CN220648178U - 一种柔性灯丝拼接结构 - Google Patents
一种柔性灯丝拼接结构 Download PDFInfo
- Publication number
- CN220648178U CN220648178U CN202321141808.2U CN202321141808U CN220648178U CN 220648178 U CN220648178 U CN 220648178U CN 202321141808 U CN202321141808 U CN 202321141808U CN 220648178 U CN220648178 U CN 220648178U
- Authority
- CN
- China
- Prior art keywords
- flexible
- flexible filament
- filament
- filaments
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000003466 welding Methods 0.000 abstract description 10
- 230000001502 supplementing effect Effects 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/052—Branched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09136—Means for correcting warpage
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Led Device Packages (AREA)
Abstract
本实用新型公开了一种柔性灯丝拼接结构,包括若干柔性灯丝,各柔性灯丝分别包括柔性基板和LED芯片,柔性基板上布设有导电线路层,若干分布于柔性基板上的LED芯片由导电线路层串并联接;本实用新型通过导电连接端上的焊孔进行重叠固定,将若干柔性灯丝组合为长柔性灯丝,并且拼接间隙小,在拼接间隙内通过补胶后固化,使相邻两根柔性灯丝形成连续,从而可连续发光,避免长柔性灯丝在拼接处形成断光阴影,导致发光连续性差,同时还可以选择将其加装到其他外部器件进行配合使用,增加了其实用性,并且正反面可以同时设置光源,不会出现背部光线不足的情况。
Description
技术领域
本实用新型涉及柔性灯丝技术领域,具体为一种柔性灯丝拼接结构。
背景技术
目前,LED灯丝灯多采用柔性灯丝作为发光元件。柔性灯丝利用HVLED技术,由多颗倒装LED倒装芯片串联形成HVLEDs模组,具有低温低能耗的优点。柔性灯丝以铜箔覆合高分子薄膜为基底材料,细长柔软而具可塑性,可弯折形成不同的造型,提供不同类型的装饰灯具,因而受到消费者的广泛青睐。目前受限于还没有一套封装设备实现超长灯丝的封装制作,特别是当需要获得不同规格长度的柔性灯丝时,无法直接通封装设备直接完成并获取该规格尺寸的柔性灯丝,即对应的封装设备能够封装制作固定规格长度的柔性灯丝,而当该柔性灯丝如不能达到使用需求,只能采取数根灯丝通过串联模组依次串联拼接的方式,导致相邻两根灯丝间形成较大的间隙,影响该柔性灯丝的连续性,即同时数跟串联方式也不能实现灯丝连续发光,会有间断。目前市面上还未见有一种制备超长柔性灯丝的封装制作设备,并且在柔性PCB板上镀金、印刷、贴片等工艺都需要专业的设备和技术,如果定制设备则会大大增加了生产成本。
实用新型内容
本实用新型要解决的技术问题是提供一种柔性灯丝拼接结构,解决了现有灯丝无法进行超长灯丝的封装制作的问题。
本实用新型是通过以下技术方案来实现的。
本实用新型的一种柔性灯丝拼接结构,包括若干柔性灯丝,各柔性灯丝分别包括柔性基板、荧光胶和LED芯片,柔性基板上布设有导电线路层,若干分布于柔性基板上的LED芯片由导电线路层串并联接,各柔性灯丝首端及末端分别设有与导电线路层电性连接并向其两端伸出的导电连接端,各相邻两柔性灯丝之间由相对的导电连接端电性拼接,且在拼接位置涂覆并固化有荧光胶,从而使各柔性灯丝依次拼接形成一体拼接结构。
进一步地,导电连接端上开设有至少一个焊孔,各相邻两柔性灯丝之间由相对的导电连接端上焊孔叠置,然后在叠置的焊孔内锡焊固定使其形成电性拼接。
进一步地,第一根柔性灯丝的首端设有与导电线路层电性连接的第一触片,最后一根柔性灯丝末端与导电线路层电性连接有第二触片。
进一步地,第一根柔性灯丝的首端设有与导电线路层电性连接的第一触片、第二触片,第一触片与第二触片位于同一侧。
进一步地,导电线路层上设有若干焊盘,LED芯片安装在焊盘上,沿着柔性基板的正面及反面涂覆有荧光胶并将LED芯片封装于荧光胶内。
进一步地,柔性基板的正面及反面分别布置导电线路层,若干布置于柔性基板的正面及反面的LED芯片由导电线路层串并联接。
本实用新型的有益效果:本实用新型通过导电连接端上的焊孔进行重叠固定,将若干柔性灯丝组合为长柔性灯丝,并且拼接间隙小,在拼接间隙内通过补胶后固化,使相邻两根柔性灯丝形成连续,从而可连续发光,避免长柔性灯丝在拼接处形成断光阴影,导致发光连续性差,同时还可以选择将其加装到其他外部器件进行配合使用,增加了其实用性,并且正反面可以同时设置光源,不会出现背部光线不足的情况。
附图说明
为了更清楚地说明实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本实用新型实施例的结构示意图;
图2是本实用新型实施例1的第一根剪切后的示意图;
图3是本实用新型实施例1的第二根剪切后的示意图;
图4是本实用新型实施例1的第三根剪切后的示意图;
图5是本实用新型实施例1的拼接平面示意图;
图6是本实用新型实施例1的对接封装流程图;
图7是本实用新型实施例1的对接封装流程示意图;
图8是本实用新型实施例2的示意图。
具体实施方式
下面结合图1-8对本实用新型进行详细说明,其中,为叙述方便,现对下文所说的方位规定如下:下文所说的上下左右前后方向与图1本身投影关系的上下左右前后方向一致。
实施例1:
结合附图1-6所述的一种柔性灯丝拼接结构,包括若干柔性灯丝10,各柔性灯丝分别包括柔性基板12和LED芯片16,LED芯片柔性基板12上布设有导电线路层11,导电线路层上11设有若干焊盘15,LED芯片16安装在焊盘15上,LED芯片为倒装,若干分布于柔性基板12上的LED芯片16由导电线路层11串并联接,焊盘15与导电线路层11电连接,以达到当导电线路层11接通电源后可以使所有LED芯片开启,各柔性灯丝10上固化有荧光胶19,柔性灯丝10进行荧光胶19覆盖固化后,在LED芯片开启发光时,荧光胶能够使灯光更加均匀鲜艳,且能够避免强光对用户在使用时产生的眩光等不适感,并对柔性灯丝的拼接位置进行补光,避免长柔性灯丝在拼接处形成断光阴影,导致发光连续性差。
各柔性灯丝10首端及末端分别设有与导电线路层电性连接并向其两端伸出的导电连接端13,各相邻两柔性灯丝10之间由相对的导电连接端电性13拼接,且在拼接位置固化有荧光胶19从而使各柔性灯丝10依次拼接形成线性灯丝整体。
导电连接端13开设有至少一个焊孔14,各相邻两柔性灯丝之间由相对的导电连接端13上焊孔14叠置,然后在叠置的焊孔14内锡焊使其形成电性拼接,多个柔性灯丝通过导电连接端的焊孔进行重叠固定,就可以得到长柔性灯丝,其长度可以根据使用场景进行改变,简单方便。
柔性灯丝10的首端与导电线路层11电性连接有第一触片17,位于首端的第一触片17可以为一个或两个。
柔性灯丝10末端与导电线路层11电性连接有第二触片18,第一触片17与第二触片18之间联接电源形成回路,即可点亮LED芯片,从而使柔性灯丝发亮。
通过以上技术方案,结合图1-4在进行长柔性灯丝的拼接时,以三根柔性灯丝拼接为例,三根柔性灯丝的拼接:第一根柔性灯丝保留首端的第一触片,其末端的第二触片剪断,保留导电线路层与导电连接端;第二根柔性灯丝将两端的第一触片与第二触片全部截去,仅保导电线路层以及导电线路层两端连接的导电连接端,第三根柔性灯丝剪去首端的第一触片,保留其保留导电线路层与导电连接端以及第二触片,进而通过导电连接端的焊孔进行重叠固定,将三根柔性灯丝重叠固定并完成电连接,再在连接位置进行荧光胶的补充,长柔性灯丝拼接完成。
当需要三根以上的柔性灯丝进行拼接时,首根与末根柔性灯丝的裁切方式不变,仅需要增加中间柔性灯丝的数量,再进行重叠固定,就可以拼接三根以上的长柔性灯丝。
实施例2:
结合附图7,实施例2与实施例1的区别在于,柔性灯丝的一端设有与导电线路层电性连接有第一触片17、第二触片18,第一触片17与第二触片18位于同侧,第一触片17第二触片18其中一个与导电线层回路线路21电连接,第一触片与第二触片之间联接电源形成回路,即可点亮LED芯片。
在进行长柔性灯丝拼接的时候,将第一根柔性灯丝末端截去,保留首端的第一触片与第二触片,并保留导电线路层与导电连接端;第二根柔性灯丝将两端的第一触片与第二触片全部截去,仅保导电线路层以及导电线路层两端连接的导电连接端;第三根柔性灯丝剪去首端的第一触片与第二触片,保留其保留导电线路层与导电连接端,再通过导电连接端的焊孔进行重叠固定,将三根柔性灯丝重叠固定并完成电连接,再在连接位置进行荧光胶的补充,完成长柔性灯丝拼接。
实施例3
在实施例2的基础上,当灯丝末端不需要电性联接,最后一根柔性灯丝的末端作为连接端或空置端,连接端或空置端的定义为作为一个连接部分,需要与外部器件形成非电性的连接,如通过设置磁珠或铁珠,作为磁吸灯具的功能部件。
实施例4
在实施例1-3的基础上,实施例4能够在柔性基板的正反面设置LED芯片和导电线路层,若干分布于柔性基板正反面上的LED芯片由导电线路层串并联接,所述柔性基板上正反面设有的各部件结构相同,经过拼接形成的长柔性灯丝,进行荧光胶覆盖后,形成的长柔性灯丝能够在正反两面同时发光,不会产生光源死角,柔性灯丝的效果更好。
上述实施例只为说明本实用新型的技术构思及特点,其目的在于让熟悉此领域技术的人士能够了解本实用新型内容并加以实施,并不能以此限制本实用新型的保护范围。凡根据本实用新型精神实质所作的等效变化或修饰,都应涵盖在本实用新型的保护范围内。
Claims (5)
1.一种柔性灯丝拼接结构,包括若干柔性灯丝,各柔性灯丝分别包括柔性基板、荧光胶和LED芯片,柔性基板上布设有导电线路层,若干分布于柔性基板上的LED芯片由导电线路层串并联接,其特征在于,各柔性灯丝首端及末端分别设有与导电线路层电性连接并向其两端伸出的导电连接端,各相邻两柔性灯丝之间由相对的导电连接端电性拼接,且在拼接位置涂覆并固化有荧光胶,从而使各柔性灯丝依次拼接形成一体拼接结构。
2.如权利要求1所述的柔性灯丝拼接结构,其特征在于,导电连接端上开设有至少一个焊孔,各相邻两柔性灯丝之间由相对的导电连接端上焊孔叠置,然后在叠置的焊孔内锡焊固定使其形成电性拼接。
3.如权利要求2所述的柔性灯丝拼接结构,其特征在于,第一根柔性灯丝的首端设有与导电线路层电性连接的第一触片,最后一根柔性灯丝末端与导电线路层电性连接有第二触片。
4.如权利要求1所述的柔性灯丝拼接结构,其特征在于,第一根柔性灯丝的首端设有与导电线路层电性连接的第一触片、第二触片,第一触片与第二触片位于同一侧。
5.根据权利要求1所述的柔性灯丝拼接结构,其特征在于:导电线路层上设有若干焊盘,LED芯片安装在焊盘上,沿着柔性基板的正面及反面涂覆有荧光胶并将LED芯片封装于荧光胶内。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321141808.2U CN220648178U (zh) | 2023-05-12 | 2023-05-12 | 一种柔性灯丝拼接结构 |
DE202024101442.1U DE202024101442U1 (de) | 2023-05-12 | 2024-03-22 | Aufspleißstruktur für flexible Filamente |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321141808.2U CN220648178U (zh) | 2023-05-12 | 2023-05-12 | 一种柔性灯丝拼接结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220648178U true CN220648178U (zh) | 2024-03-22 |
Family
ID=90297048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321141808.2U Active CN220648178U (zh) | 2023-05-12 | 2023-05-12 | 一种柔性灯丝拼接结构 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN220648178U (zh) |
DE (1) | DE202024101442U1 (zh) |
-
2023
- 2023-05-12 CN CN202321141808.2U patent/CN220648178U/zh active Active
-
2024
- 2024-03-22 DE DE202024101442.1U patent/DE202024101442U1/de active Active
Also Published As
Publication number | Publication date |
---|---|
DE202024101442U1 (de) | 2024-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106252491A (zh) | 发光装置 | |
CN111457260A (zh) | 发光组件及制作方法 | |
CN103943616B (zh) | 一种led发光装置 | |
JP7108326B2 (ja) | フレキシブルledライトバー | |
TWI723921B (zh) | 面光源之led裝置 | |
TW201123562A (en) | A light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof | |
CN109244066B (zh) | 无基材灯丝架构、无基材柔性灯丝、光源及无基材灯丝架构的制造方法 | |
TWI415309B (zh) | Preform Molded Polycrystalline Bearing Modules with Lead Frame Type | |
CN111095580A (zh) | 柔性led面光源、制作方法及发光设备 | |
CN220648178U (zh) | 一种柔性灯丝拼接结构 | |
CN210576010U (zh) | 一种可分段的柔性led灯丝结构和led光源 | |
CN211083697U (zh) | 灯串及装饰照明组件 | |
CN106783819A (zh) | 一种柔性灯丝及其制备方法 | |
CN102345814A (zh) | 简易型可拆卸式照明结构及照明灯管 | |
CN113932159A (zh) | 一种led穿孔灯 | |
CN206849865U (zh) | 贴片led交通灯光源 | |
CN115188751A (zh) | 一种rgb灯珠制作的模组及制作方法 | |
KR20220032083A (ko) | 발광 엘리먼트들을 위한 지지체 및 라이팅 디바이스 | |
CN216345485U (zh) | 一种led注塑灯 | |
CN217082259U (zh) | 一种led注塑灯 | |
CN205140981U (zh) | 一种蓝宝石基板led灯丝 | |
CN217978723U (zh) | Led供电电路结构和led发光装置 | |
CN220692023U (zh) | 内置ic灯珠的led灯具 | |
CN218001229U (zh) | 一种led柔性灯带 | |
CN220896016U (zh) | 一种灯带焊线转接板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |