation plate is fixedly mounted at the bottom of the air duct, a heat conduction plate is fixedly mounted at the bottom of the semiconductor heat dissipation plate, and a fan is rotatably mounted at the other end, far away from the semiconductor heat dissipation plate, of the air duct.
According to the scheme, cold air is output from one side of the semiconductor heat dissipation plate, and the heat dissipation effect is improved.
A preferred technical scheme is as follows: the mounting panel fixed mounting is in curb plate bottom, semiconductor heating panel bottom and be provided with the heat dissipation silica gel at the heat conduction board outer wall.
According to the scheme, the heat dissipation of the heating surface of the semiconductor heat dissipation plate can be facilitated through the heat dissipation silica gel.
Compared with the prior art, the utility model provides a high-frequency high-speed PCB substrate positioning device, which has the following beneficial effects:
(1) This high-frequency high-speed PCB base plate positioner, through at first placing the PCB board main part at the dryer top, and the position between two curb plates, then rotate the turning handle for the turning handle drives bevel gear and rotates, and bevel gear drives the whirlpool dish and rotate, and the whirlpool dish passes through the cylinder and drives the inserted bar and slide inside the shell, then splint carry out the centre gripping to the PCB board main part, can accomplish the location and the installation of PCB board main part, has avoided using the screw, convenient location and installation, can be convenient for follow-up dismantlement and maintenance change simultaneously.
(2) This high-frequency high-speed PCB base plate positioner, when dispelling the heat to the PCB board main part, at first provide the air conditioning through the semiconductor heating panel to dryer inner wall, the semiconductor heating panel opposite side face that generates heat is located the machine outer wall, and the dryer is located inside separating each other of machine, drives the air current through the fan for the air conditioning of semiconductor heating panel exports one side of PCB board main part, provides good radiating effect, provides stronger heat dispersion, makes the continuous work that can be better of PCB board main part.
Drawings
FIG. 1 is a schematic diagram of a front view of the present utility model;
FIG. 2 is an enlarged view of the structure of the present utility model in a top view;
FIG. 3 is a schematic view of a partial cross-sectional structure of the present utility model;
FIG. 4 is a schematic top view of the present utility model;
Fig. 5 is a schematic view of a bottom cross-sectional structure of the present utility model.
In the figure: 1. a PCB main body; 2. a positioning assembly; 3. a heat dissipation assembly; 21. a rod; 22. a clamping plate; 23. a housing; 24. a rotating handle; 25. a side plate; 26. a spiral groove disc; 27. a cylinder; 28. a bevel gear; 29. bevel gears; 31. a mounting plate; 32. an air duct; 33. a semiconductor heat dissipation plate; 34. a heat conductive plate; 35. a fan.
Detailed Description
Referring to fig. 1-5, in a first embodiment:
A high-frequency high-speed PCB substrate positioning device comprises a PCB main body 1, wherein a positioning component 2 is clamped on the outer wall of the PCB main body 1, and a heat dissipation component 3 is attached to the bottom of the PCB main body 1;
The positioning assembly 2 comprises a shell 23, a vortex groove disc 26 is rotatably arranged in the shell 23, a plug rod 21 is slidably arranged on the inner wall of the shell 23, a clamping plate 22 is fixedly arranged at one end of the plug rod 21, a cylinder 27 is fixedly arranged at one side of the plug rod 21, side plates 25 are attached to two sides of the PCB main body 1, a rotating handle 24 is rotatably arranged in the shell 23, a bevel gear 29 is fixedly arranged at one end of the rotating handle 24, a bevel gear 28 is meshed with the outer wall of the bevel gear 29, and the bevel gear 29 drives the bevel gear 28 to rotate, so that the vortex groove disc 26 is conveniently driven to rotate.
Further, the outer wall of the cylinder 27 slides and is in the vortex groove of the vortex groove disk 26, the clamping plate 22 is clamped on the outer wall of the PCB main body 1, the number of the side plates 25 is two, the two side plates 25 are attached to two sides of the PCB main body 1, the other end of the inserting rod 21, far away from the clamping plate 22, is fixedly provided with a limiting plate, the length of the limiting plate of the clamping plate 22 is larger than that of the inserting rod 21, the bevel gear 28 is fixedly arranged on one side of the vortex groove disk 26, and the outer wall of the rotating handle 24 is sleeved with a rubber sleeve.
Specifically, through putting PCB board main part 1 at dryer 32 top at first, and the position between two curb plates 25, then rotate handle 24 for handle 24 drives bevel gear 29 and rotates, bevel gear 29 drives bevel gear 28 and rotates, bevel gear 28 drives vortex dish 26 and rotates, vortex dish 26 passes through cylinder 27 and drives inserted bar 21 and slide in shell 23 inside, then splint 22 carries out the centre gripping to PCB board main part 1, can accomplish the location and the installation of PCB board main part 1, avoided using the screw, convenient location and installation, can be convenient for follow-up dismantlement and maintenance change simultaneously.
Please refer to fig. 1-5, and further obtain a second embodiment based on the first embodiment:
The heat dissipation assembly 3 comprises a mounting plate 31, the mounting plate 31 is fixedly mounted at the bottom of the shell 23, an air duct 32 is fixedly mounted at one end of the mounting plate 31, a semiconductor heat dissipation plate 33 is fixedly mounted at the bottom of the air duct 32, a heat conduction plate 34 is fixedly mounted at the bottom of the semiconductor heat dissipation plate 33, a fan 35 is rotatably mounted at the other end of the air duct 32 far away from the semiconductor heat dissipation plate 33, wind power is driven to rotate through the fan 35, and the semiconductor heat dissipation plate 33 is driven to dissipate heat of the PCB main body 1.
Further, the mounting plate 31 is fixedly mounted on the bottom of the side plate 25, the bottom of the semiconductor heat dissipation plate 33 and the outer wall of the heat conduction plate 34 are provided with heat dissipation silica gel.
Specifically, when radiating the PCB main body 1, firstly, the semiconductor heat dissipation plate 33 is used for providing cool air for the inner wall of the air duct 32, the heating surface on the other side of the semiconductor heat dissipation plate 33 is located on the outer wall of the machine, the air duct 32 is located inside the machine and is separated from each other, and the fan 35 drives air flow, so that the cool air of the semiconductor heat dissipation plate 33 is output to one side of the PCB main body 1, a good radiating effect is provided, a stronger radiating performance is provided, and the PCB main body 1 can work continuously better.
In summary, this high-frequency high-speed PCB base plate positioner, firstly put PCB board main part 1 at the dryer 32 top, and in the position between two curb plates 25, then rotate handle 24, make handle 24 drive bevel gear 29 rotate, bevel gear 29 drives bevel gear 28 rotation, bevel gear 28 drives vortex dish 26 rotation, vortex dish 26 passes through cylinder 27 and drives inserted bar 21 and slide in shell 23 inside, then splint 22 carries out the centre gripping to PCB board main part 1, can accomplish the location and the installation of PCB board main part 1, then when dismantling of PCB board main part 1, only need reverse rotation handle 24, drive bevel gear 29 reverse rotation, then drive bevel gear 28 reverse rotation, then drive inserted bar 21 mutual split through vortex dish 26, can control splint 22 mutual split, make PCB board main part 1 can take out, can accomplish the dismantlement, when dispelling the heat to PCB board main part 1, firstly, provide the air cooling to the inner wall of dryer 32 through semiconductor cooling plate 33, the opposite side of semiconductor cooling plate 33 sends out and is located inside the machine, dryer 32 separates each other, it is separated each other through fan 35 to drive the air current, make the output of semiconductor cooling plate 33 to provide good radiating effect to one side of PCB board 1.
Claims (7)
1. The utility model provides a high-frequency high-speed PCB base plate positioner, includes PCB board main part (1), its characterized in that: the outer wall of the PCB main body (1) is clamped with a positioning assembly (2), and a heat dissipation assembly (3) is attached to the bottom of the PCB main body (1);
The locating component (2) comprises a shell (23), a vortex groove disc (26) is rotatably installed inside the shell (23), a plug rod (21) is slidably installed on the inner wall of the shell (23), a clamping plate (22) is fixedly installed at one end of the plug rod (21), a cylinder (27) is fixedly installed on one side of the plug rod (21), side plates (25) are attached to two sides of the PCB main body (1), a rotating handle (24) is rotatably installed inside the shell (23), a bevel gear (29) is fixedly installed at one end of the rotating handle (24), and a bevel gear (28) is meshed with the outer wall of the bevel gear (29).
2. The high frequency high speed PCB substrate positioning apparatus of claim 1, wherein: the outer wall of the cylinder (27) slides into a vortex-shaped groove of the vortex-shaped groove disc (26), and the clamping plate (22) is clamped on the outer wall of the PCB main body (1).
3. The high frequency high speed PCB substrate positioning apparatus of claim 1, wherein: the number of the side plates (25) is two, and the two side plates (25) are attached to two sides of the PCB main body (1).
4. The high frequency high speed PCB substrate positioning apparatus of claim 1, wherein: the other end of the inserted link (21) far away from the clamping plate (22) is fixedly provided with a limiting plate, and the length of the limiting plate of the clamping plate (22) is greater than that of the inserted link (21).
5. The high frequency high speed PCB substrate positioning apparatus of claim 1, wherein: the bevel gear (28) is fixedly arranged on one side of the vortex groove disc (26), and a rubber sleeve is sleeved on the outer wall of the rotating handle (24).
6. The high frequency high speed PCB substrate positioning apparatus of claim 1, wherein: the heat dissipation assembly (3) comprises a mounting plate (31), the mounting plate (31) is fixedly mounted at the bottom of the shell (23), an air duct (32) is fixedly mounted at one end of the mounting plate (31), a semiconductor heat dissipation plate (33) is fixedly mounted at the bottom of the air duct (32), a heat conduction plate (34) is fixedly mounted at the bottom of the semiconductor heat dissipation plate (33), and a fan (35) is rotatably mounted at the other end of the air duct (32) away from the semiconductor heat dissipation plate (33).
7. The high frequency high speed PCB substrate positioning apparatus of claim 6, wherein: the mounting plate (31) is fixedly mounted at the bottom of the side plate (25), and radiating silica gel is arranged at the bottom of the semiconductor radiating plate (33) and on the outer wall of the heat conducting plate (34).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322285424.4U CN220858486U (en) | 2023-08-24 | 2023-08-24 | High-frequency high-speed PCB substrate positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322285424.4U CN220858486U (en) | 2023-08-24 | 2023-08-24 | High-frequency high-speed PCB substrate positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220858486U true CN220858486U (en) | 2024-04-26 |
Family
ID=90775080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322285424.4U Active CN220858486U (en) | 2023-08-24 | 2023-08-24 | High-frequency high-speed PCB substrate positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220858486U (en) |
-
2023
- 2023-08-24 CN CN202322285424.4U patent/CN220858486U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |