CN211956399U

CN211956399U - Novel radiator for electronic component

Info

Publication number: CN211956399U
Application number: CN202020896003.9U
Authority: CN
Inventors: 程群; 魏磊
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-05-26
Filing date: 2020-05-26
Publication date: 2020-11-17
Anticipated expiration: 2030-05-26

Abstract

The utility model discloses a novel radiator for electronic elements, which comprises a bottom plate and a connecting plate, wherein the connecting plate is arranged on the outer wall of the upper end of the bottom plate, a radiator fan shell is arranged on the outer wall of the right end of the upper side of the connecting plate, at the moment, the bottom plate can absorb the temperature on the electronic elements to quickly reduce the temperature of the electronic elements, then the temperature is conducted to the connecting plate through a lower clamping block, then the temperature is conducted to a radiating plate and radiating blocks at the upper end and the lower end of the radiating plate through an upper clamping block in the connecting plate, a plurality of radiating blocks and radiating plates are arranged, the temperature on the connecting plate can be quickly absorbed, cold air blown out by fan blades flows onto the radiating blocks at the moment, the temperature on the radiating blocks is absorbed and flows to the front side and the rear side, meanwhile, the radiating plates are provided, a large number of radiating blocks and radiating plates can share high temperature, so that the influence on the work of a motor and electronic elements is avoided.

Description

Novel radiator for electronic component

Technical Field

The utility model belongs to the technical field of the radiator is relevant, concretely relates to novel a radiator for electronic component.

Background

The electronic radiator is usually a radiating fin for radiating high-power electronic components, has no external power supply and is naturally cooled, most of the electronic radiators are made into aluminum alloy sections, and cut into required sizes according to the sizes of components, such as heat sinks of high-power switching tubes or triodes, certainly, in special cases, ultrahigh-power electronic components also have a heat dissipation fan, for example, a switching tube of a switching power supply must be additionally provided with the heat dissipation fan, the type of the heat sink is not strictly defined, and a strict classification method is not provided, generally, the sub-heat sink is classified according to the processing method, the cooling method, the professional application, the used materials, the used power, the characteristics of the heat sink and the like of the heat sink, and the sub-heat sink is a device for accelerating heat dissipation of a heating element, and two points are provided for measuring the quality of one heat sink: the computer is characterized in that heat dissipation and silence are achieved, a large number of integrated circuits are used in computer components, and as is known, high temperature is a large enemy of the integrated circuits, so that the high temperature can not only cause unstable system operation and shortened service life, but also can even cause some components to be burnt, and high-temperature heat is not from the outside of the computer but also from the inside of the computer or the inside of the integrated circuits.

The prior art of the radiator of the electronic element has the following problems: with the improvement of circuit integration technology, the volume of an electronic element is smaller and the power consumption is larger, so that the heat dissipation problem is more and more serious, the heat dissipation of the existing heat sink of the electronic element is slow, and the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel a radiator for electronic component to the radiator heat dissipation that proposes current electronic component among the solution above-mentioned background is slow and the not good problem of radiating effect.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel a radiator for electronic component, includes bottom plate and connecting plate, the connecting plate is installed on bottom plate upper end outer wall, be provided with radiator fan shell on the connecting plate upside right-hand member outer wall, the inside fan mouth that is provided with of radiator fan shell upper end outer wall, the inside pivot that is provided with of fan mouth, bottom plate upper end outer wall inside is provided with down the spread groove, the inside draw-in groove that is provided with down of spread groove lower extreme inner wall, the inside heating panel that stretches out left that is provided with of connecting plate, all be provided with the radiating block on the outer wall of both ends about the heating panel, the inside spread groove that is provided with of connecting plate left end outer wall, go up inside draw-in groove that is provided with of spread groove right-hand member.

Preferably, the outer wall of the circumference of the rotating shaft is provided with fan blades, and the outer wall of the lower end of the rotating shaft is provided with a motor.

Preferably, the connecting plate and the lower clamping block are both provided with two clamping blocks, and the bottom plate, the connecting plate and the heat dissipation plate are all made of aluminum.

Preferably, the radiating block is of a triangular structure, and radiating holes are formed in the outer wall of the upper end of the radiating plate.

Preferably, the bottom plate is fixedly connected with the lower clamping block through a nut, and the connecting plate is fixedly connected with the upper clamping block through a nut.

Compared with the radiator technology of the existing electronic element, the utility model provides a novel a radiator for electronic element possesses following beneficial effect:

the electronic element radiator of the utility model is provided with a plurality of groups of radiating plates on the bottom plate which is used for installing the electronic element on the radiator, and the right upper side of the bottom plate is provided with a plurality of groups of radiating plates, and a plurality of radiating blocks are arranged on each group of radiating plates, thus being convenient for absorbing the temperature on the electronic element, and being capable of driving the fan blades to rotate through the motor on the radiator, taking away the absorbed temperature on the radiating blocks, accelerating the cooling speed of the radiating blocks, when the electronic element works for a long time, the electronic element has higher temperature, at the moment, the bottom plate can absorb the temperature on the electronic element, so that the temperature of the electronic element is quickly reduced, then the electronic element is conducted to the connecting plate through the lower clamping block, and then the electronic element is conducted to the radiating plates and the radiating blocks at the upper end, at this moment, cold air blown out by the fan blades flows to the radiating block, absorbs the temperature on the radiating block and flows to the front side and the rear side, and meanwhile, the radiating plate is provided with the radiating holes, so that the cold air is blown to the radiating plate on the lower side through the radiating holes, the circulation of the cold air is facilitated, the cooling speed of the radiating block is accelerated, a large number of radiating blocks and the radiating plate can share high temperature, and the influence on the work of a motor and an electronic element is avoided.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:

fig. 1 is a schematic perspective view of a novel heat sink for electronic components according to the present invention;

fig. 2 is a schematic view of a three-dimensional structure of the heat sink of the present invention;

fig. 3 is a schematic view of a three-dimensional structure of the connection plate provided by the present invention;

fig. 4 is a schematic view of a three-dimensional structure of the heat dissipation plate of the present invention;

in the figure: 1. a base plate; 2. a connecting plate; 3. a fan port; 4. a rotating shaft; 5. a heat dissipation fan housing; 6. a lower connecting groove; 7. a lower clamping groove; 8. a heat dissipation plate; 9. an upper connecting groove; 10. an upper clamping groove; 11. a lower clamping block; 12. a heat dissipating block; 13. and an upper clamping block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a novel a radiator for electronic component, including bottom plate 1 and connecting plate 2, connecting plate 2 is installed on 1 upper end outer wall of bottom plate, be provided with radiator fan shell 5 on 2 upside right-hand member outer walls of connecting plate, inside fan mouth 3 that is provided with of radiator fan shell 5 upper end outer wall, the inside pivot 4 that is provided with of fan mouth 3, bottom plate 1 upper end outer wall is inside to be provided with down spread groove 6, inside draw-in groove 7 down of being provided with of 6 lower extreme inner walls of spread groove, 2 inside heating panel 8 that stretch out left that are provided with of connecting plate, all be provided with radiating block 12 on the outer wall of both ends about the heating panel 8, inside spread groove 9 that is provided with of 2 left ends outer walls of connecting plate, go up inside draw-in groove 10 that is provided with of spread groove 9 right.

A novel radiator for electronic elements comprises a bottom plate 1 and a connecting plate 2, fan blades are arranged on the circumferential outer wall of a rotating shaft 4, a motor is arranged on the outer wall of the lower end of the rotating shaft 4, the rotating shaft 4 can be driven by the motor, the rotating shaft 4 drives the fan blades to rotate, so that hot air generated by a radiating plate 8 can be blown away conveniently, two connecting plates 2 and two lower clamping blocks 11 are arranged, the bottom plate 1, the connecting plate 2 and the radiating plate 8 are made of aluminum materials, therefore, not only can a radiating fan shell 5 be fixedly installed, but also the heat on the electronic elements is accelerated to be quickly conducted onto the radiating plate 8 through the lower clamping blocks 11 and the connecting plates 2, so that the electronic elements can quickly radiate heat, a radiating block 12 is of a triangular structure, radiating holes are arranged in the outer wall of the upper end of the radiating plate 8, so that the heat can be quickly conducted, and accelerate the flow of air current through the louvre, bottom plate 1 and lower fixture block 11 pass through nut fixed connection, and connecting plate 2 also passes through nut fixed connection with last fixture block 13, makes each part on the bottom plate 1 install fast like this and fix, can also fix radiator fan shell 5.

The utility model discloses a theory of operation and use flow: after the heat radiator is installed, when the heat radiator is installed, the lower clamping block 11 is firstly installed on the outer wall of the lower end of the connecting plate 2 and can be fixed in a welding mode, then the upper clamping block 13 is installed on the heat dissipation plate 8, then the heat dissipation blocks 12 are respectively installed on the outer walls of the upper end and the lower end of the heat dissipation plate 8 and are fixed in a welding mode, at the same time, the heat radiator can be assembled, the upper clamping block 13 is firstly inserted into the upper clamping groove 10 on the connecting plate 2, a plurality of heat dissipation plates 8 are sequentially installed on the two connecting plates 2, then the lower clamping block 11 is clamped into the lower clamping groove 7 on the bottom plate 1, the two connecting plates 2 are kept in a symmetrical state on the bottom plate 1, then screws are installed on the screw holes on the bottom plate 1 and the connecting plates 2, the screws are screwed by using a screwdriver, so that the connecting plates 2 are respectively fixed with the bottom plate 1, then the electronic element is fixed on the connecting plate 2 through a nut, finally the electronic element can be arranged at the lower end of the bottom plate 1, meanwhile, a connecting wire on the radiating fan shell 5 is connected with an external power supply, a motor in the radiating fan shell 5 starts to work, the fan blades are driven to rotate through a rotating shaft 4 in the radiating fan shell, when the electronic element works for a long time, the electronic element has higher temperature, then the temperature on the electronic element is absorbed by the bottom plate 1, the temperature of the electronic element is rapidly reduced, then the electronic element is conducted to the connecting plate 2 through a lower clamping block 11, then the electronic element is conducted to the radiating plate 8 and radiating blocks 12 at the upper end and the lower end of the radiating plate through an upper clamping block 13 in the connecting plate 2, a plurality of radiating blocks 12 and radiating plates 8 are arranged, the temperature on the connecting plate 2 is rapidly absorbed, cold air blown by the fan blades, meanwhile, the heat dissipation plate 8 is provided with heat dissipation holes, so that cold air is blown to the heat dissipation plate 8 on the lower side through the heat dissipation holes, circulation of the cold air is facilitated, and the cooling speed of the heat dissipation block 12 is increased.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A novel radiator for electronic component, including bottom plate (1) and connecting plate (2), its characterized in that: the connecting plate (2) is installed on the outer wall of the upper end of the bottom plate (1), a radiating fan shell (5) is arranged on the outer wall of the right end of the upper side of the connecting plate (2), a fan opening (3) is formed in the outer wall of the upper end of the radiating fan shell (5), a rotating shaft (4) is arranged in the fan opening (3), a lower connecting groove (6) is formed in the outer wall of the upper end of the bottom plate (1), a lower clamping groove (7) is formed in the inner wall of the lower end of the lower connecting groove (6), a radiating plate (8) extending leftwards is arranged in the connecting plate (2), radiating blocks (12) are arranged on the outer walls of the upper end and the lower end of the radiating plate (8), an upper connecting groove (9) is formed in the outer wall of the left end of the connecting plate (2), an upper clamping groove (10, an upper clamping block (13) is arranged on the outer wall of the right end of the heat dissipation plate (8).

2. A novel heat sink for electronic components as claimed in claim 1, wherein: the fan blades are arranged on the outer wall of the circumference of the rotating shaft (4), and the motor is arranged on the outer wall of the lower end of the rotating shaft (4).

3. A novel heat sink for electronic components as claimed in claim 1, wherein: the connecting plate (2) and the lower clamping block (11) are both provided with two clamping blocks, and the bottom plate (1), the connecting plate (2) and the heat dissipation plate (8) are all made of aluminum.

4. A novel heat sink for electronic components as claimed in claim 1, wherein: the radiating block (12) is of a triangular structure, and radiating holes are formed in the outer wall of the upper end of the radiating plate (8).

5. A novel heat sink for electronic components as claimed in claim 1, wherein: the bottom plate (1) is fixedly connected with the lower clamping block (11) through nuts, and the connecting plate (2) is fixedly connected with the upper clamping block (13) through nuts.