CN220773545U - Singlechip that radiating effect is good - Google Patents
Singlechip that radiating effect is good Download PDFInfo
- Publication number
- CN220773545U CN220773545U CN202322623438.2U CN202322623438U CN220773545U CN 220773545 U CN220773545 U CN 220773545U CN 202322623438 U CN202322623438 U CN 202322623438U CN 220773545 U CN220773545 U CN 220773545U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat conducting
- heat dissipation
- conducting fin
- singlechip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000000694 effects Effects 0.000 title claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000001816 cooling Methods 0.000 claims abstract description 29
- 238000009434 installation Methods 0.000 claims description 19
- 238000007790 scraping Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 16
- 239000000428 dust Substances 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Abstract
The utility model discloses a singlechip with good heat dissipation effect, which belongs to the technical field of singlechips and comprises a circuit board, wherein an exhaust mechanism for cooling the bottom of the circuit board by air cooling is arranged at the end part of the circuit board, and a heat conducting sheet attached to the bottom of the circuit board is arranged at the bottom of the circuit board. According to the arrangement of the heat conducting fin at the bottom of the circuit board and the hollow water bin, the heat conducting fin penetrates through the hollow water bin, the top of the heat conducting fin is attached to the bottom of the circuit board, the bottom of the heat conducting fin is attached to the inner bottom of the groove on the bottom plate, the heat conducting fin is matched with the air exhaust mechanism for use, air cooling and cooling can be directly performed in the use process, meanwhile, heat of the heat conducting fin is transferred to the inside of the hollow water bin for accelerated cooling by utilizing the heat transfer effect of the heat conducting fin, the cooling rate is improved, in addition, flowing air cools the bottom of the heat conducting fin, heat in water is taken away, the heat dissipation effect in the use process is guaranteed, and the practicability is higher.
Description
Technical Field
The utility model relates to a singlechip with good heat dissipation effect, and belongs to the technical field of singlechips.
Background
In the prior art, as disclosed in the utility model with publication number 202122401298.5, an internet of things singlechip with good heat dissipation effect is disclosed, heat dissipated by a chip of a circuit board is extracted through a heat dissipation fan arranged, a heat conduction copper pipe at the bottom of the circuit board has two functions, namely, the heat of the circuit board is led out, the heat dissipation fan is conveniently extracted through a heat dissipation port, and the heat in the heat conduction copper pipe is led out through water flow through an inlet pipe and an outlet pipe external circulating water pump.
Similar to the above-mentioned application, there are currently disadvantages:
1. the cooling mode of combining air cooling and water cooling can be selected in the cooling process, but an external circulating water pump is required to be used in the using process, so that the installation difficulty of the device is increased, and the energy consumption is increased in the using process;
2. dust cannot be blocked in the exhaust and intake processes, and the dust is easy to adhere to the surface of the circuit board, so that the heat dissipation effect is affected;
therefore, the singlechip with good heat dissipation effect is designed to optimize the problems.
Disclosure of Invention
The utility model mainly aims to provide a singlechip with good heat dissipation effect, the heat conducting fin at the bottom of a circuit board and the hollow water bin are arranged, the heat conducting fin penetrates through the hollow water bin, the top of the heat conducting fin is attached to the bottom of the circuit board, the bottom of the heat conducting fin is attached to the inner bottom of a groove on a bottom plate, and then the singlechip is matched with an exhaust mechanism for use, so that air cooling and cooling can be directly carried out in the use process, meanwhile, heat of the heat conducting fin is transferred to the inside of the hollow water bin for accelerated cooling, the cooling rate is improved, in addition, flowing air cools the bottom of the heat conducting fin, and then the heat in water is taken away, the heat dissipation effect in the use process is ensured, the practicability is higher, dust entering in the heat dissipation process can be avoided, and in addition, the scraper arranged outside the installation bin in a sliding way can be used for rapidly cleaning dust on a second dust screen, and the use is more convenient.
The aim of the utility model can be achieved by adopting the following technical scheme:
a singlechip with good heat dissipation effect comprises a circuit board, wherein an exhaust mechanism for cooling the bottom of the circuit board by air cooling is arranged at the end part of the circuit board;
the bottom of the circuit board is provided with a heat conducting sheet attached to the bottom of the circuit board, two sides of the bottom of the circuit board are fixedly provided with cushion blocks, and the bottom ends of the two sets of cushion blocks are provided with a bottom plate for supporting the circuit board;
a hollow water bin attached to the top of the bottom plate is arranged below the circuit board, a gap is reserved between the top of the hollow water bin and the bottom of the circuit board, and a heat conducting fin at the bottom of the circuit board penetrates through the inside of the hollow water bin and is attached to the inner bottom of the groove at the top of the bottom plate.
Preferably, the heat conducting fin is vertically installed on the bottom surface of the circuit board, and the end part of the heat conducting fin faces the air exhaust mechanism and is vertical to the length direction of the air exhaust mechanism.
Preferably, the four corners of the circuit board and the bottom plate are provided with mounting holes for bolts to pass through, and the bottoms of the mounting holes on the bottom plate are provided with spring pads.
Preferably, one end of the circuit board, which is far away from the exhaust mechanism, is provided with a first dust screen, and the first dust screen is fixed on the end surfaces of the circuit board and the bottom plate.
Preferably, the exhaust mechanism comprises an installation bin, a heat radiation fan and a second dust screen;
the end part of the circuit board is fixed with a mounting bin for enclosing an end port between the circuit board and the bottom plate;
the heat dissipation fan is evenly installed in the installation bin along the length direction, and a second dustproof net is arranged at the outer end part of the installation bin and positioned at the input end of the heat dissipation fan.
Preferably, the end part of the installation bin is provided with a scraping plate in a sliding mode along the length direction, and the scraping plate is attached to the outer side of the second dustproof net.
Preferably, the top and the bottom of the installation bin are provided with guide grooves, and the sliding blocks in the guide grooves are fixedly connected with the scraping plates.
The beneficial effects of the utility model are as follows:
according to the singlechip with good heat dissipation effect, the heat conducting fin at the bottom of the circuit board and the hollow water bin are arranged, the heat conducting fin penetrates through the hollow water bin, the top of the heat conducting fin is attached to the bottom of the circuit board, the bottom end of the heat conducting fin is attached to the inner bottom of the groove on the bottom plate, and then the heat conducting fin is matched with the air exhaust mechanism for use, so that the air cooling and the cooling can be directly carried out in the using process, meanwhile, the heat of the heat conducting fin is transferred to the inside of the hollow water bin for accelerating and cooling, the cooling rate is improved, in addition, the flowing air cools the bottom of the heat conducting fin, and then the heat in water is taken away, the heat dissipation effect in the using process is ensured, and the practicability is higher;
the first dust screen of circuit board tip and the setting of second dust screen on the installation storehouse can avoid the entering of dust at radiating in-process, and the scraper blade that slides the setting in addition through the installation storehouse outside can clean the dust on the second dust screen fast, and it is more convenient to use.
Drawings
FIG. 1 is a front view of the present utility model;
FIG. 2 is a top plan view of the base plate of the present utility model;
FIG. 3 is a cross-sectional view of a hollow sump according to the present utility model;
FIG. 4 is a diagram of an exhaust fan according to the present utility model.
In the figure: 1. a circuit board; 2. a bottom plate; 3. a cushion block; 4. a groove; 5. a hollow water bin; 6. a heat conductive sheet; 7. an exhaust mechanism; 8. a first dust screen; 9. a spring pad; 10. a mounting bin; 11. a heat dissipation fan; 12. a second dust screen; 13. a scraper; 14. and a guide groove.
Detailed Description
In order to make the technical solution of the present utility model more clear and clear to those skilled in the art, the present utility model will be described in further detail with reference to examples and drawings, but the embodiments of the present utility model are not limited thereto.
As shown in fig. 1-3, the end of the circuit board 1 is provided with an air exhaust mechanism 7 for cooling the bottom of the circuit board 1 by air cooling, two sides of the bottom of the circuit board 1 are fixedly provided with cushion blocks 3, the bottom ends of the two sets of cushion blocks 3 are provided with a bottom plate 2 for supporting the circuit board 1, the bottom plate 2 and the cushion blocks 3 are enclosed into a rectangular sleeve shape, air is pumped from the outside by the air exhaust mechanism 7 to pass through the circuit board 1 for cooling by air cooling, the bottom of the circuit board 1 is provided with a heat conducting fin 6 attached to the bottom of the circuit board 1, the heat conducting fin 6 is vertically arranged on the bottom surface of the circuit board 1, the end of the heat conducting fin 6 faces the air exhaust mechanism 7 and is perpendicular to the length direction of the air exhaust mechanism 7, the air cooling can be conducted to the air direction in the air cooling process, a contact cooling mode is adopted for accelerating the dissipation of the bottom of the circuit board 1, a hollow water bin 5 attached to the top of the bottom of the circuit board 2 is arranged below the circuit board 1, a gap is reserved between the top of the hollow water bin 5 and the bottom of the circuit board 1, the heat conducting fin 6 passes through the inside the hollow water bin 5 and is attached to the bottom of the bottom groove 4 of the circuit board 2, the heat conducting fin 6 is cooled by the heat conducting fin 6 in the hollow water bin 6, and the inside the hollow water bin 5 is cooled by the heat conducting fin 6, and the heat of the inside the hollow water bin is cooled down by the hollow water bin 5, and the heat is cooled down by the inside the heat conducting fin 6.
As shown in fig. 1, mounting holes through which bolts pass are formed at four corners of a circuit board 1 and a bottom plate 2, a spring pad 9 is mounted at the bottom of each mounting hole on the bottom plate 2, in the process of mounting the device, the bolts directly pass through the inside of the mounting holes and pass through the inside of the spring pad 9, are connected with positioning holes on a shell, squeeze the spring pad 9, and provide an upward elastic force for the device by using the spring pad 9, so that the device can be trampled for shock absorption, a first dust screen 8 is arranged at one end of the circuit board 1 far away from an exhaust mechanism 7, and the first dust screen 8 is fixed on the end surfaces of the circuit board 1 and the bottom plate 2, in the process of heat dissipation, the exhaust mechanism 7 extracts external cold air, passes through the bottom of the circuit board 1, and hot air passes through the first dust screen 8, and the first dust screen 8 is utilized to prevent dust from entering from an exhaust port.
As shown in fig. 4, compared with the unprotected exhaust mode in the prior art, the exhaust mechanism 7 in the utility model comprises the installation bin 10, the heat dissipation fan 11 and the second dust screen 12, the installation bin 10 for enclosing the end port between the circuit board 1 and the bottom plate 2 is fixed at the end part of the circuit board 1, the heat dissipation fan 11 is uniformly installed in the installation bin 10 along the length direction, the second dust screen 12 is arranged at the outer end part of the installation bin 10 and at the input end of the heat dissipation fan 11, during the heat dissipation process, the heat dissipation fan 11 is simultaneously started, the outside air can enter the bottom of the circuit board 1 through the second dust screen 12, the second dust screen 12 is utilized to prevent the dust from entering, the scraper 13 is slidably arranged at the end part of the installation bin 10 along the length direction, the scraper 13 is attached to the outer side of the second dust screen 12, the guide groove 14 is formed at the top and the bottom of the installation bin 10, the slide block inside the guide groove 14 is fixedly connected with the scraper 13, when more dust is accumulated at the top of the second dust screen 12, the wind speed is reduced, the dust can be prevented from sliding along the length direction of the second dust screen 12 by controlling the scraper 13, and the second dust screen 12 can be cleaned by the dust screen, and the ventilation effect can be ensured.
The above description is merely a further embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto, and any person skilled in the art will be able to apply equivalents and modifications according to the technical solution and the concept of the present utility model within the scope of the present utility model disclosed in the present utility model.
Claims (7)
1. A singlechip with good heat dissipation effect comprises a circuit board (1), wherein an exhaust mechanism (7) for cooling the bottom of the circuit board (1) by air cooling is arranged at the end part of the circuit board (1);
the bottom of the circuit board (1) is provided with a heat conducting sheet (6) attached to the bottom of the circuit board (1), and is characterized in that: cushion blocks (3) are fixedly arranged at two sides of the bottom of the circuit board (1), and a bottom plate (2) for supporting the circuit board (1) is arranged at the bottom ends of the two groups of cushion blocks (3);
the lower part of the circuit board (1) is provided with a hollow water bin (5) attached to the top of the bottom plate (2), a gap is reserved between the top of the hollow water bin (5) and the bottom of the circuit board (1), and a heat conducting fin (6) at the bottom of the circuit board (1) penetrates through the inside of the hollow water bin (5) and is attached to the inner bottom of a groove (4) at the top of the bottom plate (2).
2. The singlechip with good heat dissipation effect according to claim 1, wherein: the heat conducting fin (6) is vertically arranged on the bottom surface of the circuit board (1), and the end part of the heat conducting fin (6) faces the air exhaust mechanism (7) and is vertical to the length direction of the air exhaust mechanism (7).
3. The singlechip with good heat dissipation effect according to claim 1, wherein: mounting holes for bolts to pass through are formed in four corners of the circuit board (1) and the bottom plate (2), and spring pads (9) are mounted at the bottoms of the mounting holes on the bottom plate (2).
4. The singlechip with good heat dissipation effect according to claim 1, wherein: one end of the circuit board (1) far away from the exhaust mechanism (7) is provided with a first dustproof net (8), and the first dustproof net (8) is fixed on the end faces of the circuit board (1) and the bottom plate (2).
5. The singlechip with good heat dissipation effect according to claim 1, wherein: the exhaust mechanism (7) comprises a mounting bin (10), a heat dissipation fan (11) and a second dustproof net (12);
a mounting bin (10) for enclosing an end port between the circuit board (1) and the bottom plate (2) is fixed at the end part of the circuit board (1);
the inside of the installation bin (10) is uniformly provided with a heat radiation fan (11) along the length direction, and a second dustproof net (12) is arranged at the outer end part of the installation bin (10) and positioned at the input end of the heat radiation fan (11).
6. The singlechip with good heat dissipation effect according to claim 5, wherein: the end part of the installation bin (10) is provided with a scraping plate (13) in a sliding mode along the length direction, and the scraping plate (13) is attached to the outer side of the second dustproof net (12).
7. The singlechip with good heat dissipation effect as defined in claim 6, wherein: the top and the bottom of the installation bin (10) are provided with guide grooves (14), and sliding blocks in the guide grooves (14) are fixedly connected with the scraping plates (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322623438.2U CN220773545U (en) | 2023-09-27 | 2023-09-27 | Singlechip that radiating effect is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322623438.2U CN220773545U (en) | 2023-09-27 | 2023-09-27 | Singlechip that radiating effect is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220773545U true CN220773545U (en) | 2024-04-12 |
Family
ID=90610286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322623438.2U Active CN220773545U (en) | 2023-09-27 | 2023-09-27 | Singlechip that radiating effect is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220773545U (en) |
-
2023
- 2023-09-27 CN CN202322623438.2U patent/CN220773545U/en active Active
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