CN220383285U - Structure for improving high-speed signal reference backflow ground - Google Patents
Structure for improving high-speed signal reference backflow ground Download PDFInfo
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- CN220383285U CN220383285U CN202321341083.1U CN202321341083U CN220383285U CN 220383285 U CN220383285 U CN 220383285U CN 202321341083 U CN202321341083 U CN 202321341083U CN 220383285 U CN220383285 U CN 220383285U
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- hollowed
- capacitor
- speed signal
- copper sheet
- out area
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- 239000003990 capacitor Substances 0.000 claims abstract description 76
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 71
- 229910052802 copper Inorganic materials 0.000 claims abstract description 71
- 239000010949 copper Substances 0.000 claims abstract description 71
- 230000008054 signal transmission Effects 0.000 claims abstract description 10
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010992 reflux Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a structure for improving high-speed signal reference reflow ground, which is used for high-speed signal transmission of a capacitor and comprises a hollowed-out area and a reference copper sheet, wherein the hollowed-out area and the reference copper sheet are both positioned on a plate layer below the position of a capacitor bonding pad, the reference copper sheet is positioned under the capacitor bonding pad, and two ends of the reference copper sheet are connected with the peripheral copper sheet of the hollowed-out area. According to the utility model, the reference copper sheet is arranged in the hollowed-out area on the lower plate layer of the area where the capacitor bonding pad is located, so that a reference surface on an adjacent layer is provided for the capacitor welded by the upper bonding pad.
Description
Technical Field
The utility model relates to the technical field of PCB boards, in particular to a structure for improving a high-speed signal reference reflow ground.
Background
A printed circuit board (Printed Circuit Board, PCB) is also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of the electronic components. It is called a "printed" circuit board because it is made using electronic printing.
In the application process of the high-speed circuit PCB, along with the continuous increase of the speed of the integrated circuit switch and the density of the PCB, the signal is required to be completely transmitted from the transmitting end to the receiving end, wherein the reflow of the high-speed signal is a key factor affecting the signal integrity, the reflow processing of the high-speed signal is poor, the reflow signal can be influenced by electromagnetic radiation, the higher the speed of the electromagnetic radiation is, the more serious the speed of the electromagnetic radiation is, and finally the incomplete transmission of the signal can be caused. Along with the improvement of the transmission rate, the impedance matching requirements among internal components are also improved, the capacitor is a very common PCB element, and the higher the transmission signal rate of the capacitor is, the more the problem of discontinuous impedance between the capacitor and the circuit board is easy to exist, so that the signal quality of a high-speed signal is affected.
The PCB board of the high-integrated circuit is a multilayer board generally, the PCB board is in a vertical direction from Top to Bottom from the Top layer to the Bottom layer, the capacitor is arranged on the Top layer, the adjacent layer of the capacitor pad is the Gnd02 layer, the adjacent layer of the capacitor pad is usually hollowed, namely the Gnd02 layer is hollowed when the high-speed line is optimized, the reference surface of the capacitor and the wiring is generally referred to the Gnd02 layer on the Top layer, the reflux path is shortest at the moment, but the reference plane of the Gnd02 layer is changed into Art03 or Gnd04 after the Gnd02 layer is hollowed, the distance in the vertical direction is prolonged, the reflux path of the reference ground is prolonged, and certain influence is generated on high-speed signal transmission.
The above problems are to be solved.
Disclosure of Invention
In order to overcome the defect that the high-speed signal quality is affected by the increase of a reflux path caused by the hollowing of adjacent layers of a capacitor in the prior art, the utility model provides a structure for improving the high-speed signal reference reflux ground.
The technical scheme of the utility model is as follows:
the utility model provides an improve structure of high-speed signal reference backward flow ground, improve high-speed signal reference backward flow ground's structure is used for the high-speed signal transmission of electric capacity, improve high-speed signal reference backward flow ground's structure includes and draws the sky area and consults the copper sheet, draw the sky area with consult the copper sheet all be located the electric capacity pad and locate on the regional position below sheet, consult the copper sheet and be located under the electric capacity pad, just consult copper sheet both ends with draw the surrounding copper sheet of empty district and be connected.
Further, in one embodiment, the width of the reference plane is 4 mils.
Further, in an embodiment, the hollowed-out region edge coincides with the capacitor pad edge projection on the same side.
Further, in one embodiment, the hollowed-out region edge is 7-8mil away from the capacitor pad edge on the same side.
Further, in an embodiment, the capacitor pad is rectangular, and the hollowed-out area is also rectangular.
Further, in an embodiment, the capacitor pads solder AC coupling capacitors.
Further, in an embodiment, the reference copper sheet is a long straight line.
Further, in an embodiment, the reference copper sheets are two and two reference copper sheets are arranged in parallel, and the two reference copper sheets divide the hollowed-out area into three parts.
According to the scheme, the capacitor bonding pad has the beneficial effects that the reference copper sheet is arranged in the hollowed-out area on the lower plate layer of the area where the capacitor bonding pad is located, a reference surface on an adjacent layer is provided for the capacitor welded by the upper bonding pad, the hollowed-out area ensures the reduction of the impedance of the capacitor, the reference copper sheet shortens the reflux path of signals, the problem that the reflux path of signals is increased due to the hollowed-out of the adjacent plate layer of the capacitor is solved, and the high-speed signal quality of the capacitor can be effectively improved.
Drawings
FIG. 1 is a schematic top view of a board layer in which an embodiment of a structure for improving high-speed signal reference reflow is located;
FIG. 2 is a schematic top view of a board layer of another embodiment of a structure for improving high-speed signal reference reflow.
In the figure, 1, a PCB board; 2. drawing out a dead zone; 3. a reference plane; 4. and a capacitor pad.
Detailed Description
The utility model is further described below with reference to the drawings and embodiments. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like are used in this specification for purposes of illustration only. In the description of the present utility model, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.
Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.
In addition, the technical features mentioned in the different embodiments of the utility model described below can be combined with one another as long as they do not conflict with one another.
Examples
As shown in fig. 1, the present utility model provides a structural embodiment for improving a high-speed signal reference reflow area, where the structure for improving the high-speed signal reference reflow area is used for high-speed signal transmission of a capacitor, and the structure for improving the high-speed signal reference reflow area includes a hollowed out area 2 and a reference copper sheet 3, where the hollowed out area 2 and the reference copper sheet 3 are located on a board layer below an area where a capacitor pad 4 is located, the hollowed out area 2 is formed by hollowing out copper sheets on the board layer, the reference copper sheet 3 is located under the capacitor pad 4, and on a PCB board 1, the two ends of the reference copper sheet 3 are connected with peripheral copper sheets of the hollowed out area 2.
The four capacitor pads 4 are all rectangular, and are arranged in a rectangular array of two rows and two columns, and the two capacitor pads 4 are welded with one capacitor.
The two reference copper sheets 3 are respectively positioned under the capacitor pads 4 on the same side of the two AC coupling capacitors, two ends of each reference copper sheet 3 are connected with copper sheets on opposite sides of the periphery of the hollowed-out area 2, the reference copper sheets 3 are long straight lines, the width of each reference copper sheet 3 is 4mil, and the two reference copper sheets 3 are arranged in parallel and divide the hollowed-out area 2 into three parts.
The projections of the four capacitor pads 4 on the adjacent layers (Gnd 02 layers in general) at the lower positions are all located in the hollowed-out area 2, the hollowed-out area 2 is rectangular in the embodiment, the projection distance between the edge of the hollowed-out area 2 and the edge of the capacitor pad 4 on the same side is 7mil, and the center point of the hollowed-out area 2 coincides with the center point of the projections of the four capacitor pads 4.
The utility model improves the structure of the high-speed signal reference reflow ground, and the hollowed-out area 2 is arranged on the adjacent layer of the capacitor so as to reduce the capacitance impedance, ensure the integrity of high-speed signal transmission of the capacitor, and simultaneously ensure that a capacitance signal reference plane is still the plane where the hollowed-out area 2 is positioned by the same layer of reference copper sheet 3, generally referred to as Gnd02 layer of the circuit board, thereby keeping the reflow path unchanged and reducing the influence of hollowed-out on the signal quality.
Examples
The utility model provides another embodiment of a structure for improving high-speed signal reference backflow ground, which is used for high-speed signal transmission of a capacitor, and comprises a hollowed-out area 2 and a reference copper sheet 3, wherein the hollowed-out area 2 and the reference copper sheet 3 are both positioned on a board layer below an area position where a capacitor bonding pad 4 is positioned, the board layer below the area position where the capacitor bonding pad 4 is positioned is a Gnd02 layer of a circuit board, the hollowed-out area 2 is formed by processing copper sheets on the Gnd02 layer into a hollowed-out area 2, the reference copper sheet 3 is positioned under the capacitor bonding pad 4, and two ends of the reference copper sheet 3 are connected with peripheral copper sheets of the hollowed-out area 2 on a PCB board 1.
The capacitor pads 4 are rectangular, four in total, are arranged in a matrix of two rows and two columns, and two capacitor pads 4 are welded with one capacitor.
The reference copper sheets 3 are two, and each capacitor pad 4 positioned under the capacitor pads 4 on the same side of the two AC coupling capacitors respectively, namely, each capacitor pad 4 above each reference copper sheet 3 is welded with a different AC coupling capacitor respectively. The two reference copper sheets 3 are long straight lines, the width of the two reference copper sheets is 4mil, two ends of each reference copper sheet 3 are connected with copper sheets on opposite sides of the periphery of the hollowed-out area 2, and the two reference copper sheets 3 divide the hollowed-out area 2 into three parts in parallel. The reference copper sheet 3 may be used as a trace according to design requirements.
The projections of the four capacitor pads 4 on the Gnd02 layer are all positioned in the hollowed-out area 2, the hollowed-out area 2 is rectangular, the projection distance between the edge of the hollowed-out area 2 and the edge of the capacitor pad 4 on the same side is 8mil, and the center point of the hollowed-out area 2 coincides with the center point of the projections of the four capacitor pads 4.
The structure for improving the high-speed signal reference reflow ground is provided with the hollowed-out area 2 on the adjacent layer of the capacitor, so that the capacitance impedance is reduced, the integrity of high-speed signal transmission of the capacitor is ensured, meanwhile, the capacitor signal reference plane is still in the Gnd02 layer by the same reference copper sheet 3 in the Gnd02 layer with the hollowed-out area 2, the reflow path is kept unchanged, and the influence of the hollowed-out area on the signal quality is reduced.
Examples
As shown in fig. 2, the present utility model further provides another embodiment of a structure for improving a high-speed signal reference reflow ground, where the structure for improving a high-speed signal reference reflow ground is used for high-speed signal transmission of a capacitor, the structure for improving a high-speed signal reference reflow ground includes a hollowed out area 2 and a reference copper sheet 3, both the hollowed out area 2 and the reference copper sheet 3 are located on a layer Gnd02 below an area where a capacitor pad 4 is located, the hollowed out area 2 is formed by hollowing copper sheets on the Gnd02 layer, the reference copper sheet 3 is located right below the capacitor pad 4, and two ends of the reference copper sheet 3 are connected with peripheral copper sheets of the hollowed out area 2 on a PCB board 1.
The four capacitor pads 4 are all rectangular, and are arranged in a rectangular array of two rows and two columns, and the two capacitor pads 4 are welded with one capacitor.
The projection of the four capacitor pads 4 on the Gnd02 layer is positioned in the hollowed-out area 2, the hollowed-out area 2 is rectangular, the edge of the hollowed-out area 2 coincides with the projection of the edge of the capacitor pad 4 on the same side, namely, the hollowed-out area 2 is equal to the pad area.
The two reference copper sheets 3 are respectively positioned under the capacitor pads 4 on the same side of the two AC coupling capacitors, and the two ends of each reference copper sheet 3 are connected with copper sheets on the opposite sides of the periphery of the hollowed-out area 2. The reference copper sheets 3 are long straight lines with the width of 4mil, the two reference copper sheets 3 are arranged in parallel, and the two reference copper sheets 3 divide the hollow area 2 into three parts as shown in fig. 2.
The utility model improves the structure of the high-speed signal reference reflow ground, and the hollowed-out area 2 is arranged on the adjacent layer of the capacitor so as to reduce the capacitance impedance, ensure the integrity of high-speed signal transmission of the capacitor, and simultaneously ensure that a capacitance signal reference plane is still the plane where the hollowed-out area 2 is positioned by the same layer of reference copper sheet 3, generally referred to as Gnd02 layer of the circuit board, thereby keeping the reflow path unchanged and reducing the influence of hollowed-out on the signal quality.
The reference copper sheet 3 in the embodiment is the same material as the copper sheet on the Gnd02 layer of the PCB multilayer board, the structure for improving the high-speed signal reference reflow ground is simple in structure, and the copper sheet at the position of the reference copper sheet 3 is reserved only when the board layer at the position reference plane below the capacitor pad 4 is hollowed during preparation, other steps are not needed, and the preparation method is simple.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the implementation of the utility model is not limited by the above manner, and it is within the scope of the utility model to apply the inventive concept and technical solution to other situations as long as various improvements made by the inventive concept and technical solution are adopted, or without any improvement.
Claims (8)
1. The structure for improving the high-speed signal reference reflow ground is used for high-speed signal transmission of a capacitor, and comprises a hollowed-out area and a reference copper sheet, wherein the hollowed-out area and the reference copper sheet are both positioned on a plate layer below the position of an area where a capacitor bonding pad is positioned, the reference copper sheet is positioned under the capacitor bonding pad, and two ends of the reference copper sheet are connected with the peripheral copper sheet of the hollowed-out area.
2. The structure for improving high speed signal reference reflow of claim 1, wherein the width of the reference copper sheet is 4mil.
3. The structure for improving high-speed signal reference reflow of claim 1, wherein the hollowed-out area edge coincides with the capacitor pad edge projection on the same side.
4. The structure for improving high speed signal reference reflow of claim 1, wherein the projected distance of the hollowed out area edge from the capacitor pad edge on the same side is 7-8 mils.
5. The structure for improving high-speed signal reference reflow ground of claim 1, wherein the capacitor pads are rectangular and the hollowed out area is also rectangular.
6. The structure for improving high speed signal reference reflow ground of claim 1, wherein the capacitive pads solder AC coupling capacitors.
7. The structure for improving high-speed signal reference reflow ground of claim 1, wherein the reference copper sheet is a long straight line.
8. The structure for improving high-speed signal reference reflow ground of claim 1, wherein the reference copper sheets are two and two are arranged in parallel, and the two reference copper sheets divide the hollowed-out area into three parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321341083.1U CN220383285U (en) | 2023-05-30 | 2023-05-30 | Structure for improving high-speed signal reference backflow ground |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321341083.1U CN220383285U (en) | 2023-05-30 | 2023-05-30 | Structure for improving high-speed signal reference backflow ground |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220383285U true CN220383285U (en) | 2024-01-23 |
Family
ID=89572962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321341083.1U Active CN220383285U (en) | 2023-05-30 | 2023-05-30 | Structure for improving high-speed signal reference backflow ground |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220383285U (en) |
-
2023
- 2023-05-30 CN CN202321341083.1U patent/CN220383285U/en active Active
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