CN219068203U - Single-fiber three-dimensional tera XGSPON and CATV integrated optical module - Google Patents

Abstract

The utility model relates to the field of optical communication, in particular to a single-fiber three-dimensional tera XGSPON and CATV integrated optical module, which comprises an electromagnetic shielding cover, a golden finger, a copper spindle nose, an MCU, a DC/DC voltage stabilizing circuit, an APD voltage boosting circuit, a LA chip, an LDD chip, a radio frequency amplifying chip, an AGC circuit and a three-dimensional optical sub-integrated component; the advantages are that: the module is based on an XGSPON system, can realize XGSPON signal transmission and video signal transmission, and simultaneously adopts golden fingers as an electric connector, so that hot plug can be supported; through setting up electromagnetic shield cover to cooperate three-way device and copper spindle nose to form a confined space at PCBA board upper surface, put the video signal transmission part of module in this space, avoid signal interference.

Description

Single-fiber three-dimensional tera XGSPON and CATV integrated optical module

Technical Field

The utility model relates to the field of optical communication, in particular to a single-fiber three-dimensional tera XGSPON and CATV integrated optical module.

Background

As shown in fig. 1, a radio frequency transmission scheme based on a GPON (gigabit passive optical network) transmission system is mainly adopted in the market at present: the upper end adopts an OLT (optical line terminal) optical module, a wavelength division multiplexer (WDM 1 r) is used for combining the video signal and the GPON signal and then transmitting the video signal and the GPON signal through an optical fiber, the lower end adopts a GPON ONU Treplexer module (a GPON ONU three-way module, the structure of which is shown as a part in a broken line frame in FIG. 1), and the video signal and the GPON signal are separated and applied in the module. The GPON ONU Treplexer module can realize 1.25G1310nm optical signal transmission, 2.5G 1490nm optical signal reception and 1555nm video optical signal reception.

However, the above scheme has the following drawbacks:

1. as the customer load increases and the customer demands for higher rates, the passive optical network transmission rate has been greatly improved: from GPON to XGPON (asymmetric 10G PON, downstream 10G/upstream 2.5G) to XGSPON (symmetric 10GPON, downstream 10G/upstream 10G), but video signal transmission is still based on GPON system, and customers cannot enjoy higher network speed and high definition cable tv at the same time;

2. at present, a GPON ONU Triplexer module in the market is generally electrically connected in a row-plug mode, and hot plug is not supported;

3. the existing video signal is transmitted through an optical fiber, so that the problem of signal interference exists.

Based on this, the present application is hereby proposed.

Disclosure of Invention

The utility model aims to provide a single-fiber three-dimensional tera XGSPON and CATV integrated optical module which can simultaneously realize XGSPON signal transmission and video signal transmission and support hot plug.

In order to achieve the above object, the technical scheme of the present utility model is as follows:

a single-fiber three-way tera XGSPON and CATV integrated optical module comprises an electromagnetic shielding cover, a golden finger, a copper spindle nose, an MCU, a DC/DC voltage stabilizing circuit, an APD voltage boosting circuit, an LA chip, an LDD chip, a radio frequency amplifying chip, an AGC circuit and a three-way optical sub-integrated component;

the input end of the DC/DC voltage stabilizing circuit is connected with the power output end of the golden finger to provide 12V/3.3V stable voltage for the module;

the MCU is respectively connected with the golden finger, the LA chip and the LDD chip in a two-way communication way, and also receives a level feedback signal output from the radio frequency amplifying chip and outputs a level control signal to the AGC circuit;

the LA chip is used for receiving the downlink electric signal output by the three-way optical sub-integrated component, limiting and amplifying the downlink electric signal and then transmitting the downlink electric signal to the golden finger;

the APD boosting circuit is respectively and electrically connected with the LA chip and the three-way optical sub-set component in a bidirectional way to realize 3.3V voltage boosting;

the LDD chip is used for receiving an uplink electric signal output by the golden finger and transmitting the uplink electric signal to the three-way optical sub-integrated component;

the radio frequency amplification chip is used for receiving the video electric signals output by the three-way optical subset component and transmitting the video electric signals to the copper shaft head; the radio frequency amplifying chip is in bidirectional electrical connection with the AGC circuit;

the three-way optical subset component is used for receiving a downlink optical signal and a video optical signal which are input from an optical fiber, converting the downlink optical signal into a downlink electrical signal and converting the video optical signal into a video electrical signal; the three-way optical sub-integration component is used for converting an input uplink electric signal into an uplink optical signal and outputting the uplink optical signal to the optical fiber;

the video signal transmission portion of the optical module is disposed within the electromagnetic shield.

Further, the LDD/LA integrated chip is included, and the LDD/LA integrated chip comprises the LA chip and the LDD chip.

Further, the golden finger includes 20 pins, wherein 1 st pin is defined as VeeT, 2 nd pin is defined as TXFAULT, 3 rd pin is defined as TXBURST, 4 th pin is defined as SDA, 5 th pin is defined as SCL, 6 th pin is defined as MOD-ABS, 7 th pin is defined as Vcc12, 8 th pin is defined as RXLOS, 9 th pin is defined as TXDIS, 10 th pin is defined as VeeR, 11 th pin is defined as VeeR, 12 th pin is defined as RXD-, 13 th pin is defined as rxd+, 14 th pin is defined as VeeR, 15 th pin is defined as VccR, 16 th pin is defined as VccT, 17 th pin is defined as VeeT, 18 th pin is defined as txd+, 19 th pin is defined as TXD-, and 20 th pin is defined as VeeT.

Further, the three-way optical subset assembly comprises a wavelength division multiplexer, an APD receiver, a DFB laser and a PIN receiver, wherein the wavelength division multiplexer is used for receiving and separating a downlink optical signal and a video optical signal which are input from an optical fiber, transmitting the downlink optical signal to the APD receiver and transmitting the video optical signal to the PIN receiver; the DFB laser receives the uplink electric signal output from the LDD chip and converts the uplink electric signal into an uplink optical signal, and the wavelength division multiplexer receives the uplink optical signal output from the DFB laser and transmits the uplink optical signal to the optical fiber; the APD receiver converts the downlink optical signal into a downlink electrical signal and outputs the downlink electrical signal to the LA chip; the PIN receiver converts the video optical signal into a video electric signal and outputs the video electric signal to the radio frequency amplifying chip; the APD receiver is in bidirectional electrical connection with the APD boost circuit.

Further, the electromagnetic shielding cover comprises an upper cover support and an upper cover, the upper cover support is of a four-side enclosing structure, a first notch which is attached to a three-way device base is formed in the first face of the upper cover support, a video receiving pin of the three-way device enters the electromagnetic shielding cover through the first notch, a second notch which is attached to a copper shaft head is formed in the second face of the upper cover support, a signal wire on the copper shaft head enters the electromagnetic shielding cover through the second notch, the lower portion of the upper cover support is attached to a PCBA board, and the upper portion of the upper cover support is closed through an upper cover.

Further, the electromagnetic shield cover comprises a three-way device support, the three-way device support comprises a carrier plate, the three-way device is arranged above the carrier plate, a sealing piece is arranged on the carrier plate, and the first notch is sealed by the sealing piece and a base of the three-way device.

Further, a base limiting piece is arranged on the carrier plate.

Further, the electromagnetic shielding cover comprises a pin shielding cover, one surface of the pin shielding cover is open, the opening surface of the pin shielding cover is attached to the PCBA board, and a welding point of a video receiving pin of the three-way device and the PCBA board is located in the pin shielding cover.

Further, the heat radiator comprises a heat conduction plate, a heat outlet plate and a heat transfer plate connected with the heat conduction plate and the heat outlet plate, wherein the heat conduction plate is attached to a heating device of the optical module and used for introducing heat, and the heat transfer plate is used for radiating heat outwards.

Further, the radiator is Z-shaped.

The utility model has the advantages that:

1. the module is based on an XGSPON system, can realize XGSPON signal transmission and video signal transmission, and simultaneously adopts golden fingers as an electric connector, so that hot plug can be supported;

2. an LDD/LA two-in-one chip is selected, so that the layout of a circuit structure is improved, and an optimal structure with small volume and low cost of a module is realized;

3. an electromagnetic shielding cover is arranged, and a three-way device and a copper shaft head are matched to form a closed space on the upper surface of the PCBA board, so that a video signal transmission part of the module is placed in the space, and the interference of external signals is avoided; because the video receiving pins of the three-way device need to pass through the PCBA board to be welded on the lower surface of the PCBA board, the risk of introducing signal interference from the pins exists, and the video receiving pins are shielded by adding the pin shielding cover, so that the external signal interference is further avoided;

4. when the distance between the heating device and the module shell is very large, the Z-shaped heat dissipation device is arranged, so that low-cost heat dissipation can be realized, and the Z-shaped heat dissipation device is simple in structure, convenient to manufacture, low in cost and good in heat dissipation performance.

Drawings

Fig. 1 is a radio frequency transmission scheme based on a GPON transmission system in a conventional scheme;

FIG. 2 is a schematic block diagram of a XGSPON ONU Triplexer module in an embodiment;

FIG. 3 is a schematic three-dimensional structure of a XGSPON ONU Triplexer module according to an embodiment;

FIG. 4 is a schematic three-dimensional structure of another view of FIG. 3;

FIG. 5 is a schematic diagram of the lower view of FIG. 3;

fig. 6 is a schematic three-dimensional structure of the XGSPON ONU Triplexer module with the cover removed in the embodiment;

FIG. 7 is a schematic cross-sectional view A-A of FIG. 5;

FIG. 8 is an exploded view of an upper cover, upper cover bracket, three-way device bracket in an embodiment;

fig. 9 is a schematic three-dimensional structure of the XGSPON ONU Triplexer module without the three-way device according to the embodiment;

FIG. 10 is a schematic view of a three-dimensional construction of a three-way device holder in an embodiment;

FIG. 11 is a schematic view of a Z-shaped heat sink in an embodiment;

FIG. 12 is a schematic view of the configuration of a pin shield in an embodiment;

FIG. 13 is a diagram showing the definition of pins of a golden finger according to an embodiment;

fig. 14 is a radio frequency transmission scheme based on XGPSON transmission system in an embodiment;

FIG. 15 is a schematic block diagram of a XGSPON ONU Triplexer module in an embodiment after an LDD/LA two-in-one chip is used.

Description of the reference numerals

PCBA board 1;

a three-way device 2, a video receiving pin 21 and a base 22;

the upper cover bracket 3, the first surface 31, the first notch 311, the second surface 32, the second notch 321, the third surface 33 and the fourth surface 34;

an upper cover 4; copper shaft heads 5;

the three-way bracket 6, the carrier plate 61, the sealing sheet 62 and the base limiting sheet 63;

a pin shield 7; a heat sink 8; a heat generating device 9; a heat conductive pad 10;

english definitions in FIG. 1

TX: an optical transmitter; RX: an optical receiver; V-TX: a video transmitter; V-RX: a video receiver;

WBF: the filter is used for blocking interference signals to RX; WBF-V: the filter is used for blocking interference signals to the V-RX;

IF _GPON : uplink optical signals and downlink optical signals of the GPON system; IF (IF) _video : a downstream video signal;

WDM-G: the wavelength division multiplexing filter in the GPON ONU is used for multiplexing/de-multiplexing the uplink optical signal and the downlink optical signal of the G-PON system;

WDM-G': a wavelength division multiplexing filter in G-PON ONU Triplexer for multiplexing/demultiplexing an upstream optical signal, a downstream optical signal and a downstream video signal of the G-PON system;

a WDM-G-L, a wavelength division multiplexing filter in the G-PON OLT, for multiplexing/de-multiplexing the upstream optical signal and the downstream optical signal of the G-PON system;

WDM1r: the wavelength division multiplexing filter is positioned in the service center and is used for multiplexing the uplink optical signal and the downlink video signal of the G-PON system;

split ter: a wavelength divider for dividing light of different wavelengths mixed together;

english definitions in FIG. 14

IF _XGSPON : an XGSPON system uplink optical signal and a downlink optical signal; IF (IF) _video : a downstream video signal;

WDM-X: the wavelength division multiplexing filter in the XGSPON ONU is used for multiplexing/de-multiplexing the uplink optical signal and the downlink optical signal of the XGS-PON system;

WDM-X': a wavelength division multiplexing filter in XGSPON ONU Triplexer, configured to multiplex/demultiplex an upstream optical signal, a downstream optical signal, and a downstream video signal of the xGSPON system;

WDM-X-L: the wavelength division multiplexing filter in the XGSPON OLT is used for multiplexing/de-multiplexing the upstream optical signal and the downstream optical signal of the XGSPON system;

WDM1r: the wavelength division multiplexing filter is positioned in the service center and is used for multiplexing the uplink optical signal and the downlink video signal of the XGSPON system.

Detailed Description

The present utility model is described in further detail below with reference to examples.

English notation:

LA: a limiting amplifier; LDD: a laser driving chip; AGC: automatic gain control; TO-CAN: a packaging technology of an optical device is characterized in that TO-CAN is coaxially packaged.

The embodiment provides a single-fiber three-dimensional tera XGSPON and CATV integrated optical module, namely a XGSPON ONU Triplexer module, as shown in fig. 1, electrical components mounted on a PCBA board 1 include a gold finger, a copper stub 5, an MCU, a DC/DC voltage stabilizing circuit, an APD booster circuit, a LA chip, an LDD chip, a radio frequency amplifying chip, an AGC circuit and a three-dimensional optical sub-integrated component. The input end of the DC/DC voltage stabilizing circuit is connected with the power output end of the golden finger, and provides 12V/3.3V stabilizing voltage for the XGSPON ONU Triplexer module. The MCU is respectively connected with the golden finger, the LA chip and the LDD chip in a two-way communication way, and also receives the level feedback signal output from the radio frequency amplifying chip and outputs a level control signal to the AGC circuit. The LA chip is used for receiving the downlink electric signal output by the three-way optical sub-integrated component, limiting and amplifying the downlink electric signal and then transmitting the downlink electric signal to the golden finger. The APD voltage boosting circuit is in bidirectional electrical connection with the LA chip to realize level control and feedback, and the APD voltage boosting circuit is in bidirectional electrical connection with the three-way optical sub-set component to realize level gain. The LDD chip is used for receiving an uplink electric signal output by the golden finger and transmitting the uplink electric signal to the three-way optical sub-integrated component to modulate and drive the DFB laser. The radio frequency amplification chip is used for receiving the video electric signals output by the three-way optical sub-assembly and transmitting the video electric signals to the copper shaft head 5; the radio frequency amplifying chip is electrically connected with the AGC circuit in a bidirectional way and is used for realizing level gain. The three-way optical subset component is used for receiving the downlink optical signals and the video optical signals input from the optical fibers, converting the downlink optical signals into downlink electrical signals and converting the video optical signals into video electrical signals; the three-way optical sub-integration component is used for converting an input uplink electric signal into an uplink optical signal and outputting the uplink optical signal to the optical fiber.

As shown in fig. 15, in order to perfect the circuit layout, reduce the module volume and the module cost, the embodiment selects an LDD/LA (Laser Diode Driver/Limiting Amplifier) two-in-one chip, which adopts GN28L96 chip from Semtech company and includes an LDD chip and a LA chip. Preferably, the MCU in the present embodiment employs a GD32E232K8Q7 chip from GigaDevice; the radio frequency amplifying chip adopts a TAT6254C chip of Qorvo company; the AGC circuit adopts RFSA3043TR7 chip of Qorvo company.

As shown in fig. 1, the three-way optical sub-assembly of the present embodiment includes a wavelength division multiplexer WDM, an APD receiver, a DFB laser, and a PIN receiver, each of which adopts a TO-CAN coaxial package. The wavelength division multiplexer is used for receiving and separating a downlink optical signal and a video optical signal which are input from an optical fiber, transmitting the downlink optical signal to the APD receiver and transmitting the video optical signal to the PIN receiver; the DFB laser receives the uplink electric signal output from the LDD chip and converts the uplink electric signal into an uplink optical signal, and the wavelength division multiplexer receives the uplink optical signal output from the DFB laser and transmits the uplink optical signal to the optical fiber; the APD receiver converts the downlink optical signal into a downlink electrical signal and outputs the downlink electrical signal to the LA chip; the PIN receiver converts the video optical signal into a video electric signal and outputs the video electric signal to the radio frequency amplifying chip; the APD receiver is in bidirectional electrical connection with the APD boost circuit.

In this embodiment, hot plug can be supported by using a golden finger electrical connection scheme, which uses a golden finger specification compatible with the SFF-INF-8074 protocol, the definition of pins is shown in fig. 15, in which pin 1 is defined as VeeT, pin 2 is defined as TXFAULT, pin 3 is defined as TXBURST, pin 4 is defined as SDA, pin 5 is defined as SCL, pin 6 is defined as MOD-ABS, pin 7 is defined as Vcc12, pin 8 is defined as RXLOS, pin 9 is defined as TXDIS, pin 10 is defined as VeeR, pin 11 is defined as VeeR, pin 12 is defined as RXD-, pin 13 is defined as rxd+, pin 14 is defined as VeeR, pin 15 is defined as VccR, pin 16 is defined as VccT, pin 17 is defined as VeeT, pin 18 is defined as txd+, pin 19 is defined as TXD-, and pin 20 is defined as VeeT.

After the scheme is adopted, the module realizes xGSPON signal transmission and video signal transmission based on an xGSPON system as shown in fig. 14. The working principle of the module is as follows, the XGSPON ONU Triplexer module is integrally formed by an XGSPON ONU part and a radio frequency receiving part, and a transmission route comprises:

a. the 10Gb/s uplink electric signal from the golden finger is driven by an LDD chip to form a 1270nm DFB laser, and is electro-optically converted into a 10Gb/s 1270nm uplink optical signal, and then the uplink optical signal is transmitted upwards through an optical fiber;

b. the 10Gb/s 1577nm downlink optical signal from the optical fiber is photoelectrically converted into a 10Gb/s downlink electrical signal through an APD receiver, and then is output through a golden finger after being internally integrated with a TIA (preamplifier) and an LA chip of the APD TO-CAN;

c. the 1555nm downlink video optical signal from the optical fiber is photoelectrically converted into a downlink video electric signal through a PIN receiver, and is output through a copper shaft head 5 after radio frequency amplification and radio frequency attenuation (namely an AGC circuit).

The module of the embodiment is also provided with an electromagnetic shielding cover on the PCBA board 1, and the problem of signal interference caused by XGSPON transmission to video reception is solved by arranging the video signal transmission part in the electromagnetic shielding cover so as to avoid signal interference.

As shown in fig. 3 to 12, the electromagnetic shield includes an upper cover holder 3 and an upper cover 4, the upper cover holder 3 has a four-sided enclosing structure, and four sides of the upper cover holder 3 are respectively defined as a first side 31, a second side 32, a third side 33, and a fourth side 34. The first surface 31 of the upper cover bracket 3 is provided with a first notch 311 attached to the base 22 of the three-way device 2, the video receiving pin 21 of the three-way device 2 enters the electromagnetic shielding cover through the first notch 311, the second surface 32 of the upper cover bracket 3 is provided with a second notch 321 attached to the copper shaft head 5, the signal wire on the copper shaft head 5 enters the electromagnetic shielding cover through the second notch 321, the lower part of the upper cover bracket 3 is attached to and fixed on the PCBA board 1, and the upper part is covered and sealed by the upper cover 4. Thereby realizing that the video signal transmission part is arranged in the electromagnetic shield.

The first notch 311 may be configured to be matched with the video receiving pin 21 of the three-way device 2, that is, a hole with a diameter almost equal to that of the pin is directly formed on the first surface 31, and the pin is inserted into the hole during installation, but such a scheme may increase the difficulty of installation (welding is required between the three-way device 2 and the PCBA board 1, and the upper cover bracket 3 needs to be installed and fixed before welding, so that inconvenience of welding is caused). In order to improve the convenience of installation, the first notch 311 of this embodiment adopts a U-shaped groove structure as shown in fig. 8, and the PCBA board 1 with the opening surface groove of the U-shaped groove can be installed by fixing the three-way device 2 first and then installing the upper cover bracket 3. As shown in fig. 7, after the U-shaped groove notch scheme is adopted, the base 22 of the three-way device 2 cannot completely close the first notch 311, which affects the shielding effect, so the electromagnetic shielding cover of the embodiment further includes a three-way device 2 bracket. The three-way device 2 support comprises a carrier plate 61, the three-way device 2 is arranged above the carrier plate 61, a base limiting piece 63 is arranged on the periphery of the carrier plate 61 to fix the base 22 of the three-way device 2, and meanwhile, a sealing piece 62 is arranged on the carrier plate 61, so that the first notch 311 is sealed by the sealing piece 62 and the base 22 of the three-way device 2. Therefore, the three-way support 6, the upper cover support 3 and the upper cover 4 are realized, and a closed space is formed on the upper surface of the PCBA board 1 by matching the three-way device 2 and the copper shaft head 5.

Since the video receiving pins 21 of the three-way device 2 need to be soldered through the PCBA board 1 to the lower surface of the PCBA board 1, there is a risk of introducing signal interference from the pins, and therefore, the video receiving pins 21 need to be shielded. As shown in fig. 4 and 12, the electromagnetic shielding cover comprises a pin shielding cover 7, one surface of the pin shielding cover 7 is opened, the opening surface is attached to the PCBA board 1, and the welding point of the video receiving pin 21 of the three-way device 2 and the PCBA board 1 is positioned in the pin shielding cover 7.

When the distance from the heat generating device 9 to the module housing (a housing is further installed on the module, and the housing wraps both the PCBA board 1 and the shielding case) or the electromagnetic shielding case is very large, the cost of the solution of directly placing the heat conducting pad is too high, and the heat dissipation effect of the module is not ideal, and the embodiment further includes a heat sink 8 for guiding the heat generated by the heat generating device 9 on the PCBA board 1 to the outside of the module. The heat radiator 8 comprises a heat conducting plate, a heat outlet plate and a heat transfer plate connected with the heat conducting plate and the heat outlet plate, wherein the heat conducting plate is attached to a heating device 9 of the XGSPON ONU Triplexer module and used for introducing heat, the heat transfer plate is contacted with an electromagnetic shielding cover or a shell and used for radiating the heat outwards, and meanwhile, a heat conducting pad 10 (such as heat conducting silica gel and the like) can be arranged on the heat conducting plate and the heat outlet plate to accelerate heat radiation. The radiator 8 can be in an I shape or a Z shape, but the I shape is inconvenient to process, welding is needed during manufacturing, and the Z shape can be directly formed in a stamping and bending mode, so the radiator 8 is preferably in the Z shape.

As shown in fig. 7, in this embodiment, a Z-type radiator 8 is disposed in the electromagnetic shielding cover, and a heat conduction pad 10 is disposed at a heat conduction plate at the lower part of the radiator 8 for contacting with the heat generating device 9, and a heat output plate at the upper part of the radiator 8 contacts with the upper cover 4 for dissipating heat. The Z-shaped radiator 8 has the advantages of simple structure, convenient manufacture, lower cost, good heat dissipation performance and the like.

The above embodiments are only for illustrating the concept of the present utility model and not for limiting the protection of the claims of the present utility model, and all the insubstantial modifications of the present utility model using the concept shall fall within the protection scope of the present utility model.

Claims (8)

1. The single-fiber three-dimensional tera XGSPON and CATV integrated optical module is characterized by comprising an electromagnetic shielding cover, a golden finger, a copper spindle nose, an MCU, a DC/DC voltage stabilizing circuit, an APD voltage boosting circuit, an LA chip, an LDD chip, a radio frequency amplifying chip, an AGC circuit and a three-dimensional optical sub-integrated component;

the input end of the DC/DC voltage stabilizing circuit is connected with the power output end of the golden finger to provide stable voltage for the module;

the MCU is respectively connected with the golden finger, the LA chip and the LDD chip in a two-way communication way, and also receives a level feedback signal output from the radio frequency amplifying chip and outputs a level control signal to the AGC circuit;

the LA chip is used for receiving the downlink electric signal output by the three-way optical sub-integrated component, limiting and amplifying the downlink electric signal and then transmitting the downlink electric signal to the golden finger;

the APD boosting circuit is respectively and electrically connected with the LA chip and the three-way optical sub-assembly in a bidirectional way to realize voltage boosting;

the LDD chip is used for receiving an uplink electric signal output by the golden finger and transmitting the uplink electric signal to the three-way optical sub-integrated component;

the radio frequency amplification chip is used for receiving the video electric signals output by the three-way optical subset component and transmitting the video electric signals to the copper shaft head; the radio frequency amplifying chip is in bidirectional electrical connection with the AGC circuit;

the three-way optical subset component is used for receiving a downlink optical signal and a video optical signal which are input from an optical fiber, converting the downlink optical signal into a downlink electrical signal and converting the video optical signal into a video electrical signal; the three-way optical sub-integration component is used for converting an input uplink electric signal into an uplink optical signal and outputting the uplink optical signal to the optical fiber;

a video signal transmission portion of the optical module is disposed within the electromagnetic shield; the electromagnetic shielding cover comprises an upper cover support and an upper cover, wherein the upper cover support is of a four-side enclosing structure, a first notch which is attached to a three-way device base is formed in a first surface of the upper cover support, a video receiving pin of the three-way device enters the electromagnetic shielding cover through the first notch, a second notch which is attached to a copper shaft head is formed in a second surface of the upper cover support, a signal wire on the copper shaft head enters the electromagnetic shielding cover through the second notch, the lower part of the upper cover support is attached to a PCBA board, and the upper part of the upper cover support is closed by an upper cover; the electromagnetic shielding cover comprises a pin shielding cover, one surface of the pin shielding cover is open, the opening surface of the pin shielding cover is attached to the PCBA board, and a welding point of a video receiving pin of the three-way device and the PCBA board is located in the pin shielding cover.

2. The integrated optical module of claim 1, comprising an LDD/LA two-in-one chip comprising the LA chip and the LDD chip.

3. The integrated optical module of claim 1, wherein the golden finger comprises 20 pins, wherein pin 1 is defined as VeeT, pin 2 is defined as TXFAULT, pin 3 is defined as TXBURST, pin 4 is defined as SDA, pin 5 is defined as SCL, pin 6 is defined as MOD-ABS, pin 7 is defined as Vcc12, pin 8 is defined as RXLOS, pin 9 is defined as TXDIS, pin 10 is defined as VeeR, pin 11 is defined as VeeR, pin 12 is defined as RXD-, pin 13 is defined as rxd+, pin 14 is defined as VeeR, pin 15 is defined as VccR, pin 16 is defined as VccT, pin 17 is defined as VeeT, pin 18 is defined as txd+, pin 19 is defined as TXD-, and pin 20 is defined as VeeT.

4. The integrated optical module of single-fiber three-way tera XGSPON and CATV of claim 1, wherein the three-way optical subset package comprises a wavelength division multiplexer, an APD receiver, a DFB laser, and a PIN receiver, the wavelength division multiplexer configured to receive and separate a downstream optical signal and a video optical signal input from an optical fiber, and to transmit the downstream optical signal to the APD receiver, and to transmit the video optical signal to the PIN receiver; the DFB laser receives the uplink electric signal output from the LDD chip and converts the uplink electric signal into an uplink optical signal, and the wavelength division multiplexer receives the uplink optical signal output from the DFB laser and transmits the uplink optical signal to the optical fiber; the APD receiver converts the downlink optical signal into a downlink electrical signal and outputs the downlink electrical signal to the LA chip; the PIN receiver converts the video optical signal into a video electric signal and outputs the video electric signal to the radio frequency amplifying chip; the APD receiver is in bidirectional electrical connection with the APD boost circuit.

5. The integrated optical module of single-fiber three-dimensional tera XGSPON and CATV of claim 1, wherein the electromagnetic shield comprises a three-dimensional device support, the three-dimensional device support comprises a carrier plate, the three-dimensional device is arranged above the carrier plate, a sealing sheet is arranged on the carrier plate, and the first notch is sealed by the sealing sheet and a base of the three-dimensional device.

6. The integrated optical module of single-fiber three-dimensional tera XGSPON and CATV of claim 5, wherein said carrier plate is provided with a base limiting plate.

7. The integrated optical module of single-fiber three-dimensional tera XGSPON and CATV of claim 1, comprising a heat sink comprising a heat transfer plate connecting the heat transfer plate with the heat transfer plate, and a heat-inducing plate attached to a heat-generating device of the optical module for introducing heat, the heat transfer plate for radiating heat outward.

8. The single-fiber three-way tera XGSPON and CATV integrated optical module of claim 7, wherein the heat sink is Z-shaped.

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