CN216648265U

CN216648265U - Wafer adsorption equipment

Info

Publication number: CN216648265U
Application number: CN202123361514.4U
Authority: CN
Inventors: 兰海燕; 康时俊; 沈曙光
Original assignee: Shengjisheng Precision Technology Ningbo Co ltd; SGS Ningbo Semiconductor Technology Co Ltd
Current assignee: Shengjisheng Precision Technology Ningbo Co ltd; SGS Ningbo Semiconductor Technology Co Ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-05-31
Anticipated expiration: 2031-12-27

Abstract

The utility model relates to a wafer adsorption device, which comprises a main sucker, a plurality of flexible suckers and a lifting driving module, wherein the main sucker is connected with the flexible suckers through a connecting rod; the plurality of flexible suckers are distributed in the sucker body of the main sucker; the lifting driving module is respectively connected with each disturbing sucker and used for driving each disturbing sucker to move up and down along the axial direction of the main sucker. When the wafer adsorption device disclosed by the utility model is used for adsorbing an external warped wafer, the wafer to be adsorbed is firstly adsorbed by the aid of the flexible sucker, the warped wafer is pulled down under the driving of the lifting driving module, gaps between the wafer and the sucker body of the main sucker are reduced, the main sucker has sufficient vacuum adsorption capacity, and then the wafer is adsorbed by the main sucker.

Description

Wafer adsorption equipment

Technical Field

The utility model relates to the technical field of chip manufacturing, in particular to a wafer adsorption device.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an IC product with specific electrical functions.

In the wafer processing process, a suction cup is generally used for sucking and grabbing the wafer. In the production process, the wafer is irregularly warped due to some reasons, and when the wafer warped by adopting the sucker in the prior art is adsorbed, the sucker cannot completely contact with the wafer, so that the sucker cannot adsorb the warped wafer.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provide a wafer adsorption device which can effectively adsorb warped wafers and has good practicability.

In order to achieve the above object, a wafer suction apparatus according to the present invention comprises:

the wafer adsorption device is mainly characterized by comprising a main sucker, a plurality of flexible suckers and a lifting driving module;

the plurality of flexible suckers are distributed in the sucker body of the main sucker;

the lifting driving module is respectively connected with each disturbing sucker and used for driving each disturbing sucker to move up and down along the axial direction of the main sucker.

The wafer adsorption device further comprises:

the distance detection module is arranged at a position capable of detecting the distance between each system preselection position in the external wafer to be adsorbed and the system preselection datum point, and is connected with the lifting drive module

In the above wafer adsorbing device, the distance detecting module is composed of a displacement meter.

The wafer adsorption device further comprises:

the warping degree detection module is arranged at a position where the warping degree of the wafer to be adsorbed outside can be detected, and the warping degree detection module is connected with the lifting driving module.

The wafer adsorption device comprises a lifting driving module, wherein the lifting driving module comprises a rotary motor and a transmission mechanism, and the rotary motor is respectively connected with the disturbing suckers through the transmission mechanism.

The wafer adsorption device comprises a driving mechanism, a rotating motor and a flexible sucker, wherein the driving mechanism comprises a belt pulley assembly and a screw rod driving assembly, and the rotating motor is respectively connected with the flexible sucker through the belt pulley assembly and the screw rod driving assembly in sequence.

The wafer adsorption device further comprises a plurality of flexible sucker connecting rods and a connecting plate, one end of each flexible sucker connecting rod is connected with the corresponding flexible sucker, the other end of each flexible sucker connecting rod is fixed on the connecting plate, and each flexible sucker sequentially passes through the corresponding flexible sucker connecting rod and the connecting plate and is connected with the lifting driving module.

In the above wafer adsorbing device, the suction cup body of each flexible suction cup is made of an elastic material.

In the above wafer adsorbing device, the elastic material is rubber or silica gel.

The wafer adsorption device comprises a main sucker, a first vacuum adsorption module, a second vacuum adsorption module, a flexible sucker and a second vacuum adsorption module.

The wafer adsorption device has the beneficial effects that:

through set up the main sucking disc in wafer adsorption equipment and can follow the several disturbed sucking discs that the main sucking disc reciprocated, can adsorb the wafer when needs adsorb outside warping wafer, adopt disturbed sucking disc earlier and treat adsorbing the wafer and adsorb to pulling down the warping wafer under lift drive module's drive, reduce the clearance between the sucking disc body of wafer and main sucking disc, make main sucking disc possess sufficient vacuum adsorption ability, then adsorb the wafer by main sucking disc. By the structural design, the wafer adsorption device can adsorb warped wafers, the equipment condition elimination rate is reduced, the utilization rate is improved, the production efficiency is guaranteed, and the wafer adsorption device has a good application prospect.

Drawings

The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.

Fig. 1 is a schematic view illustrating a suction surface structure of a wafer suction device according to an embodiment of the present invention.

Fig. 2 is a side cross-sectional view of a wafer chucking apparatus according to an embodiment of the present invention.

Reference numerals

1 Main suction cup

2 perturbing sucker

3 rotating motor

4 belt pulley assembly

5 support seat

6 lead screw

Detailed Description

In order to make the technical means, the inventive features, the objectives and the functions of the present invention easy to understand, the present invention will be further described with reference to the following detailed drawings. However, the present invention is not limited to the following embodiments.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.

Referring to fig. 1 and 2, the wafer chucking apparatus in this embodiment includes a main chuck 1, a plurality of flexible chucks 2, and a lift driving module (since the flexible chucks 2 are drawn in fig. 1, only some of the flexible chucks 2 are labeled since they have the same structure);

the plurality of the flexible suckers 2 are distributed in the sucker body of the main sucker 1; the specific distribution mode of the disturbing suckers 2 can be designed according to actual needs, for example, the disturbing suckers can be uniformly distributed in the sucker body of the main sucker 1, or symmetrically distributed in fig. 1;

the lifting driving module is respectively connected with the disturbing suckers 2 and used for driving the disturbing suckers 2 to move up and down along the axial direction of the main sucker 1.

Through such structural design, can be so that when needs adsorb the wafer of warping, adsorb and drop-down by disturbed sucking disc 2 earlier to the wafer, along with disturbed sucking disc 2 will warp the wafer drop-down back, after having reduced the clearance between wafer and the main sucking disc 1, main sucking disc 1 adsorbs the wafer of warping again (also can start disturbed sucking disc 2 and main sucking disc 1 simultaneously in other embodiments, after disturbed sucking disc 2 with the wafer drop-down target in place, main sucking disc 1 can adsorb the wafer automatically). And after the main sucker 1 sucks the warped wafer, the flexible sucker 2 stops sucking the warped wafer.

Through the structure, the problems that when a large-warpage wafer is encountered, the adsorption sucker does not have enough vacuum adsorption capacity to adsorb the wafer due to an overlarge gap between the wafer and the sucker, the equipment condition is eliminated and increased, and the utilization rate is reduced can be effectively solved.

In this embodiment, the wafer adsorbing device further includes:

the distance detection module is arranged in the wafer adsorption device and can detect the distance between each system pre-selection position in the external wafer to be adsorbed and the system pre-selection reference point, the distance detection module is connected with the lifting driving module, and the lifting driving module controls the moving distance of each disturbing sucker 2 according to the distance between each system pre-selection position in the external wafer to be adsorbed and the system pre-selection reference point detected by the distance detection module.

The system preselection position can generally select a position close to the edge of a wafer to be adsorbed, the system preselection datum point can be the horizontal plane of the sucker body of the main sucker 1, the position of the lowest point of the wafer to be adsorbed, or other preselection positions, after the distance between each system preselection position in the wafer and the system preselection datum point is determined, the lifting driving module drives the flexible sucker 2 to move by a corresponding distance according to the detected distance, and the farther the relative distance between the system preselection position in the wafer and the system preselection datum point is, the longer the distance for driving the flexible sucker 2 to pull down is. For ease of understanding, the following description is given by way of example:

in this embodiment, the edge positions of both sides of the wafer to be chucked are selected as the pre-selected positions of the system, and the position of the lowest point of the wafer is selected as the reference point, and if the height difference between the edge position of the wafer and the reference point is a mm, the flexible chuck 2 needs to be driven to move downward a mm.

In this embodiment, the distance detection module is constituted by a displacement meter;

and detecting the distance between each system pre-selection position in the wafer to be adsorbed and the system pre-selection datum point through a displacement meter, and sending the detected distance between each system pre-selection position and the system pre-selection datum point to the lifting driving module. In other embodiments, other distance detection devices may be used to detect the distance between the preselected location of each system in the wafer and the fiducial.

As shown in fig. 2, each of the disturbing suckers 2 in this embodiment is connected to a connecting block through a corresponding connecting rod, and the connecting block is connected to the lifting driving module, so that the lifting driving module can drive all the disturbing suckers 2 to move.

In this embodiment, the lifting driving module includes a rotating motor 3 and a transmission mechanism, and the rotating motor 3 is respectively connected to the flexible suction cups 2 through the transmission mechanism.

In this embodiment, the transmission mechanism includes a belt pulley assembly 4 and a screw transmission assembly, and the rotary motor 3 is respectively connected to the flexible suction cups 2 through the belt pulley assembly 4 and the screw transmission assembly in sequence.

That is, in this embodiment, each of the flexible suckers 2 may be connected to a nut in the screw transmission assembly, and then the rotary motor 3 is connected to each of the flexible suckers 2 sequentially through the pulley assembly 4, the screw 6 in the screw transmission assembly, and the nut, so as to drive the flexible suckers 2 to move. Due to the structural design, the spatial structure arrangement of the whole device is more reasonable, and in other embodiments, other transmission components can be adopted to replace the belt pulley component 4 to complete transmission. Through the setting of screw drive assembly in this embodiment, can convert the rotary motion of motor into linear motion, effectively drive each disturbed sucking disc 2 and go up and down. Because the rotation motor 3 is adopted to adjust the moving distance of the disturbing sucker 2 in the embodiment, the wafer adsorption device can adsorb wafers with different warping degrees, and the disturbing sucker 2 is controlled to move by a corresponding distance according to the difference of the warping degrees of the wafers. As shown in fig. 2, the pulley assembly 4 can be fixed on a supporting seat 5 in this embodiment.

In this embodiment, the suction cup body of each of the flexible suction cups 2 is made of an elastic material. Because the flexible sucker 2 is made of elastic material, the flexible sucker 2 can be better ensured to be well butted with a wafer and adsorb the wafer. After a part of the flexible sucker 2 contacts with a position of a lower point in the wafer, the sucker body of the part of the flexible sucker 2 is compressed by a certain amount under the action of external force, so that other flexible suckers 2 can continuously move to higher positions in the wafer and contact with higher points in the wafer, and all the flexible suckers can adsorb the wafer. After the wafer is adsorbed by the disturbing sucker, the wafer is pulled downwards towards the main sucker, so that the wafer is in contact with the main sucker, and the warped wafer is pulled flat in the process of attaching the wafer to the main sucker through pulling downwards.

In this embodiment, the elastic material is rubber or silicone.

In this embodiment, the main suction cup 1 is connected to a first vacuum suction module, and each of the flexible suction cups 2 is connected to a second vacuum suction module.

In other embodiments, the lifting driving module can also control the moving distance of each flexible sucker 2 according to the preset moving distance of the system. The preset moving distance of the system can be preset in the lifting driving module by an operator according to the warping degree of the wafer, so that the lifting driving module can drive the disturbing sucker to move according to the preset stroke.

Or, in another embodiment, a warpage detection module may be further disposed in the wafer suction device, and the warpage detection module is disposed in the wafer suction device and is capable of detecting a warpage of an external wafer to be sucked, and is connected to the lift driving module, so that the lift driving module can control a moving distance of each flexible chuck 2 according to the warpage of the wafer to be sucked detected by the warpage detection module. In this embodiment, the wafer adsorption device further includes a warpage detection mechanism, which detects the warpage of the wafer to be adsorbed and sends the detection result to the lifting drive module.

Because the disc surface of the main sucking disc has processing flatness, the warped wafer cannot be directly adsorbed. In the embodiment, the warped wafer is firstly adsorbed by the perturbing suckers with smaller adsorption disc surfaces, then the perturbing suckers pull down the warped wafer towards the main sucker direction under the driving of the lifting driving module, so that the gap between the wafer and the sucker body of the main sucker is reduced, the warped wafer is flattened, the main sucker has enough vacuum adsorption capacity to adsorb the wafer, and then the perturbing suckers stop adsorbing the wafer. Such structural design can adsorb the wafer in order to ensure main sucking disc, avoids disturbing nature sucking disc to adsorb the wafer for a long time simultaneously, can appear recessed phenomenon in the adsorption site department of disturbing nature sucking disc in the wafer. In this embodiment, if the wafer is recessed during the chuck's chucking process, the chuck breaks the vacuum as the chuck pulls the wafer down to a position where the main chuck can chuck the wafer.

According to the wafer adsorption device, the main sucker and the plurality of flexible suckers capable of moving up and down along the main sucker are arranged, when an external warped wafer needs to be adsorbed, the flexible suckers are firstly adopted to adsorb the wafer to be adsorbed, the warped wafer is pulled down under the driving of the lifting driving module, the gap between the wafer and the sucker body of the main sucker is reduced, the main sucker has enough vacuum adsorption capacity, and then the main sucker adsorbs the wafer. By the structural design, the wafer adsorption device can adsorb warped wafers, the equipment condition elimination rate is reduced, the utilization rate is improved, the production efficiency is guaranteed, and the wafer adsorption device has a good application prospect.

The foregoing detailed description of the preferred embodiments of the utility model has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection determined by the claims.

Claims

1. A wafer adsorption device is characterized by comprising a main sucker, a plurality of flexible suckers and a lifting driving module;

the lifting driving module is respectively connected with the disturbing suckers.

2. The wafer chucking device of claim 1, further comprising:

the distance detection module is arranged at a position capable of detecting the distance between each system preselection position in the external wafer to be adsorbed and the system preselection datum point, and is connected with the lifting drive module.

3. The wafer adsorption device of claim 2, wherein the distance detection module is constituted by a displacement meter.

4. The wafer chucking device of claim 1, further comprising:

5. The wafer chuck device of claim 1, wherein the lift driving module comprises a rotation motor and a transmission mechanism, and the rotation motor is connected to each of the flexible chucks through the transmission mechanism.

6. The wafer adsorption device of claim 5, wherein the transmission mechanism comprises a pulley assembly and a lead screw transmission assembly, and the rotary motor is respectively connected with the flexible suckers through the pulley assembly and the lead screw transmission assembly in sequence.

7. The wafer chuck device of claim 1, wherein the suction cup body of each of the flexible suction cups is made of an elastic material.

8. The wafer adsorption device of claim 7, wherein the elastic material is rubber or silicone.

9. The wafer chuck device of claim 1, wherein the main chuck is connected to a first vacuum module and each of the flexible chucks is connected to a second vacuum module.