CN220773545U - Singlechip that radiating effect is good - Google Patents

Abstract

The utility model discloses a single-chip computer with good heat dissipation effect, which belongs to the field of single-chip computer technology, including a circuit board, an exhaust mechanism for air cooling the bottom of the circuit board is provided at the end of the circuit board, and a heat conductive sheet is provided at the bottom of the circuit board and is attached to the bottom of the circuit board. The utility model sets the heat conductive sheet at the bottom of the circuit board and the hollow water tank, and the heat conductive sheet is passed through the hollow water tank, and the top of the heat conductive sheet is attached to the bottom of the circuit board, and the bottom of the heat conductive sheet is attached to the inner bottom of the groove on the bottom plate, and then used in conjunction with the exhaust mechanism, it can directly perform air cooling during use, and at the same time, utilize the heat transfer effect of the heat conductive sheet to transfer heat to the inside of the hollow water tank to accelerate cooling, thereby increasing the cooling rate, and the flowing air cools the bottom of the heat conductive sheet, and then takes away the heat in the water, thereby ensuring the heat dissipation effect during use, and having higher practicality.

Description

A single chip computer with good heat dissipation effect

Technical Field

The utility model relates to a single chip computer with good heat dissipation effect, belonging to the technical field of single chip computers.

Background technique

In the prior art, for example, a utility model with publication number 202122401298.5 discloses an IoT single-chip microcomputer with good heat dissipation effect. The heat dissipated by the chip of the circuit board is extracted by a heat dissipation fan, and the heat-conducting copper tube at the bottom of the circuit board has two functions. One is to export the heat of the circuit board to facilitate the heat dissipation fan to extract it through the heat dissipation port, and the other is to connect a circulating water pump to the inlet and outlet pipes to export the heat inside the heat-conducting copper tube through water flow. This scheme can further increase the heat dissipation capacity of the device and increase the power processed by the single-chip microcomputer.

Similar to the above application, there are still some shortcomings:

1. During the cooling process, a cooling method combining air cooling and water cooling can be selected, but an external circulating water pump is required during use, which increases the difficulty of installation of the device and increases energy consumption during use;

2. Dust cannot be blocked during the exhaust and intake process, and dust easily adheres to the surface of the circuit board, affecting the heat dissipation effect;

Therefore, a single chip microcomputer with good heat dissipation effect is designed to optimize the above problems.

Utility Model Content

The main purpose of the utility model is to provide a single-chip computer with good heat dissipation effect, a heat conductive sheet at the bottom of the circuit board and a hollow water tank are arranged, the heat conductive sheet is passed through the hollow water tank, and the top of the heat conductive sheet is fitted with the bottom of the circuit board, and the bottom end of the heat conductive sheet is fitted with the inner bottom of the groove on the bottom plate, and then used in conjunction with the exhaust mechanism, it can directly perform air cooling during use, and at the same time utilize the heat transfer effect of the heat conductive sheet to transfer heat to the inside of the hollow water tank to accelerate cooling, thereby increasing the cooling rate. In addition, the flowing air cools the bottom of the heat conductive sheet, and then takes away the heat in the water, ensuring the heat dissipation effect during use, and is more practical. The arrangement of the first dustproof net at the end of the circuit board and the second dustproof net on the mounting bin can prevent dust from entering during the heat dissipation process. In addition, the scraper slidingly arranged on the outside of the mounting bin can quickly clean the dust on the second dustproof net, which is more convenient to use.

The purpose of the utility model can be achieved by adopting the following technical solutions:

A single chip computer with good heat dissipation effect comprises a circuit board, and an exhaust mechanism for air cooling the bottom of the circuit board is arranged at the end of the circuit board;

A heat conducting sheet is provided at the bottom of the circuit board and is in contact with the bottom of the circuit board. Pads are fixedly installed on both sides of the bottom of the circuit board. Bottom ends of the two groups of pads are provided with a bottom plate for supporting the circuit board.

A hollow water tank is provided below the circuit board and is fitted with the top of the base plate, and a gap is left between the top of the hollow water tank and the bottom of the circuit board. The heat conductive sheet at the bottom of the circuit board passes through the inside of the hollow water tank and fits on the inner bottom of the groove at the top of the base plate.

Preferably, the heat conducting sheet is vertically mounted on the bottom surface of the circuit board, and the end of the heat conducting sheet faces the exhaust mechanism and is perpendicular to the length direction of the exhaust mechanism.

Preferably, mounting holes for bolts to pass through are provided at the four corners of the circuit board and the base plate, and spring pads are installed at the bottoms of the mounting holes on the base plate.

Preferably, a first dustproof net is provided at one end of the circuit board away from the exhaust mechanism, and the first dustproof net is fixed on the end surfaces of the circuit board and the bottom plate.

Preferably, the exhaust mechanism includes a mounting bin, a cooling fan and a second dustproof net;

An installation bin is fixed at the end of the circuit board to enclose the end opening between the circuit board and the bottom plate;

The interior of the installation bin is evenly equipped with cooling fans along the length direction, and the outer end of the installation bin is provided with a second dustproof net at the input end of the cooling fan.

Preferably, a scraper is slidably provided at the end of the installation bin along the length direction, and the scraper is attached to the outer side of the second dustproof net.

Preferably, guide grooves are provided at the top and the bottom of the installation bin, and the sliding blocks inside the guide grooves are fixedly connected to the scraper.

The beneficial effects of the utility model are:

The utility model provides a single chip computer with good heat dissipation effect, a heat conducting sheet at the bottom of the circuit board and a hollow water tank. The heat conducting sheet is passed through the hollow water tank, and the top of the heat conducting sheet is fitted with the bottom of the circuit board, and the bottom of the heat conducting sheet is fitted with the inner bottom of the groove of the bottom plate, and then used in conjunction with an exhaust mechanism. Air cooling can be directly performed during use, and at the same time, the heat transfer effect of the heat conducting sheet is utilized to transfer the heat to the inside of the hollow water tank to accelerate the cooling, thereby improving the cooling rate. In addition, the flowing air cools the bottom of the heat conducting sheet, and then takes away the heat in the water, thereby ensuring the heat dissipation effect during use, and having higher practicality.

The first dustproof net at the end of the circuit board and the second dustproof net on the installation bin can prevent the entry of dust during the heat dissipation process. In addition, the scraper sliding on the outside of the installation bin can quickly clean the dust on the second dustproof net, making it more convenient to use.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 is a front view of the utility model;

FIG2 is a top view of the bottom plate of the present invention;

FIG3 is a cross-sectional view of the hollow water tank of the utility model;

FIG. 4 is a diagram of an exhaust mechanism of the present utility model.

In the figure: 1. circuit board; 2. bottom plate; 3. pad; 4. groove; 5. hollow water tank; 6. heat conductive sheet; 7. exhaust mechanism; 8. first dustproof net; 9. spring pad; 10. installation bin; 11. cooling fan; 12. second dustproof net; 13. scraper; 14. guide groove.

Detailed ways

In order to make the technical solution of the utility model more clear and specific to those skilled in the art, the utility model is further described in detail below in conjunction with embodiments and drawings, but the implementation methods of the utility model are not limited thereto.

As shown in Figures 1 to 3, an exhaust mechanism 7 for air-cooling the bottom of the circuit board 1 is provided at the end of the circuit board 1, pads 3 are fixedly installed on both sides of the bottom of the circuit board 1, and a bottom plate 2 for supporting the circuit board 1 is installed at the bottom ends of the two groups of pads 3. The circuit board 1, the bottom plate 2 and the pads 3 are surrounded by a rectangular sleeve shape, and the exhaust mechanism 7 is used to draw air from the outside to pass through it for air-cooling. At the bottom of the circuit board 1, a heat conductive sheet 6 is provided that is bonded to the bottom of the circuit board 1. The heat conductive sheet 6 is vertically installed on the bottom surface of the circuit board 1, and the end of the heat conductive sheet 6 faces the exhaust mechanism 7 and is perpendicular to the length direction of the exhaust mechanism 7. In the process of air-cooling, the wind direction can be guided, and contact cooling is adopted. In this way, the heat dissipation at the bottom of the circuit board 1 is accelerated. A hollow water tank 5 is provided below the circuit board 1 and is fitted with the top of the bottom plate 2. A gap is left between the top of the hollow water tank 5 and the bottom of the circuit board 1. The heat conducting sheet 6 at the bottom of the circuit board 1 passes through the interior of the hollow water tank 5 and is fitted to the inner bottom of the groove 4 at the top of the bottom plate 2. During the heat conduction process of the heat conducting sheet 6, it passes through the interior of the hollow water tank 5 again, and the water inside the hollow water tank 5 is used to cool the heat conducting sheet 6. The heat conducting sheet 6 passes through the bottom of the hollow water tank 5 again, and the cold air from the outside cools the bottom of the heat conducting sheet 6 by air cooling, and cools the water inside the hollow water tank 5, thereby effectively maintaining the heat dissipation effect of the equipment.

As shown in Figure 1, mounting holes for bolts to pass through are provided at the four corners of the circuit board 1 and the base plate 2. A spring pad 9 is installed at the bottom of the mounting hole on the base plate 2. During the installation of the device, the bolt passes directly through the inside of the mounting hole and the inside of the spring pad 9 to connect with the positioning hole on the shell and squeeze the spring pad 9. The spring pad 9 is used to provide an upward elastic force to the device, which can achieve shock absorption. A first dustproof net 8 is provided at one end of the circuit board 1 away from the exhaust mechanism 7, and the first dustproof net 8 is fixed on the end faces of the circuit board 1 and the base plate 2. During the heat dissipation process, the exhaust mechanism 7 draws cold air from the outside and passes through the bottom of the circuit board 1, while the hot air passes through the first dustproof net 8. The first dustproof net 8 is used to prevent dust from entering from the exhaust port.

As shown in FIG. 4 , compared with the unprotected exhaust method in the prior art, the exhaust mechanism 7 in the utility model includes an installation bin 10, a heat dissipation fan 11 and a second dust-proof net 12. The installation bin 10 for enclosing the end opening between the circuit board 1 and the base plate 2 is fixed at the end of the circuit board 1. The heat dissipation fan 11 is evenly installed inside the installation bin 10 along the length direction. The second dust-proof net 12 is arranged at the outer end of the installation bin 10 and at the input end of the heat dissipation fan 11. During the heat dissipation process, the heat dissipation fan 11 is started at the same time, and the outside air can enter the circuit board only through the second dust-proof net 12. At the bottom of the road plate 1, a second dustproof net 12 is used to prevent the entry of dust. A scraper 13 is slidably provided at the end of the installation bin 10 along the length direction, and the scraper 13 is attached to the outside of the second dustproof net 12. Guide grooves 14 are provided at the top and bottom of the installation bin 10, and the slider inside the guide groove 14 is fixedly connected to the scraper 13. When more dust accumulates on the top of the second dustproof net 12, the wind speed will be reduced. By controlling the scraper 13 to slide along the length direction of the second dustproof net 12, the dust on the surface can be cleaned to ensure the ventilation effect of the second dustproof net 12.

The above is only a further embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and concept of the present invention within the scope disclosed by the present invention, which fall within the protection scope of the present invention.

Claims (7)

1. A singlechip with good heat dissipation effect comprises a circuit board (1), wherein an exhaust mechanism (7) for cooling the bottom of the circuit board (1) by air cooling is arranged at the end part of the circuit board (1);

the bottom of the circuit board (1) is provided with a heat conducting sheet (6) attached to the bottom of the circuit board (1), and is characterized in that: cushion blocks (3) are fixedly arranged at two sides of the bottom of the circuit board (1), and a bottom plate (2) for supporting the circuit board (1) is arranged at the bottom ends of the two groups of cushion blocks (3);

the lower part of the circuit board (1) is provided with a hollow water bin (5) attached to the top of the bottom plate (2), a gap is reserved between the top of the hollow water bin (5) and the bottom of the circuit board (1), and a heat conducting fin (6) at the bottom of the circuit board (1) penetrates through the inside of the hollow water bin (5) and is attached to the inner bottom of a groove (4) at the top of the bottom plate (2).

2. The singlechip with good heat dissipation effect according to claim 1, wherein: the heat conducting fin (6) is vertically arranged on the bottom surface of the circuit board (1), and the end part of the heat conducting fin (6) faces the air exhaust mechanism (7) and is vertical to the length direction of the air exhaust mechanism (7).

3. The singlechip with good heat dissipation effect according to claim 1, wherein: mounting holes for bolts to pass through are formed in four corners of the circuit board (1) and the bottom plate (2), and spring pads (9) are mounted at the bottoms of the mounting holes on the bottom plate (2).

4. The singlechip with good heat dissipation effect according to claim 1, wherein: one end of the circuit board (1) far away from the exhaust mechanism (7) is provided with a first dustproof net (8), and the first dustproof net (8) is fixed on the end faces of the circuit board (1) and the bottom plate (2).

5. The singlechip with good heat dissipation effect according to claim 1, wherein: the exhaust mechanism (7) comprises a mounting bin (10), a heat dissipation fan (11) and a second dustproof net (12);

a mounting bin (10) for enclosing an end port between the circuit board (1) and the bottom plate (2) is fixed at the end part of the circuit board (1);

the inside of the installation bin (10) is uniformly provided with a heat radiation fan (11) along the length direction, and a second dustproof net (12) is arranged at the outer end part of the installation bin (10) and positioned at the input end of the heat radiation fan (11).

6. The singlechip with good heat dissipation effect according to claim 5, wherein: the end part of the installation bin (10) is provided with a scraping plate (13) in a sliding mode along the length direction, and the scraping plate (13) is attached to the outer side of the second dustproof net (12).

7. The singlechip with good heat dissipation effect as defined in claim 6, wherein: the top and the bottom of the installation bin (10) are provided with guide grooves (14), and sliding blocks in the guide grooves (14) are fixedly connected with the scraping plates (13).