WO2004103745A1 - Semiconductor air conditioner for motor vehicle - Google Patents

Semiconductor air conditioner for motor vehicle Download PDF

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Publication number
WO2004103745A1
WO2004103745A1 PCT/CN2003/000653 CN0300653W WO2004103745A1 WO 2004103745 A1 WO2004103745 A1 WO 2004103745A1 CN 0300653 W CN0300653 W CN 0300653W WO 2004103745 A1 WO2004103745 A1 WO 2004103745A1
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WO
WIPO (PCT)
Prior art keywords
air
semiconductor
air conditioner
cold
cooling
Prior art date
Application number
PCT/CN2003/000653
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French (fr)
Chinese (zh)
Inventor
Fulin Liu
Xin Qin
Hairen Ye
Xiangxing Li
Original Assignee
Fulin Liu
Xin Qin
Hairen Ye
Xiangxing Li
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Publication date
Application filed by Fulin Liu, Xin Qin, Hairen Ye, Xiangxing Li filed Critical Fulin Liu
Priority to AU2003255108A priority Critical patent/AU2003255108A1/en
Publication of WO2004103745A1 publication Critical patent/WO2004103745A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating [HVAC] devices
    • B60H1/00478—Air-conditioning devices using the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect

Definitions

  • the present invention relates to a refrigeration device, and in particular to a semiconductor air conditioner for a vehicle.
  • the existing automotive air conditioner is cooled by using an automobile engine to drive the air conditioner compressor.
  • you need to use the air conditioner while parking you cannot turn off the engine.
  • the disadvantages are poor safety and environmental protection.
  • a cooling device, a cooling fan, a radiator, and a cooling fan are respectively arranged on the cold and hot surfaces of the semiconductor cooling chip.
  • the heat produced by the radiator and the cooling fan must be taken away to ensure a good cooling effect.
  • the existing heat sinks are mostly made of heat-dissipating aluminum, and the structure is formed by integrally extruding the base and the heat-dissipating aluminum sheet. Since the extrusion molding process is used, the space between the heat-dissipating aluminum sheets is wide, and it is difficult to achieve a good heat dissipation effect on a semiconductor air conditioner for a vehicle. Therefore, the existing automotive semiconductor air conditioner is restricted by the radiator, and it is difficult to meet the cooling requirements.
  • An object of the present invention is to provide a semiconductor air conditioner for a vehicle with a reasonable structure and a good cooling effect, which can guarantee the cooling requirements for at least two hours in a parking state.
  • a semiconductor air conditioner for a vehicle has a housing, and a semiconductor cooling sheet, a control circuit, a radiator composed of a base and a heat-dissipating aluminum sheet, and a cooling fan are arranged in the casing.
  • the base of the radiator is provided with a plurality of mutually parallel A groove, the root of the heat-dissipating aluminum sheet having a thickness corresponding to the width of the groove is inserted into the groove, so that the root of the heat-dissipating aluminum sheet is closely attached to the base; and further includes a U-shaped air deflector, which is buckled on the The heat sink makes the gap between the air deflector and the heat sink, and the heat sink aluminum sheet form a heat dissipation channel, and the heat dissipation fan is placed at one end of the heat dissipation channel.
  • the invention adopts a novel structure of the heat sink.
  • the heat sink aluminum sheet is thin and high, and the gap between them is small.
  • the heat dissipation area is increased by three times.
  • the heat dissipation channel is formed in cooperation with the air guide plate, so that the semiconductor cooling chip is cooled due to refrigeration.
  • the heat generated can be taken away in time to ensure that the temperature of the radiator is controlled below 40 ° C, thereby increasing the cooling capacity.
  • the present invention can use a battery of a car to realize power driving.
  • FIG. 1 is a schematic diagram of an appearance structure of the present invention
  • FIG. 2 is a sectional view taken along A-A in FIG. 1;
  • Fig. 3 is a sectional view taken along the line B-B of Fig. 1;
  • FIG. 4 is a schematic structural diagram of a heat sink according to the present invention.
  • the semiconductor air conditioner for a vehicle has a housing 10.
  • the housing 10 is provided with a semiconductor cooling sheet 8, a control circuit, a base 702 and a heat-dissipating aluminum sheet 701.
  • Radiator 7 Radiating fan 16, Radiator 5 consisting of a base and a cold aluminum sheet, another U-shaped wind deflector 4,
  • the cooling device is a small blower 1;
  • the base 702 of the radiator 7 is provided There are several parallel grooves 703, and the roots of the heat-dissipating aluminum sheet 701 corresponding to the thickness and the width of the grooves are inserted into the grooves, so that the roots of the heat-dissipating aluminum sheet and the base are closely attached together; and a U-shaped wind deflector 9 is also included.
  • the buckle is buckled on the radiator 7 so that the space between the air deflector and the radiator and between the aluminum fins
  • the gap forms a heat dissipation channel 79, and the heat dissipation fan 16 is placed at one end of the heat dissipation channel.
  • Another ⁇ -shaped air deflector 9 is buckled on the radiator 5 so that the gap between the air deflector and the radiator, and between the cold aluminum sheets forms a cold channel 59.
  • the small blower 1 is placed at one end of the cold channel .
  • a middle partition plate 11 is also fixed in the casing 10, and a semiconductor cooling sheet 8 is installed in a through hole thereon, and the inner cavity of the casing is divided into corresponding cold air chambers and hot air chambers, and a drain pipe joint 12 is provided at the lower part of the cold air chambers.
  • the cold air chambers correspond to the cold air inlets and outlets of the cold air channels, which are respectively provided with the cold air inlets 3 and the cold air outlets 6, and the cold air outlets 6 are provided with angle-adjustable air guide vanes 601;
  • the air inlet and outlet are respectively provided with a heat radiation inlet 13 and a heat radiation outlet 15 and are provided with joints.
  • the cooling air inlet is provided with a dust screen 2 and the cooling air inlet is provided with a dust screen 14.
  • the invention can be driven by the battery or solar battery power that comes with the car.
  • the present invention can also provide a positive and negative transfer switch on the control circuit, so that the present invention has a heating effect.

Abstract

The present invention relates to a semiconductor air conditioner for motor vehicle. The air conditioner has a shell having semiconductor refrigeration plates, a control circuit, a heat emission blower and a radiator made up with a base and alum radiator fins; and is characterized by forming a number of parallel grooves in the base, while the roots of the fins insert into the grooves as the width of which corresponds to the thickness of the fins. Then the roots of the fins are firmly connected with the base together. The air conditioner still have a `U' shape guide plate covering the radiator to form a heat emission passage between the guide plate and the alum radiator fins, while the heat emission blower is at one end of the heat emission passage. The air conditioner of the present invention has a high efficiency of refrigeration and can satisfy the demand of refrigeration.

Description

车用半导体空调器  Automotive semiconductor air conditioner
本发明所属技术领域 TECHNICAL FIELD
本发明涉及一种制冷装置， 尤其涉及一种车用半导体空调器。  The present invention relates to a refrigeration device, and in particular to a semiconductor air conditioner for a vehicle.
在本发明之前的现有技术 Prior art prior to the present invention
现有的汽车用空调器，是利用汽车的发动机驱动空调器压缩机工作而 实现制冷的。但若需在停车时使用空调器， 则不能关闭发动机。其缺点是 安全性较差， 且不环保。  The existing automotive air conditioner is cooled by using an automobile engine to drive the air conditioner compressor. However, if you need to use the air conditioner while parking, you cannot turn off the engine. The disadvantages are poor safety and environmental protection.
半导体制冷技术也可应用于车用空调器上。 其在半导体制冷芯片的 冷、 热面上分别设置散冷器、 散冷风扇和散热器、散热风扇。 半导体制冷 芯片制冷时， 需散热器和散热风扇将其制造的热量带走， 才能保证良好的 制冷效果。但现有的散热器， 其材料多为散热铝， 结构为由基座及散热铝 片一体挤压成型。 由于是采用挤压成型工艺， 散热铝片之间的向隔较宽， 在车用半导体空调器上难以达到良好的散热效果。因此， 现有的车用半导 体空调器受散热器的制约， 难以达到制冷要求。  Semiconductor refrigeration technology can also be applied to automotive air conditioners. A cooling device, a cooling fan, a radiator, and a cooling fan are respectively arranged on the cold and hot surfaces of the semiconductor cooling chip. When the semiconductor chip is cooled, the heat produced by the radiator and the cooling fan must be taken away to ensure a good cooling effect. However, the existing heat sinks are mostly made of heat-dissipating aluminum, and the structure is formed by integrally extruding the base and the heat-dissipating aluminum sheet. Since the extrusion molding process is used, the space between the heat-dissipating aluminum sheets is wide, and it is difficult to achieve a good heat dissipation effect on a semiconductor air conditioner for a vehicle. Therefore, the existing automotive semiconductor air conditioner is restricted by the radiator, and it is difficult to meet the cooling requirements.
发明目的 Object of the invention
本发明的目的在于针对上述不足， 提供一种结构合理，制冷效果良好 的车用半导体空调器， 其可保证在停车状态下至少两小时， 仍能达到制冷 要求。  An object of the present invention is to provide a semiconductor air conditioner for a vehicle with a reasonable structure and a good cooling effect, which can guarantee the cooling requirements for at least two hours in a parking state.
本发明的技术方案 Technical solution of the present invention
为达到上述目的， 本发明的技术方案如下： 车用半导体空调器， 有一 壳体， 壳体内设置有半导体制冷片、控制电路、 由基座及散热铝片组成的 散热器、 散热风扇， 其特征是： 所述散热器的基座上设有若干相互平行的 槽， 厚度与槽宽相应的散热铝片的根部插入该槽内， 使散热铝片的根部与 基座紧密贴合在一起；且还包括一 U形导风板，该导风板倒扣在散热器上 使导风板与散热器之间、散热铝片之间的间隙形成散热通道， 散热风扇置 于散热通道一端。 In order to achieve the above object, the technical solution of the present invention is as follows: A semiconductor air conditioner for a vehicle has a housing, and a semiconductor cooling sheet, a control circuit, a radiator composed of a base and a heat-dissipating aluminum sheet, and a cooling fan are arranged in the casing. Is: the base of the radiator is provided with a plurality of mutually parallel A groove, the root of the heat-dissipating aluminum sheet having a thickness corresponding to the width of the groove is inserted into the groove, so that the root of the heat-dissipating aluminum sheet is closely attached to the base; and further includes a U-shaped air deflector, which is buckled on the The heat sink makes the gap between the air deflector and the heat sink, and the heat sink aluminum sheet form a heat dissipation channel, and the heat dissipation fan is placed at one end of the heat dissipation channel.
本发明采用新型结构的散热器， 其散热铝片又薄又高， 且之间的间隙 很小， 散热面积增大了 3倍， 并配合导风板形成散热通道， 使半导体制冷 芯片因制冷而产生的热量能及时地带走， 保证了散热器的温度控制在 40 °C以下，进而增加了制冷量。且本发明可利用汽车的蓄电池实现动力驱动。 附图说明  The invention adopts a novel structure of the heat sink. The heat sink aluminum sheet is thin and high, and the gap between them is small. The heat dissipation area is increased by three times. The heat dissipation channel is formed in cooperation with the air guide plate, so that the semiconductor cooling chip is cooled due to refrigeration. The heat generated can be taken away in time to ensure that the temperature of the radiator is controlled below 40 ° C, thereby increasing the cooling capacity. And the present invention can use a battery of a car to realize power driving. BRIEF DESCRIPTION OF THE DRAWINGS
图 1是本发明的的外观结构示意图；  FIG. 1 is a schematic diagram of an appearance structure of the present invention;
图 2是图 1的 A-A剖视图；  FIG. 2 is a sectional view taken along A-A in FIG. 1;
图 3是图 1的 B-B剖视图；  Fig. 3 is a sectional view taken along the line B-B of Fig. 1;
图 4是本发明所述散热器的结构示意图。  FIG. 4 is a schematic structural diagram of a heat sink according to the present invention.
现结合附图和实施例对本发明作进一步说明：  The present invention will be further described with reference to the drawings and embodiments:
实施例 Examples
如图 1至图 4所示， 本发明所述的车用半导体空调器， 有一壳体 10， 壳体 10内设置有半导体制冷片 8、控制电路、 由基座 702及散热铝片 701 组成的散热器 7、 散热风扇 16， 由基座及散冷铝片组成的散冷器 5、 另一 U形导风板 4、 散冷装置为一小型鼓风机 1 ; 散热器 7的基座 702上设有 若干相互平行的槽 703, 厚度与槽宽相应的散热铝片 701的根部插入该槽 内，使散热铝片的根部与基座紧密贴合在一起；且还包括一 U形导风板 9， 该导风板 9.倒扣在散热器 7上使导风板与散热器之间、散热铝片之间的间 隙形成散热通道 79， 散热风扇 16置于散热通道一端。 另一 ϋ形导风板 9 倒扣在散冷器 5上使导风板与散冷器之间、散冷铝片之间的间隙形成散冷 通道 59， 小型鼓风机 1置于散冷通道一端。 As shown in FIG. 1 to FIG. 4, the semiconductor air conditioner for a vehicle according to the present invention has a housing 10. The housing 10 is provided with a semiconductor cooling sheet 8, a control circuit, a base 702 and a heat-dissipating aluminum sheet 701. Radiator 7, Radiating fan 16, Radiator 5 consisting of a base and a cold aluminum sheet, another U-shaped wind deflector 4, The cooling device is a small blower 1; The base 702 of the radiator 7 is provided There are several parallel grooves 703, and the roots of the heat-dissipating aluminum sheet 701 corresponding to the thickness and the width of the grooves are inserted into the grooves, so that the roots of the heat-dissipating aluminum sheet and the base are closely attached together; and a U-shaped wind deflector 9 is also included. The air deflector 9. The buckle is buckled on the radiator 7 so that the space between the air deflector and the radiator and between the aluminum fins The gap forms a heat dissipation channel 79, and the heat dissipation fan 16 is placed at one end of the heat dissipation channel. Another ϋ-shaped air deflector 9 is buckled on the radiator 5 so that the gap between the air deflector and the radiator, and between the cold aluminum sheets forms a cold channel 59. The small blower 1 is placed at one end of the cold channel .
壳体 10内还固定有中隔板 11 ,半导体制冷片 8安装在其上的通孔中， 并使壳体内腔分隔成对应的冷风室和热风室，冷风室下部设有排水管接头 12, 冷风室对应于散冷通道的进、 出风处分别开有散冷进风口 3、 散冷出 风口 6， 散冷出风口 6设有角度可调的导风叶 601 ; 热风室对应于散热通 道的进、 出风处分别开有散热进风口 13、 散热出风口 15， 并设有接头。 散冷进风口设有隔尘网 2， 散热进风口设有隔尘网 14。  A middle partition plate 11 is also fixed in the casing 10, and a semiconductor cooling sheet 8 is installed in a through hole thereon, and the inner cavity of the casing is divided into corresponding cold air chambers and hot air chambers, and a drain pipe joint 12 is provided at the lower part of the cold air chambers. The cold air chambers correspond to the cold air inlets and outlets of the cold air channels, which are respectively provided with the cold air inlets 3 and the cold air outlets 6, and the cold air outlets 6 are provided with angle-adjustable air guide vanes 601; The air inlet and outlet are respectively provided with a heat radiation inlet 13 and a heat radiation outlet 15 and are provided with joints. The cooling air inlet is provided with a dust screen 2 and the cooling air inlet is provided with a dust screen 14.
本发明可使用汽车自带的蓄电池或太阳能电池电力作动力来驱动。此 夕卜， 本发明还可在控制电路上设置正负极转换开关， 使本发明具有制暖的 效果。  The invention can be driven by the battery or solar battery power that comes with the car. In addition, the present invention can also provide a positive and negative transfer switch on the control circuit, so that the present invention has a heating effect.

Claims

权 利 要 求 Rights request
1、 车用半导体空调器， 有一壳体， 壳体内设置有半导体制冷片、 控 制电路、 由基座及散热铝片组成的散热器、 散热风扇， 其特征是： 所述散 热器的基座上设有若干相互平行的槽，厚度与槽宽相应的散热铝片的根部 插入该槽内，使散热铝片的根部与基座紧密贴合在一起；且还包括一 U形 导风板， 该导风板倒扣在散热器上使导风板与散热器之间、散热铝片之间 的间隙形成散热通道， 散热风扇置于散热通道一端。  1. A semiconductor air conditioner for a vehicle has a casing, which is provided with a semiconductor cooling sheet, a control circuit, a radiator composed of a base and a heat-dissipating aluminum sheet, and a cooling fan, and is characterized in that: A plurality of parallel grooves are provided, and the root of the heat-dissipating aluminum sheet having a thickness corresponding to the slot width is inserted into the groove, so that the root of the heat-dissipating aluminum sheet and the base are closely attached together; and further comprising a U-shaped air deflector, the The air deflector is buckled on the radiator, so that the gap between the air deflector and the radiator and the heat sinking aluminum sheet forms a heat dissipation channel, and the heat dissipation fan is placed at one end of the heat dissipation channel.
2、 根据权利要求 1所述的车用半导体空调器， 其特征是： 壳体内还 设置有由基座及散冷铝片组成的散冷器、另一 U形导风板及风冷装置，另 一 U形导风板倒扣在散冷器上使导风板与散冷器之间、散冷铝片之间的间 隙形成散冷通道， 风冷装置置于散冷通道一端。  2. The semiconductor air conditioner for a vehicle according to claim 1, further comprising: a heat dissipator composed of a base and a cold dissipative aluminum sheet, another U-shaped air deflector and an air cooling device, Another U-shaped air deflector is buckled on the radiator, so that the gap between the air deflector and the radiator, and between the cold aluminum sheets forms a cold channel, and the air cooling device is placed at one end of the cold channel.
3、 根据权利要求 2所述的车用半导体空调器， 其特征是： 所迷风冷 装置为小型鼓风机。  3. The semiconductor air conditioner for a vehicle according to claim 2, wherein the fan-cooled device is a small blower.
4、 根据权利要求 1或 2或 3所述的车用半导体空调器， 其特征是： 壳体内还固定有中隔板， 半导体制冷片安装在其上的通孔中， 并使壳体内 腔分隔成对应的冷风室和热风室， 冷风室对应于散冷通道的进、 出风处分 别开有散冷进风口、 散冷出风口， 热风室对应于散热通道的进、 出风处分 别开有散热进风口、 散热出风口。  4. The semiconductor air conditioner for a vehicle according to claim 1 or 2 or 3, characterized in that: a middle partition plate is also fixed in the casing, and a semiconductor cooling sheet is installed in a through hole thereon, and the inner cavity of the casing is separated. Corresponding cold air room and hot air room, the cold air room corresponds to the cooling air inlet and outlet of the cold air inlet, and the cold air outlet, respectively, and the hot air room corresponds to the cooling channel inlet and outlet, respectively. Cooling air inlet and cooling air outlet.
5、 根据权利要求 4所述的车用半导体空调器， 其特征是： 所述散冷 出风口设有角度可调的导风叶。  5. The semiconductor air conditioner for a vehicle according to claim 4, characterized in that: the diffuse cold air outlet is provided with an air guide blade with adjustable angle.
6、 根据权利要求 4所述的车用半导体空调器， 其特征是： 所述所述 冷风室下部设有排水管接头。 6. The semiconductor air conditioner for a vehicle according to claim 4, wherein a drain pipe joint is provided at a lower portion of the cold air chamber.
7、 根据权利要求 4所述的车用半导体空调器， 其特征是： 所述热风 室的散热进风口、 散热出风口上分别设有接头。 7. The semiconductor air conditioner for a vehicle according to claim 4, characterized in that: the heat radiation inlet and the heat radiation outlet of the hot air chamber are respectively provided with joints.
8、 根据权利要求 1所述的车用半导体空调器， 其特征是： 所述进风 口设有隔尘网。  8. The semiconductor air conditioner for a vehicle according to claim 1, characterized in that: the air inlet is provided with a dust screen.
9、 根据权利要求 1所述的车用半导体空调器， 其特征是： 所述控制 电路上设有正负极转换开关。  9. The semiconductor air conditioner for a vehicle according to claim 1, wherein the control circuit is provided with a positive and negative transfer switch.
PCT/CN2003/000653 2003-05-22 2003-08-11 Semiconductor air conditioner for motor vehicle WO2004103745A1 (en)

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CN03226364.3 2003-05-22
CNU032263643U CN2732524Y (en) 2003-05-22 2003-05-22 Semiconductor air cooling conditioner for automobile

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CN102147166A (en) * 2010-02-10 2011-08-10 郑云兵 Semiconductor refrigerator
CN104180458A (en) * 2014-09-09 2014-12-03 上海理工大学 Auxiliary dual-temperature air conditioner matched with skylight of car
CN104589955A (en) * 2014-12-15 2015-05-06 重庆铭武机电有限公司 Double-refrigerating-sheet car air-conditioning system

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