CN214954241U

CN214954241U - Optical module

Info

Publication number: CN214954241U
Application number: CN202121565320.3U
Authority: CN
Inventors: 张华妮; 刘鹏飞; 杨冰; 蔚永军; 张晓廓
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-07-09
Filing date: 2021-07-09
Publication date: 2021-11-30
Anticipated expiration: 2031-07-09

Abstract

The optical module comprises an optical receiving device, wherein the optical receiving device comprises a tube seat, a heat sink, a TEC (thermoelectric cooler), an adjustable filter bracket, an adjustable filter and an optical receiving chip, the heat sink comprises a vertical bearing table and a horizontal bearing table, the TEC is vertically arranged on the vertical bearing table, the adjustable filter bracket is arranged on the upper surface of the vertical bearing table and is perpendicular to the vertical bearing table, the adjustable filter is arranged on the surface of the adjustable filter bracket, and the optical receiving chip is arranged below the adjustable filter; the adjustable filter is a wavelength adjustable filter, and the TEC can adjust the surface temperature of the adjustable filter to enable the adjustable filter to show different surface temperatures, so that the adjustable filter has the capacity of receiving signal light with different wavelengths; the TEC is vertically arranged on the surface of the heat sink, so that the working performance of the TEC can be prevented from being influenced by the through holes formed in the surface of the TEC; meanwhile, the structure of the heat sink can be fully utilized, and the miniaturization development of the optical module is facilitated.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

In optical communication, an optical module is a tool for realizing the interconversion of optical signals and is one of the key devices in optical communication equipment. More wavelengths are typically transmitted using the same fiber to increase the optical communication rate. In the light receiving structure, the plurality of filters are arranged to receive the signal light with the plurality of wavelengths and realize light splitting, and the arrangement of the plurality of filters occupies a large space, so that the miniaturization development of the optical module is not facilitated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module, through the rational design of adjustable filter and other structures in order to realize receiving the signal light of a plurality of wavelengths when miniaturized.

The application provides an optical module, includes:

a circuit board;

the light receiving device is electrically connected with the circuit board and is used for converting an optical signal into an electric signal;

the light receiving device includes:

a tube holder;

the heat sink is arranged on the surface of the tube seat and comprises a vertical bearing platform and a horizontal bearing platform, and the surface of the horizontal bearing platform is provided with a through groove;

the lower surface of the TEC is arranged on the heat sink and used for adjusting the surface temperature of the adjustable filter plate;

the adjustable filter plate bracket is arranged on the upper surface of the TEC, is vertical to the TEC, is provided with a through hole and is used for supporting the adjustable filter plate;

the adjustable filter is arranged on the surface of the through hole of the adjustable filter support and receives signal light with different wavelengths based on different surface temperatures;

and the light receiving chip is arranged in the through groove and used for receiving the signal light split by the adjustable filter.

Has the advantages that: the optical module that this application embodiment provided includes light receiving element, light receiving element includes the tube socket, locate the heat sink on tube socket surface, the TEC, adjustable filter support, adjustable filter and light receiving chip, wherein the heat sink includes vertical plummer and the horizontal plummer that mutually perpendicular set up, the TEC is vertical to be placed on vertical plummer, vertical plummer surface is located to the lower surface of specifically TEC, adjustable filter support locates the upper surface of vertical plummer and sets up perpendicularly with vertical plummer, adjustable filter support surface is equipped with adjustable filter, the below of adjustable filter is equipped with light receiving chip.

Wherein, the tunable filter is the tunable filter of wavelength, TEC can adjust the surface temperature of tunable filter, make tunable filter show different surface temperature, make like this that tunable filter possesses the ability that can receive different wavelength signal light, adjust to first temperature like TEC with the surface temperature of tunable filter, under first temperature, the signal light of first wavelength can the adjustable filter of printing opacity, TEC still can adjust the surface temperature of tunable filter to the second temperature, under the second temperature, the signal light of second wavelength can the adjustable filter of printing opacity, thereby the surface temperature through adjusting tunable filter makes the signal light of different wavelengths permeate through tunable filter in this application, tunable filter in this application can replace a plurality of filters of traditional optical module structure.

The TEC in the embodiment of the application is vertically arranged on the surface of the heat sink, because if the TEC is horizontally arranged, the adjustable filter plate is arranged on the surface of the TEC, at the moment, a through hole needs to be formed in the surface of the TEC so that signal light transmitted from the adjustable filter plate can pass through the through hole, and the working performance of the TEC is inevitably influenced by the through hole in the surface of the TEC, so that the TEC in the application is vertically arranged on the surface of the heat sink, and the working performance of the TEC can be ensured.

The heat sink of the embodiment of the application is an L-shaped heat sink and comprises a vertical bearing platform and a horizontal bearing platform, wherein the surface of the horizontal bearing platform is provided with a through groove communicated to the surface of a tube seat, the vertical bearing platform, the horizontal bearing platform and the through groove can bear more devices, the structure of the heat sink is fully utilized, various structures are compactly concentrated on the heat sink and the tube seat, and the miniaturization development of an optical module is facilitated.

The embodiment of the application provides an optical module, through the compact rational design of adjustable filter and other structures in order to realize receiving the signal light of a plurality of wavelengths when miniaturized, and then promote optical communication rate.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a light receiving device of an optical module provided in the embodiment of the present application;

fig. 7 is a schematic structural diagram of an optical receiver of an optical module according to an embodiment of the present application after a pin is removed;

fig. 8 is an exploded schematic view of a light receiving device of an optical module according to an embodiment of the present application after a pin is removed;

fig. 9 is a partially exploded schematic view of a light receiving device provided in an embodiment of the present application;

fig. 10 is a schematic structural diagram of a heat sink of a light receiving device provided in an embodiment of the present application;

fig. 11 is a schematic diagram of a relative structure of a tunable filter and a tunable filter holder of a light receiving device according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module. The following describes the optical module in the optical communication terminal according to the foregoing embodiment with reference to fig. 3 and 4; as shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module 400.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver module 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module 400 are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

The optical transceiver module 400 includes two parts, namely an optical transmitter and an optical receiver, which are respectively used for transmitting and receiving optical signals. The emission secondary module generally comprises a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively positioned on different sides of the light emitter, light beams are respectively emitted from the front side and the back side of the light emitter, and the lens is used for converging the light beams emitted from the front side of the light emitter so that the light beams emitted from the light emitter are converging light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter. The optical transceiver module 400 will be described in detail below.

Fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present disclosure; as shown in fig. 5, the optical transceiver module 400 in the foregoing embodiment includes an optical transmitter 500 and an optical receiver 700, and the optical module further includes a round-square tube 600 and an optical fiber adapter 800, in this embodiment, the optical transceiver sub-module is preferably an optical fiber adapter 800 for connecting optical fibers, that is, the optical fiber adapter 800 is embedded on the round-square tube 600 for connecting optical fibers. Specifically, the round and square tube 600 is provided with a third tube opening 603 for inserting the optical fiber adapter 800, the optical fiber adapter 800 is embedded into the third tube opening 603, the light emitting device 500 and the light receiving device 700 respectively establish optical connection with the optical fiber adapter 800, light emitted from the light receiving and emitting assembly and received light are transmitted through the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is a transmission channel for light entering and exiting from the light receiving and emitting assembly, and the light receiving and emitting assembly realizes a single-fiber bidirectional light transmission mode.

The round and square tube 600 is used for carrying the light emitting device 500 and the light receiving device 700, and in the embodiment of the present application, the round and square tube 600 is made of a metal material, which is beneficial to realizing electromagnetic shielding and heat dissipation. The round and square tube body 600 is provided with a first tube orifice 601 and a second tube orifice 602, and the first tube orifice 601 and the second tube orifice 602 are respectively arranged on the adjacent side walls of the round and square tube body 600. Preferably, the first nozzle 601 is disposed on a side wall of the round and square tube 600 in the length direction, and the second nozzle 602 is disposed on a side wall of the round and square tube 600 in the width direction.

The light emitting device 500 is embedded in the first pipe orifice 601, and the light emitting device 500 is in heat conduction contact with the round and square pipe body 600 through the first pipe orifice 601; the light receiving device 700 is embedded in the second pipe port 602, and the light receiving device 700 is in heat-conducting contact with the round-square pipe body 600 through the second pipe port 602. Alternatively, the light emitting device 500 and the light receiving device 700 are press-fitted directly into the round and square tube body 600, and the round and square tube body 600 is in contact with the light emitting device 500 and the light receiving device 700, respectively, directly or through a heat transfer medium. The round and square tube body can be used for heat dissipation of the light emitting device 500 and the light receiving device 700, and the heat dissipation effect of the light emitting device 500 and the light receiving device 700 is guaranteed.

Fig. 6 shows a schematic configuration diagram of a light receiving device according to an exemplary embodiment, and fig. 7 shows a schematic configuration diagram of a light receiving device according to an exemplary embodiment after a pin is removed; as shown in fig. 6 and 7, the light receiving device in the embodiment of the present application includes a heat sink 701, a TEC (thermoelectric cooler) 702, a tunable filter holder 703, a tunable filter 704, a thermistor 705, a condensing lens 706, a light receiving chip 707, a TIA (transimpedance amplifier) 708, and a stem 709. The centers of the tunable filter support 703, the tunable filter 704, the focusing lens 706, and the light receiving chip 707 are on the same vertical line and are coaxially disposed.

Fig. 10 shows a structure of the heat sink 701, as shown in fig. 10, the heat sink 701 is an L-shaped heat sink, and specifically includes a vertical carrier 7011 and a horizontal carrier 7012, a through groove 7013 is formed on a surface of the horizontal carrier 7012, it should be noted that, in this application, a tube seat 709 is used as a reference surface, a direction perpendicular to the tube seat 709 is vertical, and a direction parallel to the tube seat 709 is horizontal, in this application, the vertical carrier 7011 is arranged perpendicular to the tube seat 709, and thus the carrier is described as a vertical carrier, and another carrier is described as a horizontal carrier. The through-slots 7013 communicate directly with the socket surface. The vertical bearing table 7011 has a TEC702 on its surface, the TEC702 includes an upper surface and a lower surface, the TEC702 is placed vertically, specifically, the lower surface of the TEC702 is adhered to the surface of the vertical bearing table 7011, where the lower surface of the TEC is a cathode of the TEC, that is, the cathode of the TEC is connected to the surface of the vertical bearing table 7011 in this application; the upper surface of the TEC is the anode of the TEC, the surface of the tube seat 709 is provided with a TEC pin, and the anode of the TEC is electrically connected with the TEC pin; an adjustable filter bracket 703 is vertically arranged on the upper surface of the TEC, the adjustable filter bracket 703 is vertically arranged with the TEC, the adjustable filter bracket 703 is used for supporting an adjustable filter 704 and a thermistor 705, fig. 11 shows that a through hole 7031 is arranged in the middle of the adjustable filter bracket 703, the adjustable filter 704 is arranged on the surface of the through hole 7031, and the through hole 7031 is arranged to allow signal light transmitted from the adjustable filter 704 to pass through and continue to transmit the signal light; a converging lens 706 is bridged on the surface of the through groove 7013, a light receiving chip 707 is arranged below the converging lens 706 and in the through groove 7013, and a TIA708 is arranged on one side of the light receiving chip 707; the signal light with the specific wavelength passes through the adjustable filter 704, is split and then enters the convergent lens 706 through the through hole 7031, and enters the light receiving chip 707 through the converged signal light beam of the convergent lens 706; the L-shaped heat sink provided in the embodiment of the present application includes a vertical carrier 7011, a horizontal carrier 7012, and a through groove 7013, and devices can be disposed on the surfaces of the vertical carrier 7011 and the horizontal carrier 7012 and in the through groove 7013, so that the heat sink 701 can carry more devices, and more devices are concentrated on the heat sink 701, which is beneficial to miniaturization of an optical module.

The TEC702 comprises an upper surface and a lower surface, the TEC702 is vertically placed, specifically, the lower surface of the TEC702 is adhered to the surface of the vertical bearing table 7011, and the lower surface of the TEC is a cathode of the TEC, that is, the cathode of the TEC is connected to the surface of the vertical bearing table 7011 in the present application; the upper surface of the TEC is the anode of the TEC, the surface of the tube seat 709 is provided with a TEC pin, and the anode of the TEC is electrically connected with the TEC pin; the upper surface of the TEC is vertically provided with an adjustable filter bracket 703, the adjustable filter bracket 703 is vertically arranged with the TEC, and the adjustable filter bracket 703 is used for supporting an adjustable filter 704 and a thermistor 705. The surface temperature of the adjustable filter plate 704 is collected in real time through the thermistor 705, the collected surface temperature of the adjustable filter plate 704 is fed back to the thermoelectric refrigerator driving circuit, the thermoelectric refrigerator driving circuit determines to input heating or refrigerating current into the TEC702 according to the received surface temperature of the adjustable filter plate 704, heating or refrigerating of the adjustable filter plate 704 is achieved, and therefore the adjustable filter plate 704 can present different temperatures to receive signal light with different wavelengths. In the present embodiment, in order to accurately monitor the temperature of the tunable filter 704, the thermistor 705 is disposed on the near side of the tunable filter 704. The TEC in the embodiment of the application is vertically arranged on the surface of the heat sink, because if the TEC is horizontally arranged, the adjustable filter plate is arranged on the surface of the TEC, at the moment, a through hole needs to be formed in the surface of the TEC so that signal light transmitted from the adjustable filter plate can pass through the through hole, and the working performance of the TEC is inevitably influenced by the through hole in the surface of the TEC, so that the TEC in the application is vertically arranged on the surface of the heat sink, and the working performance of the TEC can be ensured.

The structure of the adjustable filter holder 703 is shown in fig. 11, a through hole 7031 is provided in the middle of the adjustable filter holder 703, a protruding end 7032 is provided at one end of the adjustable filter holder, the protruding end 7032 is convenient for the adjustable filter holder 703 to be fixedly connected to the TEC, and the through hole 7031 is provided to allow the signal light transmitted from the adjustable filter 704 to pass through, so as to continue the transmission of the signal light; the function of the adjustable filter 704 can be improved through the adjustable filter bracket 703 and the through hole 7031 in the middle of the adjustable filter bracket.

Tunable filter 704 can replace the function of a plurality of traditional filters, tunable filter 704 can make the signal light of different wavelength pass through presenting different temperatures, specifically, set up thermistor 705 on tunable filter 704's surface, gather tunable filter 704's surface temperature in real time through thermistor 705, and feed back the surface temperature of tunable filter 704 who gathers to thermoelectric refrigerator drive circuit, thermoelectric refrigerator drive circuit is according to the surface temperature of received tunable filter 704, confirm to the refrigerated electric current of input heating or among TEC702, the realization is to tunable filter 704's heating or refrigeration, thereby make tunable filter 704 present different temperatures, with the signal light of receiving different wavelength. In the present embodiment, in order to accurately monitor the temperature of the tunable filter 704, the thermistor 705 is disposed on the near side of the tunable filter 704. Tunable filter 704 can make the signal light of different wavelength pass through presenting different temperatures, if adjust tunable filter 704's surface temperature to first temperature, under first temperature, the signal light of first wavelength can the adjustable filter of printing opacity, TEC still can adjust the surface temperature of tunable filter to the second temperature, under the second temperature, the signal light of second wavelength can the adjustable filter of printing opacity, thereby the signal light that makes different wavelength through the surface temperature who adjusts tunable filter in this application sees through tunable filter, tunable filter in this application can replace a plurality of filters of traditional optical module structure.

Thermistor 705 collects the surface temperature of tunable filter 704 in real time and feeds back the collected surface temperature of tunable filter 704 to thermoelectric refrigerator driving circuit, and thermoelectric refrigerator driving circuit determines to input heating or refrigerating current into TEC702 according to the received surface temperature of tunable filter 704, so as to realize heating or refrigerating of tunable filter 704, thereby allowing tunable filter 704 to exhibit different temperatures to receive signal lights with different wavelengths. In the present embodiment, in order to accurately monitor the temperature of the tunable filter 704, the thermistor 705 is disposed on the near side of the tunable filter 704.

The focusing lens 706 focuses the signal light from the tunable filter 704, and then transmits the signal light to the light receiving chip 707 after focusing.

The light receiving chip 707 may receive the signal light from the collecting lens 706, a commonly used light receiving chip is a photodetector APD, and a commonly used light receiving chip may be an APD, and is configured to receive an optical signal sent by an external device and convert the optical signal sent by the external device into an electrical signal; an input pin of the TIA708 is connected to an output pin of the light receiving chip 707, and is configured to convert an electrical signal output by the light receiving chip 707 into a voltage signal; a high-frequency signal input pin of the amplitude limiting amplification chip is connected with an output pin of the TIA708 and is used for amplifying a voltage signal output by the TIA 708; the input pin of the clock data recovery chip is connected with the high-frequency signal output pin of the amplitude limiting amplification chip and used for shaping the voltage signal output by the amplitude limiting amplification chip, and the output pin of the clock data recovery chip is connected with the golden finger. The connecting device is connected with an upper computer through the golden finger, and then signals received by the light receiving device can be sent to the upper computer.

An input pin of the TIA708 is connected to an output pin of the light receiving chip 707, and is configured to convert an electrical signal output by the light receiving chip 707 into a voltage signal; a high-frequency signal input pin of the amplitude limiting amplification chip is connected with an output pin of the TIA708 and is used for amplifying a voltage signal output by the TIA 708; the input pin of the clock data recovery chip is connected with the high-frequency signal output pin of the amplitude limiting amplification chip and used for shaping the voltage signal output by the amplitude limiting amplification chip, and the output pin of the clock data recovery chip is connected with the golden finger. The connecting device is connected with an upper computer through the golden finger, and then signals received by the light receiving device can be sent to the upper computer.

Fig. 8 is an exploded schematic view of a light receiving device of an optical module according to an embodiment of the present application after a pin is removed; as shown in fig. 8, the surface of the tube seat is provided with a light receiving chip 707 and a TIA708, and the surface of the heat sink 701 is provided with a TEC (thermoelectric cooler) 702, an adjustable filter bracket 703, an adjustable filter 704, a thermistor 705, and a focusing lens 706, and the specific arrangement manner of each structure is as described above, which is not described herein again.

Fig. 9 is a partially exploded schematic view of a light receiving device provided in an embodiment of the present application; in the application, the lower surface of the TEC702 is vertically adhered to a vertical bearing table of the heat sink 701, and the protruding end 7032 of the adjustable filter bracket 703 is adhered to the upper surface of the TEC702 and is perpendicular to the TEC 702.

To sum up, the optical module includes tunable filter in the embodiment of this application, tunable filter is wavelength tunable filter, TEC can adjust tunable filter's surface temperature, make tunable filter show different surface temperature, make like this that tunable filter possesses the ability that can receive different wavelength signal light, adjust tunable filter's surface temperature to first temperature like TEC, under first temperature, the signal light of first wavelength can the adjustable filter of printing opacity, TEC still can adjust tunable filter's surface temperature to the second temperature, under the second temperature, the signal light of second wavelength can the adjustable filter of printing opacity, thereby the surface temperature through adjusting tunable filter makes the signal light of different wavelengths permeate adjustable filter in this application, tunable filter in this application can replace a plurality of filters of traditional optical module structure.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising:

a circuit board;

the light receiving device includes:

a tube holder;

2. The optical module of claim 1, wherein the through slot communicates with the header surface;

the light receiving device further includes:

and the converging lens is bridged on the upper surface of the through groove and is used for converging the signal light split by the adjustable filter.

3. The optical module according to claim 2, wherein the tunable filter, the condensing lens, and the light receiving chip are coaxially disposed, and the signal light passes through the tunable filter, the condensing lens, and the light receiving chip in this order.

4. A light module as claimed in claim 1, characterized in that a thermistor is arranged in the vicinity of the tunable filter for detecting the surface temperature of the tunable filter.

5. The optical module of claim 1, wherein a TIA is provided near the light receiving chip, and the TIA is provided on a surface of the stem.

6. The optical module of claim 1, wherein the surface of the tube socket is provided with TEC pins;

the negative pole of the TEC is arranged on the surface of the vertical bearing table of the heat sink, and the positive pole of the TEC is connected with the pin of the TEC.

7. The optical module of claim 4, wherein the tunable filter holder comprises a protruding end and a bearing surface, the protruding end is connected to the TEC surface, and the bearing surface is used for bearing the tunable filter and the thermistor.

8. The optical module of claim 4, wherein the TEC adjusts the tunable filter surface temperature based on the tunable filter surface temperature collected by the thermistor.

9. The optical module according to claim 2, wherein the signal light passes through the tunable filter, the through hole, the condensing lens, and the light receiving chip in this order.

10. The light module of claim 1, wherein the heat sink is an L-shaped heat sink.