CN111565542A - Electronic equipment high heat conduction air-cooled frame - Google Patents
Electronic equipment high heat conduction air-cooled frame Download PDFInfo
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- CN111565542A CN111565542A CN202010355518.2A CN202010355518A CN111565542A CN 111565542 A CN111565542 A CN 111565542A CN 202010355518 A CN202010355518 A CN 202010355518A CN 111565542 A CN111565542 A CN 111565542A
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- 238000001816 cooling Methods 0.000 claims abstract description 74
- 238000005192 partition Methods 0.000 claims abstract description 57
- 239000011229 interlayer Substances 0.000 claims abstract description 8
- 239000012530 fluid Substances 0.000 claims abstract description 6
- 230000000712 assembly Effects 0.000 claims abstract description 4
- 238000000429 assembly Methods 0.000 claims abstract description 4
- 238000010276 construction Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 26
- 238000013461 design Methods 0.000 description 8
- 238000009423 ventilation Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-heat-conductivity air-cooled rack for electronic equipment, which is mainly used for aviation and communication electronic equipment. The invention is realized by the following technical scheme: the middle part of a module bearing area in the heat-conducting air-cooling rack is provided with a movable air-cooling partition plate connected with an upper interlayer and a lower interlayer, a high heat consumption module and a common air-cooling module which are arranged in a guide rail groove of the rack through a wedge-shaped locking strip are arranged in each module bearing area, the side face of the whole module is attached to the outer surface of the left side of a guide plate by the high heat consumption module through the pressure of the wedge-shaped locking strip, and the generated heat is transmitted to the movable air-cooling partition plate through the surface of a module body and; working fluid generated by air cooler assemblies on two sides of a box body of the rack oppositely enters each module bearing area from the movable air-cooling partition plate to establish a smooth air channel, cold air enters from the middle of the movable air-cooling partition plate and flows in the air channel, and air closed circulation is performed in the air channel of the air-cooling partition plate of the rack to take away heat of the high-heat-consumption module and/or the air-cooling module.
Description
Technical Field
The invention relates to a high-heat-conductivity air-cooled frame mainly used for aviation and communication electronic equipment.
Background
Electronic equipment generally requires higher reliability, and excellent heat dissipation is an important guarantee for reliable operation of the electronic equipment. In electronic equipment, the main heat generation is generated by high-power devices, so the heat dissipation of the high-power devices is the key for heat dissipation of the whole electronic equipment. Because the electronic equipment generally uses multilayer circuit boards and high-density surface mounting elements, the electronic components and the equipment can dissipate a large amount of heat during working, the heat flux density is increased, and the electronic equipment needs to be reasonably thermally designed to ensure the reliability of the components and the communication equipment. Electronic equipment for realizing system functions is mainly installed and debugged in a centralized mode by adopting a cabinet and a functional rack so as to save installation space and weight, the interior of the rack is divided into a plurality of modules according to functions, each module realizes a single function and is installed in the rack through a mechanism, and because the number of functional modules in the rack is large, heat consumption is high, a natural heat dissipation mode is not enough, and forced ventilation heat dissipation is generally needed. Forced ventilation is to utilize a fan to perform air draft or blast so as to enhance the air flow speed in the equipment and achieve the purpose of heat dissipation.
Forced air cooling is widely adopted in electronic equipment cooling systems requiring heat dissipation due to reliable work, easy maintenance and relatively low cost, and is also the main cooling form adopted by high-power devices. Forced ventilation is to utilize a fan to perform air draft or blast so as to enhance the air flow speed in the equipment and achieve the purpose of heat dissipation. The key to the forced air cooling design is the design of the frame and the design of the air duct in the frame, so as to reasonably control and distribute the air flow. The development of the modern electronic technology is very rapid, the high speed and the large capacity are realized, and because of the requirement of electromagnetic shielding, a tighter metal box body is formed between the left side plate, the right side plate, the upper supporting plate and the lower supporting plate of the rack and the panel, so that the normal heat exchange between the module in the rack and the external environment is influenced, and meanwhile, the equipment possibly needs to operate under extreme environmental conditions for a long time, so that if the heat is not well dissipated, part of the module sensitive to the temperature can be damaged, and the equipment can not work normally. The air cooling frame mainly adopts a fan or environment-controlled air as a main cooling means, and adopts an interface which meets the relevant standard, a plurality of frame components and at least 1 fan assembly or airplane environment-controlled air inlet to form comprehensive equipment. Modules in traditional air-cooled racks usually work in a mode of conduction heat dissipation, the modules in the racks are installed in guide rail grooves of the racks through wedge-shaped locking strips, ribs are pressed on the guide rail grooves through force improved by the wedge-shaped locking strips, heat is led out to the guide rail grooves on a partition plate of the racks through the ribs, and heat is taken away to a heat sink through cooling air in a cold plate. The efficiency is low due to small heat transfer area, large thermal resistance and long conduction path. The heat consumption of the modules in the traditional air cooling rack is limited at a certain upper limit, and according to engineering experience, the heat consumption of the internal modules cannot exceed 50W generally, otherwise, the internal modules cannot work normally. Usually, most of the modules in the rack meet the requirement of less than 50W, but the heat consumption of few modules, such as power amplifiers, power supplies and the like, exceeds the requirement. Modules that do not meet the requirements are at present mainly treated in the following two ways:
1) removing the rack, and performing heat dissipation design as an independent module;
2) the heat dissipation mode is changed, and the liquid cooling mode is adopted, so that the heat dissipation capacity of a single module is improved.
All the modes have great limitations, the problems are solved at the cost of increasing the volume and the weight, extremely strict space and weight requirements on the airplane can not be met frequently, and the application range of the air cooling rack is greatly limited. In view of the limitations of the conventional air-cooled rack, a new air-cooled rack structure is urgently needed to be researched, and a targeted heat dissipation measure is performed on a very small number of high-heat-consumption modules so as to ensure that the modules can normally work in the rack.
Disclosure of Invention
Aiming at overcoming the defects of a conduction heat dissipation air-cooled rack, the invention aims to provide the high-heat-conduction air-cooled rack for the electronic equipment, which can greatly improve the heat dissipation capacity of a high-heat-consumption module in the rack and improve the adaptability of the rack to the high-heat-consumption module under the condition of not changing the volume and the weight of the air-cooled rack.
The technical solution of the invention for realizing the above purpose is as follows: a high thermal conductivity air-cooled rack for electronic equipment, comprising: divide into the module according to realizing the function difference and bear regional 1, backplate and bear regional 2 and the regional 3 three functional area's of external interface rack structure, its characterized in that: the back plate bearing area 2 is provided with external interfaces arranged in a linear array, the middle part of the module bearing area 1 in the heat-conducting air-cooling rack is provided with a movable air-cooling partition plate 5 connected with an upper interlayer and a lower interlayer, each module bearing area 1 in the heat-conducting air-cooling rack is internally provided with a high heat consumption module 7 and a common air-cooling module 8 which are arranged in a rack guide rail groove through a wedge-shaped locking strip, the side surface of the whole module is attached to the outer surface of the left side of a guide plate 10 by the high heat consumption module 7 through the pressure of the wedge-shaped locking strip 9, and heat generated by the high heat consumption module 7 is transmitted to the movable air-cooling partition plate 5 through the surface of the; working fluid generated by fan assemblies 6 fixedly connected to two sides of a box body of the heat-conducting air-cooling rack oppositely enters each module bearing area 1 through the movable air-cooling partition plates 5 to establish an unblocked air channel with the rack air-cooling partition plates 4, cold air enters from the middle of the movable air-cooling partition plates 5, air flows in the air channel formed in the rack air-cooling partition plates 4 and flows out from two sides of the rack, and air cold flows in the air channel of the rack air-cooling partition plates 4 to perform air closed circulation so as to take away heat of the high-heat-consumption modules 7 and/or the air-cooling modules 8.
Compared with the prior art, the invention has the following beneficial effects:
the structure is simple. Aiming at the reality that the packaging density of electronic devices in electronic equipment is continuously improved and the heat flux density is continuously increased, from the aspect of mechanical design of the electronic equipment, the frame structure is divided into three functional areas, namely a module bearing area, a back plate bearing area and an external interface area according to different functions, a movable air-cooling partition plate and a high heat consumption module are adjacently arranged in the module bearing area, and an air channel formed by the air-cooling partition plate and the frame air-cooling partition plate improves the upper limit of the maximum heat consumption of the module in the frame. After the high heat consumption module and the frame are installed, the outer surface of the left side of the whole module is attached to the movable air-cooled partition plate through the pressure of the wedge-shaped locking strip on the module rib, and the heat dissipation capacity of the air-cooled frame based on conduction heat dissipation is improved. Because the degree of universalization of parts is high, the method is undoubtedly favorable for realizing mass production and reducing the production cost. And secondly, the volume weight and the heat dissipation mode of the machine frame are not increased, and the adaptability and the reliability of the machine frame are improved. The movable air-cooling partition plate can be flexibly arranged according to the position of the high heat consumption module, and can move along with the high heat consumption module, so that no matter which position the high heat consumption module is positioned near the air inlet, the temperature of the air flow is relatively low.
The heat dissipation capacity is high. The invention pastes the left outer surface of the whole module on the guide plate of the movable air-cooled clapboard, greatly increases the conduction and heat dissipation area of the module, solves the problems of small conduction area and large thermal resistance caused by the fact that the module in the traditional air-cooled rack can only conduct through the rib, ensures that the heat in the high heat consumption module can be quickly conducted to the rack, and avoids the accumulation of the heat in the high heat consumption module and the interior. Meanwhile, the air-cooled partition board changes the air flowing mode inside the air-cooled partition board of the traditional air-cooled rack, so that cold air can enter through the air inlet of the air-cooled partition board, and the heat conducted to the cold plate by the high-heat-consumption module can be taken away by the flowing of the air inside the air-cooled partition board. Tests prove that under the same conditions, the heat dissipation capacity of the high-heat-consumption module is greatly improved. Compared with the traditional heat dissipation mode of the air-cooled rack, the temperature rise of the 20W power device in the high heat dissipation module is reduced by 5-10 ℃. The heat dissipation capability and the reliability of the communication equipment can be effectively improved, and the normal work of the electronic equipment is ensured.
The rack adopts the structural design of the movable air-cooling partition plate, and the heat dissipation capacity of the high heat consumption module and the air-cooling module is improved by reducing the heat transfer path and the thermal resistance of the high heat consumption module.
Drawings
FIG. 1 is a schematic view of a high thermal conductivity air-cooled rack of an electronic device according to the present invention;
FIG. 2 is a schematic view of the principle of heat conduction of the front view of FIG. 1;
FIG. 3 is a schematic view of the configuration of the air-cooled module of FIG. 1;
FIG. 4 is a schematic view of the construction of the movable air-cooled partition;
fig. 5 is a schematic view of the flow of cooling air in the high thermal conductivity air-cooled rack of the electronic device of the present invention.
In the figure: 1. the air cooling system comprises a module bearing area, a back plate bearing area, an external interface area, a rack air cooling partition plate (containing an air duct), a movable air cooling partition plate, a fan assembly, a high heat dissipation module, an 8 air cooling module, a wedge-shaped locking strip and a guide plate, wherein the module bearing area is 2, the back plate bearing area is 3, the external interface area is 4, the rack air cooling partition plate (containing an air duct) is 5, the fan assembly is 6.
Detailed Description
See fig. 1-5. In a preferred embodiment described below, an air-cooled rack for electronic equipment with high thermal conductivity comprises: divide into the module according to realizing the function difference and bear regional 1, backplate and bear regional 2 and the regional 3 three functional area's of external interface rack structure, its characterized in that: the back plate bearing area 2 is provided with external interfaces arranged in a linear array, the middle part of the module bearing area 1 in the heat-conducting air-cooling rack is provided with a movable air-cooling partition plate 5 connected with an upper interlayer and a lower interlayer, each module bearing area 1 in the heat-conducting air-cooling rack is internally provided with a high heat consumption module 7 and a common air-cooling module 8 which are arranged in a rack guide rail groove through a wedge-shaped locking strip, the side surface of the whole module is attached to the outer surface of the left side of a guide plate 10 by the high heat consumption module 7 through the pressure of the wedge-shaped locking strip 9, and heat generated by the high heat consumption module 7 is transmitted to the movable air-cooling partition plate 5 through the surface of the; working fluid generated by fan assemblies 6 fixedly connected to two sides of a box body of the heat-conducting air-cooling rack oppositely enters each module bearing area 1 through the movable air-cooling partition plates 5 to establish an unblocked air channel with the rack air-cooling partition plates 4, cold air enters from the middle of the movable air-cooling partition plates 5, air flows in the air channel formed in the rack air-cooling partition plates 4 and flows out from two sides of the rack, air cold flow performs air closed circulation in the air channel of the rack air-cooling partition plates 4, and heat conducted to the cold plates 4 by the high-heat-consumption modules 7 and/or the air-cooling modules 8 is taken away.
The working fluid establishes a smooth air channel inside the air-cooled partition plate and the cold plate, cold air enters from the middle of the air-cooled partition plate of the module bearing area 1 divided into 4 partition frames, and flows out from two sides of the rack to form closed circulating air flow in the air channel of the rack. Cold air enters an air duct of the air-cooled partition plate 4 of the rack through an air inlet of the air-cooled partition plate of the module bearing area 1 to flow, enters the air duct through the movable air-cooled partition plate 5 in the middle, is shunted along the air-cooled partition plates 4 at two ends of the movable air-cooled partition plate 5, takes away heat of the high heat consumption module 7 and/or the air-cooled module 8, and conducts and dissipates heat of the modules installed in the rack in an air outlet mode from the left end part and the right end part of the fan rack.
According to the design of relevant specifications, the fan assembly 6 is arranged at the left end part and the right end part of the rack, and the rack fan assembly can be conveniently disassembled and maintained. All the external connectors, grounding posts and other devices for information exchange with external equipment are arranged in the external interface area 3, and the external connector area is a main area for external information exchange. The air-cooled modules in the module-carrying region 1 of the thermally conductive air-cooled rack housing may be field replaceable modules (LRMs).
The foregoing is directed to the preferred embodiment of the present invention and it is noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (6)
1. A high thermal conductivity air-cooled rack for electronic equipment, comprising: divide into the module according to realizing the function difference and bear regional (1), backplate and bear regional (2) and the frame construction of the three functional area of external interface region (3), its characterized in that: the back plate bearing area (2) is provided with external interfaces in linear array arrangement, the middle part of the module bearing area (1) in the heat-conducting air-cooling rack is provided with a movable air-cooling partition plate (5) which is connected with an upper interlayer and a lower interlayer, each module bearing area (1) in the heat-conducting air-cooling rack is internally provided with a high heat consumption module (7) and a common air-cooling module (8) which are arranged in a rack guide rail groove through a wedge-shaped locking strip, the high heat consumption module (7) sticks the side surface of the whole module to the outer surface of the left side of a guide plate (10) through the pressure of the wedge-shaped locking strip (9), and the heat generated by the high heat consumption module (7) is transmitted to the movable air-cooling partition plate (5) through the surface of a module body and is; working fluid generated by fan assemblies (6) fixedly connected to two sides of a box body of the heat-conducting air-cooling rack oppositely enters each module bearing area (1) through the movable air-cooling partition plate (5), an unblocked air channel is established with the rack air-cooling partition plate (4), cold air enters from the middle of the movable air-cooling partition plate (5), air flows in the air channel formed in the rack air-cooling partition plate (4) and flows out from two sides of the rack, air cold flow performs air closed circulation in the air channel of the rack air-cooling partition plate (4), and heat of a high heat consumption module (7) and/or an air-cooling module (8) is taken away.
2. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: the working fluid establishes a smooth air channel inside the air-cooled partition plate and the cold plate, cold air enters from the middle of the air-cooled partition plate of the module bearing area (1) divided into 4 partition frames, and flows out from two sides of the rack to form closed circulating air flow in the air channel of the rack.
3. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: cold air enters an air duct of the rack air-cooling partition plate (4) through an air inlet of the air-cooling partition plate of the module bearing area (1) to flow, enters the air duct through the middle movable air-cooling partition plate (5), is shunted along the rack air-cooling partition plates (4) at two ends of the movable air-cooling partition plate (5), takes away heat of the high heat consumption module (7) and/or the air-cooling module (8), and conducts and dissipates heat of the module installed in the rack in an air outlet mode from the left end portion and the right end portion of the fan rack.
4. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: the fan assembly (6) is arranged at the left end part and the right end part of the frame so as to be convenient to disassemble and maintain.
5. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: all external connectors, grounding columns and all devices for information exchange of external equipment are arranged in the external interface area (3), and the external connectors, the grounding columns and all devices are the main area for external information exchange.
6. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: the air cooling module in the module bearing area (1) of the heat-conducting air cooling rack box body is a field replaceable module (LRM).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010355518.2A CN111565542A (en) | 2020-04-29 | 2020-04-29 | Electronic equipment high heat conduction air-cooled frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010355518.2A CN111565542A (en) | 2020-04-29 | 2020-04-29 | Electronic equipment high heat conduction air-cooled frame |
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| Publication Number | Publication Date |
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| CN111565542A true CN111565542A (en) | 2020-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010355518.2A Pending CN111565542A (en) | 2020-04-29 | 2020-04-29 | Electronic equipment high heat conduction air-cooled frame |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113339311A (en) * | 2021-05-31 | 2021-09-03 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Preparation method of high-corrosion-resistance air-cooled rack |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202050625U (en) * | 2011-03-16 | 2011-11-23 | 深圳市禾望电气有限公司 | Radiating system of power electronic equipment |
| CN104300190A (en) * | 2014-01-27 | 2015-01-21 | 河南科技大学 | Forced air cooling battery box, and box body and cooling plates thereof |
| CN206149712U (en) * | 2016-11-15 | 2017-05-03 | 陕西宏德电子设备有限公司 | Forced air cooling machine case |
| CN110769638A (en) * | 2019-09-28 | 2020-02-07 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for light-weight integrated electronic equipment rack structure |
-
2020
- 2020-04-29 CN CN202010355518.2A patent/CN111565542A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202050625U (en) * | 2011-03-16 | 2011-11-23 | 深圳市禾望电气有限公司 | Radiating system of power electronic equipment |
| CN104300190A (en) * | 2014-01-27 | 2015-01-21 | 河南科技大学 | Forced air cooling battery box, and box body and cooling plates thereof |
| CN206149712U (en) * | 2016-11-15 | 2017-05-03 | 陕西宏德电子设备有限公司 | Forced air cooling machine case |
| CN110769638A (en) * | 2019-09-28 | 2020-02-07 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for light-weight integrated electronic equipment rack structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113339311A (en) * | 2021-05-31 | 2021-09-03 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Preparation method of high-corrosion-resistance air-cooled rack |
| CN113339311B (en) * | 2021-05-31 | 2023-08-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Preparation method of high corrosion-resistant air-cooled frame |
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Application publication date: 20200821 |
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