CN220651982U - Silicon wafer transfer device and silicon wafer processing equipment - Google Patents

Abstract

The utility model belongs to the technical field of photovoltaics, and discloses a silicon wafer transfer device and silicon wafer processing equipment. The silicon wafer transfer device comprises a moving mechanism and a transfer mechanism, wherein the transfer mechanism comprises a connecting bracket, a supporting bracket and a sucker assembly, the connecting bracket is connected to the moving mechanism, the moving mechanism can drive the connecting bracket to reciprocate along a first direction, the supporting bracket is arranged on the connecting bracket, the supporting bracket is provided with at least one group of sucker assemblies, each sucker assembly comprises at least two suckers, each sucker of the sucker assemblies is used for independently adsorbing an equal-divided silicon wafer, or all the suckers of the sucker assemblies are used for commonly adsorbing the whole silicon wafer. The silicon wafer transfer device can be compatible with transfer of whole silicon wafers and aliquoting silicon wafers, has strong use flexibility, can avoid the condition that sucking discs which do not need to adsorb the silicon wafers still normally generate adsorption actions when transferring aliquoting silicon wafers, and saves resources.

Description

Silicon wafer transfer device and silicon wafer processing equipment

Technical Field

The utility model relates to the technical field of photovoltaics, in particular to a silicon wafer transfer device and silicon wafer processing equipment.

Background

Silicon wafers are one of the most basic materials in the manufacture of electronic components and are mainly applied to the fields of semiconductor manufacture, solar cell panel manufacture and the like. In the process of processing a silicon wafer, the silicon wafer needs to be transported, carried or rotated, and therefore a special transfer device is required. With the development of a new process heterojunction battery (HJT), dividing the silicon wafer gradually into process development, wherein dividing the silicon wafer equally refers to dividing the whole silicon wafer equally to obtain one of the silicon wafers, for example: in actual production, one transfer device is usually required for moving equal-divided silicon wafers, another transfer device is required for moving whole silicon wafers, and the existing transfer device can only move one silicon wafer.

Therefore, a silicon wafer transfer device and a silicon wafer processing apparatus are needed to solve the above problems.

Disclosure of Invention

The utility model aims to provide a silicon wafer transfer device and silicon wafer processing equipment, wherein the silicon wafer transfer device has good compatibility for whole silicon wafers and equally divided silicon wafers, and can improve the moving efficiency of the silicon wafers and further improve the production efficiency.

To achieve the purpose, the utility model adopts the following technical scheme:

a silicon wafer transfer apparatus, the silicon wafer transfer apparatus comprising:

a moving mechanism;

the transfer mechanism comprises a connecting bracket, a supporting bracket and a sucker assembly, wherein the connecting bracket is connected with the moving mechanism, the moving mechanism is used for driving the connecting bracket to move, the supporting bracket is arranged on the connecting bracket, the supporting bracket is provided with at least one group of sucker assemblies, each sucker assembly comprises at least two suckers, each sucker of the sucker assemblies is used for independently absorbing one equal-divided silicon wafer, or all suckers of the sucker assemblies are used for jointly absorbing the whole silicon wafer;

and the sum of the width dimension of all the suckers of the sucker assembly and the gap dimension between all two adjacent suckers is smaller than or equal to the side length of the whole silicon wafer.

As an optional technical scheme, the sucking disc subassembly is provided with three groups, and three groups sucking disc subassembly is along the interval setting of second direction, every sucking disc subassembly all includes along two of first direction interval setting sucking disc, every sucking disc is used for adsorbing a half silicon chip alone, wherein, the second direction with first direction is perpendicular.

As an optional technical scheme, the moving mechanism drives the connecting support to reciprocate along a first direction, the transfer mechanism further comprises a longitudinal adjusting structure, the longitudinal adjusting structure is connected between the connecting support and the supporting support, and the longitudinal adjusting structure is used for driving the supporting support to reciprocate along a third direction, wherein the third direction is perpendicular to the first direction and the second direction in pairs.

As an optional technical scheme, the sucking disc subassembly still includes the sucking disc support, the sucking disc support set up in the support frame, two the sucking disc set up respectively in the both ends of sucking disc support, just set up the fine setting structure on the sucking disc support, the fine setting structure is used for adjusting two distance between the sucking disc.

As an optional technical scheme, fine setting structure includes slide rail, slider and driving piece, the slide rail fixed set up in the sucking disc support, two the slider slip set up in the slide rail, two the sucking disc set up respectively in two the slider, the driving piece is used for making two the slider is close to each other or is kept away from each other along first direction, and then adjusts two distance between the sucking disc.

As an optional technical scheme, the bracket is further provided with a sensor, and the sensor is used for detecting the working state of the sucker.

As an optional technical scheme, the moving mechanism includes the guide rail that extends along first direction, the linking bridge includes guide, riser and bottom plate, the guide set up in one side of riser, the guide can be in on the guide rail along first direction reciprocating motion, the bottom plate set up in the bottom of riser, the riser with be provided with the reinforcing plate between the bottom plate, support bracket connect in the bottom plate.

As an optional technical scheme, the silicon wafer transfer device further comprises a valve group, the valve group is arranged on the vertical plate, the valve group is connected with the suction disc, and the valve group is used for enabling two suction discs of the suction disc assembly to work simultaneously or enabling two suction discs to work respectively.

As an alternative solution, the sum of the width dimension of all the suction cups of each suction cup assembly and the gap dimension between all two adjacent suction cups is less than or equal to 182mm;

or, the sum of the width dimension of all the suction cups of each suction cup assembly and the gap dimension between all two adjacent suction cups is less than or equal to 210mm.

The utility model also adopts the following technical scheme:

the silicon wafer processing equipment comprises a silicon wafer placing device and a silicon wafer processing device, and further comprises the silicon wafer transferring device, wherein the silicon wafer transferring device is arranged between the silicon wafer placing device and the silicon wafer processing device and is used for transferring equal-divided silicon wafers or whole silicon wafers of the silicon wafer placing device to the silicon wafer processing device.

The utility model has the beneficial effects that:

the utility model discloses a silicon wafer transfer device, which comprises a moving mechanism and a transfer mechanism, wherein the transfer mechanism comprises a connecting bracket, a supporting bracket and a sucker assembly, the connecting bracket is connected with the moving mechanism, the moving mechanism can drive the connecting bracket to move, the supporting bracket is arranged on the connecting bracket, the supporting bracket is provided with at least one group of sucker assemblies, the sucker assembly comprises at least two suckers, each sucker of the sucker assemblies is used for independently absorbing an equal-divided silicon wafer, or all suckers of the sucker assemblies are used for jointly absorbing a whole silicon wafer; the sum of the width dimension of all the suckers and the gap dimension between all the two adjacent suckers is smaller than or equal to the side length of the whole silicon wafer. In actual use, when at least two suckers work simultaneously, the sucker assembly can adsorb the whole silicon wafer or equal silicon wafers with the same quantity as the suckers, the adsorption stability of the whole silicon wafer can be ensured, and the adsorption efficiency can be improved when a plurality of equal silicon wafers are adsorbed simultaneously; at least two sucking discs can work respectively for the equal division silicon chip of the quantity that adsorbs the quantity less than sucking disc avoids appearing the sucking disc that need not to adsorb the silicon chip still normally produces the condition of adsorption action, saves the resource. In addition, the silicon wafer transfer device can be compatible with the whole silicon wafer and the equally divided silicon wafer, and the compatibility of silicon wafer processing equipment is improved.

The utility model also discloses silicon wafer processing equipment, which comprises the silicon wafer placing device and the silicon wafer processing device, and further comprises the silicon wafer transferring device, wherein the silicon wafer transferring device is arranged between the silicon wafer placing device and the silicon wafer processing device and is used for transferring the equal-divided silicon wafers or the whole silicon wafers of the silicon wafer placing device to the silicon wafer processing device. The silicon wafer processing equipment can process whole silicon wafers or equally divide the silicon wafers without replacing the silicon wafer transfer device, and improves the processing efficiency.

Drawings

FIG. 1 is a schematic view of a transfer apparatus for transferring whole silicon wafers according to an embodiment of the present utility model;

fig. 2 is a schematic structural view of a transfer device according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a transfer mechanism and a valve block according to an embodiment of the present utility model;

fig. 4 is a partial enlarged view of a in fig. 3.

In the figure:

1. a silicon wafer transfer device; 2. A whole silicon wafer;

10. a moving mechanism; 11. A guide rail;

20. a transfer mechanism; 21. a connecting bracket; 211. a guide member; 212. a vertical plate; 213. a bottom plate; 214. a reinforcing plate; 22. a support bracket; 23. a suction cup assembly; 231. a suction cup; 24. a cylinder; 25. a suction cup bracket; 251. a sensor;

30. and a valve group.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

As shown in fig. 1 to 3, in this embodiment, a silicon wafer transfer apparatus 1 is provided, the silicon wafer transfer apparatus 1 includes a moving mechanism 10 and a transfer mechanism 20, the transfer mechanism 20 includes a connecting bracket 21, a supporting bracket 22 and a chuck assembly 23, the connecting bracket 21 is connected to the moving mechanism 10, the moving mechanism 10 can drive the connecting bracket 21 to move, the supporting bracket 22 is disposed on the connecting bracket 21, at least one group of chuck assemblies 23 is mounted on the supporting bracket 22, the chuck assembly 23 includes at least two chucks 231, each chuck 231 of the chuck assemblies 23 is used for individually adsorbing an equal portion of silicon wafer, or all chucks 231 of the chuck assemblies 23 are used for commonly adsorbing an entire piece of silicon wafer 2; wherein, all suction cups 231 of the suction cup assembly 23 are arranged in parallel along the first direction at intervals, and the sum of the width dimension of all suction cups 231 and the gap dimension between all two adjacent suction cups 231 is smaller than or equal to the side length of the whole silicon wafer. Specifically, in this embodiment, the chuck assembly 23 includes at least two chucks 231, where the chuck assembly 23 is used to adsorb silicon wafers, the sizes of all chucks are the same, the size of each chuck along the first direction is a, the gap value between two adjacent chucks along the first direction is b, and assuming that one chuck assembly 23 has N chucks, N is greater than or equal to 2, na+ (N-1) b, that is, the sum of the value of N multiplied by a and the value of (N-1) multiplied by b, where the value of na+ (N-1) b is less than or equal to the side length of the whole silicon wafer, stable adsorption of the silicon wafers can be ensured; when the whole silicon wafer 2 needs to be adsorbed, at least two suckers 231 synchronously work, so that the adsorption stability of the whole silicon wafer 2 can be ensured, when the equal-divided silicon wafers need to be adsorbed, if the equal-divided silicon wafers with the same quantity as the suckers 231 need to be adsorbed, all the suckers 231 of the sucker assembly 231 synchronously work, the adsorption efficiency of the equal-divided silicon wafers can be improved, the transfer efficiency and the production efficiency of the equal-divided silicon wafers are further improved, if the equal-divided silicon wafers need to be adsorbed or the equal-divided silicon wafers with the quantity less than the suckers 231 need to be adsorbed, the suckers 231 above the equal-divided silicon wafers need to be adsorbed work, and other suckers 231 do not work, so that the resource waste caused by the fact that the suckers 231 which do not adsorb the equal-divided silicon wafers are in a working state can be avoided. The sucking disc subassembly 23 adsorbs the silicon chip, and support frame 22 is used for keeping the stability of silicon chip, and linking bridge 21 is connected in mobile mechanism 10, and mobile mechanism is used for shifting the silicon chip that sucking disc subassembly 23 adsorbed. The silicon wafer transfer device 1 can be compatible with the transfer of aliquoting silicon wafers and whole silicon wafers 2, and ensures the transfer efficiency and production efficiency of the silicon wafers.

In some embodiments, the chuck assemblies 23 are provided with three groups, the three groups of chuck assemblies 23 are arranged at intervals along a second direction, each chuck assembly 23 comprises two chucks 231 arranged at intervals along a first direction, and each chuck 231 is used for independently sucking one half silicon wafer, wherein the second direction is perpendicular to the first direction. Specifically, the transfer mechanism 20 in this embodiment includes three groups of chuck assemblies 23, the three groups of chuck assemblies 23 are disposed at intervals in the support frame 22 along the length direction, that is, the second direction, of the support frame 22, and each chuck assembly 23 includes two chucks 231 disposed at intervals along the first direction, so that the three groups of chuck assemblies 23 can adsorb at most three whole wafers 2 or six half wafers simultaneously. Alternatively, the three groups of chuck assemblies 23 may not work simultaneously, so that the transfer mechanism 20 may adsorb silicon wafer combinations of different numbers and different sizes, which will not be described herein. The sucking disc subassembly 23 includes two sucking discs 231, sucking disc subassembly 23 is used for adsorbing the silicon chip, when needs adsorb whole piece silicon chip 2, two sucking discs 231 synchronous operation can ensure the adsorption stability of whole piece silicon chip 2, when needs adsorb half piece silicon chip, if need adsorb two half piece silicon chips, then two sucking discs 231 synchronous operation of sucking disc subassembly 231 can promote half piece silicon chip's adsorption efficiency, and then promote half piece silicon chip's transfer efficiency and production efficiency, if need adsorb single half piece silicon chip, then the sucking disc 231 work that is located half piece silicon chip top, another sucking disc 231 does not work, can avoid not adsorbing half piece silicon chip's sucking disc 231 and also be in the wasting of resources that the operating condition leads to. Alternatively, in other embodiments, the number of suction cups 231 may be specifically set according to the type of the sucked aliquoting silicon wafer, and the group of suction cup assemblies 23 includes 3 or 4 suction cups 231, which will not be described herein.

In some embodiments, the moving mechanism 10 drives the connecting bracket 21 to reciprocate along the first direction, the transferring mechanism 20 further includes a longitudinal adjusting structure connected between the connecting bracket 21 and the supporting bracket 22, and the longitudinal adjusting structure is used for driving the supporting bracket 22 to reciprocate along a third direction, wherein the third direction is perpendicular to the first direction and the second direction. Specifically, in this embodiment, the moving mechanism 10 drives the connecting bracket 21 to reciprocate along the first direction, so as to move the transferring mechanism that adsorbs silicon wafers, and further transfer the silicon wafers, and the longitudinal adjusting structure is located between the connection and the supporting brackets 22, so that the supporting brackets 22 can move along the third direction relative to the connecting bracket 21, and further ensure that the suction cup assembly 23 can move along the third direction, so that the suction cup 231 can adsorb silicon wafers with different heights, and flexibility and adaptability of the transferring mechanism 20 are improved.

Alternatively, the longitudinal adjustment structure is a cylinder 24, the cylinder 24 is connected to the connecting bracket 21, and a piston rod of the cylinder 24 is connected to the supporting bracket 22. Specifically, in this embodiment, the air cylinder 24 is used for adjusting the distance between the support bracket 22 and the connection bracket 21, so that the suction cup 231 can adsorb silicon wafers with different heights, flexibility and adaptability of the transfer mechanism 20 are improved, the air cylinder 24 can enable the connection bracket 21 and the support bracket 22 to have better stability, shake of the suction cup assembly 23 on the support bracket 22 can be avoided, the silicon wafers are difficult to align when being adsorbed, the silicon wafers fall off, and the adsorption stability of the silicon wafers is ensured.

Alternatively, in other embodiments, the longitudinal adjustment structure may be other structures that move linearly, such as a rail-slider structure, which is not described herein.

In some embodiments, the suction cup assembly 23 further includes a suction cup support 25, the suction cup support 25 is disposed on the support 22, the two suction cups 231 are disposed on two ends of the suction cup support 25, and a fine adjustment structure is disposed on the suction cup support 25, and the fine adjustment structure is used for adjusting a distance between the two suction cups 231. Specifically, in this embodiment, setting up the fine setting structure on the sucking disc support 25 and can adjusting the distance between two sucking discs 231, can make sucking disc subassembly 23 can be applicable to not unidimensional whole piece silicon chip 2 or two half silicon chips of different intervals, promote this application scope who moves mechanism 20, promote the stability in the silicon chip adsorption, and avoid the silicon chip to drop in the transfer process.

In some embodiments, the fine tuning structure includes a slide rail, a slider and a driving member, the slide rail is fixedly disposed on the suction cup support 25, the two sliders are slidably disposed on the slide rail, the two suction cups 231 are respectively disposed on the two sliders, and the driving member is used for making the two sliders approach to or separate from each other along the first direction, so as to adjust the distance between the two suction cups 231. Specifically, in this embodiment, the slide rail is disposed at the bottom of the suction cup support 25, the two sliders are slidably disposed on the slide rail, the two suction cups 231 are respectively disposed on the two sliders, the driving member is used for making the two sliders approach to or separate from each other along the first direction, and further adjusting the distance between the two suction cups 231, so that the suction cup assembly 23 can adsorb the whole silicon wafer 2 with different sizes or two half silicon wafers with different distances. In this embodiment, the driving member is a motor or a hydraulic cylinder. In this embodiment, after the adjustment of the fine adjustment structure, the value 2a+b needs to be smaller than or equal to the side length of the whole silicon wafer, so that stable adsorption of the silicon wafer can be ensured.

Optionally, in another embodiment, the fine tuning structure includes a screw, a screw nut and a driving motor, the screw includes threads with opposite rotation directions at two ends, the two screw nuts are respectively disposed at two ends of the screw, the two suction cups 231 are respectively disposed at the two screw nuts, the driving motor is connected with the screw transmission, when the driving motor drives the screw to rotate, the two screw nuts are mutually close to or mutually far away along the screw, and then the distance between the two suction cups 231 is adjusted, so that the suction cup assembly 23 can adsorb whole silicon wafers 2 with different sizes or two half silicon wafers with different distances.

In some embodiments, as shown in fig. 3, a sensor 251 is further disposed on the suction cup 231, where the sensor 251 is used to detect the working state of the suction cup 231. Specifically, in this embodiment, the sensor 251 is used to detect whether the suction cup 231 effectively adsorbs the silicon wafer, so as to ensure the stability of the adsorption of the silicon wafer. Optionally, the sensor 251 in this embodiment is a light sensor, and determines whether the suction cup 231 is attached with a silicon wafer by detecting whether light returns, and in other embodiments, other kinds of sensors may be used, which will not be described herein.

Alternatively, the suction cup 231 is a bernoulli suction cup. Specifically, in this embodiment, since the bernoulli chuck can carry objects almost without contact, it is particularly suitable for pressure sensitive workpieces such as silicon wafers, and the leakage compensation is good, so that the damage to the silicon wafers caused by the chuck 231 can be avoided, the production loss is reduced, and the waste is avoided.

In some embodiments, as shown in fig. 2, the moving mechanism 10 includes a guide rail 11 extending along a first direction, the connection bracket 21 includes a guide 211, a vertical plate 212, and a bottom plate 213, the guide 211 is disposed on one side of the vertical plate 212, the guide 211 can reciprocate on the guide rail 11 along the first direction, the bottom plate 213 is disposed at the bottom of the vertical plate 212, a reinforcing plate 214 is disposed between the vertical plate 212 and the bottom plate 213, and the support bracket 22 is connected to the bottom plate 213. Specifically, in this embodiment, the guide rail 11 can provide guiding and stable support for the vertical plate 212 and the bottom plate 213 through the guide member 211, so that it can ensure that the cylinder 24 connected with the bottom plate 213 has sufficient stability, further ensure that the support bracket 22 has good stability, ensure that the silicon wafer can be stably adsorbed, and avoid shaking when transferring the silicon wafer. The reinforcing plate 214 is arranged between the vertical plate 212 and the bottom plate 213, which is also beneficial to improving the stability of the support bracket 22, and further ensures the adsorption stability of the silicon wafer. Optionally, the guide 211 in this embodiment is in driving connection with a driving motor, which is used to drive the guide 211 to reciprocate along the guide rail 11, which is not described herein. Alternatively, in other embodiments, the moving mechanism may be a mechanical arm, etc., which is not described herein.

In some embodiments, the silicon wafer transfer apparatus 1 further includes a valve block 30, the valve block 30 is disposed on the vertical plate 212, the valve block 30 is connected to the suction cup 231 of the suction cup assembly 23, and the valve block 30 is used to enable the two suction cups 231 to work simultaneously or enable the two suction cups 231 to work separately. Specifically, in this embodiment, one end of the valve block 30 is connected to an external air source, the other end of the valve block 30 is connected to the suction cup 231 and the air cylinder 24, the external air source provides power to the suction cup 231 and the air cylinder 24 through the valve block 30, the valve block 30 is used for controlling the working states of all suction cups 231 and the air cylinder 24, the valve block 30 is arranged on the vertical plate 212, the stability of the valve block 30 can be ensured, the distance of a connecting pipeline can be shortened, the control precision is improved, the working states of all suction cups 231 can be controlled by the valve block 30, different suction cup assemblies 23 can be enabled to work simultaneously or not simultaneously, and two suction cups 231 of the same group can be enabled to work synchronously or respectively, so that the silicon wafer transfer device 1 can work according to the types and the number of silicon wafers required to be transferred, and the waste of resources is reduced.

Optionally, in this embodiment, the silicon wafer transfer device 1 further includes a controller, and the controller is connected to the valve group 30, and controls the operation of the suction cup 231 and the cylinder 24 by controlling the action of the valve group 30, so that the silicon wafer suction is more flexible.

In some embodiments, the sum of the width dimension of all suction cups 231 of each suction cup assembly 23 and the gap dimension between all two adjacent suction cups 231 is less than or equal to 182mm, or the sum of the width dimension of all suction cups 231 of each suction cup assembly 23 and the gap dimension between all two adjacent suction cups 231 is less than or equal to 210mm. Specifically, in this embodiment, since the sizes of the whole silicon wafer in common use are 182mm×182mm and 210mm×210mm, this arrangement can ensure that the chuck assembly 23 can adsorb the whole silicon wafer and half silicon wafer, and enhance the safety of the adsorption.

The embodiment also provides silicon wafer processing equipment, which comprises a silicon wafer placing device and a silicon wafer processing device, and further comprises the silicon wafer transfer device 1, wherein the silicon wafer transfer device 1 is arranged between the silicon wafer placing device and the silicon wafer processing device and is used for moving an equal-divided silicon wafer or a whole silicon wafer of the silicon wafer placing device to the silicon wafer processing device. The silicon wafer processing equipment can process whole silicon wafers or equally divide the silicon wafers without replacing the silicon wafer transfer device 1, and improves the processing efficiency.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. The silicon wafer transfer device is characterized in that the silicon wafer transfer device (1) comprises:

a moving mechanism (10);

the transfer mechanism (20), transfer mechanism (20) includes linking bridge (21), support frame (22) and sucking disc subassembly (23), linking bridge (21) connect in mobile mechanism (10), mobile mechanism (10) are used for driving linking bridge (21) motion, support frame (22) set up in linking bridge (21), at least a set of sucking disc subassembly (23) are installed to support frame (22), sucking disc subassembly (23) include two at least sucking discs (231), every sucking disc (231) of sucking disc subassembly (23) are used for adsorbing an equal part silicon chip alone, alternatively, all sucking discs (231) of sucking disc subassembly (23) are used for adsorbing whole piece silicon chip (2) jointly;

wherein the sum of the width dimension of all the suction cups (231) of the suction cup assembly (23) and the gap dimension between all two adjacent suction cups (231) is smaller than or equal to the side length of the whole silicon wafer.

2. The silicon wafer transfer apparatus according to claim 1, wherein the suction cup assemblies (23) are provided with three groups, the three groups of suction cup assemblies (23) are arranged at intervals along a second direction, each suction cup assembly (23) comprises two suction cups (231) arranged at intervals along a first direction, each suction cup (231) is used for individually sucking one half silicon wafer, and the second direction is perpendicular to the first direction.

3. The silicon wafer transfer device according to claim 1, wherein the moving mechanism (10) drives the connecting bracket (21) to reciprocate along a first direction, the transfer mechanism (20) further comprises a longitudinal adjusting structure, the longitudinal adjusting structure is connected between the connecting bracket (21) and the supporting bracket (22), and the longitudinal adjusting structure is used for driving the supporting bracket (22) to reciprocate along a third direction, wherein the third direction, the first direction and the second direction are perpendicular to each other.

4. The silicon wafer transfer device according to claim 1, wherein the chuck assembly (23) further comprises a chuck support (25), the chuck support (25) is disposed on the support (22), two chucks (231) are respectively disposed on two ends of the chuck support (25), and fine adjustment structures are disposed on the chuck support (25) and are used for adjusting a distance between the two chucks (231).

5. The silicon wafer transfer device according to claim 4, wherein the fine adjustment structure comprises a slide rail, a slide block and a driving member, the slide rail is fixedly arranged on the chuck support (25), two slide blocks are slidably arranged on the slide rail, two chucks (231) are respectively arranged on the two slide blocks, and the driving member is used for enabling the two slide blocks to be close to or far away from each other along a first direction, so that a distance between the two chucks (231) is adjusted.

6. The silicon wafer transfer apparatus according to claim 5, wherein the suction cup (231) is further provided with a sensor (251), and the sensor (251) is configured to detect an operation state of the suction cup (231).

7. A silicon wafer transfer apparatus according to claim 3, wherein the moving mechanism (10) comprises a guide rail (11) extending in the first direction, the connection bracket (21) comprises a guide member (211), a vertical plate (212) and a bottom plate (213), the guide member (211) is provided on one side of the vertical plate (212), the guide member (211) can reciprocate on the guide rail (11) in the first direction, the bottom plate (213) is provided at the bottom of the vertical plate (212), a reinforcing plate (214) is provided between the vertical plate (212) and the bottom plate (213), and the support bracket (22) is connected to the bottom plate (213).

8. The silicon wafer transfer apparatus according to claim 7, wherein the silicon wafer transfer apparatus (1) further comprises a valve block (30), the valve block (30) is provided to the vertical plate (212), the valve block (30) is connected to the suction cup (231) of the suction cup assembly (23), and the valve block (30) is configured to enable two suction cups (231) of the suction cup assembly (23) to operate simultaneously or to enable two suction cups (231) to operate separately.

9. The silicon wafer transfer apparatus according to any one of claims 1 to 8, wherein a sum of a width dimension of all the suction cups (231) of each suction cup assembly (23) and a gap dimension between all two adjacent suction cups (231) is 182mm or less;

or, the sum of the width dimension of all the suction cups (231) of each suction cup assembly (23) and the gap dimension between all two adjacent suction cups (231) is less than or equal to 210mm.

10. Silicon wafer processing equipment, the silicon wafer processing equipment includes silicon wafer placer and silicon wafer processingequipment, characterized in that, the silicon wafer processing equipment still includes the silicon wafer of any one of claims 1-9 and moves device (1) to move, silicon wafer moves device (1) install in silicon wafer placer with silicon wafer processingequipment, be used for with silicon wafer placer's aliquoting silicon wafer or whole piece silicon wafer move to silicon wafer processingequipment.