CN220556793U

CN220556793U - Assembled power module structure

Info

Publication number: CN220556793U
Application number: CN202322033681.9U
Authority: CN
Inventors: 段红
Original assignee: Shenzhen Liangchuang Technology Co ltd
Current assignee: Shenzhen Liangchuang Technology Co ltd
Priority date: 2023-07-31
Filing date: 2023-07-31
Publication date: 2024-03-05
Anticipated expiration: 2033-07-31

Abstract

The utility model relates to the technical field of power supplies, in particular to an assembled power supply module structure, which comprises a power supply shell, wherein a frame-shaped clamping cover is fixedly arranged at the top of the power supply shell, a semiconductor refrigerating sheet is arranged in the frame-shaped clamping cover, a rotating frame is fixedly arranged at the top of the power supply shell, a rotating rod is rotatably arranged at one side of the rotating frame, a radiating fin is rotatably arranged at one side of the rotating rod, a radiating fan is fixedly arranged at the top of the radiating fin, a clamping strip is fixedly arranged at one side of the radiating fin, a clamping frame is fixedly arranged at the top of the frame-shaped clamping cover, a lock tongue is fixedly arranged at one side of the radiating fin, and a fixing plate is fixedly arranged at the top of the frame-shaped clamping cover. The advantages are that: the device is clamped on the lock tongue through the lock tongue frame, the clamping strip is clamped in the clamping frame, the radiating fin radiates heat to the semiconductor refrigerating fin, the radiating fin radiates heat in time, heat accumulation of the semiconductor refrigerating fin is avoided, and therefore the fault probability of the semiconductor refrigerating fin is reduced.

Description

Assembled power module structure

Technical Field

The utility model relates to the technical field of power supplies, in particular to an assembled power supply module structure.

Background

The power module is a power supply which can be directly mounted on a printed circuit board and is characterized in that the power module can provide power for an application specific integrated circuit, a digital signal processor, a microprocessor, a memory, a field programmable gate array and other digital or analog loads. Generally, such modules are referred to as load power supply systems or point-of-use power supply systems. Because of the advantages of the modular structure, the modular power supply is widely applied to the communication fields of switching equipment, access equipment, mobile communication, microwave communication, optical transmission, routers and the like, and automotive electronics, aerospace and the like, and the power supply module is mainly formed by placing electronic elements in an open box body structure and then sealing the internal electronic elements by filling insulating pouring sealant.

The utility model discloses an assembled power module structure in chinese patent CN219372727U, this assembled power module structure, frame type clamping lid is when the normal work of power shell inner assembly, axial flow type heat dissipation fan and semiconductor refrigeration piece also can be opened, if ageing problem appears in axial flow type heat dissipation fan and semiconductor refrigeration piece, the convenience is dismantled the change to axial flow type heat dissipation fan and semiconductor refrigeration piece, frame type clamping lid is sealed the last opening of power shell, can save the use of pouring sealant, and can open frame type clamping lid, maintain the inside subassembly of power shell, however, this assembled power module structure has following defect when solving the problem:

the device directly dissipates heat of the semiconductor refrigerating sheet through the axial flow type heat dissipation fan, and a heat conducting medium is not arranged between the semiconductor refrigerating sheet and the axial flow type heat dissipation fan, so that the heat accumulation of the semiconductor refrigerating sheet is easily caused by untimely dissipation of the heat-generating surface of the semiconductor refrigerating sheet, and further the semiconductor refrigerating sheet is caused to fail.

Disclosure of Invention

The object of the present utility model is to solve at least one of the technical drawbacks mentioned in the background.

Therefore, an objective of the present utility model is to provide an assembled power module structure, which is designed to solve the problem that the heat accumulation of the semiconductor refrigeration sheet is caused by the fact that the heat-generating surface of the semiconductor refrigeration sheet is not emitted in time due to the assembled power module structure in the prior art.

In order to achieve the above object, an embodiment of an aspect of the present utility model provides an assembled power module structure, which includes a power housing, a frame-type clamping cover is fixedly installed at the top of the power housing, a semiconductor refrigeration sheet is provided inside the frame-type clamping cover, a rotating frame is fixedly installed at the top of the power housing, a rotating rod is rotatably provided at one side of the rotating frame, a heat sink is rotatably provided at one side of the rotating rod, a heat dissipating fan is fixedly installed at the top of the heat sink, a clamping strip is fixedly installed at one side of the heat sink, a clamping frame is fixedly installed at the top of the frame-type clamping cover, a lock tongue is fixedly installed at one side of the heat sink, a fixing plate is fixedly installed at the top of the frame-type clamping cover, a spring is fixedly installed at one side of the fixing plate, a lock tongue frame is fixedly installed at one end of the spring, a slide rod is fixedly installed at one side of the lock tongue frame, and a pull handle is fixedly installed at one end of the slide rod.

By any of the above schemes, it is preferable that the top and bottom of the semiconductor refrigeration piece are provided with heat conducting silica gel pieces, and the heat conducting silica gel pieces can improve the heat conduction efficiency of the semiconductor refrigeration piece and avoid heat accumulation on the semiconductor refrigeration piece.

By any of the above schemes, preferably, the power electronic component is fixedly mounted in the power supply housing, and the cold conducting copper pipe can uniformly conduct heat to each electronic component, so that the heat of the electronic component is uniformly reduced.

Compared with the prior art, the utility model has the following advantages and beneficial effects:

1. the device comprises a lock tongue frame, a locking strip, a cooling fin, a cooling fan, a semiconductor cooling fin, a cooling fan and a cooling fan, wherein the cooling fan and the semiconductor cooling fin are started, the semiconductor cooling fin radiates heat through the cooling fin, then the heat is radiated through the cooling fan, the device is locked on the lock tongue through the lock tongue frame, the locking strip is locked in the locking frame, the cooling fin is further used for radiating the heat of the semiconductor cooling fin, the heat accumulation of the semiconductor cooling fin is avoided due to timely radiation of the cooling fin, and the fault probability of the semiconductor cooling fin is further reduced.

2. The locking bolt frame is clamped on the locking bolt, and the clamping strip is clamped in the clamping frame, so that the radiating fin extrudes the semiconductor refrigerating piece to be fixed, and the fixing effect of the semiconductor refrigerating piece is improved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic view of a three-dimensional structure according to the present utility model;

FIG. 2 is an exploded schematic view of the structure according to the present utility model;

FIG. 3 is a schematic view of the structure of FIG. 2 from the bottom in accordance with the present utility model;

fig. 4 is an exploded view of the power supply housing according to the present utility model.

Wherein: 10. the power supply comprises a power supply shell, 101, power supply electronic elements, 102, a cold conducting copper pipe, 11, a frame-type clamping cover, 111, clamping frames, 112, a fixed plate, 113, a spring, 114, a lock tongue frame, 115, a sliding rod, 116, a pull handle, 12, a semiconductor refrigerating sheet, 121, a substrate, 122, an electrode sheet, 123, a heat conducting silica gel sheet, 13, a rotating frame, 14, a rotating rod, 141, a radiating sheet, 142, a radiating fan, 143, clamping strips, 144, a lock tongue, 145 and a rotating shaft.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

As shown in fig. 1 to 4, an assembled power module structure of the present embodiment comprises a power housing 10, a frame-shaped card cover 11 is fixedly installed on top of the power housing 10, a semiconductor cooling fin 12 is provided inside the frame-shaped card cover 11, the semiconductor cooling fin 12 is inserted into the frame-shaped card cover 11, a substrate 121 is fixedly installed on one side of the semiconductor cooling fin 12, electrode plates 122 are fixedly installed on opposite sides of the power housing 10 and the substrate 121, a rotating frame 13 is fixedly installed on top of the power housing 10, a rotating rod 14 is rotatably provided on one side of the rotating frame 13, rotating shafts 145 are provided on both ends of the rotating rod 14, the rotating frame 13 and the heat dissipation fin 141 are rotatably connected with the rotating rod 14 through the rotating shafts 145, a heat dissipation fin 141 is rotatably provided on one side of the rotating rod 14, the rotating rod 14 and the heat dissipation fin 141 are rotatably installed on top of the heat dissipation fin 141 with the rotating frame 13 as a center, a clamping strip 143 is fixedly arranged on one side of a radiating fin 141, a clamping frame 111 is fixedly arranged on the top of a frame-shaped clamping cover 11, the clamping strip 143 is clamped into the clamping frame 111, one side of the radiating fin 141 is fixed, a locking bolt 144 is fixedly arranged on one side of the radiating fin 141, a fixing plate 112 is fixedly arranged on the top of the frame-shaped clamping cover 11 on the locking bolt 144 under the elasticity of the spring 113, a spring 113 is fixedly arranged on one side of the fixing plate 112, a locking bolt frame 114 is fixedly arranged at one end of the spring 113, the locking bolt frame 114 is clamped with the top of the locking bolt 144, the locking bolt frame 114 presses the spring 113 to enable the radiating fin 141 to press a semiconductor refrigerating sheet 12, the locking bolt frame 114 is clamped on the locking bolt 144 under the elasticity of the spring 113, a sliding rod 115 is fixedly arranged on one side of the locking bolt frame 114, the sliding rod 115 is in sliding connection with the inside of the fixing plate 112, a pull handle 116 is fixedly arranged at one end of the sliding rod 115, the pull handle 116 is pulled, the pull handle 116 drives the latch bolt 114 to move through the slide bar 115.

Example 1: the power electronic components 101 are fixedly arranged in the power supply shell 10, the cold conducting copper pipe 102 is fixedly arranged in the power supply shell 10, and the cold conducting copper pipe 102 uniformly distributes cold energy on each electronic component 101.

Example 2: the top and the bottom of semiconductor refrigeration piece 12 are provided with heat conduction silica gel piece 123, and the one side that two sets of heat conduction silica gel pieces 123 keep away from semiconductor refrigeration piece 12 is respectively with cold copper pipe 102 and fin 141 butt, and heat conduction silica gel piece 123 increases the contact surface of semiconductor refrigeration piece 12 and cold copper pipe 102 and fin 141, improves heat conduction efficiency.

The working principle of the utility model is as follows: in the course of the use of the device,

1. inserting the semiconductor refrigerating sheet 12 into the frame-type clamping cover 11, then rotating the rotating rod 14 and the radiating fin 141 by taking the rotating frame 13 as the center, clamping the clamping strip 143 into the clamping frame 111, fixing one side of the radiating fin 141, then pulling the pull handle 116, driving the spring bolt frame 114 to move by the pull handle 116 through the sliding rod 115, enabling the spring 113 to be extruded by the spring bolt frame 114, enabling the radiating fin 141 to extrude the semiconductor refrigerating sheet 12, and then enabling the spring bolt frame 114 to be clamped on the spring bolt 144 under the elasticity of the spring 113;

2. the heat radiation fan 142 and the semiconductor cooling fin 12 are activated, the semiconductor cooling fin 12 radiates heat through the heat radiation fin 141, and then the heat is radiated through the heat radiation fan 142.

Compared with the prior art, the utility model has the following beneficial effects compared with the prior art:

1. the semiconductor refrigerating sheet 12 is inserted into the frame-type clamping cover 11, then the rotating rod 14 and the radiating sheet 141 are rotated by taking the rotating frame 13 as the center, the clamping strip 143 is clamped into the clamping frame 111, one side of the radiating sheet 141 is fixed, then the pull handle 116 is pulled, the pull handle 116 drives the spring bolt frame 114 to move through the sliding rod 115, the spring bolt frame 114 presses the spring 113, the radiating sheet 141 presses the semiconductor refrigerating sheet 12, then the spring bolt frame 114 is clamped on the spring bolt 144 under the elasticity of the spring 113, the radiating fan 142 and the semiconductor refrigerating sheet 12 are started, the semiconductor refrigerating sheet 12 radiates heat through the radiating sheet 141, and then the radiating fan 142 radiates heat.

2. The latch bolt frame 114 is clamped on the latch bolt 144, the clamping strip 143 is clamped in the clamp frame 111, so that the radiating fin 141 extrudes the semiconductor refrigeration piece 12 to be fixed, the semiconductor refrigeration piece 12 is prevented from being separated from the frame-shaped clamping cover 11, the fixing effect of the semiconductor refrigeration piece 12 is improved, and the stability of the semiconductor refrigeration piece 12 is improved.

Claims

1. The utility model provides an assembled power module structure, its characterized in that, including power shell (10), the top fixed mounting of power shell (10) has frame type clamping lid (11), the inside semiconductor refrigeration piece (12) that is provided with of frame type clamping lid (11), the top fixed mounting of power shell (10) has rotating frame (13), one side rotation of rotating frame (13) is provided with dwang (14), one side rotation of dwang (14) is provided with fin (141), the top fixed mounting of fin (141) has radiator fan (142), one side fixed mounting of fin (141) has draw-in bar (143), the top fixed mounting of frame type clamping lid (11) has clamping frame (111), one side fixed mounting of fin (141) has spring bolt (144), the top fixed mounting of frame type clamping lid (11) has fixed plate (112), one side fixed mounting of fixed plate (112) has spring (113), one end fixed mounting of spring (113) has spring bolt (114), one end fixed mounting of spring bolt (115) has slide bar (116).

2. The assembled power module structure as claimed in claim 1, wherein the latch bracket (114) is engaged with a top portion of the latch (144), and the slide bar (115) is slidably connected to an inside of the fixing plate (112).

3. The assembled power module structure as claimed in claim 1, wherein a substrate (121) is fixedly mounted on one side of the semiconductor cooling sheet (12), and electrode sheets (122) are fixedly mounted on opposite sides of the power supply housing (10) and the substrate (121).

4. The assembled power module structure of claim 1, wherein the semiconductor refrigeration sheet (12) is provided with thermally conductive silicone sheets (123) at the top and bottom.

5. The assembled power module structure as claimed in claim 1, wherein the rotating shaft (145) is provided at both ends of the rotating shaft (14), and the rotating frame (13) and the heat sink (141) are rotatably connected to the rotating shaft (14) through the rotating shaft (145).

6. The assembled power module structure as claimed in claim 1, characterized in that the power electronic component (101) is fixedly mounted in the power housing (10), and the cold conducting copper pipe (102) is fixedly mounted in the power housing (10).

7. The assembled power module structure as claimed in claim 4, wherein the sides of the two groups of heat conducting silicon sheets (123) away from the semiconductor refrigerating sheet (12) are respectively abutted against the cold conducting copper tube (102) and the radiating fin (141).