CN220720878U

CN220720878U - Automobile seat ventilation fan

Info

Publication number: CN220720878U
Application number: CN202322536846.4U
Authority: CN
Inventors: 袁建和
Original assignee: Hemei Auto Parts Qingxian Co ltd
Current assignee: Hemei Auto Parts Qingxian Co ltd
Priority date: 2023-09-19
Filing date: 2023-09-19
Publication date: 2024-04-05
Anticipated expiration: 2033-09-19

Abstract

The utility model discloses a ventilation fan for an automobile seat, which belongs to the technical field of temperature regulation of automobile seats and comprises a fan body and a semiconductor cold-hot module, wherein the semiconductor cold-hot module comprises a shell with openings at two ends and a semiconductor sheet arranged in the shell, two working surfaces of the semiconductor sheet and the inner wall of the shell enclose a first ventilation cavity and a second ventilation cavity which are relatively independent, one end opening of the shell is communicated with an air outlet of the fan body, the other end opening of the shell comprises a first discharge opening leading into the seat and a second discharge opening leading out of the seat, the first discharge opening is communicated with the first ventilation cavity, and the second discharge opening is communicated with the second ventilation cavity. According to the utility model, the two working surfaces of the semiconductor wafer correspond to the two relatively independent ventilation cavities, one ventilation cavity can be used for leading cold/hot air into the seat for use, and the other ventilation cavity can be used for discharging unused hot/cold air, so that the heat and the cold of the semiconductor wafer can be used separately, and the refrigerating or heating effect is improved.

Description

Automobile seat ventilation fan

Technical Field

The utility model relates to the technical field of automobile seat temperature regulation, in particular to an automobile seat ventilation fan.

Background

The automobile seat capable of circulating air is an effective supplement to an automobile air conditioning system, and the air is discharged from the rear part or the bottom part by using a small fan through distributing small holes on the surface of the seat so as to have the function of adjusting the temperature and the humidity of the surface of the seat.

The fan can be connected with the air conditioning system, can also be provided with an independent heat source or cold source, and can be used for introducing hot air or cold air as required, so that the fan can be used as an effective supplement of the automobile air conditioning system, can meet the requirements of different drivers and passengers on the surface temperature of the seat in different seasons to the maximum extent, and improves the comfort of the drivers and passengers.

The refrigeration (heat) in the automobile seat air conditioning system constructed by utilizing the electric refrigeration and heating principle of the thermoelectric semiconductor component is independent of the original air conditioning system of the automobile, and the thermoelectric semiconductor air conditioning module is driven by the electric energy of the automobile to directly realize the refrigeration (heat) function of the seat system. When the thermoelectric semiconductor component works, one side of the thermoelectric semiconductor component refrigerates, and the other side of the thermoelectric semiconductor component heats simultaneously, and how to use the cold energy of the cold side or the heat energy of the hot side is a key for applying the thermoelectric semiconductor component to a car seat.

For example, chinese patent publication No. CN 213619483U discloses a semiconductor refrigerating apparatus for a car seat, which uses a semiconductor refrigerator and a second semiconductor refrigerator to perform refrigeration and uses a first outlet fan and a second outlet fan to perform blowing air to achieve a refrigerating effect, but this scheme can perform only refrigeration, cannot perform heating according to seasons, weather conditions, and the like, and has a limitation in application.

For another example, chinese patent application publication No. CN 102001299a discloses a new thermoelectric semiconductor air-conditioning seat module and a seat air-conditioning system, which includes at least one thermoelectric module, an outer fin unit and an inner fin unit mounted on each thermoelectric module, which share an axial fan, and a fan outlet is consistent with heat conduction directions of heat conduction devices of the inner and outer fin units. In this scheme, the air outlet of the axial fan is directed towards the inner side radiating fin unit and the outer side radiating fin unit, that is, the scheme does not distinguish the hot surface and the cold surface, which will cause the influence of cold energy when utilizing heat, and the influence of heat when utilizing cold energy, and finally influence the refrigerating or heating effect.

Therefore, how to distinguish heat and cold of thermoelectric semiconductors is a technical problem to be solved.

Disclosure of Invention

The present utility model is directed to a ventilation fan for a car seat, which solves the problems of the prior art, and by associating two working surfaces of a semiconductor wafer with two ventilation chambers which are relatively independent, cold/hot air can be led into the seat for use by one of the ventilation chambers, and unused hot/cold air can be discharged by the other ventilation chamber, so that the heat and cold of the semiconductor wafer can be used separately, and the refrigerating or heating effect can be improved.

In order to achieve the above object, the present utility model provides the following solutions:

the utility model provides an automobile seat ventilation fan, which comprises a fan body and a semiconductor cold and hot module, wherein the semiconductor cold and hot module comprises a shell with openings at two ends and a semiconductor sheet arranged in the shell, two working surfaces of the semiconductor sheet and the inner wall of the shell enclose a first ventilation cavity and a second ventilation cavity which are relatively independent, one end opening of the shell is communicated with an air outlet of the fan body, the other end opening of the shell comprises a first discharge opening leading into a seat and a second discharge opening leading out of the seat, the first discharge opening is communicated with the first ventilation cavity, and the second discharge opening is communicated with the second ventilation cavity.

Preferably, the housing includes a thermal insulation structure including a vacuum insulation panel, a glass fiber layer, and a foam material layer disposed in sequence.

Preferably, a heat dissipation grid is respectively arranged in the first ventilation cavity and the second ventilation cavity, the heat dissipation grid is connected with the inner wall of the heat insulation structure and the working surface of the semiconductor wafer, and the direction of holes formed by the heat dissipation grid is consistent with the ventilation direction of the first ventilation cavity and the second ventilation cavity.

Preferably, the heat dissipation grille comprises an X-shaped structure, a plurality of X-shaped structures are sequentially arranged, and the holes are formed between the adjacent X-shaped structures and between the X-shaped structures and the inner wall of the heat insulation structure.

Preferably, the heat dissipation grille is made of red copper.

Preferably, the semiconductor chip is reserved with four lead pins, and the four lead pins are sequentially arranged along the length direction of the semiconductor chip and are respectively a first pin, a second pin, a third pin and a fourth pin, wherein the first pin and the fourth pin are power interfaces, and the second pin and the third pin are NTC temperature control signal interfaces.

Preferably, the fan body adopts a centrifugal fan, an air inlet of the centrifugal fan is located in an axial direction, and an air outlet of the centrifugal fan is located in a tangential direction.

Preferably, the discharge direction of the first discharge port is parallel to the axial direction of the centrifugal fan, and the discharge direction of the second discharge port is in the same direction as the air outlet direction of the air outlet of the centrifugal fan.

Preferably, each of the four lead pins is led out from the second drain port.

Preferably, the air outlet of the fan body is connected with an opening at one end of the shell through a corrugated pipe section, and the corrugated pipe section can stretch and bend.

Compared with the prior art, the utility model has the following technical effects:

in the utility model, the cooling capacity or heat generated by the semiconductor wafer is taken away through the fan body, in the process, by arranging the two relatively independent ventilation cavities, the wind in the ventilation cavities is not interfered with each other, the two working surfaces of the semiconductor wafer are corresponding to the two ventilation cavities, when the fan body is used for blowing, cold/hot air can be led into the seat for use by using one ventilation cavity, and unused hot/cold air can be discharged by using the other ventilation cavity, so that the heat and the cooling capacity of the semiconductor wafer can be distinguished and utilized, the mutual interference is avoided, and the refrigerating or heating effect can be improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a front view of FIG. 1;

FIG. 3 is a cross-sectional view A-A of FIG. 2;

FIG. 4 is a schematic diagram of a semiconductor cold and hot module structure according to the present utility model;

1, a fan body; 2. a semiconductor cooling and heating module; 21. a semiconductor wafer; 211. a first pin; 212. a second pin; 213. a third pin; 214. a fourth pin; 22. a thermal insulation structure; 23. a heat-dissipating grille; 24. a first ventilation chamber; 25. a second ventilation chamber; 26. a first discharge port; 27. a second discharge port; 3. corrugated pipe sections.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model aims to provide a ventilation fan for an automobile seat, which solves the problems in the prior art, and by corresponding two working surfaces of a semiconductor wafer to two ventilation cavities which are relatively independent, cold/hot air can be led into the seat for use by one ventilation cavity, and unused hot/cold air can be discharged by the other ventilation cavity, so that the heat and the cold of the semiconductor wafer can be utilized in a differentiated mode, and the refrigerating or heating effect is improved.

In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.

As shown in fig. 1 to 4, the present utility model provides a ventilation fan for a car seat, comprising a fan body 1 and a semiconductor cooling and heating module 2, wherein the semiconductor cooling and heating module 2 has a function of generating cooling capacity or heat after being electrified, and is a tool for generating heat or cooling, and the working principle thereof is as follows: when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer is generated between the two ends, and the heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end and a hot end. The fan body 1 may be a general axial fan or a centrifugal fan, and the fan body 1 can perform air blowing or air blowing, so as to carry heat or cold generated by the semiconductor cooling and heating module 2 to a designated area of the automobile seat in the form of hot air or cold air for use.

More specifically, the semiconductor cooling and heating module 2 may include a casing with two open ends and a semiconductor wafer 21 disposed in the casing, where the casing mainly serves to enclose and form a cavity, and two working surfaces (i.e., a cold end and a hot end) of the semiconductor wafer 21 and an inner wall of the casing enclose a first ventilation cavity 24 and a second ventilation cavity 25 that are relatively independent, that is, the cold end and the hot end of the semiconductor wafer 21 are isolated in different ventilation cavities by the casing, when refrigeration is needed, heat is exhausted, when refrigeration is needed, and when heating is needed, a power supply voltage of the semiconductor wafer 21 is switched, and at this time, the refrigeration is exhausted, and the heat is utilized. To achieve the above effect, one end opening of the casing may be connected to the air outlet of the fan body 1, and the other end opening of the casing includes a first discharge port 26 leading into the seat and a second discharge port 27 leading out of the seat, the first discharge port 26 being connected to the first ventilation chamber 24 for utilizing the cooling or heating generated by the semiconductor chips 21 in the first ventilation chamber 24; the second exhaust port 27 communicates with the second ventilation chamber 25 for exhausting heat or cold generated from the semiconductor wafer 21 in the second ventilation chamber 25.

As is apparent from the above description, the present utility model takes away the cold or heat generated by the semiconductor wafer 21 through the fan body 1, and in this process, by providing two relatively independent ventilation chambers (i.e., the first ventilation chamber 24 and the second ventilation chamber 25), the air in the first ventilation chamber 24 and the second ventilation chamber 25 does not interfere with each other, the two working surfaces of the semiconductor wafer 21 are corresponding to the two ventilation chambers, and when the fan body 1 is used for blowing air, one ventilation chamber can be used for introducing cold/hot air into the seat for use, and the other ventilation chamber can be used for exhausting unused hot/cold air, thereby distinguishing the heat and cold of the semiconductor wafer 21 for use, avoiding the interference with each other, and improving the refrigerating or heating effect.

The housing includes a heat insulation structure 22, and the purpose of the heat insulation structure 22 is to reduce heat conduction between the first ventilation cavity 24 and the second ventilation cavity 25 and the outside, so as to transfer heat/cold to a required position more, and avoid power loss of the semiconductor chip 21. The thermal insulation structure 22 may include a vacuum insulation panel, a fiberglass layer, and a foam layer in sequence, and may effectively insulate a substantial portion of the heat or cold.

As shown in fig. 4, the first ventilation cavity 24 and the second ventilation cavity 25 are respectively provided with a heat dissipation grating 23, and the heat dissipation grating 23 has the main function of receiving the temperature control adjustment of the semiconductor wafer 21, conducting heat to the temperature, and meeting the requirements. The heat dissipation grid 23 can better transfer the heat or cold energy generated by the semiconductor wafer 21 out, the heat dissipation grid 23 is arranged in the ventilation cavity, when blowing, the blown external air can exchange heat with the heat dissipation grid 23, after the heat or cold energy of the heat dissipation grid 23 is absorbed, the external air is heated by cold or cooled by heat, for the first ventilation cavity 24, the heat or cold energy can be better transferred into the seat, the requirement is met, useless cold energy or heat energy can be effectively removed for the second ventilation cavity 25, and the normal and effective work of the semiconductor wafer 21 is ensured. The heat radiation grille 23 connects the inner wall of the heat insulation structure 22 and the working face of the semiconductor fin 21, facilitates the installation and heat radiation of the heat radiation grille 23, and plays a supporting role for the first ventilation cavity 24 and the second ventilation cavity 25. The direction of the holes surrounded by the heat dissipation grating 23 is consistent with the ventilation direction of the first ventilation cavity 24 and the second ventilation cavity 25, that is, the heat dissipation grating 23 is arranged in a manner that the contact area between the semiconductor fin 21 and the air blowing is ensured to be enough, that is, the obstruction to ventilation can be avoided or reduced as much as possible on the basis of ensuring effective heat dissipation.

Further, the heat dissipating grill 23 may include an X-shaped structure having two ends of one side connected to the heat insulating structure 22 and two ends of the other side connected to the semiconductor chip 21. The plurality of X-shaped structures are sequentially arranged, and holes for ventilation are formed between the adjacent X-shaped structures and between the X-shaped structures and the inner wall of the heat insulation structure 22.

The heat radiation grille 23 is made of a material having good heat conductivity as much as possible, and can ensure heat radiation effect, for example, red copper, which is relatively pure copper, has good electric conductivity and plasticity, and has excellent heat conductivity, ductility and corrosion resistance.

As shown in fig. 4, the semiconductor chip 21 reserves four lead pins, and the four lead pins are sequentially arranged along the length direction of the semiconductor chip 21 and are respectively a first pin 211, a second pin 212, a third pin 213 and a fourth pin 214, wherein the first pin 211 and the fourth pin 214 are power interfaces, and the second pin 212 and the third pin 213 are NTC temperature control signal interfaces. When the first pin 211 is connected with the positive electrode of the power supply and the fourth pin 214 is connected with the negative electrode of the power supply, the semiconductor wafer 21 in the first ventilation cavity 24 is a hot end, the semiconductor wafer 21 in the second ventilation cavity 25 is a cold end, and at the moment, hot air is introduced into the seat; when the fourth pin 214 is connected to the positive power supply and the first pin 211 is connected to the negative power supply, the semiconductor wafer 21 in the first ventilation cavity 24 is a cold end, the semiconductor wafer 21 in the second ventilation cavity 25 is a hot end, and at this time, cold air is introduced into the seat.

As shown in fig. 1 and 2, the fan body 1 may be a centrifugal fan, an air inlet of the centrifugal fan is located in an axial direction, an air outlet of the centrifugal fan is located in a tangential direction, and when the centrifugal fan is operated, external air can be sucked into the centrifugal fan in the axial direction and then discharged out of the centrifugal fan in the tangential direction.

As shown in fig. 3, the discharge direction of the first discharge port 26 is parallel to the axial direction of the centrifugal fan, the centrifugal fan may be made into a flat shape, and the first discharge port 26 is aligned with a duct leading into the seat, so that the installation of the ventilating fan is facilitated, and the design of flattening and miniaturization can be realized, so that the occupied space is reduced. The discharging direction of the second discharging port 27 is the same as the air outlet direction of the air outlet of the centrifugal fan, namely, the setting direction of the second discharging port 27 is different from the setting direction of the first discharging port 26, so that the unnecessary cold energy/heat can be conveniently discharged.

As shown in fig. 3, an arc-shaped partition plate can be arranged at the boundary between the first discharge port 26 and the second discharge port 27, the partition plate extends to the inner side of the second discharge port 27, through holes can be formed in the partition plate, after the four lead pins of the semiconductor chip 21 pass through the through holes, the lead pins are arranged close to the inner wall of the second discharge port 27 and are led out of the second discharge port 27, the positions of the through holes are sealed, the whole arrangement mode of the lead pins can be convenient for wiring, and the influence on hot air/cold air is small.

The corrugated pipe section 3 can be further arranged, the air outlet of the fan body 1 is connected with an opening at one end of the shell through the corrugated pipe section 3, and the position adjustment and the installation of the fan body 1 and the semiconductor cold-hot module 2 can be better realized by utilizing the telescopic and bending functions of the corrugated pipe section 3.

The principles and embodiments of the present utility model have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present utility model; also, it is within the scope of the present utility model to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the utility model.

Claims

1. A car seat ventilation fan, characterized in that: including fan body and cold and hot module of semiconductor, cold and hot module of semiconductor includes both ends open-ended casing and sets up semiconductor piece in the casing, two working faces of semiconductor piece with the inner wall of casing encloses into relatively independent first ventilation chamber and second ventilation chamber, the one end opening intercommunication of casing the air outlet of fan body, the other end opening of casing is including leading to the first discharge port in the seat and leading to the outer second discharge port of seat, first discharge port with first ventilation chamber intercommunication, the second discharge port with second ventilation chamber intercommunication.

2. The automotive seat ventilation fan of claim 1, wherein: the shell comprises a heat insulation structure, wherein the heat insulation structure comprises a vacuum heat insulation plate, a glass fiber layer and a foam material layer which are sequentially arranged.

3. The automotive seat ventilation fan of claim 2, wherein: the first ventilation cavity and the second ventilation cavity are respectively provided with a heat dissipation grating, the heat dissipation gratings are connected with the inner wall of the heat insulation structure and the working face of the semiconductor wafer, and the direction of holes formed by the heat dissipation gratings is consistent with the ventilation direction of the first ventilation cavity and the second ventilation cavity.

4. A car seat ventilation fan as claimed in claim 3, wherein: the heat dissipation grille comprises an X-shaped structure, a plurality of X-shaped structures are sequentially arranged, and holes are formed between the adjacent X-shaped structures and between the X-shaped structures and the inner wall of the heat insulation structure.

5. A car seat ventilation fan as claimed in claim 3, wherein: the radiating grid is made of red copper.

6. The automotive seat ventilation fan of any one of claims 1-5, wherein: four lead pins are reserved on the semiconductor chip, are sequentially arranged along the length direction of the semiconductor chip and are respectively a first pin, a second pin, a third pin and a fourth pin, wherein the first pin and the fourth pin are power interfaces, and the second pin and the third pin are NTC temperature control signal interfaces.

7. The automotive seat ventilation fan of claim 6, wherein: the fan body adopts centrifugal fan, centrifugal fan's air intake is located axial, centrifugal fan's air outlet is located tangential.

8. The automotive seat ventilation fan of claim 7, wherein: the discharge direction of the first discharge port is parallel to the axial direction of the centrifugal fan, and the discharge direction of the second discharge port is in the same direction as the air outlet direction of the air outlet of the centrifugal fan.

9. The automotive seat ventilation fan of claim 8, wherein: the four lead pins are led out from the second discharge port.

10. The automotive seat ventilation fan of claim 1, wherein: the air outlet of the fan body is connected with an opening at one end of the shell through a corrugated pipe section, and the corrugated pipe section can stretch and bend.