CN220710260U - Wafer cleaning device, wafer cleaning brush cleaning device and semiconductor process equipment - Google Patents

Abstract

The utility model provides a wafer cleaning device, a wafer cleaning brush cleaning device and semiconductor process equipment. The wafer cleaning device comprises a cleaning brush, a mechanical arm and a cleaning pipeline, wherein the cleaning pipeline is arranged in the mechanical arm, the cleaning brush is arranged on a bottom plate of the mechanical arm, a liquid outlet structure communicated with the cleaning pipeline is arranged on the bottom plate, and the liquid outlet structure is uniformly distributed on the bottom plate, so that the cleaning liquid provided by the cleaning pipeline flows to the surface of the cleaning brush to form a buffer water film. The utility model is beneficial to improving the cleaning effect on the surface of the wafer and improving the cleaning capability on particles in the cleaning brush.

Description

Wafer cleaning device, wafer cleaning brush cleaning device and semiconductor process equipment

Technical Field

The present utility model relates to the field of semiconductor technologies, and in particular, to a wafer cleaning device, a wafer cleaning brush cleaning device, and a semiconductor processing apparatus.

Background

In the field of semiconductor manufacturing, wet etching and washing machine cleaning is an important ring, and the aim of removing pollutants on the surface of a wafer is achieved by combining ultrapure water and a brush.

In order to prevent the brush from directly contacting the wafer, a common brush cleaning method is to use a nozzle outside the brush to provide ultrapure water for wetting so as to ensure that a buffer fluid water film is formed between the brush and the wafer. As shown in fig. 1, when the brush 10 cleans the wafer 20, the moving arm 30 moves the brush 10 to the upper surface of the wafer 20, and the external nozzle 40 sprays ultrapure water onto the surface of the wafer 20 to remove particles from the surface of the wafer 20 in cooperation with the brush 10. However, the thickness of the water film formed by the ultra-pure water provided by the external nozzle 40 is strongly related to the flow rate of water and the rotation speed of the wafer 20, so that the brush 10 cannot be ensured to contact the water film, and the effect of brushing the water film is achieved; and the external nozzle 40 may spray pure water directly onto the brush 10 during the cleaning of the wafer 20, causing splash back.

As shown in fig. 2, when the brush 10 is self-cleaning, the moving arm 30 moves the brush 10 into the cleaning chamber 50, and sprays cleaning liquid through the external connection pipe 60 to wash the surface of the brush 10. However, the external pipeline 60 only washes the outer wall of the brush 10 at the periphery, and cannot ensure the removal of particles in the brush 10, so that cross contamination is caused to the wafer.

Accordingly, there is a need for a new type of wafer cleaning apparatus, wafer brush cleaning apparatus, and semiconductor processing equipment that solve the above-mentioned problems of the prior art.

Disclosure of Invention

The utility model aims to provide a wafer cleaning device, a wafer cleaning brush cleaning device and semiconductor process equipment, so as to improve the cleaning effect on the surface of a wafer and the cleaning capability on particles in the cleaning brush.

In order to achieve the above object, the wafer cleaning device of the present utility model includes a cleaning brush, a mechanical arm, and a cleaning pipeline, wherein the cleaning pipeline is disposed in the mechanical arm, the cleaning brush is disposed on a bottom plate of the mechanical arm, the bottom plate is provided with a liquid outlet structure communicated with the cleaning pipeline, and the liquid outlet structure is uniformly distributed on the bottom plate, so that the cleaning liquid provided by the cleaning pipeline flows to the surface of the cleaning brush to form a buffer water film.

The wafer cleaning device has the beneficial effects that: the cleaning pipeline capable of supplying the cleaning liquid is additionally arranged in the mechanical arm of the movable cleaning brush, and the liquid outlet structure is arranged on the bottom plate of the cleaning brush, so that the cleaning liquid flowing out of the liquid outlet structure can flow from the root of the cleaning brush to the surface of the cleaning brush to form a buffer water film, thereby being beneficial to improving the cleaning effect on the surface of a wafer, and the cleaning liquid can take away dirt and particles in the cleaning brush from top to bottom, thereby being beneficial to improving the cleaning capability of the particles in the cleaning brush; meanwhile, compared with the prior art that the cleaning liquid can only rinse the outer wall of the cleaning brush at the periphery, the cleaning liquid flowing out of the liquid outlet structure is uniformly distributed on the bottom plate, so that the cleaning brush arranged in each area on the bottom plate can be comprehensively rinsed by the cleaning liquid flowing out of the liquid outlet structure, the cleaning capability of particles in the cleaning brush is improved, and the cleaning liquid is split by the liquid outlet structure, so that the flow of the cleaning liquid is stable and uniformly distributed on the surfaces of all the cleaning brushes, and a buffer water film is formed, so that the cleaning effect and the cleaning efficiency of the cleaning brush on the surfaces of wafers are improved.

Preferably, the wafer cleaning device further comprises an ultrasonic generator and a controller, wherein the ultrasonic generator is fixedly arranged with the cleaning brush, the controller is electrically connected with the ultrasonic generator, and the controller is used for controlling the ultrasonic generator to be opened when the cleaning brush is self-cleaned. The beneficial effects are that: the self-cleaning capability of the cleaning brush is enhanced, so that pollutants in the cleaning brush are easier to fall off.

Preferably, the power of the ultrasonic generator is not more than 100W. The beneficial effects are that: avoiding the cleaning brush from shaking to influence other parts.

Preferably, the wafer cleaning apparatus further includes a rotating member connected to the cleaning brush to rotate the cleaning brush. The beneficial effects are that: is beneficial to improving the cleaning effect on the surface of the wafer and improving the cleaning capability on particles in the cleaning brush.

Preferably, a buffer cavity is further arranged in the mechanical arm, and the buffer cavity is communicated with the cleaning pipeline and the liquid outlet structure. The beneficial effects are that: the cleaning liquid in the cleaning pipeline is prevented from directly flowing out of the liquid outlet structure, and the cleaning liquid flows out of the liquid outlet structure after being buffered by the buffer cavity, so that the flow of the cleaning liquid flowing out is stable and uniformly distributed on the surface of the cleaning brush, and the cleaning liquid is more favorable for forming a buffer water film for the cleaning brush, thereby improving the cleaning capacity of particles in the cleaning brush and the cleaning effect on the surface of a wafer.

Preferably, the cleaning brush comprises a plurality of brush pieces, and when the bottom plate is horizontally placed, the distance between the projection of the brush pieces on the bottom surface of the bottom plate and the projection of the liquid outlet structure on the bottom surface of the bottom plate is greater than or equal to 0. The beneficial effects are that: the distance between the projection of the brush piece on the bottom surface of the bottom plate and the projection of the liquid outlet structure on the bottom surface of the bottom plate is equal to 0, namely the liquid outlet structure is connected with the outer wall of the brush piece, so that the cleaning liquid flowing out of the liquid outlet structure can directly flow along the surface of the brush piece to form a water film; the distance between the projection of the brush piece on the bottom surface of the bottom plate and the projection of the liquid outlet structure on the bottom surface of the bottom plate is larger than 0, namely the liquid outlet structure is not connected with the outer wall of the brush piece and is arranged at intervals, cleaning liquid flowing out of the liquid outlet structure flows along the bottom of the bottom plate and then flows to the surface of the brush piece, namely the cleaning liquid is buffered and then flows to the surface of the brush piece, so that a buffer water film is formed for the brush piece more conveniently.

Preferably, the brush member includes N brush rings sequentially sleeved from the center of the base plate from inside to outside, N is a positive integer greater than or equal to 1, and the brush rings include annular brush portions or sub-brush portions having a number of at least 2. The beneficial effects are that: is beneficial to improving the cleaning effect on the surface of the wafer.

Preferably, the periphery of each sub-brush part is surrounded with a plurality of liquid outlet structures, when the bottom plate is horizontally placed, the projection of each sub-brush part on the bottom surface of the bottom plate and the projection of a plurality of liquid outlet structures on the periphery of the sub-brush part on the bottom surface of the bottom plate form a projection unit, and a plurality of projection units are arranged at intervals and along the circumferential direction. The beneficial effects are that: the flow rate of the cleaning liquid flowing out can be stable and uniformly distributed on the surface of the brush piece, a buffer water film is formed for the brush piece, dirt and particles on the surface of the brush piece can be taken away from top to bottom, and therefore the cleaning capability of particles in the brush piece and the cleaning effect of the surface of a wafer are improved.

Preferably, when the bottom plate is horizontally placed, the projection of the sub-brush part on the bottom surface of the bottom plate and the projection of the liquid outlet structure on the bottom surface of the bottom plate are alternately arranged and circumferentially arranged. The beneficial effects are that: the flow rate of the cleaning liquid flowing out can be stable and uniformly distributed on the surface of the brush piece, a buffer water film is formed for the brush piece, dirt and particles on the surface of the brush piece can be taken away from top to bottom, and therefore the cleaning capability of particles in the brush piece and the cleaning effect of the surface of a wafer are improved.

Preferably, the cleaning brush further comprises a fixing piece, the plurality of brush pieces are uniformly distributed on the fixing piece, the fixing piece is arranged at the top of the bottom plate, the bottom plate is further provided with a penetrating part for the brush pieces to penetrate through, and the distance between the penetrating part and the liquid outlet structure is larger than 0. The beneficial effects are that: the liquid outlet structure is not connected with the outer wall of the hairbrush piece and is arranged at intervals, namely the bottom plate is of a hollowed-out structure, so that the fixing piece is stably arranged at the top of the bottom plate; and the cleaning liquid flowing out of the liquid outlet structure flows along the bottom of the bottom plate and then flows to the surface of the brush piece, namely, the cleaning liquid is buffered and then flows to the surface of the brush piece, so that a buffer water film is formed for the cleaning brush.

Preferably, the plurality of brush pieces are uniformly distributed at the bottom of the bottom plate, and the distance between the fixed part of the brush piece at the bottom surface of the bottom plate and the liquid outlet structure is greater than or equal to 0. The beneficial effects are that: the liquid outlet structure is connected with the outer wall of the brush piece, so that cleaning liquid flowing out of the liquid outlet structure can directly flow along the surface of the brush piece to form a water film, and a fixing piece for fixing the brush piece is not needed, the overall weight of the cleaning brush is reduced, and the mechanical arm is convenient to convey the cleaning brush.

Preferably, the projection of the brush piece on the bottom surface of the bottom plate and the projection of the liquid outlet structure on the bottom surface of the bottom plate are at least one of a cross structure, an annular structure, a circular structure, a frame structure, a fan-shaped structure, an arch structure and a triangle structure. The beneficial effects are that: can set according to actual need, the commonality is strong, satisfies multiple user demand.

The wafer cleaning brush cleaning device comprises the wafer cleaning device and a self-cleaning cavity, wherein the cleaning brush is arranged in the self-cleaning cavity to perform self-cleaning.

The wafer cleaning brush cleaning device has the beneficial effects that: the cleaning brush can be self-cleaned by only arranging the cleaning pipeline in the mechanical arm without externally connecting a flushing pipeline, so that the cleaning brush is simple and convenient, and the cost investment is reduced; the cleaning liquid flowing out of the liquid outlet structure can flow from the root of the cleaning brush to the surface of the cleaning brush, so that dirt and particles accumulated in the cleaning brush can be taken away from top to bottom, and the cleaning capability of the particles in the cleaning brush can be improved; compared with the prior art that the cleaning liquid can only wash the outer wall of the cleaning brush at the periphery, the liquid outlet structure is uniformly distributed on the bottom plate, so that the cleaning liquid flowing out of the liquid outlet structure can comprehensively wash the cleaning brush arranged in each area on the bottom plate, the cleaning capability of particles in the cleaning brush is improved, and cross contamination to wafers is avoided.

The semiconductor process equipment comprises the wafer cleaning device and a wafer cleaning cavity, wherein the cleaning brush is arranged in the wafer cleaning cavity to clean the wafer.

The semiconductor process equipment has the beneficial effects that: the wafer can be cleaned by the cleaning brush only by the cleaning pipeline arranged in the mechanical arm without externally connecting an external nozzle, so that the cleaning brush is simple and convenient, and the cost investment is reduced; and the cleaning liquid flowing out of the liquid outlet structure can be used for distributing the cleaning liquid, so that the flow of the cleaning liquid is stable and uniformly distributed on the surfaces of all cleaning brushes, and a buffer water film is formed, thereby improving the cleaning effect and the cleaning efficiency on the surfaces of the wafers, and effectively avoiding back splash in the wafer cleaning process.

Drawings

FIG. 1 is a schematic diagram of a prior art brush cleaning wafer;

FIG. 2 is a schematic view of a prior art brush self-cleaning;

FIG. 3 is a schematic cross-sectional view of a wafer cleaning apparatus according to an embodiment of the present utility model;

FIG. 4 is an enlarged schematic view of a portion of the A structure of the wafer cleaning apparatus shown in FIG. 3;

FIG. 5 is a schematic view of a first base plate of the wafer cleaning apparatus shown in FIG. 3;

FIG. 6 is a schematic view of a second type of bottom plate of the wafer cleaning apparatus shown in FIG. 3;

FIG. 7 is a schematic view of a third type of bottom plate of the wafer cleaning apparatus shown in FIG. 3;

FIG. 8 is a schematic view of a fourth bottom plate of the wafer cleaning apparatus shown in FIG. 3;

FIG. 9 is a schematic view of a wafer brush cleaning apparatus in accordance with an embodiment of the present utility model;

fig. 10 is a schematic view of a semiconductor processing apparatus in an embodiment of the utility model.

Wherein, the reference numerals in fig. 1 to 10 are respectively:

10. a brush; 20. a wafer; 40. an external nozzle; 50. a cavity; 60. an external pipeline;

100. a wafer cleaning device; 110. a cleaning brush; 111. a brush member; 112. a fixing member; 120. a mechanical arm; 121. a bottom plate; 122. a penetration portion; 123. a fixing part; 130. cleaning a pipeline; 140. a liquid outlet structure; 150. an ultrasonic generator; 160. a cache cavity; 200. cleaning the cavity; 300. and (3) a wafer.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.

In order to overcome the problems in the prior art, the embodiment of the utility model provides a wafer cleaning device, a wafer cleaning brush cleaning device and semiconductor process equipment, so as to improve the cleaning effect on the surface of a wafer and the cleaning capability on particles in the cleaning brush.

FIG. 3 is a schematic cross-sectional view of a wafer cleaning apparatus according to an embodiment of the present utility model; fig. 4 is an enlarged view of a portion of the a structure of the wafer cleaning apparatus shown in fig. 3.

In some embodiments, referring to fig. 3 and 4, the wafer cleaning apparatus 100 includes a cleaning brush 110, a mechanical arm 120, and a cleaning pipeline 130, the cleaning pipeline 130 is disposed in the mechanical arm 120, the cleaning brush 110 is disposed on a bottom plate 121 of the mechanical arm 120, the bottom plate 121 is provided with a liquid outlet structure 140 that is communicated with the cleaning pipeline 130, and the liquid outlet structure 140 is uniformly distributed on the bottom plate 121, so that the cleaning liquid provided by the cleaning pipeline 130 flows to the surface of the cleaning brush 110 to form a buffer water film.

The cleaning pipeline 130 capable of supplying the cleaning liquid is additionally arranged in the mechanical arm 120 of the movable cleaning brush 110, and the liquid outlet structure 140 is arranged on the bottom plate 121 of the cleaning brush 110, so that the cleaning liquid flowing out of the liquid outlet structure 140 can flow from the root of the cleaning brush 110 to the surface of the cleaning brush 110 to form a buffer water film, thereby being beneficial to improving the cleaning effect on the surface of a wafer, and the cleaning liquid can take away dirt and particles in the cleaning brush 110 from top to bottom, thereby being beneficial to improving the cleaning capability on the particles in the cleaning brush 110; meanwhile, compared with the prior art that the cleaning liquid can only wash the outer wall of the cleaning brush at the periphery, the cleaning liquid flowing out of the liquid outlet structure 140 is uniformly distributed on the bottom plate 121, so that the cleaning brush 110 arranged in each area on the bottom plate 121 can be comprehensively washed by the cleaning liquid flowing out of the liquid outlet structure 140, the cleaning capability of particles in the cleaning brush 110 is improved, and the cleaning liquid is distributed by the liquid outlet structure 140, so that the flow of the cleaning liquid is stable and uniformly distributed on the surfaces of all the cleaning brushes 110, a buffer water film is formed, and the cleaning effect and the cleaning efficiency of the cleaning brush 110 on the surfaces of wafers are improved.

In some embodiments, the cleaning fluid provided by the cleaning line 130 is Ultra Pure Water (UPW). The UPW flowing out of the liquid outlet structure 140 washes the brush from inside to outside, which improves the cleaning ability of the surface particles of the brush member in the brush, and can form a buffer water film on the surface of all brush members, thereby enhancing the cleaning ability of the wafer.

In some embodiments, referring to fig. 3 and 4, the wafer cleaning apparatus 100 further includes an ultrasonic generator 150 and a controller (not shown in the drawings), the ultrasonic generator 150 is fixedly disposed with the cleaning brush 110, the controller (not shown in the drawings) is electrically connected with the ultrasonic generator 150, and the controller (not shown in the drawings) is used for controlling the ultrasonic generator 150 to be opened when the cleaning brush 110 is self-cleaned, so as to enhance the self-cleaning capability of the cleaning brush, and make the pollutants in the cleaning brush more easily fall off.

Specifically, the controller is also connected with the mechanical arm electrically, and after the controller controls the mechanical arm to move the cleaning brush to the self-cleaning cavity, the controller controls the ultrasonic generator to be opened so as to enhance the self-cleaning capability of the cleaning brush.

In some embodiments, the power of the sonotrode is no greater than 100W. Avoiding the cleaning brush from shaking to influence other parts.

In some embodiments, the wafer cleaning apparatus further comprises a rotating member coupled to the cleaning brush to rotate the cleaning brush. Is beneficial to improving the cleaning effect on the surface of the wafer and improving the cleaning capability on particles in the cleaning brush.

In some embodiments, referring to fig. 3, a buffer cavity 160 is further disposed in the mechanical arm 120, and the buffer cavity 160 communicates the cleaning pipeline 130 and the liquid outlet structure 140. The cleaning solution in the cleaning pipeline 130 is prevented from directly flowing out of the liquid outlet structure 140, and flows out of the liquid outlet structure 140 after being buffered by the buffer cavity 160, so that the flow rate of the cleaning solution flowing out is stable and uniformly distributed on the surface of the cleaning brush 110, and the cleaning solution is more favorable for forming a buffer water film for the cleaning brush 110, thereby improving the cleaning capability of particles in the cleaning brush 110 and the cleaning effect on the surface of a wafer.

FIG. 5 is a schematic view of a first base plate of the wafer cleaning apparatus shown in FIG. 3; FIG. 6 is a schematic view of a second type of bottom plate of the wafer cleaning apparatus shown in FIG. 3; FIG. 7 is a schematic view of a third type of bottom plate of the wafer cleaning apparatus shown in FIG. 3; fig. 8 is a schematic structural view of a fourth bottom plate in the wafer cleaning apparatus shown in fig. 3.

In some embodiments, referring to fig. 3 to 8, the cleaning brush 110 includes a plurality of brush members 111, and when the bottom plate 121 is horizontally disposed, a distance between a projection of the brush members 111 on the bottom surface of the bottom plate 121 and a projection of the liquid outlet structure 140 on the bottom surface of the bottom plate 121 is greater than or equal to 0. The distance between the projection of the brush member 111 on the bottom surface of the bottom plate 121 and the projection of the liquid outlet structure 140 on the bottom surface of the bottom plate 121 is equal to 0, that is, the liquid outlet structure 140 is connected with the outer wall of the brush member 111, so that the cleaning liquid flowing out from the liquid outlet structure 140 can directly flow along the surface of the brush member 111 to form a water film; the distance between the projection of the brush 111 on the bottom surface of the bottom plate 121 and the projection of the liquid outlet structure 140 on the bottom surface of the bottom plate 121 is greater than 0, that is, the liquid outlet structure 140 is not connected with the outer wall of the brush 111, and is set at intervals, the cleaning liquid flowing out of the liquid outlet structure 140 flows along the bottom of the bottom plate 121 and then flows to the surface of the brush 111, that is, the cleaning liquid can be buffered and then flows to the surface of the brush 111, which is more favorable for forming a buffer water film for the brush 111.

In some embodiments, the brush member 111 is formed of several bundles of bristles.

In some embodiments, the brush member 111 is made of a sponge-like hydrophilic material. Specifically, the spongy hydrophilic material is polyvinyl alcohol (PVA).

In some embodiments, referring to fig. 3 and 4, the cleaning brush 110 further includes a fixing member 112, the plurality of brush members 111 are uniformly distributed on the fixing member 112, and the fixing member 112 is disposed on the top of the bottom plate 121, that is, the fixing member 112 is disposed in the buffer cavity 160. Referring to fig. 3 to 7, the bottom plate 121 is further provided with a penetration 122 through which the brush member 111 passes, and a distance between the penetration 122 and the liquid outlet structure 140 is greater than 0. Namely, the liquid outlet structure 140 is not connected to the outer wall of the brush member 111, and is disposed at intervals, namely, the bottom plate 121 is in a hollow structure, which is beneficial for the cleaning brush 110 to be stably disposed at the top of the bottom plate 121; and the cleaning solution flowing out of the liquid outlet structure 140 flows along the bottom of the bottom plate 121 and then flows to the surface of the brush member 111, i.e. the cleaning solution is buffered and then flows to the surface of the brush member 111, which is more favorable for forming a buffer water film for the brush member 111.

In some embodiments, referring to fig. 3 and 4, the ultrasonic generator 150 is fixedly disposed on the fixing member 112, that is, the ultrasonic generator 150 may be located in the buffer cavity 160 or located outside the buffer cavity 160. The fixing member 112 is movably disposed or fixedly disposed with the bottom plate 121.

In some embodiments, the rotating member is fixedly disposed on the fixing member, so as to drive the fixing member to rotate and drive the brush member to rotate.

In some embodiments, referring to fig. 8, the plurality of brush pieces 111 are uniformly distributed at the bottom of the bottom plate 121, and a distance between the fixing portion 123 of the bottom surface of the bottom plate 121 and the liquid outlet structure 140 of the brush pieces 111 is greater than or equal to 0. That is, the liquid outlet structure 140 is connected to the outer wall of the brush member 111, so that the cleaning liquid flowing out from the liquid outlet structure 140 can directly flow along the surface of the brush member 111 to form a water film, and no additional fixing member for fixing the brush member 111 is required, thereby reducing the overall weight of the cleaning brush 110 and facilitating the transportation of the cleaning brush 110 by the mechanical arm.

In some embodiments, the fixing portion 123 is an area of the bottom surface of the bottom plate 121 for fixing the brush member 111, and the brush member 111 is fixedly disposed on the fixing portion 123 by a welding method, an adhesive method, a clamping method, or the like.

In some embodiments, when the plurality of brush pieces 111 are uniformly distributed at the bottom of the bottom plate 121, the ultrasonic generator 150 is fixedly disposed at the top of the bottom plate 121.

In some embodiments, the bottom plate includes an outer ring fixing portion and a rotating portion surrounded by the outer ring fixing portion, and the rotating portion is rotatably connected with the outer ring fixing portion. The plurality of brush pieces 111 are uniformly distributed at the bottom of the bottom plate 121, that is, when the brush pieces 111 are located at the rotating portion at the fixing portion 123 of the bottom surface of the bottom plate 121, the rotating piece is fixedly disposed at the rotating portion, and the rotating piece drives the rotating portion to rotate so as to drive the brush pieces 111 to rotate. The liquid outlet structures 140 are all disposed on the rotating portion.

In some embodiments, the projection of the brush piece on the bottom surface of the bottom plate and the projection of the liquid outlet structure on the bottom surface of the bottom plate are at least one of a cross structure, an annular structure, a circular structure, a frame structure, a fan-shaped structure, an arch structure and a triangle structure, and can be set according to actual needs, so that the brush piece is high in universality and meets various use requirements.

In some embodiments, the liquid outlet structure is a structure penetrating through the bottom plate, and may be a penetrating hole, a penetrating ring, a penetrating groove, or the like.

In some embodiments, the liquid outlet structure is a micron-sized through structure.

In some embodiments, the brush member includes N brush rings sequentially sleeved from the center of the base plate from inside to outside, N is a positive integer greater than or equal to 1, and the brush rings include annular brush portions or sub-brush portions having a number of at least 2. Is beneficial to improving the cleaning effect on the surface of the wafer.

In some embodiments, the sub-brush part is at least one of a cross-shaped structure, a circular structure, a frame-shaped structure, a fan-shaped structure, an arch-shaped structure, and a triangle-shaped structure.

In some embodiments, the brush member 111 includes N brush rings sequentially sleeved from the center of the base plate from the inside to the outside, and the brush rings include at least 2 sub brush parts. When the bottom plate 121 is horizontally disposed, the projection of the sub-brush portion on the bottom surface of the bottom plate 121 and the projection of the liquid outlet structure 140 on the bottom surface of the bottom plate 121 are spaced apart and circumferentially disposed. Specifically, referring to fig. 5, the projection of the sub-brush portion on the bottom surface of the bottom plate 121 is in a cross-shaped structure, that is, the penetrating portion 122 is in a cross-shaped structure, the liquid outlet structure 140 is in a circular structure, and the penetrating portion 122 and the liquid outlet structure 140 are alternately arranged along the circumferential direction. The flow rate of the cleaning liquid flowing out can be stable and uniformly distributed on the surface of the brush piece 111, so that a buffer water film is formed for the brush piece 111, dirt and particles on the surface of the brush piece 111 can be taken away from top to bottom, and the cleaning capability of particles in the brush piece 111 and the cleaning effect of the surface of a wafer are improved.

In some embodiments, the brush member 111 includes N brush rings sequentially sleeved from the center of the base plate 121 from the inside to the outside, and the brush rings include at least 2 sub brush parts. The periphery of each sub-brush part is surrounded by a plurality of liquid outlet structures 140, when the bottom plate 121 is horizontally placed, the projection of each sub-brush part on the bottom surface of the bottom plate 121 and the projection of a plurality of liquid outlet structures 140 on the periphery of each sub-brush part on the bottom surface of the bottom plate 121 form a projection unit, and a plurality of projection units are arranged at intervals and along the circumferential direction. Specifically, referring to fig. 6, the projection of the sub-brush portion on the bottom surface of the bottom plate 121 is in a cross structure, that is, the penetrating portion 122 is in a cross structure, the liquid outlet structure 140 is in a circular structure, a plurality of liquid outlet structures 140 are enclosed on the periphery of the penetrating portion 122, a plurality of liquid outlet structures 140 enclosed on the periphery of the penetrating portion 122 form a group of penetrating units, and a plurality of groups of penetrating units are arranged at intervals and along the circumferential direction. The flow rate of the cleaning liquid flowing out can be stable and uniformly distributed on the surface of the brush piece 111, so that a buffer water film is formed for the brush piece 111, dirt and particles on the surface of the brush piece 111 can be taken away from top to bottom, and the cleaning capability of particles in the brush piece 111 and the cleaning effect of the surface of a wafer are improved.

In some embodiments, referring to fig. 7, at least part of the brush member 111 on the bottom surface of the bottom plate 121 is in a frame structure, at least part of the brush member 111 on the bottom surface of the bottom plate 121 is in an arch structure, that is, at least part of the through portion 122 is in a frame structure, at least part of the through portion 122 is in a triangle structure, at least part of the liquid outlet structure 140 is in a frame structure, at least part of the liquid outlet structure 140 is in a triangle structure, and the through portion 122 and the liquid outlet structure 140 are spaced apart from each other.

In some embodiments, the brush member 111 includes N brush rings, which include an annular brush part, sequentially sleeved from the inside to the outside from the center of the bottom plate 121. The brush member 111 has an annular structure, referring to fig. 8, that is, the fixing portion 123 has an annular structure, the liquid outlet structure 140 has an arc structure, the liquid outlet structure 140 is connected to a side wall of the fixing portion 123, and the fixing portion 123 and the liquid outlet structure 140 are alternately arranged. Specifically, the brush member 111 is fixed to the fixing portion 123 having a ring-shaped structure, that is, a projection of the brush member 111 on the bottom surface of the bottom plate 121 has a ring-shaped structure.

FIG. 9 is a schematic view of a wafer brush cleaning apparatus in an embodiment of the utility model;

in some embodiments, referring to fig. 9 and 3, the wafer cleaning brush cleaning device includes a wafer cleaning device 100 and a self-cleaning cavity 200, the wafer cleaning device 100 includes a cleaning brush 110, a mechanical arm 120, and a cleaning pipeline 130, the cleaning pipeline 130 is disposed in the mechanical arm 120, the cleaning brush 110 is disposed on a bottom plate 121 of the mechanical arm 120, the bottom plate 121 is provided with a liquid outlet structure 140 that is communicated with the cleaning pipeline 130, and the liquid outlet structure 140 is uniformly distributed on the bottom plate 121, so that the cleaning liquid provided by the cleaning pipeline 130 flows to the surface of the cleaning brush 110 to form a buffer water film. The brush 110 is disposed in the self-cleaning chamber 200 to perform self-cleaning.

According to the wafer cleaning brush cleaning device, an external flushing pipeline is not required, and the cleaning brush can be automatically cleaned only by the cleaning pipeline arranged in the mechanical arm, so that the device is simple and convenient, and the cost input is reduced; the cleaning liquid flowing out of the liquid outlet structure can flow from the root of the cleaning brush to the surface of the cleaning brush, so that dirt and particles accumulated in the cleaning brush can be taken away from top to bottom, and the cleaning capability of the particles in the cleaning brush can be improved; compared with the prior art that the cleaning liquid can only wash the outer wall of the cleaning brush at the periphery, the liquid outlet structure is uniformly distributed on the bottom plate, so that the cleaning liquid flowing out of the liquid outlet structure can comprehensively wash the cleaning brush arranged in each area on the bottom plate, the cleaning capability of particles in the cleaning brush is improved, and cross contamination to wafers is avoided.

Fig. 10 is a schematic view of a semiconductor processing apparatus in an embodiment of the utility model.

In some embodiments, referring to fig. 10 and 3, the semiconductor processing apparatus includes a wafer cleaning device 100 and a wafer cleaning cavity (not shown in the drawings), the wafer cleaning device 100 includes a cleaning brush 110, a mechanical arm 120, and a cleaning pipeline 130, the cleaning pipeline 130 is disposed in the mechanical arm 120, the cleaning brush 110 is disposed on a bottom plate 121 of the mechanical arm 120, the bottom plate 121 is provided with a liquid outlet structure 140 that is communicated with the cleaning pipeline 130, and the liquid outlet structure 140 is uniformly distributed on the bottom plate 121, so that the cleaning liquid provided by the cleaning pipeline 130 flows to the surface of the cleaning brush 110 to form a buffer water film. The cleaning brush 110 is disposed in the wafer cleaning chamber (not shown) to clean the wafer 300.

According to the semiconductor process equipment, an external nozzle is not required to be additionally connected, and the wafer can be cleaned by the cleaning brush only by the cleaning pipeline arranged in the mechanical arm, so that the cleaning brush is simple and convenient, and the cost investment is reduced; and the cleaning liquid flowing out of the liquid outlet structure can be used for distributing the cleaning liquid, so that the flow of the cleaning liquid is stable and uniformly distributed on the surfaces of all cleaning brushes, and a buffer water film is formed, thereby improving the cleaning effect and the cleaning efficiency on the surfaces of the wafers, and effectively avoiding back splash in the wafer cleaning process.

While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (14)

1. The wafer cleaning device is characterized by comprising a cleaning brush, a mechanical arm and a cleaning pipeline, wherein the cleaning pipeline is arranged in the mechanical arm, the cleaning brush is arranged on a bottom plate of the mechanical arm, the bottom plate is provided with a liquid outlet structure communicated with the cleaning pipeline, and the liquid outlet structure is uniformly distributed on the bottom plate, so that the cleaning liquid provided by the cleaning pipeline flows to the surface of the cleaning brush to form a buffer water film.

2. The wafer cleaning apparatus of claim 1, further comprising an ultrasonic generator fixedly disposed with the cleaning brush and a controller electrically connected to the ultrasonic generator for controlling the ultrasonic generator to be turned on when the cleaning brush is self-cleaning.

3. The wafer cleaning apparatus of claim 2, wherein the power of the ultrasonic generator is no greater than 100W.

4. The wafer cleaning apparatus of claim 1, further comprising a rotating member coupled to the cleaning brush to rotate the cleaning brush.

5. The wafer cleaning device of claim 1, wherein a buffer cavity is further provided in the mechanical arm, and the buffer cavity is communicated with the cleaning pipeline and the liquid outlet structure.

6. The apparatus of any of claims 1-5, wherein the cleaning brush comprises a plurality of brush members, and a distance between a projection of the brush members on a bottom surface of the bottom plate and a projection of the liquid outlet structure on the bottom surface of the bottom plate is greater than or equal to 0 when the bottom plate is horizontally placed.

7. The wafer cleaning apparatus according to claim 6, wherein the brush member includes N brush rings sequentially sleeved from the center of the base plate from the inside to the outside, N being a positive integer greater than or equal to 1, the brush rings including annular brush portions or sub-brush portions having a number of at least 2.

8. The wafer cleaning device according to claim 7, wherein a plurality of liquid outlet structures are arranged around the periphery of each sub-brush portion, when the bottom plate is horizontally placed, projections of each sub-brush portion on the bottom surface of the bottom plate and projections of a plurality of liquid outlet structures around the periphery of each sub-brush portion on the bottom surface of the bottom plate form a projection unit, and the projection units are arranged at intervals and along the circumferential direction.

9. The wafer cleaning apparatus of claim 7, wherein when the base plate is placed horizontally, projections of the sub-brush portions on the bottom surface of the base plate are spaced apart from projections of the liquid outlet structure on the bottom surface of the base plate and are disposed circumferentially.

10. The wafer cleaning device of claim 6, wherein the cleaning brush further comprises a fixing member, the plurality of brush members are uniformly distributed on the fixing member, the fixing member is disposed on the top of the bottom plate, the bottom plate is further provided with a penetrating portion through which the brush members penetrate, and a distance between the penetrating portion and the liquid outlet structure is greater than 0.

11. The apparatus of claim 6, wherein the plurality of brush members are uniformly distributed at the bottom of the bottom plate, and a distance between a fixing portion of the brush member at the bottom surface of the bottom plate and the liquid outlet structure is greater than or equal to 0.

12. The wafer cleaning apparatus of claim 6, wherein the projection of the brush member onto the bottom surface of the bottom plate and the projection of the liquid outlet structure onto the bottom surface of the bottom plate are at least one of a cross-shaped structure, an annular structure, a circular structure, a frame-shaped structure, a fan-shaped structure, an arch-shaped structure, and a triangular structure.

13. A wafer cleaning brush cleaning apparatus, comprising:

the wafer cleaning apparatus of any one of claims 1-12;

the self-cleaning cavity body is provided with the cleaning brush which is arranged in the self-cleaning cavity body to perform self-cleaning.

14. A semiconductor processing apparatus, comprising:

the wafer cleaning apparatus of any one of claims 1-12;

the wafer cleaning cavity body is provided with the cleaning brush which is arranged in the wafer cleaning cavity body to clean the wafer.