CN220439603U - Chip assembly heat abstractor and chip assembly - Google Patents
Chip assembly heat abstractor and chip assembly Download PDFInfo
- Publication number
- CN220439603U CN220439603U CN202321630473.0U CN202321630473U CN220439603U CN 220439603 U CN220439603 U CN 220439603U CN 202321630473 U CN202321630473 U CN 202321630473U CN 220439603 U CN220439603 U CN 220439603U
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- Prior art keywords
- chip assembly
- connecting hole
- fan housing
- chip
- heat
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 241000883990 Flabellum Species 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a chip assembly heat dissipation device and a chip assembly. This chip subassembly heat abstractor and chip subassembly, when radiating and using, through the setting of radiating block and heat dissipation connecting hole in the cooling mechanism, can pass through the top of heat dissipation connecting hole screw connection at the chip with the radiating block, the chip will produce the heat conduction in the radiating block, the rethread radiating block distributes away with the heat, accomplish first heat dissipation, then through fan housing, a motor, the setting of pivot, flabellum and fan housing connecting hole, the fan housing passes through fan housing connecting hole and radiating block screw connection fixedly, then pivot and flabellum pass through the operation drive of motor and rotate down, the heat of radiating block more fast gives off away, thereby reach the quick heat dissipation to high-power chip, avoid the chip damage, the effect of improvement radiating efficiency.
Description
Technical Field
The present utility model relates to the field of heat dissipation technologies, and in particular, to a heat dissipation device for a chip assembly and a chip assembly.
Background
The electronic product inevitably has heating phenomena in the use process, particularly a circuit with larger power, the heating phenomena are more obvious, if the temperature of the chip is too high in the working process, the function of the chip is affected, the chip is possibly burnt out in severe cases, so that the use stability of the product is affected, when the chip is subjected to heat dissipation, a radiating fin is usually added on an electronic element, heat is conducted in the radiating fin and then is radiated into the surrounding air through the radiating fin, the radiating effect can be realized to a certain extent, but when a high-power device is encountered, the heat dissipation can not be well completed, and the radiating efficiency is low, so that the chip assembly radiating device and the chip assembly are particularly required.
However, when the existing chip heat dissipation device dissipates heat, a heat dissipation fin is usually added on the electronic component, heat is conducted in the heat dissipation fin and dissipated into surrounding air through the heat dissipation fin, so that the heat dissipation effect can be achieved to a certain extent, but when a high-power device is encountered, heat dissipation cannot be well completed when the high-power device is required to dissipate heat rapidly, and the heat dissipation efficiency is low.
Disclosure of Invention
The utility model aims to provide a chip assembly radiating device and a chip assembly, which are used for solving the problems that when a chip is radiated, radiating fins are usually added on an electronic element, heat is conducted in the radiating fins and then radiated into surrounding air through the radiating fins, the radiating effect can be realized to a certain extent, but when a high-power device is encountered, the radiating can not be well completed when the high-power device is required to radiate, and the radiating efficiency is low.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the chip assembly comprises a connecting bottom plate and a chip assembly, wherein the chip assembly comprises a main plate, connecting holes and connecting screws, and the chip assembly is arranged at the top of the connecting bottom plate.
Preferably, the chip assembly comprises a main board, a connecting hole and a connecting screw, wherein the main board is arranged at the top of the connecting bottom board, the connecting hole is formed in the main board, and the connecting screw is arranged in the connecting hole.
Preferably, the connecting screw is in threaded connection with the connecting hole, and the outer diameter of the connecting screw is matched with the inner diameter of the connecting hole in size.
Preferably, a chip assembly heat abstractor, including connecting bottom plate, chip assembly and cooling mechanism, cooling mechanism includes radiating block, heat dissipation connecting hole, fan housing, motor, pivot, flabellum and fan housing connecting hole, the connecting bottom plate top is provided with the chip assembly, the chip assembly top is provided with the radiating block, the inside heat dissipation connecting hole of having seted up in radiating block both sides, the radiating block top is provided with the fan housing, the inside motor that is provided with of fan housing, the inside pivot that is provided with of motor, pivot one end is provided with the flabellum, the fan housing connecting hole has been seted up in the fan housing top outside.
Preferably, the heat dissipation block is welded with the heat dissipation connecting hole, and the heat dissipation connecting hole is connected with the main board through a screw.
Preferably, the fan cover is connected with the radiating block through a fan cover connecting hole by a screw, and the fan cover is matched with the radiating block in size.
Preferably, the fan blade is connected with the rotating shaft through a clamping groove, and the fan blade is tightly attached to the rotating shaft.
Compared with the prior art, the utility model has the beneficial effects that: this chip subassembly heat abstractor and chip subassembly, when dispelling the heat, through the setting of radiator block and heat dissipation connecting hole in the cooling mechanism, can pass through the heat dissipation connecting hole screw connection with the radiator block at the chip top, the heat conduction that the chip produced is in the radiator block, again by the radiator block with the heat dispersion go out, accomplish first heat dissipation, then through fan housing, a motor, the pivot, the setting of flabellum and fan housing connecting hole, the fan housing passes through fan housing connecting hole and radiator block screw connection fixedly, then pivot and flabellum pass through the operation drive of motor and rotate down, the heat of radiator block more quick the giving off, thereby reach the quick heat dissipation to high-power chip, avoid the chip damage, the effect of improvement radiating efficiency.
Drawings
FIG. 1 is a schematic diagram of a heat dissipating device for a chip assembly and an overall structure of the chip assembly according to the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation mechanism according to the present utility model;
FIG. 3 is a schematic diagram of a heat dissipating block according to the present utility model;
fig. 4 is a schematic diagram of a motor, a rotating shaft and fan blade connection structure according to the present utility model.
Reference numerals in the drawings: 1. a connecting bottom plate; 2. a chip assembly; 201. a main board; 202. a connection hole; 203. a connecting screw; 3. a heat dissipation mechanism; 301. a heat dissipation block; 302. a heat radiation connecting hole; 303. a fan cover; 304. a motor; 305. a rotating shaft; 306. a fan blade; 307. fan housing connecting hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the chip assembly comprises a connecting bottom plate 1 and a chip assembly 2, wherein the chip assembly 2 comprises a main plate 201, connecting holes 202 and connecting screws 203, and the chip assembly 2 is arranged on the top of the connecting bottom plate 1.
Further, the chip assembly 2 comprises a main board 201, a connecting hole 202 and a connecting screw 203, the main board 201 is arranged at the top of the connecting bottom board 1, the connecting hole 202 is formed in the main board 201, the connecting screw 203 is arranged in the connecting hole 202, the main board 201 and the connecting bottom board 1 are fixedly connected through the connecting hole 202 by the connecting screw 203 through the arrangement of the main board 201, the connecting hole 202 and the connecting screw 203, and the connecting mode is simple and stable.
Further, the connecting screw 203 is in threaded connection with the connecting hole 202, the outer diameter of the connecting screw 203 is matched with the inner diameter of the connecting hole 202 in size, and through the arrangement, the assembly and the disassembly of workers are facilitated, and the operation is simple.
Further, a chip assembly heat abstractor, including connecting bottom plate 1, chip assembly 2 and cooling mechanism 3, cooling mechanism 3 includes cooling block 301, cooling connecting hole 302, fan housing 303, motor 304, pivot 305, flabellum 306 and fan housing connecting hole 307, the bottom plate 1 top is provided with chip assembly 2, chip assembly 2 top is provided with cooling block 301, cooling connecting hole 302 has been seted up to cooling block 301 both sides inside, cooling block 301 top is provided with fan housing 303, fan housing 303 inside is provided with motor 304, motor 304 inside is provided with pivot 305, pivot 305 one end is provided with flabellum 306, fan housing 303 top outside is seted up fan housing connecting hole 307, through cooling block 301 and cooling connecting hole 302's setting in the cooling mechanism, can pass through cooling block 301 and cooling connecting hole 302 screw connection at the chip top, the heat conduction that the chip produced is in cooling block 301, again, by cooling block 301 disperse out the heat, accomplish first time cooling block 303, then through fan housing 303, motor 304, pivot 305, flabellum 306 and fan housing connecting hole 307 sets up, fan housing 303 passes through fan housing connecting hole 307 and cooling block 301 and cooling block 305, thereby the fast rotation of fan housing 301 is fast with the fan housing 306, thereby the heat dissipation efficiency is improved, and the chip is more fast cooled down, and the heat dissipation efficiency is improved, thereby, and the chip assembly heat dissipation is more fast cooled down.
Further, the heat dissipation block 301 is welded with the heat dissipation connecting hole 302, and the heat dissipation connecting hole 302 is connected with the main board 201 by screws.
Further, the fan housing 303 is connected with the heat dissipation block 301 by screws through the fan housing connection holes 307, and the fan housing 303 is matched with the heat dissipation block 301 in size, so that the fan housing 303 can be stably mounted on the top of the heat dissipation block 301 and is fixedly and stably arranged.
Further, the fan blade 306 is connected with the rotating shaft 305 through a clamping groove, the fan blade 306 is tightly attached to the rotating shaft 305, and through the arrangement, the fan blade 306, the rotating shaft 305 and the motor 304 are conveniently detached and replaced, and the maintenance is simple.
Working principle: when the chip assembly radiating device and the chip assembly are used, the connecting screw 203 penetrates through the connecting hole 202 to fixedly connect the main board 201 with the connecting bottom board 1, the connecting mode is simple and stable, the radiating block 301 and the radiating connecting hole 302 are arranged in the radiating mechanism, the radiating block 301 can be connected to the top of a chip through the radiating connecting hole 302 in a screwed mode, heat generated by the chip is conducted in the radiating block 301, the radiating block 301 disperses the heat to finish the first radiating, the fan cover 303, the motor 304, the rotating shaft 305, the fan blade 306 and the fan cover connecting hole 307 are arranged in a third step, the fan cover 303 is fixedly connected with the radiating block 301 through the fan cover connecting hole 307 in a screwed mode, then the rotating shaft 305 and the fan blade 306 are driven to rotate through the operation of the motor 304, the heat of the radiating block 301 is radiated more quickly, so that the chip is prevented from being damaged, the radiating efficiency is improved, and the using process of the chip assembly radiating device and the chip assembly is finished.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A chip assembly comprising a connection base plate (1) and a chip assembly (2), characterized in that: the chip assembly comprises a connecting base plate (1), wherein a chip assembly (2) is arranged at the top of the connecting base plate (1), the chip assembly (2) comprises a main plate (201), a connecting hole (202) and a connecting screw (203), the main plate (201) is arranged at the top of the connecting base plate (1), the connecting hole (202) is formed in the main plate (201), the connecting screw (203) is arranged in the connecting hole (202), the connecting screw (203) is in threaded connection with the connecting hole (202), and the outer diameter of the connecting screw (203) is matched with the inner diameter of the connecting hole (202).
2. The chip assembly heat abstractor of claim 1, a chip assembly heat abstractor is still provided, a chip assembly heat abstractor is characterized in that, including connection bottom plate (1), chip assembly (2) and cooling mechanism (3), cooling mechanism (3) are including radiating block (301), heat dissipation connecting hole (302), fan housing (303), motor (304), pivot (305), flabellum (306) and fan housing connecting hole (307), connection bottom plate (1) top is provided with chip assembly (2), chip assembly (2) top is provided with radiating block (301), radiating block (301) both sides inside has been seted up heat dissipation connecting hole (302), radiating block (301) top is provided with fan housing (303), fan housing (303) inside is provided with motor (304), motor (304) inside is provided with pivot (305), pivot (305) one end is provided with flabellum (306), fan housing connecting hole (307) have been seted up in fan housing (303) top outside.
3. The heat dissipating device for a chip assembly according to claim 2, wherein the heat dissipating block (301) is welded to the heat dissipating connecting hole (302), and the heat dissipating connecting hole (302) is screwed to the motherboard (201).
4. A heat sink for a chip assembly according to claim 3, wherein the fan housing (303) is screwed to the heat sink (301) through a fan housing connection hole (307), and the fan housing (303) is sized to match the heat sink (301).
5. The heat dissipating device for a chip assembly according to claim 4, wherein the fan blade (306) is connected to the rotating shaft (305) by a slot, and the fan blade (306) is tightly attached to the rotating shaft (305).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321630473.0U CN220439603U (en) | 2023-06-26 | 2023-06-26 | Chip assembly heat abstractor and chip assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321630473.0U CN220439603U (en) | 2023-06-26 | 2023-06-26 | Chip assembly heat abstractor and chip assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220439603U true CN220439603U (en) | 2024-02-02 |
Family
ID=89694704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321630473.0U Active CN220439603U (en) | 2023-06-26 | 2023-06-26 | Chip assembly heat abstractor and chip assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220439603U (en) |
-
2023
- 2023-06-26 CN CN202321630473.0U patent/CN220439603U/en active Active
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| GR01 | Patent grant |