CN215062549U - Air conditioning device based on 3D temperature-uniforming plate module - Google Patents
Air conditioning device based on 3D temperature-uniforming plate module Download PDFInfo
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- CN215062549U CN215062549U CN202120191678.8U CN202120191678U CN215062549U CN 215062549 U CN215062549 U CN 215062549U CN 202120191678 U CN202120191678 U CN 202120191678U CN 215062549 U CN215062549 U CN 215062549U
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Abstract
The utility model relates to an air conditioning equipment based on 3D temperature-uniforming plate module, including the casing, install the refrigeration module and the module of heating in the casing, a side of casing is equipped with the air intake, and the another side that corresponds with it is equipped with the air outlet, and the air intake goes out to be equipped with the main fan, the refrigeration module with heat and be equipped with 3D temperature-uniforming plate module between the module, the lower part of 3D temperature-uniforming plate module with heat the module contact, upper portion with the refrigeration module contact. The utility model discloses an utilize the high thermal conductivity of 3D samming board module to be quick with the cold and hot quick even diffusion of concentrating, realize rapid cooling and heating after with cold and hot exchange through the fan, air conditioning equipment can be used to the cooling in summer, and the natural wind fan can be blown in spring and autumn, is used for the heating winter, and energy-concerving and environment-protective, safe and reliable, small, air conditioning equipment is whole can remove at will moreover, and is nimble light.
Description
Technical Field
The utility model relates to an air conditioning technology field especially relates to an air conditioning equipment based on 3D temperature-uniforming plate module.
Background
Air conditioner fan of market low side carries out the heat transfer mode through water shower on the cascade and reaches the cooling purpose, and this mode cooling effect is poor, breeds the bacterium easily, and the electrical apparatus short circuit that ages easily, and the potential safety hazard is big. The product after the upgrading adds and is equipped with semiconductor refrigeration chip, through the pure water of semiconductor refrigeration pre-installation, the water shower after the refrigeration is on cascade or filter, and the cooling effect has the promotion after the heat transfer, but also breeds the bacterium easily equally, and the potential safety hazard is big, needs continuous water of interpolation again, and the refrigeration time is slow. Therefore, it is urgently needed to develop a cold and hot air conditioning device capable of rapidly heating or rapidly cooling.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model provides an air conditioning equipment based on 3D temperature-uniforming plate module, the isothermality is good, and the thermal resistance is little, and cold volume loss is little, and is fast, and under the same refrigeration power, the temperature cooling is the fastest, and the body is felt optimally.
Air conditioning equipment based on 3D temperature-uniforming plate module, including the casing, install the refrigeration module and the module of heating in the casing, a side of casing is equipped with the air intake, and another side that corresponds with it is equipped with the air outlet, and the air intake goes out to be equipped with main fan, its characterized in that: the heating module is characterized in that a 3D temperature equalizing plate module is arranged between the refrigerating module and the heating module, the lower portion of the 3D temperature equalizing plate module is in contact with the heating module, and the upper portion of the 3D temperature equalizing plate module is in contact with the refrigerating module.
In a further technical scheme, the 3D temperature-uniforming plate module comprises an upper temperature-uniforming plate, a lower temperature-uniforming plate, a frame temperature-uniforming plate and a temperature-uniforming plate heat exchanger, wherein the upper temperature-uniforming plate is fixedly connected with the lower surface of the refrigeration module, the lower temperature-uniforming plate is fixedly connected with the upper surface of the heating module, the frame temperature-uniforming plate is bent to form an installation space, and the temperature-uniforming plate heat exchanger is arranged in the installation space and is in contact with the frame temperature-uniforming plate.
In a further technical scheme, the frame temperature-uniforming plate is bent for four times to form a frame body with a rectangular cross section, and the bent parts are all subjected to rounding treatment.
In a further technical scheme, the temperature-equalizing plate heat exchanger is provided with a plurality of ventilation grooves.
In another technical scheme, the 3D temperature-uniforming plate module comprises an upper temperature-uniforming plate, a lower temperature-uniforming plate, a temperature-uniforming plate heat exchanger and a plurality of vertical temperature-uniforming plates, wherein the upper temperature-uniforming plate is fixedly connected with the lower surface of the refrigeration module, the lower temperature-uniforming plate is fixedly connected with the upper surface of the heating module, the temperature-uniforming plate heat exchanger is provided with a plurality of clamping grooves, the vertical temperature-uniforming plates are correspondingly arranged in the clamping grooves one by one, and ventilation grooves are reserved between the adjacent vertical temperature-uniforming plates.
In a further technical scheme, the ventilating device further comprises a radiating fin, and the radiating fin is embedded in the ventilating groove.
In a further technical scheme, the cooling fin is bent for multiple times to form a snake-shaped cooling fin with a plurality of groove structures.
In another technical scheme, the 3D temperature-uniforming plate module comprises an upper temperature-uniforming plate, a lower temperature-uniforming plate, a frame temperature-uniforming plate and a heat sink, the upper temperature-uniforming plate is fixedly connected to the lower surface of the refrigeration module, the lower temperature-uniforming plate is fixedly connected to the upper surface of the heating module, and the frame temperature-uniforming plate is respectively in contact with the upper temperature-uniforming plate and the lower temperature-uniforming plate.
In a further technical scheme, the frame temperature-uniforming plate is bent for multiple times to form a plurality of supporting bodies, the upper parts of the plurality of supporting bodies are in contact with the upper temperature-uniforming plate, and the lower parts of the plurality of supporting bodies are in contact with the lower temperature-uniforming plate; the radiating fins are embedded in the supporting body.
In a further technical scheme, a radiator in contact with the refrigerating module is arranged at the upper part of the refrigerating module, and a radiating fan is arranged above the radiator; a water storage cavity is further arranged in the shell, and pure water for atomization is stored in the water storage cavity; an atomizing filter screen is arranged at the air outlet of the shell.
The utility model provides a dual-purpose air conditioning equipment of desktop changes in temperature can be used to the cooling in summer, and the natural wind fan can be blown in spring and autumn, is used for the heating winter, and is energy-concerving and environment-protective, safe and reliable, small, and air conditioning equipment is whole can remove at will moreover, and is nimble light. The characteristics that the heat conduction speed is fast, the effect is even through utilizing 3D temperature-uniforming plate module mainly, through setting 3D temperature-uniforming plate module to have the structure that the surface area is big and whole light in weight to improve the effect that air conditioning equipment refrigerates or heated.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the internal structure of embodiment 1 of the present invention;
fig. 3 is a schematic view of the internal structure of embodiment 2 of the present invention;
FIG. 4 is a schematic view of the heat sink with three structures according to the present invention;
fig. 5 is an internal structural view of embodiment 3 of the present invention;
fig. 6 is a schematic view of the overall structure of embodiment 4 of the present invention;
FIG. 7 is a schematic structural view of a frame vapor chamber according to example 4;
FIG. 8 is a schematic diagram of the refrigerating operation of the present invention shown in FIG. 1;
fig. 9 is a schematic diagram of the refrigerating operation of the present invention shown in fig. 2.
The heat dissipation device comprises a shell-100, an electric control area-110, a heat exchange area-120, an atomization area-130, a semiconductor heat dissipation area-140, an air outlet-101, an air inlet-102, an atomization filter screen-103, an air deflector-104, a radiator-105, a heat dissipation fan-106, a main fan-107, a refrigeration module-200, a heating module-300, a 3D temperature equalization plate module-400, an upper temperature equalization plate-401, a lower temperature equalization plate-402, a temperature equalization plate heat exchanger-403, a clamping groove-403 a, a vertical temperature equalization plate-404, a frame temperature equalization plate-410, an installation space-411, a support body-412, a heat dissipation plate-500, a folding heat dissipation plate-510, an aluminum extruded heat dissipation plate 520 and a harmonica type heat dissipation plate-530.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1:
the utility model discloses a can refrigerate, heat dual-purpose air conditioning equipment, as shown in fig. 1 and fig. 2, including casing 100, install the refrigeration module 200 in casing 100 and heat module 300, be equipped with 3D samming board module 400 between refrigeration module 200 and the module 300 that heats, the lower part of 3D samming board module 400 with heat the module 300 contact, upper portion with refrigeration module 200 contacts.
An air inlet 102 is arranged on one side surface of the shell 100, an air outlet 101 is arranged on the other side surface corresponding to the air inlet 102, a main fan 107 is arranged at the air inlet 102, and an atomizing filter screen 103 and an air deflector 104 are arranged at the air outlet 101. The interior of the housing 100 is divided into an electric control area 110, a heat exchange area 120, an atomization area 130 and a semiconductor heat dissipation area 140. The electronic control section 110 is used for mounting an electronic control module and is located at the lowermost portion of the housing 100. The heat exchange area 120 is located above the electric control area 110 and used for installing the 3D temperature equalization plate module 400, the 3D temperature equalization plate module 400 comprises an upper temperature equalization plate 401, a lower temperature equalization plate 402, a frame temperature equalization plate 410 and a temperature equalization plate heat exchanger 403, the upper temperature equalization plate 401 is fixedly connected with the lower surface of the refrigeration module 200, the lower temperature equalization plate 402 is fixedly connected with the upper surface of the heating module 300, the frame temperature equalization plate 410 forms an installation space 411 after being bent, and the temperature equalization plate heat exchanger 403 is arranged in the installation space 411 and is in contact with the frame temperature equalization plate 410. The frame vapor chamber 410 is bent and does not contact end to end. Specifically, the frame temperature equalization plate 410 is bent four times to form a frame body with a rectangular cross section, and the bent portions are all rounded.
The atomization region 130 is used for storing purified water for atomization, and is located at both sides of the heat exchange region 120. The semiconductor heat dissipation area 140 is located above the heat exchange area 120 and the atomization area 130, and is provided with a heat sink 105, and a heat dissipation fan 106 is further disposed above the heat sink 105.
In this embodiment, the refrigeration module 200 is made of a TEC semiconductor chip, a refrigeration surface of the TEC semiconductor chip is in contact with the upper temperature-uniforming plate 401, and a heating surface of the TEC semiconductor chip is in contact with the heat sink 105.
When the air conditioner of the embodiment is in refrigeration operation, the principle is as shown in fig. 8 and fig. 9, the refrigeration module 200 works and the heating module 300 does not work, the refrigeration module 200 conducts low temperature to the upper temperature equalizing plate 401, the frame temperature equalizing plate 410, the temperature equalizing plate heat exchanger 403 and the lower temperature equalizing plate 402, the low temperature is diffused to the whole 3D temperature equalizing plate module 400, natural wind is sucked into the shell 100 under the action of the main fan 107 and is subjected to heat exchange through the 3D temperature equalizing plate module 400, and the natural wind penetrates through the ventilation groove to perform sufficient heat exchange with the temperature equalizing plate heat exchanger 403 and then leaves the air conditioner from the air outlet 101, so that cold energy is radiated to the air flowing circularly through the module.
Specifically, in the heat conduction process inside the air conditioning device, the refrigeration surface of the TEC semiconductor chip radiates the refrigeration to the upper temperature equalizing plate 401, the upper temperature equalizing plate 401 conducts the temperature uniformly in the transverse direction, and then the refrigeration radiates to the frame temperature equalizing plate 410 and the temperature equalizing plate heat exchanger 403, and when natural wind enters the inside of the casing 100 along with the main fan 107, the natural wind is fully contacted with the temperature equalizing plate heat exchanger 403 through the ventilation groove to become cold wind, and then the cold wind is conveyed to the environment through the air outlet 101.
The utility model discloses the make full use of 3D module isothermality is good, and the thermal resistance is little, and cold volume loss is little, and fast characteristic is compared in traditional air conditioning equipment under the same refrigeration power, and the temperature cooling is the fastest, and the body is felt optimally.
In this embodiment, the inside vacuum of 3D temperature-uniforming plate module 400 is filled with the environmental protection organic liquid, the temperature application range: the temperature is 40 ℃ below zero to 180 ℃, so that the 3D temperature equalizing plate module 400 can realize rapid cold and heat transfer and temperature equalization during refrigeration and heating.
During heating, the refrigeration module 200 does not work, the heating module works and transfers heat to the lower temperature equalizing plate 402, the lower temperature equalizing plate 402 quickly and uniformly diffuses the heat in the transverse direction and transfers the heat to the frame temperature equalizing plate 410 and the temperature equalizing plate heat exchanger 403, meanwhile, the main fan 107 sucks natural wind into the shell 100, performs heat exchange with the temperature equalizing plate heat exchanger 403 through the ventilation groove to form hot wind, and returns to the environment along with the air outlet 101. In the heat exchange process, the utility model discloses make full use of temperature-uniforming plate isothermal performance excellent characteristics for the air-out temperature remains invariable throughout. Still be equipped with the atomizer in addition, atomize the pure water in the atomizing area 130, guarantee the humidity of environment, keep best body to feel.
Example 2:
as shown in fig. 3, in this embodiment, a 3D temperature-uniforming plate module 400 with another structure is adopted, where the 3D temperature-uniforming plate module 400 includes an upper temperature-uniforming plate 401, a lower temperature-uniforming plate 402, a temperature-uniforming plate heat exchanger 403, and a plurality of vertical temperature-uniforming plates 404, the upper temperature-uniforming plate 401 is fixedly connected to the lower surface of the refrigeration module 200, the lower temperature-uniforming plate 402 is fixedly connected to the upper surface of the heating module 300, the temperature-uniforming plate heat exchanger 403 is provided with a plurality of slots 403a, the vertical temperature-uniforming plates 404 are installed in the slots 403a in a one-to-one correspondence manner, and a ventilation slot is left between the adjacent vertical temperature-uniforming plates 404.
The speed is faster when heat transfer is performed, for example, when refrigeration is performed, the refrigeration module 200 firstly radiates cold to the upper temperature-uniforming plate 401, the cold is uniformly diffused along the transverse direction by using the upper temperature-uniforming plate 401, the vertical temperature-uniforming plate 404 embedded in the clamping groove 403a simultaneously performs heat exchange with the upper temperature-uniforming plate 401, and the cold is uniformly diffused along the vertical direction. The natural wind passes through the gap between the vertical temperature equalizing plates 404, exchanges heat with the gap, turns into cold wind, and is discharged to the environment from the air outlet 101. The advantages of high cooling speed and good isothermal property of the uniform temperature plate are fully utilized, rapid refrigeration and uniform refrigeration are realized, and the optimal feeling is provided for users.
Example 3:
as shown in fig. 5, in example 2, heat dissipation fins 500 are further embedded between the vertical temperature uniforming plates 404. As shown in fig. 4, the heat sink 500 may be provided with three forms including a folded heat sink 510, an extruded aluminum heat sink 520, and a tubular harmonica heat sink 530, and as shown in a of fig. 4, the folded heat sink 510 is bent several times to form a serpentine heat sink 500 having a plurality of groove structures. As shown in fig. 4 b, the aluminum extruded fin 520 includes a body having a large surface area with a plurality of partition portions arranged in parallel. As shown in the drawing c in fig. 4, the harmonica tube cooling fin 530 includes a body, a hollow cavity is formed inside the body, and a plurality of partition plates are arranged in the cavity to partition the cavity into a plurality of independent channels.
In the present embodiment, the heat sink 500 employs a folded heat sink 510. The heat sink 500 can increase the heat exchange area between the natural wind and the 3D temperature equalization plate module 400 during the heat exchange process, thereby improving the heat exchange efficiency.
Example 4:
as shown in fig. 6, the 3D temperature-uniforming plate module 400 of this embodiment adopts a lighter structure, and specifically, the 3D temperature-uniforming plate module 400 includes an upper temperature-uniforming plate 401, a lower temperature-uniforming plate 402, a frame temperature-uniforming plate 410 and heat dissipation fins 500, where the upper temperature-uniforming plate 401 is fixedly connected to the lower surface of the refrigeration module 200, the lower temperature-uniforming plate 402 is fixedly connected to the upper surface of the heating module 300, and the frame temperature-uniforming plate 410 is in contact with the upper temperature-uniforming plate 401 and the lower temperature-uniforming plate 402, respectively.
As shown in fig. 7, the frame vapor chamber 410 is bent for multiple times to form a plurality of support bodies 412, wherein the upper portions of the plurality of support bodies 412 are in contact with the upper vapor chamber 401, and the lower portions are in contact with the lower vapor chamber 402; the heat sink 500 is embedded in the support 412.
The frame vapor chamber 410 of this embodiment is an integral vapor chamber, and is bent several times to form a serpentine structure with upper and lower portions contacting the upper vapor chamber 401 and the lower vapor chamber 402, and has a plurality of peak-shaped support bodies 412, and heat dissipation fins 500 for increasing the heat exchange area are provided between the support bodies 412.
When heat exchange is performed, taking the working principle of refrigeration as an example, the upper temperature-uniforming plate 401 radiates the cold energy to the upper part of the supporting body 412, the supporting body 412 evenly transmits the cold energy to the whole frame temperature-uniforming plate 410, and the cold energy of the frame temperature-uniforming plate 410 is radiated by all the radiating fins 500 at the same time to rapidly cool down, so that the light-weight design of the whole 3D temperature-uniforming plate module 400 is realized, and the cooling speed and the cooling effect are not influenced.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only represent preferred embodiments of the present invention, which are described in more detail and detail, but are not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides an air conditioning equipment based on 3D temperature-uniforming plate module, includes the casing, installs the refrigeration module and the module of heating in the casing, and a side of casing is equipped with the air intake, and the another side that corresponds with it is equipped with the air outlet, and the air intake goes out to be equipped with main fan, its characterized in that: the heating module is characterized in that a 3D temperature equalizing plate module is arranged between the refrigerating module and the heating module, the lower portion of the 3D temperature equalizing plate module is in contact with the heating module, and the upper portion of the 3D temperature equalizing plate module is in contact with the refrigerating module.
2. The air conditioning device based on the 3D temperature equalization plate module as claimed in claim 1, wherein: the 3D temperature-uniforming plate module comprises an upper temperature-uniforming plate, a lower temperature-uniforming plate, a frame temperature-uniforming plate and a temperature-uniforming plate heat exchanger, wherein the upper temperature-uniforming plate is fixedly connected with the lower surface of the refrigeration module, the lower temperature-uniforming plate is fixedly connected with the upper surface of the heating module, the frame temperature-uniforming plate forms an installation space after being bent, and the temperature-uniforming plate heat exchanger is arranged in the installation space and is in contact with the frame temperature-uniforming plate.
3. The air conditioning device based on the 3D temperature equalization plate module set as claimed in claim 2, wherein: the frame temperature equalizing plate is bent for four times to form a frame body with a rectangular cross section, and the bent parts are rounded.
4. The air conditioning device based on the 3D temperature-uniforming plate module set is characterized in that: the temperature-equalizing plate heat exchanger is provided with a plurality of ventilation grooves.
5. The air conditioning device based on the 3D temperature equalization plate module as claimed in claim 1, wherein: the 3D temperature-uniforming plate module comprises a temperature-uniforming plate, a lower temperature-uniforming plate, a temperature-uniforming plate heat exchanger and a plurality of vertical temperature-uniforming plates, wherein the upper temperature-uniforming plate is fixedly connected with the lower surface of the refrigeration module, the lower temperature-uniforming plate is fixedly connected with the upper surface of the heating module, the temperature-uniforming plate heat exchanger is provided with a plurality of clamping grooves, and the vertical temperature-uniforming plates are installed in the clamping grooves in a one-to-one correspondence manner and are adjacent to each other, and ventilation grooves are reserved between the vertical temperature-uniforming plates.
6. The air conditioning device based on the 3D temperature equalization plate module set as claimed in claim 5, wherein: the ventilating structure also comprises a radiating fin which is embedded in the ventilating groove.
7. The air conditioning device based on the 3D temperature equalization plate module as claimed in claim 6, wherein: the cooling fin is bent for multiple times to form the serpentine cooling fin with the multiple groove structures.
8. The air conditioning device based on the 3D temperature equalization plate module as claimed in claim 1, wherein: the 3D temperature-uniforming plate module comprises an upper temperature-uniforming plate, a lower temperature-uniforming plate, a frame temperature-uniforming plate and radiating fins, wherein the upper temperature-uniforming plate is fixedly connected with the lower surface of the refrigeration module, the lower temperature-uniforming plate is fixedly connected with the upper surface of the heating module, and the frame temperature-uniforming plate is respectively contacted with the upper temperature-uniforming plate and the lower temperature-uniforming plate.
9. The air conditioning device based on the 3D temperature equalization plate module set as claimed in claim 8, wherein: the frame temperature-equalizing plate is bent for multiple times to form a plurality of supporting bodies, the upper parts of the supporting bodies are in contact with the upper temperature-equalizing plate, and the lower parts of the supporting bodies are in contact with the lower temperature-equalizing plate; the radiating fins are embedded in the supporting body.
10. The 3D vapor panel module-based air conditioning device according to any one of claims 1-9, wherein: the upper part of the refrigeration module is provided with a radiator which is contacted with the refrigeration module, and a radiating fan is arranged above the radiator; a water storage cavity is further arranged in the shell, and pure water for atomization is stored in the water storage cavity; an atomizing filter screen is arranged at the air outlet of the shell.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120191678.8U CN215062549U (en) | 2021-01-22 | 2021-01-22 | Air conditioning device based on 3D temperature-uniforming plate module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120191678.8U CN215062549U (en) | 2021-01-22 | 2021-01-22 | Air conditioning device based on 3D temperature-uniforming plate module |
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| CN215062549U true CN215062549U (en) | 2021-12-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
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2021
- 2021-01-22 CN CN202120191678.8U patent/CN215062549U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
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