CN210819007U - Wafer cutting machine with adjustable workstation - Google Patents
Wafer cutting machine with adjustable workstation Download PDFInfo
- Publication number
- CN210819007U CN210819007U CN201921640843.2U CN201921640843U CN210819007U CN 210819007 U CN210819007 U CN 210819007U CN 201921640843 U CN201921640843 U CN 201921640843U CN 210819007 U CN210819007 U CN 210819007U
- Authority
- CN
- China
- Prior art keywords
- ceramic
- cutting machine
- sucking disc
- wafer cutting
- driving motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer cutting machine with adjustable workstation, including sucking disc fixing base, driving motor and ceramic sucking disc, driving motor's output shaft in the sucking disc fixing base, driving motor is used for the drive the sucking disc fixing base is rotatory, be equipped with the recess on the sucking disc fixing base, ceramic sucking disc sets up in the recess, still include at least three vertical adjustment mechanism, vertical adjustment mechanism connects driving motor is last, vertical adjustment mechanism is used for setting up and adjusts on presetting the plane degree of ceramic sucking disc reaches the plane degree of adjusting ceramic sucking disc.
Description
Technical Field
The utility model belongs to the technical field of the wafer cutting, more specifically say, relate to a wafer cutting machine with adjustable workstation.
Background
Wafer dicing is an important ring in the manufacturing process of a wafer that is cut into small chips by a dicing process. Because wafer cutting is the first step in the semiconductor subsequent packaging process, the area to be cut on the wafer is well laid out in advance, once the wafer cutting fails or the precision cannot be achieved, the loss cost is very high, and the requirements on the precision and the stability of equipment for wafer cutting are extremely high.
The equipment for cutting the wafer comprises a grinding wheel and a rotary workbench arranged below the grinding wheel. The grinding wheel is used for cutting wafers placed on the rotary working platform, the rotating speed of the grinding wheel is as high as 60000r/min, after the rotary working platform is used for a period of time, the plane of the rotary working platform is not kept in a horizontal state, the cutting edge breakage is easily caused, the cutting precision is easily influenced, and therefore the requirement on the flatness of the rotary working platform is extremely high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer cutting machine with adjustable workstation to there is swivel work head in solving prior art after using a period, swivel work head's plane does not keep the horizontally state, very easily arouses the cutting to collapse the limit and influence the technical problem of cutting accuracy.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a wafer cutting machine with adjustable workstation, including sucking disc fixing base, driving motor and ceramic sucking disc, driving motor's output shaft in the sucking disc fixing base, driving motor is used for the drive the sucking disc fixing base is rotatory, be equipped with the recess on the sucking disc fixing base, the ceramic sucking disc sets up in the recess, still include at least three vertical adjustment mechanism, vertical adjustment mechanism connects driving motor is last, vertical adjustment mechanism is used for setting up and adjusting on predetermineeing the plane degree of ceramic sucking disc.
Further, the vertical adjusting mechanism comprises an adjusting rod and a supporting block, one end of the adjusting rod is fixed on the driving motor, and the other end of the adjusting rod faces the preset plane and is in threaded connection with the supporting block.
Further, the support block further comprises an elastic adjusting piece, and the elastic adjusting piece is located between the support block and the preset plane.
Further, the elastic adjusting piece is a disc spring or an adjusting pad.
Further, still include the regulating part, the regulating part is located ceramic sucking disc with between the sucking disc fixing base, the regulating part is located the recess, the regulating part is used for adjusting ceramic sucking disc's plane degree.
Furthermore, one end of the adjusting piece is positioned in the ceramic sucker and is in threaded connection with the ceramic sucker, and the other end of the adjusting piece is abutted against the bottom of the groove.
Further, the regulating part is provided with a plurality of, the regulating part equidistance sets up on a circumference, the circumference with ceramic sucking disc's center is the centre of a circle.
Further, the groove is set to be a circular groove, the ceramic sucker is a circular sucker, and the axial direction of the circular sucker is collinear with the axial direction of the circular groove.
Furthermore, the dustproof cover is sleeved on the sucker fixing seat, one end of the connecting rod is fixed to the dustproof cover, the other end of the connecting rod is fixed to the driving motor, and the dustproof pull curtain is fixed to two opposite sides of the dustproof cover.
Further, still include waterproof ring, waterproof ring is fixed on the dust cover, waterproof ring encloses to be located the sucking disc fixing base, waterproof ring is located one side that the dust cover dorsad driving motor.
The utility model provides a pair of wafer cutting machine with adjustable workstation's beneficial effect lies in: compared with the prior art, the utility model discloses a wafer cutting machine's ceramic sucking disc's plane degree can be adjusted to the plane degree of the potsherd on the ceramic sucking disc can be adjusted, guarantees the cutting accuracy and the quality of wafer. Vertical adjustment mechanism guarantees that driving motor stably sets up on predetermineeing the plane, guarantees driving motor job stabilization nature.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a first schematic structural diagram of a wafer cutting machine with an adjustable worktable according to an embodiment of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
fig. 3 is a schematic diagram of an explosion structure of a wafer cutting machine with an adjustable worktable according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1. a sucker fixing seat; 11. a groove; 2. a drive motor; 3. a ceramic chuck; 4. a vertical adjustment mechanism; 41. adjusting a rod; 42. a support block; 43. an elastic adjustment member; 5. a ceramic plate; 6. a dust cover; 7. a connecting rod; 8. a dustproof pull curtain; 9. a waterproof ring; 10. and presetting a plane.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 3, a wafer cutting machine with an adjustable worktable according to the present invention will now be described. The utility model provides a wafer cutting machine with adjustable workstation, including sucking disc fixing base 1, driving motor 2 and ceramic chuck 3, driving motor 2's output shaft is in sucking disc fixing base 1, driving motor 2 is used for driving sucking disc fixing base 1 rotatory, be equipped with recess 11 on sucking disc fixing base 1, ceramic chuck 3 sets up in recess 11, still include at least three vertical adjustment mechanism 4, vertical adjustment mechanism 4 is connected on driving motor 2, vertical adjustment mechanism 4 is used for setting up on presetting plane 10 and adjusts ceramic chuck 3's plane degree.
The preset plane 10 is a plane for fixing the driving motor 2.
The flatness is the deviation of the surface of the ceramic sucker 3 for absorbing the ceramic plate 5 from an ideal plane.
And the ceramic sucker 3 is used for being connected with the ceramic plate 5.
And the ceramic plate 5 is used for placing the wafer.
The use process comprises the following steps: the driving motor 2 is firstly placed on the preset plane 10, the vertical adjusting mechanisms 4 are in contact with the preset plane 10 at the moment, and the driving motor 2 is kept on the preset plane 10 through the at least three vertical adjusting mechanisms 4. Place ceramic sucking disc 3 in recess 11, detect whether the plane degree of ceramic sucking disc 3 is in predetermineeing the within range, if do not, adjust vertical adjustment mechanism 4, make driving motor 2 change at the inclination of predetermineeing on plane 10 to the plane degree of adjustment ceramic sucking disc 3. After the wafer cutting machine is used for a period of time, whether the flatness of the ceramic sucker 3 is within a preset range is detected, if not, the vertical adjusting mechanism 4 is adjusted, so that the inclination angle of the driving motor 2 on the preset plane 10 is changed, and the flatness of the ceramic sucker 3 is adjusted within the preset range.
The utility model provides a pair of wafer cutting machine with adjustable workstation compares with prior art, and wafer cutting machine's ceramic sucking disc 3's plane degree can be adjusted to the plane degree of potsherd 5 on the ceramic sucking disc 3 can be adjusted, guarantees the cutting accuracy and the quality of wafer. The vertical adjusting mechanism 4 ensures that the driving motor 2 is stably arranged on the preset plane 10, and ensures the working stability of the driving motor 2.
Further, please refer to fig. 1 and 2, as a specific embodiment of the present invention, the vertical adjusting mechanism 4 includes an adjusting rod 41 and a supporting block 42, one end of the adjusting rod 41 is fixed on the driving motor 2, the other end of the adjusting rod 41 faces the preset plane 10, and is screwed to the supporting block 42, and the adjusting rod 41 is inserted into the supporting block 42.
The supporting block 42 is in threaded connection with the adjusting rod 41, and the supporting block 42 performs fine adjustment on the adjusting rod 41, so that the flatness of the ceramic sucker 3 is finely adjusted. The vertical adjusting mechanism 4 is simple in structure and very practical. The supporting block 42 is contacted with the preset plane 10, so that the position of the supporting block 42 on the adjusting rod 41 is changed to realize the adjustment of the flatness of the ceramic sucker 3, which is very convenient.
Specifically, the adjustment rods 41 are arranged at equal lengths.
Further, referring to fig. 1 and 2, as an embodiment of the wafer cutting machine with an adjustable worktable according to the present invention, the wafer cutting machine further includes an elastic adjusting member 43, and the elastic adjusting member 43 is located between the supporting block 42 and the predetermined plane 10.
The elastic adjustment member 43 prevents the supporting block 42 from directly contacting the predetermined plane 10, and thus protects the predetermined plane 10 and the supporting block 42. Abrasion between the predetermined plane 10 and the supporting block 42 is not easily generated.
Further, referring to fig. 1 and 2, as an embodiment of the wafer cutting machine with an adjustable worktable of the present invention, the elastic adjusting member 43 is a disc spring or an adjusting pad.
The dish spring has super large rigidity with the adjustment pad, is difficult for taking place deformation, plays the effect of stable support driving motor 2.
Further, please refer to fig. 1 to 3, which are schematic views illustrating a specific embodiment of the wafer cutting machine with an adjustable worktable according to the present invention, further comprising an adjusting member (not shown), wherein the adjusting member is located between the ceramic chuck 3 and the chuck fixing base 1, the adjusting member is located in the groove 11, and the adjusting member is used for adjusting the flatness of the ceramic chuck 3.
After vertical adjustment mechanism 4 adjusts and accomplishes, can adjust the plane degree of ceramic sucking disc 3 through the regulating part, make vertical adjustment mechanism 4 and regulating part cooperate jointly to adjust the plane degree of ceramic sucking disc 3, improve the convenience of this wafer cutting machine adjustment.
Further, referring to fig. 1 to 3, as a specific embodiment of the wafer cutting machine with the adjustable worktable of the present invention, one end of the adjusting member is located in the ceramic chuck 3 and is screwed to the ceramic chuck 3, and the other end of the adjusting member abuts against the bottom of the groove 11.
The connecting structure of the adjusting piece and the ceramic sucker 3 is simple and very practical. The adjusting piece can be finely adjusted on the ceramic sucker 3, so that the length of the adjusting piece protruding out of the ceramic sucker 3 is changed. The ceramic sucker 3 with the length of the adjusting piece protruding out of the ceramic sucker 3 changed is placed in the groove 11, so that the flatness of the ceramic sucker 3 is changed.
Further, referring to fig. 1 to 3, as a specific embodiment of the wafer cutting machine with an adjustable worktable provided by the present invention, the adjusting member is provided with a plurality of adjusting members, the equal distance of the adjusting members is set on a circumference, and the circumference uses the center of the ceramic chuck 3 as the center of circle.
The ceramic sucker 3 is stably placed in the groove 11 by the cooperation of the plurality of adjusting pieces, so that the ceramic sucker 3 is not easy to shake.
Further, referring to fig. 1 and 3, as a specific embodiment of the wafer cutting machine with an adjustable worktable provided by the present invention, the groove 11 is set to be a circular groove, the ceramic chuck 3 is a circular chuck, and the axial direction of the circular chuck is collinear with the axial direction of the circular groove.
The circular sucker and the circular groove are convenient to mount and dismount, and the convenience of assembling the wafer cutting machine is improved.
Further, please refer to fig. 1 and fig. 3, as the utility model provides a specific implementation of a wafer cutting machine with adjustable workstation, still include dust cover 6, connecting rod 7 and dustproof drawing curtain 8, the sucking disc fixing base 1 is located to 6 covers of dust cover, and the one end of connecting rod 7 is fixed on dust cover 6, and the other one end of connecting rod 7 is fixed on driving motor 2, and the relative both sides of dust cover 6 all are fixed with dustproof drawing curtain 8.
The dust cover 6 is fixed on the driving motor 2 through the connecting rod 7, and the dust cover 6 is not easy to separate from the driving motor 2, so that a better dust prevention effect is achieved. When the predetermined plane 10 is moved, the driving motor 2 is further moved, and both ends of the dust cover 6 are displaced. When the dust cover 6 is displaced, the dust-proof pull curtain 8 is compressed or extended, and the dust cover 6 is not easy to be damaged, so that the dust prevention of the driving motor 2 is ensured.
Further, please refer to fig. 1 and fig. 3, as a specific embodiment of the wafer cutting machine with the adjustable worktable provided by the present invention, the wafer cutting machine further includes a waterproof ring 9, the waterproof ring 9 is fixed on the dust cover 6, the waterproof ring 9 is enclosed on the suction cup fixing seat 1, and the waterproof ring 9 is located on one side of the dust cover 6 facing away from the driving motor 2.
When water on the dust cover 6 flows to the gap between the suction cup fixing seat 1 and the dust cover 6, the waterproof ring 9 plays a role in preventing water from flowing to the gap between the suction cup fixing seat 1 and the dust cover 6, thereby playing a waterproof role in the driving motor 2.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a wafer cutting machine with adjustable workstation, includes sucking disc fixing base, driving motor and ceramic sucking disc, driving motor's output shaft in the sucking disc fixing base, driving motor is used for the drive the sucking disc fixing base is rotatory, be equipped with the recess on the sucking disc fixing base, the ceramic sucking disc sets up in the recess, its characterized in that still includes at least three vertical adjustment mechanism, vertical adjustment mechanism connects driving motor is last, vertical adjustment mechanism is used for setting up and adjusting on predetermineeing the plane degree of ceramic sucking disc.
2. The wafer cutting machine with the adjustable worktable as claimed in claim 1, wherein the vertical adjustment mechanism comprises an adjustment lever and a support block, one end of the adjustment lever is fixed to the driving motor, the other end of the adjustment lever faces the preset plane, and the adjustment lever is screwed to the support block.
3. The wafer cutting machine with adjustable table as claimed in claim 2, further comprising a resilient adjustment member, wherein the resilient adjustment member is located between the support block and the predetermined plane.
4. The wafer cutting machine with adjustable table as claimed in claim 3, wherein the elastic adjusting member is a disc spring or an adjusting pad.
5. The wafer cutting machine with the adjustable worktable as claimed in claim 1, further comprising an adjusting member, wherein the adjusting member is located between the ceramic chuck and the chuck fixing base, the adjusting member is located in the groove, and the adjusting member is used for adjusting the flatness of the ceramic chuck.
6. The wafer cutting machine with adjustable table as claimed in claim 5, wherein one end of the adjusting member is located in the ceramic chuck and screwed to the ceramic chuck, and the other end of the adjusting member abuts against the bottom of the groove.
7. The wafer cutting machine with adjustable worktable of claim 5, wherein the adjusting member is provided with a plurality of adjusting members, the adjusting members are arranged on a circumference with equal distance, and the circumference takes the center of the ceramic sucker as the center of the circle.
8. The wafer cutting machine with adjustable table as set forth in claim 1, wherein said recess is provided as a circular groove, said ceramic chuck is a circular chuck, and an axial direction of said circular chuck is collinear with an axial direction of said circular groove.
9. The wafer cutting machine with the adjustable worktable as claimed in claim 1, further comprising a dust cover, a connecting rod and a dust-proof pull curtain, wherein the dust cover is sleeved on the sucker fixing seat, one end of the connecting rod is fixed on the dust cover, the other end of the connecting rod is fixed on the driving motor, and the dust-proof pull curtain is fixed on two opposite sides of the dust cover.
10. The wafer cutting machine with the adjustable worktable as claimed in claim 9, further comprising a waterproof ring fixed on the dustproof cover, wherein the waterproof ring is enclosed in the suction cup fixing seat, and the waterproof ring is located on a side of the dustproof cover facing away from the driving motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921640843.2U CN210819007U (en) | 2019-09-27 | 2019-09-27 | Wafer cutting machine with adjustable workstation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921640843.2U CN210819007U (en) | 2019-09-27 | 2019-09-27 | Wafer cutting machine with adjustable workstation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210819007U true CN210819007U (en) | 2020-06-23 |
Family
ID=71277068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921640843.2U Active CN210819007U (en) | 2019-09-27 | 2019-09-27 | Wafer cutting machine with adjustable workstation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210819007U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116373138A (en) * | 2023-06-02 | 2023-07-04 | 沈阳和研科技股份有限公司 | Dicing saw |
-
2019
- 2019-09-27 CN CN201921640843.2U patent/CN210819007U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116373138A (en) * | 2023-06-02 | 2023-07-04 | 沈阳和研科技股份有限公司 | Dicing saw |
| CN116373138B (en) * | 2023-06-02 | 2023-08-25 | 沈阳和研科技股份有限公司 | Dicing saw |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210819007U (en) | Wafer cutting machine with adjustable workstation | |
| JP5679887B2 (en) | Flange end face correction method | |
| US9358655B2 (en) | Outer periphery polishing apparatus for disc-shaped workpiece | |
| JP2014124732A (en) | Work clamp method, work clamp device, work plane grinding method and work plane grinder | |
| CN113471126B (en) | Accurate die bonder | |
| JP5318517B2 (en) | Chuck table mechanism | |
| EP1707309A1 (en) | Lens stock device and lens processing system with the same | |
| JP5530815B2 (en) | Dress board holding table | |
| JP5863483B2 (en) | Plate member grinding machine | |
| JP7051205B2 (en) | Cutting equipment | |
| JP6228349B2 (en) | Processing equipment | |
| US20090044669A1 (en) | Machining method employing oblique workpiece spindle | |
| CN211662380U (en) | Wafer cutting machine with adjustable vacuum chuck | |
| JP5242348B2 (en) | Processing equipment | |
| CN115435015A (en) | Air-float rotary table and working method thereof | |
| CN108818292A (en) | A kind of grinder work holder of plug for industrial use production | |
| JPH11309673A (en) | Spindle slant angle adjusting mechanism of flattening device | |
| CN216179177U (en) | Edge grinding clamping tool | |
| CN220774330U (en) | Wafer clamping mechanism for wafer cleaning machine | |
| CN220548108U (en) | Auxiliary device for installing chemical mechanical polishing head | |
| CN216830126U (en) | Grinding device for bucket side plate | |
| CN216784753U (en) | Workpiece feeding device | |
| JP2013162116A (en) | Grinding attachment | |
| CN217820504U (en) | Display screen inspection tool that two-sided used | |
| CN216327210U (en) | Edging mechanism is used in camera lens processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |