CN220474407U - Surface mount ceramic resistor - Google Patents
Surface mount ceramic resistor Download PDFInfo
- Publication number
- CN220474407U CN220474407U CN202221434706.5U CN202221434706U CN220474407U CN 220474407 U CN220474407 U CN 220474407U CN 202221434706 U CN202221434706 U CN 202221434706U CN 220474407 U CN220474407 U CN 220474407U
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- Prior art keywords
- ceramic resistor
- chip
- electrode
- metal lead
- insulating layer
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- 239000000919 ceramic Substances 0.000 title claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 34
- 238000005476 soldering Methods 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 32
- 238000009413 insulation Methods 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001851 vibrational circular dichroism spectroscopy Methods 0.000 description 1
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- Details Of Resistors (AREA)
Abstract
The utility model provides a patch type ceramic resistor, which comprises an insert type ceramic resistor chip, a metal lead and an insulating layer, wherein a first electrode and a second electrode are respectively printed on two opposite sides of the insert type ceramic resistor chip; one end of the metal lead is connected with the first electrode by soldering tin, and the other end is a welding end; the insulating layer wraps all areas except the second electrode on the metal lead and the plug-in ceramic resistor chip, and the welding end of the metal lead is positioned outside the insulating layer. This scheme sets up through above-mentioned mode, can directly utilize the plug-in components formula ceramic resistor chip that has ripe application now as the main material according to the processing demand, need not to order for the development, very big reduction the cost of paster formula ceramic resistor, insulating layer compromise insulating, protection and sucking disc three effects simultaneously, increased holistic life and the convenience of resistance.
Description
Technical Field
The utility model belongs to the technical field of electrical components, and particularly relates to a patch type ceramic resistor.
Background
The patch type ceramic resistor has the advantages of small volume, light weight, high installation density, strong shock resistance, strong anti-interference capability, good high-frequency characteristic and the like, and is widely applied to computers, mobile phones, electronic dictionaries, medical electronic products, camcorders, electronic kilowatt-hour meters, VCDs and the like.
The conventional chip ceramic resistor generally has standard specifications and standard external dimensions, but the specific power required is different according to the products of the final application, so that the chip ceramic resistor needs to be developed and customized according to the corresponding products, resulting in higher cost. The plug-in chip with the same performance has more widely applicable scenes and lower cost, but due to the structural characteristics, in certain application occasions, workers also need to realize connection and fixation in a manual welding mode, and the working efficiency is influenced.
Disclosure of Invention
The utility model aims to at least solve one of the technical problems in the prior art and provide the patch type ceramic resistor which has a simple structure and low production cost and can adapt to various working requirements.
The utility model adopts the following technical scheme:
a chip ceramic resistor comprising:
the plug-in ceramic resistor chip is characterized in that a first electrode and a second electrode are respectively printed on two opposite sides of the plug-in ceramic resistor chip;
one end of the metal lead is connected with the first electrode by soldering tin, and the other end of the metal lead is a welding end;
and the insulating layer wraps all areas except the second electrode on the metal lead and the plug-in ceramic resistor chip, and the welding end of the metal lead is positioned outside the insulating layer.
Further, the metal lead is bent to be Z-shaped, one end of the metal lead is connected with the first electrode in a soldering mode, and the other end of the metal lead is bent to be flush with the end face of the insulating layer wrapping the second electrode on the plug-in ceramic resistor chip.
Further, a strip-shaped groove for heat dissipation is formed in the insulating layer, which is close to the end face of the second electrode, on the opposite face.
Further, a plurality of strip-shaped grooves are formed in the insulating layer, close to the end face of the second electrode, in a face-to-face mode, and the strip-shaped grooves are arranged at intervals in a surrounding mode.
Further, the insulation layer wraps the plug-in ceramic resistor chip and then is packaged to form a cylinder or a polygonal prism.
Further, the plug-in ceramic resistor chip is a single-layer flaky plug-in ceramic resistor chip.
Compared with the prior art, the utility model has the beneficial effects that:
when the patch type ceramic resistor is used, the first electrode of the plug-in type ceramic resistor chip and one end of the metal lead are connected and fixed through soldering tin, then the metal lead and the plug-in type ceramic resistor chip are wrapped by the molten insulating layer until solidification, and finally the exposed second electrode and the soldering end of the metal lead can be matched together to realize electrical connection with an external PCB. This scheme sets up through above-mentioned mode, can directly utilize current plug-in components formula ceramic resistor chip as the master material according to the processing demand, need not to order for the development, very big reduction the cost of paster formula ceramic resistor, insulating layer compromise insulating, protection and sucking disc three effects simultaneously, increased holistic life and the convenience of resistance.
Drawings
Fig. 1 is an end view of a preferred embodiment of a chip ceramic resistor without a solder mask according to the present utility model;
FIG. 2 is a top view of a first embodiment of a chip ceramic resistor of the present utility model;
fig. 3 is a bottom view of a first embodiment of the chip ceramic resistor of the present utility model;
FIG. 4 is a top view of a second embodiment of a chip ceramic resistor of the present utility model;
fig. 5 is a bottom view of a second embodiment of the chip ceramic resistor of the present utility model;
FIG. 6 is a top view of a third embodiment of a chip ceramic resistor of the present utility model;
fig. 7 is a bottom view of a third embodiment of the chip ceramic resistor of the present utility model.
Wherein, each reference sign in the figure:
10. plug-in ceramic resistor chip; 101. a first electrode; 102. a second electrode; 20. a metal lead; 30. an insulating layer; 301. a strip-shaped groove.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
The utility model is shown with reference to fig. 1-7, and comprises an insert ceramic resistor chip 10, a metal lead 20 and an insulating layer 30, wherein a first electrode 101 and a second electrode 102 are respectively printed on two opposite sides of the insert ceramic resistor chip 10; one end of the metal lead 20 is in solder connection with the first electrode 101, and the other end is a welding end; the insulating layer 30 surrounds the metal lead 20 and all regions of the interposer ceramic resistor chip 10 except the second electrode 102, and the soldered ends of the metal lead 20 are located outside the insulating layer 30. When the plug-in ceramic resistor chip 10 is used, the first electrode 101 of the plug-in ceramic resistor chip 10 and one end of the metal lead 20 can be connected and fixed through soldering tin, then the metal lead 20 and the plug-in ceramic resistor chip 10 are wrapped by the melted insulating layer 30 until solidification, and finally the exposed second electrode 102 and the soldering end of the metal lead 20 can be matched together to realize electrical connection with an external PCB. The proposal can directly utilize the plug-in ceramic resistor chip 10 which is already mature to be applied at present as a main material according to the processing requirement without custom development, greatly reduces the cost of the surface-mounted ceramic resistor, simultaneously ensures the insulation, protection and sucking disc of the insulating layer 30, prolongs the service life and convenience of the whole resistor,
as a preferred embodiment of the utility model, it may also have the following additional technical features:
in this embodiment, referring to fig. 1, the metal lead 20 is bent in a "Z" shape, one end of the metal lead 20 is soldered to the first electrode 101, and the other end is bent to be flush with the end surface of the insulating layer 30 on the package ceramic resistor chip 10, which encapsulates the second electrode 102. Through the arrangement of bending the metal lead 20, the metal lead 20 can be more attached to the plug-in ceramic resistor chip 10, and the subsequent insulating part can be closed and connected during processing, so that a better protection effect is achieved. Meanwhile, in the scheme, the welding end of the metal lead 20 and the second electrode 102 are simultaneously used for realizing connection with the PCB, so that the metal lead 20 is bent to be flush with the end face of the second electrode 102, the connection with the PCB can be realized better in resistance, and the connection difficulty is reduced.
In this embodiment, referring to fig. 2-7, the insulation layer 30 wraps the inserted ceramic resistor chip 10 and is packaged to form a cylinder or a polygonal prism. By this arrangement, the insulating layer 30 can be customized to various shapes during processing according to the production needs or customer needs achieved, and is more adaptable. Meanwhile, the resistors can be stably placed in various shapes, and the resistors cannot be easily fallen down to be lost.
In the first embodiment, referring to fig. 2-3, the insulation layer 30 encapsulates the ceramic resistor chip 10 and then encapsulates the ceramic resistor chip to form a cylinder. Second embodiment referring to fig. 4 to 5, the insulation layer 30 encapsulates the ceramic resistor chip 10 to form a cylinder with two cut sections. Third embodiment referring to fig. 6 to 7, the insulation layer 30 encapsulates the package type ceramic resistor chip 10 to form an octagonal prism. In other embodiments, the customization can be performed according to actual use conditions and customer requirements, and is not limited to the above embodiments.
In this embodiment, referring to fig. 3, 5 and 7, a strip-shaped groove 301 for heat dissipation is formed on the insulating layer 30 on the surface of the insulating layer that is close to the second electrode 102. Through the arrangement of the strip-shaped groove 301, heat generated in the working process of the chip can be rapidly discharged from the strip-shaped groove 301, the overall temperature of the resistor is reduced, the working influence of high temperature on the resistor is reduced, and the service life of the resistor is prolonged.
In this embodiment, as shown in fig. 3, 5 and 7, a plurality of strip-shaped grooves 301 are disposed on the insulating layer 30 on the surface of the insulating layer, which is close to the second electrode 102, and the plurality of strip-shaped grooves 301 are disposed at intervals around the insulating layer. Through above-mentioned setting, increase the radiating rate of chip through increasing the quantity of bar recess 301 with this, improve cooling efficiency, encircle the interval simultaneously and set up and can make each position of chip heat dissipation more even, the radiating effect of resistance is better, improves the life of resistance.
In this embodiment, the plug-in ceramic resistor chip 10 is a single-layer chip-type plug-in ceramic resistor chip 10. The single-layer chip-type plug-in ceramic resistor chip 10 is a relatively mature product in the existing electrical element, and can meet the working requirement of the chip ceramic resistor by directly selecting the material as a main material, and meanwhile, the chip processing and debugging can be greatly omitted, so that the production cost of the chip ceramic resistor is reduced.
The above additional technical features can be freely combined and superimposed by a person skilled in the art without conflict.
The above embodiments are only preferred embodiments of the present utility model, and the scope of the present utility model is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present utility model are intended to be within the scope of the present utility model as claimed.
Claims (4)
1. The chip ceramic resistor is characterized by comprising:
an insert ceramic resistor chip (10), wherein a first electrode (101) and a second electrode (102) are respectively printed on two opposite surfaces of the insert ceramic resistor chip (10);
a metal lead (20), one end of which is connected with the first electrode (101) by soldering, and the other end of which is a welding end;
the insulation layer (30) wraps all areas except the second electrode (102) on the metal lead (20) and the plug-in ceramic resistor chip (10), and the welding end of the metal lead (20) is positioned outside the insulation layer (30);
a plurality of strip-shaped grooves (301) are formed in the insulating layer (30) and are close to the end face of the second electrode (102), and the strip-shaped grooves (301) are arranged at intervals in a surrounding mode;
the insulating layer (30) is provided with a strip-shaped groove (301) for heat dissipation on the surface, which is close to the second electrode (102), of the insulating layer.
2. The chip ceramic resistor according to claim 1, wherein the metal lead (20) is bent in a zigzag shape, one end of the metal lead (20) is connected with the first electrode (101) by soldering, and the other end of the metal lead is bent to be level with the end face of the insulating layer (30) wrapping the second electrode (102) on the chip ceramic resistor chip (10).
3. A chip ceramic resistor according to claim 1, characterized in that the insulating layer (30) is wrapped around the chip ceramic resistor (10) and then encapsulated to form a cylinder or a polygonal prism.
4. A chip ceramic resistor according to claim 1, characterized in that the chip ceramic resistor chip (10) is a single-layer chip ceramic resistor chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221315795 | 2022-05-27 | ||
| CN2022213157951 | 2022-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220474407U true CN220474407U (en) | 2024-02-09 |
Family
ID=89800186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221434706.5U Active CN220474407U (en) | 2022-05-27 | 2022-06-08 | Surface mount ceramic resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220474407U (en) |
-
2022
- 2022-06-08 CN CN202221434706.5U patent/CN220474407U/en active Active
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