CN220774330U - Wafer clamping mechanism for wafer cleaning machine - Google Patents
Wafer clamping mechanism for wafer cleaning machine Download PDFInfo
- Publication number
- CN220774330U CN220774330U CN202321976845.5U CN202321976845U CN220774330U CN 220774330 U CN220774330 U CN 220774330U CN 202321976845 U CN202321976845 U CN 202321976845U CN 220774330 U CN220774330 U CN 220774330U
- Authority
- CN
- China
- Prior art keywords
- wafer
- wafer clamping
- clamping
- seat
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 34
- 230000007246 mechanism Effects 0.000 title claims abstract description 18
- 238000012546 transfer Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 7
- 230000008093 supporting effect Effects 0.000 abstract description 18
- 235000012431 wafers Nutrition 0.000 description 269
- 238000005299 abrasion Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a wafer clamping mechanism for a wafer cleaning machine, which comprises a wafer clamping base plate, a wafer clamping swivel seat and a wafer clamping bearing seat, and relates to the technical field of wafer clamping equipment. The wafer clamping rotary seat is arranged, one side of the wafer clamping rotary seat is fixedly connected with the wafer clamping support seat, the other side of the wafer clamping rotary seat is rotatably connected with the wafer clamping base plate, the wafer can be preset on the wafer clamping support seat when the wafer cleaning machine is used for cleaning the wafer, then the position of the wafer can be adjusted by driving the wafer clamping rotary seat to rotate, and the wafer clamping central support seat is arranged inside the wafer clamping base plate and is rotatably connected with the wafer clamping base plate, and the wafer clamping outer edge support column is arranged outside the wafer clamping base plate and is rotatably connected with the wafer clamping base plate, so that the wafer clamping central support seat and the wafer clamping outer edge support column can be used for clamping and supporting the wafer, and the stability of clamping and rotating adjustment of the wafer is ensured.
Description
Technical Field
The utility model relates to the technical field of wafer clamping equipment, in particular to a wafer clamping mechanism for a wafer cleaning machine.
Background
Wafer refers to an important material in the semiconductor manufacturing process. The round sheet-shaped object is manufactured by taking monocrystalline silicon as a base material and adopting a series of processing and treating processes. Wafers typically have a planar surface and specific dimensions for use in fabricating integrated circuits and other semiconductor devices.
A wafer cleaning machine is a device that is specially used for cleaning semiconductor wafers. In semiconductor manufacturing, wafers often require multiple processing and handling steps, and therefore cleaning the wafers between each step is important. The wafer cleaning machine can remove pollutants, residues and other impurities on the surface of the wafer, and ensure the quality and the purity of the wafer.
The wafer cleaning machine in the prior art has insufficient stability during clamping, so that the wafer is easy to deviate in the clamping process, and room for improvement exists.
Disclosure of Invention
The present utility model is directed to a wafer clamping mechanism for a wafer cleaning machine, so as to solve the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a wafer clamping mechanism for a wafer cleaning machine comprises a wafer clamping base plate, a wafer clamping swivel seat, a wafer clamping bearing seat, a wafer clamping center bearing seat and a wafer clamping outer edge bearing column; the wafer clamping swivel seat is rotationally connected with the wafer clamping base plate through a wafer clamping swivel seat driving wheel, the wafer clamping bearing seat is fixedly connected with the wafer clamping swivel seat, a wafer clamping contact ball is fixedly connected inside the wafer clamping bearing seat, the wafer clamping center bearing seat is rotationally connected with the wafer clamping base plate, and the wafer clamping outer edge bearing column is fixedly connected with the wafer clamping base plate; through being provided with the wafer clamping swivel mount and one side and the wafer clamping supporting seat fixed connection of wafer clamping swivel mount, the opposite side rotates with the wafer clamping base and is connected, the accessible is preset the wafer on the wafer clamping supporting seat when using the wafer cleaning machine to carry out the cleaning operation of wafer, then through the position of driving the rotatable adjustable wafer of wafer clamping swivel mount, and because the inside and the wafer clamping base rotation of wafer clamping base are connected of wafer clamping center supporting seat setting, the outside and the wafer clamping base rotation of wafer clamping outer fringe supporting column setting at the wafer clamping base are connected, consequently, can utilize wafer clamping center supporting seat and wafer clamping outer fringe supporting column to carry out the centre gripping support to the wafer, guarantee the centre gripping and the stability of rotation regulation of wafer.
As still further aspects of the utility model: the wafer clamping center bearing seat comprises a bearing seat center concave area and a bearing seat outer edge flat area, wherein the bearing seat center concave area is arranged in the center area of the wafer clamping center bearing seat, and the bearing seat outer edge flat area is arranged in the outer edge area of the wafer clamping center bearing seat; through being provided with the central sunk area of supporting seat and the outer fringe flat area of supporting seat, the cavity that can utilize supporting seat central sunk area and wafer formation at the in-process that wafer and wafer centre of holding hold the seat contact, the cavity arouses the atmospheric pressure and changes can make wafer and wafer centre of holding hold the seat contact more stable, promotes the connection stability of wafer centre of holding hold seat and wafer, guarantees the centre of holding hold seat and holds the supporting effect to the centre of holding of wafer region.
As still further aspects of the utility model: one end of the wafer clamping outer edge supporting column is fixedly connected with a contact column, and the contact column is movably connected with the wafer; by the arrangement, friction generated during contact of the wafer can be reduced, and abrasion at the outer edge of the wafer is avoided.
As still further aspects of the utility model: a central bearing seat transfer groove is formed in the wafer clamping base plate, one side of the wafer clamping central bearing seat is fixedly connected with a central bearing seat transfer rail, and the central bearing seat transfer rail is matched with the central bearing seat transfer groove; the central bearing seat transfer rail can be used for rotationally connecting the wafer clamping central bearing seat, so that the wafer clamping central bearing seat can be rotated to enable the central concave area of the bearing seat and the wafer to form a stable cavity.
As still further aspects of the utility model: the wafer clamping base is internally provided with a wafer clamping swivel base movable cavity and a swivel base driving wheel movable cavity, the wafer clamping swivel base driving wheel is rotatably connected with the swivel base driving wheel movable cavity, the wafer clamping swivel base is movably connected with the wafer clamping swivel base movable cavity, and the wafer clamping swivel base driving wheel is movably connected with the wafer clamping swivel base; a servo motor is fixedly connected to one side of the wafer clamping base plate, and the output end of the servo motor penetrates through the movable cavity of the swivel drive wheel and is fixedly connected with the wafer clamping swivel drive wheel to drive the wafer clamping swivel drive wheel to rotate.
As still further aspects of the utility model: a contact ball cavity is formed in the wafer clamping bearing seat, and the contact ball cavity is fixedly connected with the wafer clamping contact ball; the wafer clamping contact ball penetrates out of the contact ball cavity at one point of the outer circumferential wall of the wafer clamping contact ball to be in contact with the wafer to form a tangential point, and the tangential point is flush with the height of the wafer clamping bearing seat.
As still further aspects of the utility model: and polishing the contact column.
Compared with the prior art, the utility model has the beneficial effects that:
1. the wafer clamping rotary seat is arranged, one side of the wafer clamping rotary seat is fixedly connected with the wafer clamping support seat, the other side of the wafer clamping rotary seat is rotatably connected with the wafer clamping base plate, when the wafer cleaning machine is used for cleaning a wafer, the wafer is preset on the wafer clamping support seat, then the wafer is driven to rotate to adjust the position of the wafer, and the wafer clamping center support seat is arranged in the wafer clamping base plate and is rotatably connected with the wafer clamping base plate, and the wafer clamping outer edge support column is arranged outside the wafer clamping base plate and is rotatably connected with the wafer clamping base plate, so that the wafer can be clamped and supported by the wafer clamping center support seat and the wafer clamping outer edge support column, and the stability of clamping and rotation adjustment of the wafer is ensured;
2. by arranging the central concave area of the bearing seat and the outer edge flat area of the bearing seat, a cavity formed by the central concave area of the bearing seat and the wafer can be utilized in the process of contacting the wafer with the wafer clamping central bearing seat, and the wafer can be contacted with the wafer clamping central bearing seat more stably due to the change of air pressure caused by the cavity, so that the connection stability of the wafer clamping central bearing seat and the wafer is improved, and the clamping supporting effect of the wafer clamping central bearing seat on the wafer central area is ensured; the friction generated during the contact of the wafer can be reduced, so that the abrasion of the outer edge of the wafer is avoided;
3. the central bearing seat transfer rail is arranged to rotatably connect the wafer clamping central bearing seat, so that the wafer clamping central bearing seat can be rotated to enable the central concave area of the bearing seat and the wafer to form a stable cavity;
4. a servo motor is fixedly connected to one side of the wafer clamping base plate, and the output end of the servo motor penetrates through the movable cavity of the swivel drive wheel and is fixedly connected with the wafer clamping swivel drive wheel to drive the wafer clamping swivel drive wheel to rotate;
5. the wafer clamping contact ball penetrates out of the contact ball cavity at one point of the outer circumferential wall of the wafer clamping contact ball to be in contact with the wafer to form a tangential point, and the tangential point is flush with the height of the wafer clamping bearing seat.
Drawings
FIG. 1 is a schematic view showing the overall structure of a wafer clamping mechanism for a wafer cleaning machine according to the present utility model;
FIG. 2 is a schematic diagram showing the structure of the wafer chuck support and the wafer chuck contact ball in the wafer chuck mechanism for a wafer cleaning machine according to the present utility model;
FIG. 3 is a schematic view of a transfer of a center support in a wafer chuck for a wafer cleaning machine according to the present utility model;
FIG. 4 is a schematic view of a wafer clamping base in a wafer clamping mechanism for a wafer cleaning machine according to the present utility model;
FIG. 5 is a front perspective view of a wafer clamping center support bracket in a wafer clamping mechanism for a wafer cleaning machine according to the present utility model;
in the figure: 1. a wafer clamping base; 11. a wafer clamping swivel seat movable cavity; 12. a swivel drive wheel movable cavity; 13. a central support bracket transfer slot; 2. wafer clamping swivel mount; 3. a wafer clamping support; 31. a contact ball cavity; 4. a wafer clamping center support bracket; 41. a central concave area of the bearing seat; 42. the outer edge flat area of the bearing seat; 5. wafer clamping outer edge support columns; 51. a contact column; 6. a wafer clamping turret drive wheel; 7. wafer clamping contact balls; 8. the central bearing seat rotates.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "configured" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. Hereinafter, an embodiment of the present utility model will be described in accordance with its entire structure.
Referring to fig. 1 to 5, in an embodiment of the present utility model, a wafer clamping mechanism for a wafer cleaning machine includes a wafer clamping base 1, a wafer clamping swivel base 2, a wafer clamping support bracket 3, a wafer clamping center support bracket 4 and a wafer clamping outer edge support column 5; the wafer clamping swivel base 2 is rotationally connected with the wafer clamping base 1 through a wafer clamping swivel base driving wheel 6, the wafer clamping bearing seat 3 is fixedly connected with the wafer clamping swivel base 2, a wafer clamping contact ball 7 is fixedly connected inside the wafer clamping bearing seat 3, the wafer clamping center bearing seat 4 is rotationally connected with the wafer clamping base 1, and the wafer clamping outer edge bearing column 5 is fixedly connected with the wafer clamping base 1; through being provided with wafer clamping swivel mount 2 and one side and wafer clamping support seat 3 fixed connection, opposite side and wafer clamping base 1 rotation connection, the accessible is preset on wafer clamping support seat 3 when using the wafer cleaning machine to carry out the cleaning operation of wafer, then through the position of driving wafer clamping swivel mount 2 rotation adjustable wafer, and because wafer clamping center support seat 4 sets up in the inside of wafer clamping base 1 and wafer clamping base 1 rotation connection, wafer clamping outer fringe support post 5 sets up in the outside of wafer clamping base 1 and wafer clamping base 1 rotation connection, therefore available wafer clamping center support seat 4 and wafer clamping outer fringe support post 5 carry out the centre gripping support to the wafer, guarantee the stability of centre gripping and the rotation regulation of wafer.
As still further aspects of the utility model: the wafer clamping center bearing seat 4 comprises a bearing seat center concave area 41 and a bearing seat outer edge flat area 42, the bearing seat center concave area 41 is arranged in the center area of the wafer clamping center bearing seat 4, and the bearing seat outer edge flat area 42 is arranged in the outer edge area of the wafer clamping center bearing seat 4; through being provided with the central sunk area 41 of supporting seat and the outer fringe flat area 42 of supporting seat, the cavity that can utilize the central sunk area 41 of supporting seat and wafer formation at the in-process that wafer and wafer centre gripping support seat 4 contacted, the cavity arouses that atmospheric pressure changes can make wafer and wafer centre gripping support seat 4 contact more stably, promotes the connection stability of wafer centre gripping support seat 4 and wafer, guarantees the centre gripping support effect of wafer centre gripping support seat 4 to the wafer centre region.
As still further aspects of the utility model: one end of the wafer clamping outer edge supporting column 5 is fixedly connected with a contact column 51, and the contact column 51 is movably connected with the wafer; by arranging the contact posts 51, friction generated when the wafer is contacted with the contact posts 51 can be reduced, and abrasion at the outer edge of the wafer is avoided.
As still further aspects of the utility model: a central bearing seat transfer groove 13 is formed in the wafer clamping base plate 1, a central bearing seat transfer rail 8 is fixedly connected to one side of the wafer clamping central bearing seat 4, and the central bearing seat transfer rail 8 is matched with the central bearing seat transfer groove 13; the central support pedestal transfer rail 8 is configured to rotatably couple the wafer clamping central support pedestal 4 such that the wafer clamping central support pedestal 4 is rotatable to form a stable cavity between the support pedestal central depression 41 and the wafer.
As still further aspects of the utility model: the wafer clamping base plate 1 is internally provided with a wafer clamping swivel seat movable cavity 11 and a swivel seat driving wheel movable cavity 12, the wafer clamping swivel seat driving wheel 6 is rotatably connected with the swivel seat driving wheel movable cavity 12, the wafer clamping swivel seat 2 is movably connected with the wafer clamping swivel seat movable cavity 11, and the wafer clamping swivel seat driving wheel 6 is movably connected with the wafer clamping swivel seat 2; a servo motor is fixedly connected to one side of the wafer clamping base plate 1, and the output end of the servo motor penetrates through the movable cavity 12 of the swivel driving wheel and is fixedly connected with the wafer clamping swivel driving wheel 6 to drive the wafer clamping swivel driving wheel 6 to rotate.
As still further aspects of the utility model: a contact ball cavity 31 is formed in the wafer clamping bearing seat 3, and the contact ball cavity 31 is fixedly connected with the wafer clamping contact ball 7; the wafer clamping contact ball 7 passes through the contact ball cavity 31 at a point of the outer circumferential wall to contact the wafer to form a tangent point, and the tangent point is level with the height of the wafer clamping bearing seat 3.
As still further aspects of the utility model: the contact pillars 51 are polished.
The working principle of the utility model is as follows: through the wafer clamping swivel seat 2, one side of the wafer clamping swivel seat 2 is fixedly connected with the wafer clamping base seat 3, the other side of the wafer clamping swivel seat 2 is rotatably connected with the wafer clamping base seat 1, when a wafer cleaning machine is used for cleaning a wafer, the wafer can be preset on the wafer clamping base seat 3, then the position of the wafer can be adjusted by driving the wafer clamping swivel seat 2 to rotate, and as the wafer clamping center base seat 4 is arranged inside the wafer clamping base seat 1 and is rotatably connected with the wafer clamping base seat 1, the wafer clamping outer edge bearing column 5 is arranged outside the wafer clamping base seat 1 and is rotatably connected with the wafer clamping base seat 1, so that the wafer can be clamped and supported by the wafer clamping center base seat 4 and the wafer clamping outer edge bearing column 5, and the stability of wafer clamping and rotation adjustment can be ensured;
by arranging the central concave area 41 of the bearing seat and the outer edge flat area 42 of the bearing seat, a cavity formed by the central concave area 41 of the bearing seat and the wafer can be utilized in the process of contacting the wafer with the wafer clamping central bearing seat 4, and the wafer can be contacted with the wafer clamping central bearing seat 4 more stably due to the change of air pressure caused by the cavity, so that the connection stability of the wafer clamping central bearing seat 4 and the wafer is improved, and the clamping and supporting effect of the wafer clamping central bearing seat 4 on the wafer central area is ensured; the contact posts 51 can reduce friction generated when the wafer contacts the contact posts 51, so that abrasion at the outer edge of the wafer is avoided;
the central support seat transfer rail 8 is configured to rotatably connect the wafer clamping central support seat 4, so that the wafer clamping central support seat 4 can be rotated to form a stable cavity between the support seat central depression 41 and the wafer;
a servo motor is fixedly connected to one side of the wafer clamping base plate 1, and the output end of the servo motor penetrates through the movable cavity 12 of the swivel drive wheel and is fixedly connected with the wafer clamping swivel drive wheel 6 to drive the wafer clamping swivel drive wheel 6 to rotate;
the wafer clamping contact ball 7 passes through the contact ball cavity 31 at a point of the outer circumferential wall to contact the wafer to form a tangent point, and the tangent point is level with the height of the wafer clamping bearing seat 3.
The foregoing description is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical solution of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. A wafer clamping mechanism for a wafer cleaning machine comprises a wafer clamping base plate (1), a wafer clamping swivel seat (2), a wafer clamping bearing seat (3), a wafer clamping center bearing seat (4) and a wafer clamping outer edge bearing column (5); the method is characterized in that: the wafer clamping swivel mount (2) is rotationally connected with the wafer clamping base plate (1) through a wafer clamping swivel mount driving wheel (6), the wafer clamping support seat (3) is fixedly connected with the wafer clamping swivel mount (2), the wafer clamping contact ball (7) is fixedly connected with the inside of the wafer clamping support seat (3), the wafer clamping center support seat (4) is rotationally connected with the wafer clamping base plate (1), and the wafer clamping outer edge support column (5) is fixedly connected with the wafer clamping base plate (1).
2. The wafer chuck mechanism for a wafer cleaning machine according to claim 1, wherein the wafer chuck center support base (4) includes a support base center concave region (41) and a support base outer edge flat region (42), the support base center concave region (41) is disposed in a center region of the wafer chuck center support base (4), and the support base outer edge flat region (42) is disposed in an outer edge region of the wafer chuck center support base (4).
3. Wafer clamping mechanism for a wafer cleaning machine according to claim 2, characterized in that one end of the wafer clamping outer edge support column (5) is fixedly connected with a contact column (51), and the contact column (51) is movably connected with a wafer.
4. A wafer clamping mechanism for a wafer cleaning machine according to claim 3, wherein a central support seat transfer groove (13) is formed in the wafer clamping base plate (1), a central support seat transfer rail (8) is fixedly connected to one side of the wafer clamping central support seat (4), and the central support seat transfer rail (8) is matched with the central support seat transfer groove (13).
5. The wafer clamping mechanism for a wafer cleaning machine according to claim 4, wherein a wafer clamping swivel base movable cavity (11) and a swivel base driving wheel movable cavity (12) are formed in the wafer clamping base (1), the wafer clamping swivel base driving wheel (6) is rotatably connected with the swivel base driving wheel movable cavity (12), the wafer clamping swivel base (2) is movably connected with the wafer clamping swivel base movable cavity (11), and the wafer clamping swivel base driving wheel (6) is movably connected with the wafer clamping swivel base (2).
6. The wafer clamping mechanism for a wafer cleaning machine according to claim 5, wherein a contact ball cavity (31) is formed in the wafer clamping support seat (3), and the contact ball cavity (31) is fixedly connected with the wafer clamping contact ball (7).
7. Wafer clamping mechanism for a wafer cleaning machine according to claim 6, characterized in that the contact posts (51) are polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976845.5U CN220774330U (en) | 2023-07-26 | 2023-07-26 | Wafer clamping mechanism for wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976845.5U CN220774330U (en) | 2023-07-26 | 2023-07-26 | Wafer clamping mechanism for wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220774330U true CN220774330U (en) | 2024-04-12 |
Family
ID=90602852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321976845.5U Active CN220774330U (en) | 2023-07-26 | 2023-07-26 | Wafer clamping mechanism for wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220774330U (en) |
-
2023
- 2023-07-26 CN CN202321976845.5U patent/CN220774330U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20050176350A1 (en) | Semiconductor wafer grinder | |
| CN111730430B (en) | Grinding apparatus with adjustable suction cup turntable | |
| US20110282484A1 (en) | Substrate positioning apparatus, substrate processing apparatus, substrate positioning method, and computer readable medium having a program stored thereon | |
| JPS61164773A (en) | Method and device for grinding wafer | |
| CN113241321A (en) | Mechanical arm | |
| CN116766029A (en) | Wafer clamping type edge polishing device and process thereof | |
| CN220774330U (en) | Wafer clamping mechanism for wafer cleaning machine | |
| CN210173204U (en) | Inner spherical surface machining device for bearing seat | |
| TWM260001U (en) | Calibration wafer and kit | |
| CN113579955A (en) | Double-station silicon carbide crystal shaping all-in-one machine | |
| CN115435015B (en) | Air-floatation rotary table and working method thereof | |
| CN210819007U (en) | Wafer cutting machine with adjustable workstation | |
| CN115157049A (en) | Polishing equipment for semiconductor material production | |
| CN111823084B (en) | Grinding apparatus with differential thread structure | |
| JPH065568A (en) | Fully-automatic polishing device of semiconductor wafer | |
| CN217371658U (en) | Grinding device for silicon wafer production and processing | |
| CN217009126U (en) | Automatic contact angle measuring mechanism for silicon wafer | |
| CN218776315U (en) | Grinding machine thimble processing auxiliary device | |
| CN217606800U (en) | Position correction device for silicon wafer | |
| CN220358057U (en) | Wafer wax pasting mechanism | |
| CN218461840U (en) | Silicon wafer polishing machine | |
| CN217552792U (en) | Precision rotating platform capable of performing all-dimensional accurate correction and positioning on wafer | |
| CN216179177U (en) | Edge grinding clamping tool | |
| CN218556688U (en) | Positioning tool for polishing display screen | |
| CN218631991U (en) | Wafer turnover mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |