CN111565542A - Electronic equipment high heat conduction air-cooled frame - Google Patents

Abstract

The invention discloses a high-heat-conductivity air-cooled rack for electronic equipment, which is mainly used for aviation and communication electronic equipment. The invention is realized by the following technical scheme: the middle part of a module bearing area in the heat-conducting air-cooling rack is provided with a movable air-cooling partition plate connected with an upper interlayer and a lower interlayer, a high heat consumption module and a common air-cooling module which are arranged in a guide rail groove of the rack through a wedge-shaped locking strip are arranged in each module bearing area, the side face of the whole module is attached to the outer surface of the left side of a guide plate by the high heat consumption module through the pressure of the wedge-shaped locking strip, and the generated heat is transmitted to the movable air-cooling partition plate through the surface of a module body and; working fluid generated by air cooler assemblies on two sides of a box body of the rack oppositely enters each module bearing area from the movable air-cooling partition plate to establish a smooth air channel, cold air enters from the middle of the movable air-cooling partition plate and flows in the air channel, and air closed circulation is performed in the air channel of the air-cooling partition plate of the rack to take away heat of the high-heat-consumption module and/or the air-cooling module.

Description

High thermal conductivity air-cooled rack for electronic equipment

technical field

The invention relates to an air-cooled rack with high thermal conductivity mainly used for aviation and communication electronic equipment.

Background technique

Electronic equipment usually requires high reliability, and excellent heat dissipation is an important guarantee for the reliable operation of electronic equipment. In electronic devices, the main heat is generated by high-power devices, so the heat dissipation of high-power devices is the key to the heat dissipation of the entire electronic device. Due to the widespread use of multi-layer circuit boards and high-density surface mount components in electronic equipment, electronic components and equipment will dissipate a lot of heat during operation, and the heat flow density will increase. In order to ensure the reliability of components and communication equipment, it is necessary to Proper thermal design of electronic equipment. The electronic equipment that realizes the system function mostly adopts the cabinet and functional rack for centralized installation and debugging to save the installation space and weight. The inside of the rack is divided into multiple modules according to the function. In the rack, due to the large number of functional modules in the rack and the large heat consumption, it is not enough to adopt the natural cooling method, and usually forced ventilation must be used for cooling. Forced ventilation is the use of fans to exhaust or blow air to enhance the air flow speed in the equipment and achieve the purpose of heat dissipation.

Forced air cooling is widely used in electronic equipment cooling systems that require heat dissipation due to its reliable heat dissipation, easy maintenance and relatively low cost, and is also the main cooling form for high-power devices. Forced ventilation is the use of fans to exhaust or blow air to enhance the air flow speed in the equipment and achieve the purpose of heat dissipation. The key to adopting a forced-air cooling design lies in the design of the rack and the design of the air ducts within the rack to properly control and distribute the airflow. The development of contemporary electronic technology is extremely rapid, with high speed and large capacity, and due to the need for electromagnetic shielding, a tight metal box is formed between the left and right side panels, the upper and lower pallets and the panel of the rack, which affects the modules in the rack and the The external environment is normal for heat exchange, and the equipment may need to operate under extreme environmental conditions for a long time. Therefore, if there is no good heat dissipation, some modules that are sensitive to temperature may be damaged, making the equipment unable to work normally. Among them, the air-cooled rack mainly uses fans or environmental control air as the main cooling means, adopts interfaces that meet relevant standards, and combines multiple rack components and at least one fan assembly or aircraft environmental control air inlet to form a comprehensive device. The modules in the traditional air-cooled rack usually work in the mode of conduction heat dissipation. The modules in the rack are installed in the guide rail grooves of the rack through the wedge-shaped locking strips, and the ribs are pressed against the guide rail grooves by the increased force of the wedge-shaped locking strips. , the heat is exported to the guide rail grooves on the rack partition through the ribs, and the heat is carried to the heat sink by the cooling air in the cold plate. Due to the small heat transfer area, large thermal resistance and long conduction path, the efficiency is low. Modules inside traditional air-cooled racks have a certain upper limit on heat consumption. According to engineering experience, the heat consumption of internal modules generally cannot exceed 50W, otherwise it will not work properly. Usually, most of the modules in the rack meet the requirements of less than 50W, but there are always a very small number of modules, such as power amplifiers, power supplies and other modules whose heat consumption exceeds the requirements. Modules that do not meet the requirements are mainly dealt with in the following two ways at this stage:

1) Remove the rack and use it as an independent module for heat dissipation design;

2) Change the heat dissipation method and adopt the liquid cooling method to improve the heat dissipation capacity of a single module.

All of the above methods have great limitations. They all solve the problem at the expense of increasing the volume and weight. They often cannot meet the extremely strict space and weight requirements on the aircraft, which greatly limits the use of air-cooled racks. In view of the limitations of the above traditional air-cooled racks, it is urgent to study a new air-cooled rack structure, and take targeted cooling measures for a very small number of high-heat-consuming modules to ensure that such modules can work normally in the rack. .

SUMMARY OF THE INVENTION

In order to overcome the shortcoming of the air-cooled rack with conduction heat dissipation, the purpose of the present invention is to solve the problem of thermal design of high-power devices in electronic equipment, and to provide a heat dissipation capacity that can greatly improve the heat dissipation capacity of the high-heat-consuming module in the rack, so that the air-cooled rack can be Air-cooled racks with high thermal conductivity for electronic equipment that improve the adaptability of racks to high-heat-consuming modules without changing the volume and weight.

The technical solution of the present invention to achieve the above object is: an air-cooled rack with high thermal conductivity for electronic equipment, including: three functional areas divided into module carrying area 1, backplane carrying area 2 and external interface area 3 according to different functions The rack structure is characterized in that: the backplane bearing area 2 is provided with external interfaces arranged in a line array, and in the middle of the module bearing area 1 in the heat-conducting air-cooled rack, there is a movable air-cooled partition 5 connected with upper and lower partitions , In each module carrying area 1 in the heat-conducting air-cooled rack, there are high-heat-consuming modules 7 and common air-cooling modules 8 installed in the rack rail grooves through wedge-shaped locking strips, and the high-heat-consuming modules 7 are installed through wedge-shaped locking strips 9 The entire module side is attached to the outer surface of the left side of the deflector 10 by the pressure, and the heat generated by the high heat consumption module 7 is conducted to the movable air-cooling partition 5 through the surface of the module body, and then passes through the cooling of the air duct in the movable air-cooling partition 5. The air is taken away; the working fluid generated by the fan assemblies 6 fixed on both sides of the heat-conducting air-cooled rack box enters each module carrying area 1 through the movable air-cooled partitions 5, and establishes with the rack air-cooled partitions 4. Unobstructed air duct, cold air enters from the middle of the movable air-cooled partition 5, and the air flows in the air duct formed inside the rack air-cooled partition 4, and flows out from both sides of the rack, and the cold air flows through the rack air-cooled partition. 4. Closed circulation of air is carried out in the air duct to take away the heat of the high heat consumption module 7 and/or the air cooling module 8.

Compared with the prior art, the present invention has the following beneficial effects:

Simple structure. Aiming at the fact that the packaging density of electronic devices in the electronic device is continuously improved and the heat flow density is continuously increasing, the present invention starts from the mechanical design of the electronic device and divides it into three functions: a module carrying area, a backplane carrying area and an external interface area according to different functions. The regional rack structure, the movable air-cooled partition and the high heat consumption module are installed adjacent to the module bearing area. The air duct formed by the air-cooled partition and the rack air-cooled partition increases the upper limit of the maximum heat consumption of the modules inside the rack. . After the high heat consumption module and the inside of the rack are installed, the left outer surface of the entire module is attached to the movable air-cooled partition through the pressure of the wedge-shaped locking strip on the module rib, which improves the heat dissipation of the air-cooled rack based on conduction heat dissipation. ability. Due to the high degree of generalization of parts and components, this is undoubtedly conducive to achieving mass production and reducing production costs. Secondly, the volume weight and heat dissipation method of the rack are not increased, which improves the adaptability and reliability of this type of rack. The movable air-cooled baffles can be flexibly arranged according to the position of the high-heat-consumption module, and the movable air-cooled baffles can move with the high-heat-consumption module, so that no matter where the high-heat-consumption module is located, it can be near the air inlet, and the airflow temperature is relatively low.

High heat dissipation capacity. In the present invention, the left outer surface of the entire module is attached to the guide plate of the movable air-cooled partition, which greatly increases the conduction and heat dissipation area of the module, and changes the conduction of the modules in the traditional air-cooled frame only through the ribs, resulting in a small conduction area. , the problem of large thermal resistance, so that the heat inside the high-heat-consuming module can be quickly transferred to the rack, avoiding heat accumulation in the high-heat-consuming module and inside. At the same time, the air-cooled partitions change the air flow inside the traditional air-cooled racks, so that cold air can enter through the air inlets of the air-cooled partitions, ensuring that the flow of air inside the air-cooled partitions can take away high heat Dissipate the heat that the module conducts to the cold plate. Tests have proved that under the same conditions, the heat dissipation capacity of the high heat dissipation module is greatly improved. The temperature rise of the 20W power device inside the high heat consumption module is 5-10°C lower than that of the traditional air-cooled rack conduction heat dissipation. The heat dissipation capability and reliability of the communication equipment can be effectively improved, and the normal operation of the electronic equipment can be ensured.

The rack adopts the structural design of movable air-cooled partitions, which improves the heat dissipation capacity of the high-heat-consumption module and the air-cooled module by reducing the heat transfer path and thermal resistance of the high-heat-consumption module.

Description of drawings

1 is a schematic structural diagram of an air-cooled rack with high thermal conductivity of electronic equipment of the present invention;

Fig. 2 is the thermal conduction principle schematic diagram of the front view of Fig. 1;

Fig. 3 is the structural schematic diagram of the air-cooled module of Fig. 1;

Fig. 4 is the structural representation of movable air-cooled partition;

FIG. 5 is a schematic diagram of the flow of cooling air in the air-cooled rack with high thermal conductivity of electronic equipment according to the present invention.

In the figure: 1. Module bearing area, 2. Backplane bearing area, 3. External interface area, 4. Rack air-cooled partition (including air ducts), 5. Active air-cooled partition, 6. Fan assembly, 7. High heat consumption module, 8 air cooling modules, 9. Wedge locking strip, 10 deflector.

Detailed ways

See Figures 1-5. In the preferred embodiment described below, a high thermal conductivity air-cooled rack for electronic equipment includes: a rack that is divided into three functional areas: a module carrying area 1, a backplane carrying area 2, and an external interface area 3 according to different implementation functions. The structure is characterized in that: the backplane bearing area 2 is provided with external interfaces arranged in a line array, and the middle of the module bearing area 1 in the heat-conducting air-cooled frame is provided with a movable air-cooling baffle 5 connected with upper and lower partitions, and the heat-conducting air In each module carrying area 1 in the cold rack, there are high heat consumption modules 7 and common air cooling modules 8 installed in the rack rail grooves through wedge-shaped locking strips. The side of the whole module is attached to the left outer surface of the deflector 10, and the heat generated by the high heat consumption module 7 is conducted to the movable air-cooling partition 5 through the surface of the module body, and then taken away by the cold air in the air duct in the movable air-cooling partition 5. The working fluid generated by the fan assemblies 6 fixed on both sides of the heat-conducting air-cooled rack box enters each module carrying area 1 through the movable air-cooled partitions 5, and establishes a smooth air flow with the rack air-cooled partitions 4. The cold air enters from the middle of the movable air-cooling baffle 5, flows in the air duct formed inside the rack air-cooling baffle 4, flows out from both sides of the rack, and the cold air flows in the air duct of the rack air-cooling baffle 4 A closed air circulation is performed to take away the heat conducted to the cold plate 4 by the high heat consumption module 7 and/or the air cooling module 8 .

The working fluid establishes a smooth air duct inside the air-cooled partition and the cold plate, and the cold air enters from the middle of the air-cooled partition in the module carrying area 1 divided into 4 partition frames, and flows out from both sides of the rack, forming in the rack air duct. Closed circulation air flow. The cold air enters the air duct of the rack air-cooling partition 4 through the air-cooling baffle air inlet of the module carrying area 1 for air flow, enters through the middle movable air-cooling baffle 5, and is cooled along both ends of the movable air-cooling baffle 5. The partition plate 4 divides the flow to take away the heat of the high heat consumption module 7 and/or the air cooling module 8, and conducts and dissipates the modules installed in the rack in the form of air outlet from the left and right ends of the fan rack.

Designed in accordance with relevant specifications, the fan assembly 6 is installed at the left and right ends of the rack, and the rack fan assembly can be easily disassembled and maintained. In the external interface area 3, all devices for information exchange with external equipment, such as external plug-ins, grounding posts, etc., are arranged, which is the main area for external information exchange. The air-cooled modules in the module carrying area 1 of the thermally conductive air-cooled rack box may be field replaceable modules (LRMs).

The above are the preferred embodiments of the present invention. It should be noted that the above-mentioned embodiments illustrate the present invention, however, the present invention is not limited thereto, and those skilled in the art can design the invention without departing from the scope of the appended claims. Alternative embodiments. For those skilled in the art, without departing from the spirit and essence of the present invention, various modifications and improvements can be made, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims (6)

1. A high thermal conductivity air-cooled rack for electronic equipment, comprising: divide into the module according to realizing the function difference and bear regional (1), backplate and bear regional (2) and the frame construction of the three functional area of external interface region (3), its characterized in that: the back plate bearing area (2) is provided with external interfaces in linear array arrangement, the middle part of the module bearing area (1) in the heat-conducting air-cooling rack is provided with a movable air-cooling partition plate (5) which is connected with an upper interlayer and a lower interlayer, each module bearing area (1) in the heat-conducting air-cooling rack is internally provided with a high heat consumption module (7) and a common air-cooling module (8) which are arranged in a rack guide rail groove through a wedge-shaped locking strip, the high heat consumption module (7) sticks the side surface of the whole module to the outer surface of the left side of a guide plate (10) through the pressure of the wedge-shaped locking strip (9), and the heat generated by the high heat consumption module (7) is transmitted to the movable air-cooling partition plate (5) through the surface of a module body and is; working fluid generated by fan assemblies (6) fixedly connected to two sides of a box body of the heat-conducting air-cooling rack oppositely enters each module bearing area (1) through the movable air-cooling partition plate (5), an unblocked air channel is established with the rack air-cooling partition plate (4), cold air enters from the middle of the movable air-cooling partition plate (5), air flows in the air channel formed in the rack air-cooling partition plate (4) and flows out from two sides of the rack, air cold flow performs air closed circulation in the air channel of the rack air-cooling partition plate (4), and heat of a high heat consumption module (7) and/or an air-cooling module (8) is taken away.

2. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: the working fluid establishes a smooth air channel inside the air-cooled partition plate and the cold plate, cold air enters from the middle of the air-cooled partition plate of the module bearing area (1) divided into 4 partition frames, and flows out from two sides of the rack to form closed circulating air flow in the air channel of the rack.

3. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: cold air enters an air duct of the rack air-cooling partition plate (4) through an air inlet of the air-cooling partition plate of the module bearing area (1) to flow, enters the air duct through the middle movable air-cooling partition plate (5), is shunted along the rack air-cooling partition plates (4) at two ends of the movable air-cooling partition plate (5), takes away heat of the high heat consumption module (7) and/or the air-cooling module (8), and conducts and dissipates heat of the module installed in the rack in an air outlet mode from the left end portion and the right end portion of the fan rack.

4. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: the fan assembly (6) is arranged at the left end part and the right end part of the frame so as to be convenient to disassemble and maintain.

5. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: all external connectors, grounding columns and all devices for information exchange of external equipment are arranged in the external interface area (3), and the external connectors, the grounding columns and all devices are the main area for external information exchange.

6. The high thermal conductivity air-cooled rack of electronic equipment of claim 1, wherein: the air cooling module in the module bearing area (1) of the heat-conducting air cooling rack box body is a field replaceable module (LRM).

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