CN220773303U - Combo PON optical module and optical system - Google Patents

Abstract

The utility model discloses a Combo PON optical module and an optical system, wherein the optical module comprises: an upper cover; a base; a PCB board; a terminal block; the tail fiber type single-fiber four-wave optical assembly comprises a first emitting optical assembly with emitting wavelength being more than or equal to 1530nm, a first receiving optical assembly with receiving wavelength being 1270nm, a second emitting optical assembly with emitting wavelength being 1490nm, a second receiving optical assembly with receiving wavelength being 1310nm and a WDM coupler, wherein the tail fiber type single-fiber four-wave optical assembly is electrically connected with a PCB, a laser in the first emitting optical assembly is a DML laser, an emitting driving circuit corresponding to the DML laser on the PCB is a DML driving circuit, and the WDM coupler is used for wave combination coupling and transmitting optical signals through the tail fiber type single fiber extending out of the shell. The optical module with small size, high reliability and low power consumption is realized, and is suitable for being used in a wide-temperature area and small-space environment.

Description

Combo PON optical module and optical system

Technical Field

The utility model belongs to the technical field of optical communication, and particularly relates to a Combo PON optical module and an optical system.

Background

PON (Passive Optical Network ) optical modules have been widely used in access networks with the advantages of high bandwidth, good scalability, and low operation and maintenance costs. The Combo PON optical module is a hybrid integrated optical transceiver module integrating 2.5G PON and 10G PON and derived along with continuous upgrading of PON technology, so that resources and space can be saved, and coexistence of 2.5G and 10G networks is realized.

Combo PON is a PON network supporting a variety of PON protocols, and is currently generally referred to as XG (S) -PON & GPON. The Combo PON scheme of XGS-PON and GPON is a built-in multiplexing scheme, supports three-mode coexistence of XGS-PON/XG-PON/GPON, is also called as 'three-speed Combo PON' in the industry, and is recognized as the best solution for smooth upgrading of the GPON to the XGS-PON in the industry.

The three-rate Combo PON utilizes the principle that two technologies of XGS-PON and GPON adopt different bearing wavelengths, and the two wavelengths are combined in one optical module, so that independent sending and receiving processing of GPON and XGS-PON optical signals is realized. The three-rate Combo PON optical module is internally provided with a combiner, 4 uplink and downlink wavelengths required by the split-wave XGS-PON and the GPON can be combined, the XGS-PON and the XG-PON use the same wavelength, the uplink wavelength of 1270nm and the downlink wavelength of 1577nm are used, the GPON uses the uplink wavelength of 1310nm and the downlink wavelength of 1490nm, and the three-rate Combo PON optical module realizes single-fiber four-wavelength transmission and processing.

The existing Combo PON network and optical modules have the following problems:

(1) The downlink wavelength of the Combo PON optical module 10G end is 1577nm, an EML (External Modulation Laser ) laser is used, the EML laser has the characteristic of low dispersion, the EML laser is more suitable for long-distance and higher-speed transmission, and meanwhile, the EML laser also needs more complicated electrical layout because an EAM (Electro Absorption Modulator, an electroabsorption modulator) is integrated in a chip, so the EML optical module has the characteristics of high cost and high power consumption, and is not suitable for working under the condition of high environmental temperature;

(2) At present, a commercial Combo PON optical module generally uses standardized optical module interfaces, such as SFP (Small Form Factor Pluggable, small pluggable), sfp+, XFP (10 Gigabit Small Form Factor Pluggable) and the like, the optical interfaces of the standardized pluggable optical module interfaces are pluggable golden fingers, and the standardized pluggable optical module interfaces have a hot-plugging function and can be easily replaced and upgraded, but have the problems of poor vibration resistance and impact resistance at the same time, and are not suitable for special application scene working environments (such as an airplane, a vehicle and a bus type optical network of missile-borne equipment).

Disclosure of Invention

Aiming at the problems pointed out in the background technology, one of the purposes of the application is to provide a Combo PON optical module, which realizes high reliability, small size and low power consumption packaging, improves the adaptation ring temperature range, resists vibration and expands the application scene.

In order to solve the technical problems, the utility model is realized by adopting the following technical scheme:

a Combo PON optical module comprising:

an upper cover;

a base which cooperates with the upper cover to form a housing;

the PCB is positioned in the shell;

a terminal block electrically connected with the PCB and protruding from the housing for electrically connecting with a main circuit board;

the tail fiber type single-fiber four-wave optical assembly comprises a first emitting optical assembly with emitting wavelength being more than or equal to 1530nm, a first receiving optical assembly with receiving wavelength being 1270nm, a second emitting optical assembly with emitting wavelength being 1490nm, a second receiving optical assembly with receiving wavelength being 1310nm and a WDM coupler, wherein the tail fiber type single-fiber four-wave optical assembly is electrically connected with the PCB, a laser in the first emitting optical assembly is a DML laser, an emitting driving circuit corresponding to the DML laser on the PCB is a DML driving circuit, and the WDM coupler is used for wave combination coupling and transmitting optical signals through the tail fiber type single-fiber extending out of the shell.

In some embodiments of the present application, the upper cover and the base are fixed by screw fitting.

In some embodiments of the present application, a plurality of mounting posts are disposed on the base, and fasteners pass through mounting holes on the main circuit board and extend into the mounting posts to fasten the Combo PON optical module to the main circuit board.

In some embodiments of the present application, the first transmitting light assembly, the first receiving light assembly, the second transmitting light assembly, and the second receiving light assembly are electrically connected to the PCB board through a flexible circuit board, respectively.

In some embodiments of the present application, the front surface of the PCB board is provided with a first electrical connection area and a second electrical connection area, and the back surface of the PCB board is provided with a third electrical connection area and a fourth electrical connection area;

two of the first transmitting optical assembly, the first receiving optical assembly, the second transmitting optical assembly and the second receiving optical assembly are respectively and electrically connected with the first electric connection area and the second electric connection area through corresponding flexible circuit boards, and the other two of the first transmitting optical assembly, the first receiving optical assembly, the second transmitting optical assembly and the second receiving optical assembly are respectively and electrically connected with the third electric connection area and the fourth electric connection area through corresponding flexible circuit boards.

In some embodiments of the present application, an electrical chip connected to the first light emitting component, the first light receiving component, the second light emitting component and the second light receiving component is disposed on the PCB board, and an upper surface of the electrical chip is connected to the housing in contact through a heat conducting rubber pad.

In some embodiments of the present application, the area on the PCB where the electrical chip is located is a copper sheet layer on the PCB, where the copper sheet is connected to copper pads on the back of the PCB 130 through a plurality of heat dissipation holes, and the copper pads are connected to the housing through a heat-conducting rubber pad in contact.

In some embodiments of the present application, the terminal strip is disposed at a first end of the PCB board, and the pigtail type single-fiber four-wave optical component is disposed at a second end of the PCB board opposite to the first end.

In some embodiments of the present application, each copper terminal on the terminal block includes:

a first transverse section electrically connected to the PCB board;

a second lateral section electrically connected to the main circuit board;

a second transition section that interfaces between the first and second lateral sections.

Compared with the prior art, the Combo PON optical module has the following beneficial effects:

(1) The Combo PON optical module is compact in arrangement structure and small-size design is realized;

(2) The independent optical module can be formed, has universality, is suitable for batch production, and is convenient to design, assemble and assemble;

(3) The light module adopts a DML driving circuit at the 10G end, has low cost and smaller power consumption, and is suitable for application environments with high environmental temperature and small space size;

(4) The whole package of the optical module adopts a surface welding type electric interface, so that the whole vibration resistance and shock resistance are enhanced, and the reliability of the optical module for tolerating severe environments is improved.

In some embodiments of the present application, there is also provided an optical system comprising:

a main circuit board;

a plurality of Combo PON optical modules as described above, electrically connected to the main circuit board through respective terminal blocks.

The optical modules are independently packaged on the main circuit board, so that the application can be expanded to complete the integral assembly of the optical system, the optical modules are independent, when one optical module is damaged, only the optical module is independently replaced, the use of other optical modules is not delayed, and the use reliability of the whole optical system is improved.

Other features and advantages of the present utility model will become more apparent from the following detailed description of embodiments of the present utility model, which is to be read in connection with the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a first structural diagram of an embodiment of a Combo PON optical module according to the present utility model;

fig. 2 is an exploded view of one embodiment of a Combo PON optical module according to the present utility model;

fig. 3 is a second structural diagram of an embodiment of a Combo PON optical module according to the present utility model;

fig. 4 is a front view of a pigtail type single-fiber four-wave optical module in an embodiment of a Combo PON optical module according to the present utility model;

fig. 5 is a schematic diagram of an embodiment of a Combo PON optical module according to the present utility model;

fig. 6 is a design architecture diagram of a pigtail type single-fiber four-wave optical module in an embodiment of a Combo PON optical module according to the present utility model;

fig. 7 is a block diagram of connection of a PCB board, a terminal block and a pigtail type single-fiber four-wave optical component in an embodiment of a Combo PON optical module according to the present utility model;

fig. 8 is a block diagram of a terminal block in an embodiment of a Combo PON optical module according to the present utility model;

fig. 9 is a block diagram of one embodiment of an optical system in accordance with the present utility model.

Reference numerals:

100. a Combo PON optical module; 110. an upper cover; 120. a base; 121. a mounting column; 130. a PCB board; 131. an electrical chip; 140. a terminal block; 141. a first transverse section; 142. a second transverse section; 143. a third transition section; 150. a pigtail type single-fiber four-wave optical component; 151. a first light emitting component; 1511. a first flexible circuit board; 152. a first light receiving assembly; 1521. a second flexible circuit board; 153. a second light emitting component; 1531. a third flexible circuit board; 154. a second light receiving assembly; 1541. a fourth flexible circuit board; 160. a heat conducting rubber pad; 170. a filter; 180. a screw;

200. a main circuit board;

300. a fastener.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Referring to fig. 1 to 9, the present application proposes a Combo PON optical module 100, which has advantages of small size, high integration, high reliability, low power consumption, and wide temperature zone adaptation, and has independent electrical and optical interfaces, so as to facilitate electrical connection with external electrical components and optical connection with an optical connector.

Referring to fig. 1 to 3, the Combo PON optical module 100 includes an upper cover 110, a base 120, a PCB board 130, a terminal block 140, and a pigtail type single-fiber four-wave optical assembly 150.

The upper cover 110 and the base 120 cooperate to form the outer housing of the Combo PON optical module 100, i.e., the appearance of the Combo PON optical module 100.

In some embodiments of the present application, the upper cover 110 and the base 120 may be fixedly coupled by a screw 180.

The inner wall of the upper cover 110 is provided with a plurality of studs (not shown), the base 120 is provided with a plurality of through parts (not shown) corresponding to the plurality of studs, the inner side wall of the through parts can be provided with internal threads, and the screw 180 penetrates through the through parts and stretches into the studs, so that the threaded fixed connection between the upper cover 110 and the base 120 is realized.

The PCB 130 is located in the housing, and the PCB 130 is clamped in the housing by the fixed connection between the upper cover 110 and the base 120.

An electrical chip 131 is disposed on the PCB board 130, and the electrical chip 131 may be an emission driving chip for driving an emission optical component (e.g., TOSA (Transmitter Optical Subassembly, optical emission sub-module)), a reception driving chip for driving a reception optical component (e.g., ROSA (Receiver Optical Subassembly, optical reception sub-module)), and a control chip electrically connected to the emission driving chip and the reception driving chip, respectively.

Among other things, the emission light components may include lasers (e.g., EML (External Modulation Laser, external modulation laser) lasers, DML (Direct Modulation Laser ) lasers), MPD (Monitor Photo Detector, monitor photodiode), etc.; the receiving optical component may include a photodetector PD (Photo Diode)/APD (Avalanche Photo Diode ), TIA (Trans-impedance amplifier), transimpedance amplifier), or the like.

In some embodiments herein, to improve the vibration and shock resistance performance of the Combo PON optical module 100, the Combo PON optical module 100 is integrally packaged.

Referring to fig. 1 to 3 and 7 to 9, a terminal block 140 is provided for providing an electrical interface of the Combo PON optical module 100 for connecting to an external main circuit board 200.

The terminal block 140 can stably realize the electrical connection between the Combo PON optical module 100 and the main circuit board 200, and improve the vibration resistance and shock resistance of the Combo PON optical module 100.

In order to reduce the power consumption and cost of the Combo PON optical module 100, in some embodiments of the present application, a downstream emission wavelength of a 10g end of the Combo PON optical module 100 is a wavelength greater than or equal to 1530nm, and specifically, a DML laser is used for the first emission optical component 151 that emits the wavelength, and an emission driving circuit corresponding to the DML laser on the PCB 130 is a DML driving circuit.

Compared with an EML driving circuit, the system power consumption and cost are reduced by using the DML driving circuit, and the Combo PON optical module 100 can be applied to a high-environment-temperature and small-size application environment scene.

The emission wavelength of the first emission optical component 151 is greater than or equal to 1530, for example, the first emission optical component 151 may include a DML laser with an emission wavelength of 1550nm, or may include a DML laser with an emission wavelength of 1560 nm, or may include a DML laser with an emission wavelength of 1610 nm, and correspondingly, a corresponding DML driving circuit is disposed on the PCB 130.

In some embodiments of the present application, referring to fig. 5, the first light emitting component 151 may include a DML laser with an emission wavelength of 1550nm, and correspondingly, a corresponding DML driving circuit is disposed on the PCB board 130, where the wavelength 1550nm is similar to 1577nm and meets the requirement of a low-loss optical fiber communication window, and can be separated from the other three wavelengths 1270nm/1310nm/1490nm of the Combo PON optical module 100.

Thus, the Combo PON optical module 100 employs multiplexing of 10G PON and 2.5G PON, the 10G PON having an upstream wavelength of 1270nm and a downstream wavelength of 1550nm; the upstream wavelength of the 2.5G PON is 1310nm, and the downstream wavelength is 1490nm.

Referring to fig. 1 to 5, in some embodiments of the present application, a pigtail type single-fiber four-wave optical module 150 is used inside the Combo PON optical module 100. The pigtail type single-fiber four-wave optical assembly 150 is clamped and fixed after the upper cover 110 and the base 120 are matched and fastened through a positioning structure designed at one end inside the upper cover 110 and the base 120.

Two sets of optical transceiver devices are integrated in the pigtail type single-fiber four-wave optical module 150, see fig. 5, which is a first transmitting optical module 151 with an transmitting wavelength of 1550nm, a first receiving optical module 152 with a receiving wavelength of 1270nm, a second transmitting optical module 153 with an transmitting wavelength of 1490nm, and a second receiving optical module 154 with a receiving wavelength of 1310nm, respectively.

The first transmitting optical assembly 151 comprises a 1550nm DML laser, the first receiving optical assembly 152 comprises a 1270nm APD detector, the second transmitting optical assembly 153 comprises a 2.5G 1490nm DML laser, and the second receiving optical assembly 154 comprises a 1310nm APD detector

The WDM coupler in the pigtail type single-fiber four-wave optical module 150 is used for wave-combining coupling and transmitting optical signals through the pigtail type single fibers extending out of the housing, that is, the pigtail type single fibers extending out of the housing form the optical interface of the Combo PON optical module 100, so as to realize long-distance optical signal transmission.

In some embodiments of the present application, referring to fig. 6, a schematic diagram of a pigtail single-fiber four-wave optical assembly 150 is presented, including WDM couplers that employ a plurality of differently arranged directional filters 170 to effect the transmission and reception of optical signals and are coupled into a single optical fiber via an optical connector.

In some embodiments of the present application, for structural arrangement rationality, referring to fig. 2 and 7, the terminal strip 140 is disposed at one end of the PCB 130, and the pigtail type single-fiber four-wave optical component 150 is disposed at the other end of the PCB 130 opposite to the terminal strip 140.

In some embodiments of the present application, to make electrical connection of the PCB board 130 to the main circuit board 200 using the terminal block 140, referring to fig. 8, each copper terminal on the terminal block 140 includes a first lateral section 141, a second lateral section 142, and a third transition section 143 that interfaces between the first and second lateral sections 141, 142.

When the Combo PON optical module 100 is electrically connected to the main circuit board 200 of a user, the base 120 of the Combo PON optical module 100 is disposed on the main circuit board 200, and the two are electrically connected by using the exposed terminal strip 140, see fig. 9, specifically, the first transverse section 141 is electrically connected to the PCB 130, the second transverse section 142 is electrically connected to the main circuit board 200, and the third transition section 143 is an arc-shaped section.

Correspondingly, in order to reliably connect the user main circuit board 200 and the Combo PON optical module 100, referring to fig. 1 and 3, a plurality of mounting posts 121 are further provided on the base 120 of the Combo PON optical module 100.

Correspondingly, referring to fig. 9, a plurality of mounting holes (not shown) corresponding to the plurality of mounting posts 121 are further provided on the user main circuit board 200, and a fastener 300 (e.g., a bolt) is connected into the mounting posts 121 through the mounting holes, so that the Combo PON optical module 100 is reliably fastened to the user main circuit board 200.

Since four optical components (i.e., the first transmitting optical component 151, the first receiving optical component 152, the second transmitting optical component 153, and the second receiving optical component 154) are disposed on the pigtail type single-fiber four-wave optical component 150, in order to facilitate the electrical connection of the pigtail type single-fiber four-wave optical component 150 with the PCB 130, referring to fig. 2 and 7, the first transmitting optical component 151 is electrically connected with the PCB 130 through the first flexible circuit board 1511, the second transmitting optical component 153 is electrically connected with the PCB 130 through the second flexible circuit board 1521, the first receiving optical component 152 is electrically connected with the PCB 130 through the third flexible circuit board 1531, and the second receiving optical component 154 is electrically connected with the PCB 130 through the fourth flexible circuit board 1541.

For example, the DML laser in the first transmitting optical component 151 is driven by a corresponding transmitting driving chip on the PCB board 130 to transmit an optical signal with a wavelength of 1550nm, the optical signal is transmitted to an opposite receiving party through the WDM coupler, and meanwhile, the transmitted optical signal is received by the MPD and converted into a current, and the control chip collects the current signal and performs an algorithm calculation, so as to obtain an accurate transmitting optical power.

The light received from the opposite party is received by the APD detector in the first receiving optical component 152, the optical signal is converted into a current signal, the current signal is processed into a voltage signal with a certain amplitude in cooperation with TIA, and the control chip acquires the voltage signal and performs algorithm calculation, so that the accurate received optical power is obtained.

In order to facilitate the electrical connection between the pigtail type single-fiber four-wave optical assembly 150 and the PCB 130, a first electrical connection region (not shown) and a second electrical connection region (not shown) are disposed on the front surface of the PCB 130, and a third electrical connection region (not shown) and a fourth electrical connection region (not shown) are disposed on the back surface of the PCB 130.

Two of the first transmitting light assembly 151, the first receiving light assembly 152, the second transmitting light assembly 153, and the second receiving light assembly 154 are electrically connected to the first and second electrical connection regions, respectively, through corresponding flexible circuit boards.

The other two of the first transmitting light assembly 151, the first receiving light assembly 152, the second transmitting light assembly 153 and the second receiving light assembly 154 are electrically connected to the third electrical connection region and the fourth electrical connection region through corresponding flexible circuit boards, respectively.

Wherein the electrical connection region as described above may be a pad.

In some embodiments of the present application, referring to fig. 2, the first transmitting light assembly 151 is electrically connected to the first electrical connection region through a first flexible circuit board 1511, and the first receiving light assembly 152 is electrically connected to the second electrical connection region through a second flexible circuit board 1521; referring to fig. 7, the second light emitting module 153 is electrically connected to the third electrical connection region through the third flexible circuit board 1531, and the second light receiving module 154 is electrically connected to the fourth electrical connection region through the fourth flexible circuit board 1541.

Since the terminal strip 140 and the pigtail type single-fiber four-wave optical module 150 need to extend out from the housing, when the upper cover 110 and the base 120 cooperate to form the housing, an avoiding portion is formed for avoiding the portion of the terminal strip 140 and the pigtail type single-fiber four-wave optical module 150 extending out of the housing.

The method realizes the high-reliability structural packaging of the Combo PON optical module 100, has high vibration resistance and high shock resistance, and can be used in special occasions such as airplanes, missiles and the like; and the electrical signals of the optical assembly are in a surface welding mode between the flexible circuit board and the PCB 130 and between the PCB 130 and the main circuit board 200, and the electrical signals are directly accessed from the surface of the PCB 130 without through holes, so that the integrity and the reliability of signal connection are ensured.

And the Combo PON optical module 100 is packaged in a small size, and is suitable for small space use.

Due to the small-size package, to reduce the power consumption of the optical module and realize the use in a higher temperature environment, the Combo PON optical module 100 is designed with a heat dissipation channel.

Referring to fig. 2, an electric chip (illustrated as an electric chip 131) connected to the first transmitting light assembly 151, the first receiving light assembly 152, the second transmitting light assembly 153, and the second receiving light assembly 154 is provided on the pcb 130, and the electric chip 131 may include the transmitting driving chip, the receiving driving chip, and the control chip as described above.

The electric chip 131 is disposed on the front surface of the PCB 130, and the upper surface of the electric chip 131 is in contact with the case through a heat conductive rubber pad (not shown), so that a part of heat generated from the electric chip 131 is transferred to the external environment through the heat conductive rubber pad and the case.

The upper region of the PCB 130 where the electric chip 131 is located is a layer of copper sheet (not shown) on the PCB 130, the copper sheet is connected with copper pads on the back of the PCB 130 through a plurality of heat dissipation holes (not shown), the copper pads are in contact connection with the shell through the heat conduction rubber pads 160, and when the electric chip 131 works and heats, heat is guided to the shell through the heat dissipation holes and the copper pads and then transferred to the external environment, so that good heat dissipation is realized.

The Combo PON optical module 100 as described above, while realizing independent transmission of a 2.5G network and a 10G network without mutual influence, has advantages of low power consumption, small size, high reliability, and low cost, and can be suitable for application scenarios in a wide temperature range.

The Combo PON optical module 100 as described above is fabricated as a standard optical module having a uniform external dimension with an optical port and an electrical interface for electrically connecting the subscriber main circuit board 200.

The Combo PON optical module 100, as a standard optical unit, may be conveniently assembled in an optical system as an independent unit, and is convenient for repair and replacement.

Referring to fig. 9, the present application also relates to an optical system including a main circuit board 200 and a plurality of Combo PON optical modules, each of which may be a Combo PON optical module 100 as described above with reference to fig. 1-8.

Only one Combo PON optical module, combo PON optical module 100, is shown in fig. 9.

The plurality of Combo PON optical modules 100 are electrically connected to the main circuit board 200, respectively.

Since the optical system provided in this embodiment includes the Combo PON optical module 100 provided in the foregoing embodiment, the optical system has the same beneficial effects as those of the Combo PON optical module 100 described above, and will not be described herein again.

With a plurality of Combo PON optical modules 100, the optical system may be implemented with multi-channel signal transmission.

And after the Combo PON optical modules 100 are welded with the main circuit board 200 to complete electric connection and the tail fiber type single-fiber four-wave optical assembly 150 is connected with an external optical connector, the optical connection is completed, so that the whole assembly of the optical system can be completed, the operation process difficulty is greatly simplified, and the production efficiency is improved.

Of course, the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (10)

1. A Combo PON optical module comprising:

an upper cover;

a base which cooperates with the upper cover to form a housing;

the PCB is positioned in the shell;

a terminal block electrically connected with the PCB and protruding from the housing for electrically connecting with a main circuit board;

the tail fiber type single-fiber four-wave optical assembly comprises a first emitting optical assembly with emitting wavelength being more than or equal to 1530nm, a first receiving optical assembly with receiving wavelength being 1270nm, a second emitting optical assembly with emitting wavelength being 1490nm, a second receiving optical assembly with receiving wavelength being 1310nm and a WDM coupler, wherein the tail fiber type single-fiber four-wave optical assembly is electrically connected with the PCB, a laser in the first emitting optical assembly is a DML laser, an emitting driving circuit corresponding to the DML laser on the PCB is a DML driving circuit, and the WDM coupler is used for wave combination coupling and transmitting optical signals through the tail fiber type single-fiber extending out of the shell.

2. The Combo PON optical module according to claim 1, wherein the upper cover and the base are fixed by screw fitting.

3. The Combo PON optical module according to claim 1, wherein a plurality of mounting posts are provided on the base, and fasteners pass through mounting holes on the main circuit board and extend into the mounting posts to fasten the Combo PON optical module to the main circuit board.

4. The Combo PON optical module according to claim 2, wherein the first transmitting optical assembly, the first receiving optical assembly, the second transmitting optical assembly, and the second receiving optical assembly are electrically connected to the PCB board through a flexible circuit board, respectively.

5. The Combo PON optical module according to claim 4, wherein a first electrical connection area and a second electrical connection area are provided on a front surface of the PCB, and a third electrical connection area and a fourth electrical connection area are provided on a back surface of the PCB;

two of the first transmitting optical assembly, the first receiving optical assembly, the second transmitting optical assembly and the second receiving optical assembly are respectively and electrically connected with the first electric connection area and the second electric connection area through corresponding flexible circuit boards, and the other two of the first transmitting optical assembly, the first receiving optical assembly, the second transmitting optical assembly and the second receiving optical assembly are respectively and electrically connected with the third electric connection area and the fourth electric connection area through corresponding flexible circuit boards.

6. The Combo PON optical module according to claim 1, wherein an electrical chip connected to the first transmitting optical module, the first receiving optical module, the second transmitting optical module and the second receiving optical module is disposed on the PCB board, and an upper surface of the electrical chip is connected to the housing in contact through a thermal conductive rubber pad.

7. The Combo PON optical module according to claim 6, wherein the area on the PCB where the electrical chip is located is a copper sheet on the PCB, the copper sheet is connected to copper pads on the back of the PCB through a plurality of heat dissipation holes, and the copper pads are connected to the housing through a heat conductive rubber pad in contact.

8. The Combo PON optical module of claim 1, wherein the terminal block is disposed at a first end of the PCB and the pigtail single-fiber four-wave optical assembly is disposed at a second end of the PCB opposite the first end.

9. The Combo PON optical module according to claim 1 or 8, wherein each copper terminal on the terminal block comprises:

a first transverse section electrically connected to the PCB board;

a second lateral section electrically connected to the main circuit board;

a second transition section that interfaces between the first and second lateral sections.

10. An optical system, comprising:

a main circuit board;

a plurality of Combo PON optical modules as claimed in any one of claims 1 to 9, electrically connected to the main circuit board by respective terminal blocks.