CN220383283U - Printed circuit board for testing reliability of laser hole - Google Patents
Printed circuit board for testing reliability of laser hole Download PDFInfo
- Publication number
- CN220383283U CN220383283U CN202320849455.5U CN202320849455U CN220383283U CN 220383283 U CN220383283 U CN 220383283U CN 202320849455 U CN202320849455 U CN 202320849455U CN 220383283 U CN220383283 U CN 220383283U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- foil layer
- laser
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 94
- 239000011889 copper foil Substances 0.000 claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000007586 pull-out test Methods 0.000 claims abstract description 18
- 229910052705 radium Inorganic materials 0.000 claims abstract description 18
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 claims abstract description 18
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000005856 abnormality Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000005553 drilling Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000007585 pull-off test Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 101001034845 Mus musculus Interferon-induced transmembrane protein 3 Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a printed circuit board for testing the reliability of laser holes, which comprises an FR4 material layer and a second copper foil layer which are sequentially arranged from top to bottom; the printed circuit board is provided with a first copper foil layer and a plurality of laser holes which are arranged according to a preset first arrangement mode for single-side pull-out test; and/or the printed circuit board is provided with a first copper foil layer and a plurality of radium holes which are arranged according to a preset second arrangement mode for vertical pull-out test; the laser holes sequentially penetrate through the first copper foil layer and the FR4 material layer from top to bottom; and electroplated copper is arranged in the radium perforation and on the upper surface of the first copper foil layer. The utility model can monitor the quality condition of the laser hole in the production process, not only can timely find abnormality, but also can optimize the yield according to statistics.
Description
Technical Field
The utility model relates to a printed circuit board for testing the reliability of laser perforation, and belongs to the technical field of printed circuit boards.
Background
In recent years, the circuit board is developed towards a small and dense direction, and the through holes on the corresponding circuit board are also smaller and smaller, so that the high-density interconnection circuit board, namely the HDI board, is developed, most remarkable characteristics are that most mechanical drilling holes are replaced by laser drilling holes, the minimum aperture of the laser drilling holes can be 2-3 mil, the minimum aperture of the mechanical drilling holes is remained at 7.5-10 mil, and the laser drilling holes can be used for designing circuits which are much denser than the mechanical drilling holes.
However, the small aperture means that the current conducting area is small, and the bonding area between conductors is small, so that the conventional laser punching circuit board has the problems of cold and hot shock resistance, extreme environment resistance and the like, and the separation of the bottom of the laser hole and the copper foil at the bottom easily occurs when the electronic product is subjected to cold and hot shock or extreme environment, so that the circuit is broken. At present, a good mode for monitoring the quality condition of the laser hole in the production process does not exist.
The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art, and provides the printed circuit board for testing the reliability of laser perforation, which can monitor the quality condition of the laser perforation in the production process, can discover abnormality in time and can optimize the yield according to statistics.
In order to achieve the above purpose, the utility model is realized by adopting the following technical scheme:
the utility model discloses a printed circuit board for testing the reliability of laser holes, which comprises an FR4 material layer and a second copper foil layer which are sequentially arranged from top to bottom;
the printed circuit board is provided with a first copper foil layer and a plurality of laser holes which are arranged according to a preset first arrangement mode for single-side pull-out test;
and/or the printed circuit board is provided with a first copper foil layer and a plurality of radium holes which are arranged according to a preset second arrangement mode for vertical pull-out test;
the laser holes sequentially penetrate through the first copper foil layer and the FR4 material layer from top to bottom; and electroplated copper is arranged in the laser hole and on the upper surface of the first copper foil layer.
Further, the thickness of the first copper foil layer is in the range of 0.3mil to 1.4mil.
Further, the thickness of the second copper foil layer is in the range of 0.3mil to 1.4mil.
Further, the FR4 material of the FR4 material layer includes an epoxy resin, and/or a phenolic resin.
Further, the FR4 material layer thickness ranges from 2mil to 5mil.
Further, the aperture range of the radium perforation is 3 mil-6 mil;
the vertical distance between the upper surface of the electroplated copper in the laser perforation and the upper surface of the electroplated copper on the first copper foil layer is less than 15um.
Further, the first arrangement mode is that,
the surface area of the first copper foil layer is 5mm x 10mm;
the number of the laser holes is 20, the laser holes are uniformly distributed on the first copper foil layer in two rows, the number of each row is 10, and the number of each row is 2;
the center distance of the laser perforation of two adjacent columns is 1mm; the center distance of the laser perforation of two adjacent rows is 0.5mm.
Further, the second arrangement mode is that,
the surface area of the first copper foil layer is 4mm x 4mm;
the number of the laser holes is 5, and the laser holes are uniformly arranged in the center on the first copper foil layer, wherein the laser holes comprise 1 center laser hole and 4 corner laser holes;
the center distance between the center radium perforation and the corner radium perforation isThe method comprises the steps of carrying out a first treatment on the surface of the The center distance between two adjacent corner radium perforations is 2mm.
Compared with the prior art, the utility model has the beneficial effects that:
the printed circuit board is provided with the first copper foil layer and the plurality of laser holes, and different arrangement modes are presented according to different pull-out tests, so that the quality condition of the laser holes in the production process can be monitored, anomalies can be found in time, and the yield can be optimized according to statistics.
Drawings
FIG. 1 is a schematic vertical cross-section of a printed circuit board for laser perforation reliability testing provided in an embodiment;
FIG. 2 is a schematic diagram of a first arrangement provided by the embodiments;
FIG. 3 is a schematic diagram I for a one-sided pull-out test provided in an embodiment;
FIG. 4 is a schematic diagram II for a one-sided pull-out test provided in an embodiment;
FIG. 5 is a schematic diagram of a break in the pull-off test provided in the examples;
FIG. 6 is a second schematic diagram of a break in pull-off test provided in the examples;
FIG. 7 is a schematic representation of a break in the pull-off test provided in the examples III;
FIG. 8 is a schematic diagram of a second arrangement provided by the embodiments;
FIG. 9 is a schematic diagram I for a vertical pull-out test provided in an embodiment;
FIG. 10 is a schematic diagram II for a vertical pull-out test provided in an embodiment;
in the figure: 1. perforating with radium; 2. electroplating copper; 3. a first copper foil layer; 4. a layer of FR4 material; 5. a second copper foil layer; 6. tension rod.
Detailed Description
The utility model is further described below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present utility model, and are not intended to limit the scope of the present utility model.
The utility model discloses a printed circuit board for testing the reliability of laser holes, which is shown in figure 1, and comprises an FR4 material layer 4 and a second copper foil layer 5 which are sequentially arranged from top to bottom;
the printed circuit board is provided with a first copper foil layer 3 and a plurality of laser holes 1 which are arranged according to a preset first arrangement mode for single-side pull-out test;
and/or the printed circuit board is provided with a first copper foil layer 3 and a plurality of laser holes 1 which are arranged according to a preset second arrangement mode for vertical pull-out test;
the laser perforation 1 sequentially penetrates through the first copper foil layer 3 and the FR4 material layer 4 from top to bottom; both the inside of the laser perforation 1 and the upper surface of the first copper foil layer 3 are provided with electroplated copper 2.
Specifically, the first copper foil layer 3 and the second copper foil layer 5 are electroplated copper 2 foils commonly used in the printed circuit board industry, and the thickness range is 0.3 mil-1.4 mil1/3 Oz-1 Oz.
Further, the FR4 material layer 4 has a thickness in the range of 2mil to 5mil. The FR4 material of the FR4 material layer 4 comprises an epoxy resin, and/or a phenolic resin. In this embodiment, in order to eliminate the influence of the material on the test, the material of model IT170 of the company of Lingzu is uniformly selected. The reliability of the laser holes 1 under the FR4 material layers 4 with different thicknesses can be tested
The aperture of the laser perforation 1 ranges from 3mil to 6mil.
The electroplated copper 2 is common hole filling electroplating of the printed circuit board, copper is filled in the laser hole 1, but in the process of electroplating copper 2, due to the existence of the laser hole 1, a recess inevitably exists at the laser hole 1, the recess for filling copper is controlled below 15um, namely, the vertical distance between the upper surface of the electroplated copper 2 in the laser hole 1 and the upper surface of the electroplated copper 2 on the first copper foil layer 3 is less than 15um.
The specific preparation principle is as follows:
firstly, preparing a printed circuit board, wherein the printed circuit board comprises two copper foil layers, and an FR4 material layer 4 is arranged between the copper foil layers; the copper foil layer and the FR4 material layer 4 on the upper surface are drilled with laser holes 1, the laser holes 1 are arranged according to a preset first arrangement mode or a preset second arrangement mode, and then the laser holes 1 are metallized and filled with hole copper electroplating 2.
Secondly, carrying out full-surface photosensitive film pressing on the copper on the surface of the laser hole 1 after copper 2 is electroplated, exposing the copper surface of the area except the first copper foil layer 3 through exposure and development, and etching to remove redundant exposed copper surface, so as to only keep the first copper foil layer 3, thereby forming the printed circuit board for testing the laser perforation reliability in the embodiment.
As shown in fig. 2, the first arrangement mode is that,
the surface area of the first copper foil layer 3 is 5mm by 10mm;
the number of the laser holes 1 is 20, the laser holes are uniformly distributed on the first copper foil layer 3 in two rows, the number of each row is 10, and the number of each row is 2;
the center distance of the laser holes 1 of two adjacent rows is 1mm; the center distance of the laser holes 1 of two adjacent rows is 0.5mm.
As shown in fig. 8, the second arrangement is,
the surface area of the first copper foil layer 3 is 4mm by 4mm;
the number of the laser holes 1 is 5, and the laser holes are uniformly arranged in the center on the first copper foil layer 3, wherein the number of the laser holes comprises 1 center laser hole and 4 corner laser holes;
the center distance between the center radium perforation and the corner radium perforation isThe method comprises the steps of carrying out a first treatment on the surface of the The center distance between two adjacent corner radium perforations is 2mm.
It should be noted that, in this embodiment, the printed circuit board may be respectively provided with a first copper foil layer 3 and a plurality of radium holes 1 arranged according to a preset first arrangement mode for single-side pull-out test, and a first copper foil layer 3 and a plurality of radium holes 1 arranged according to a preset second arrangement mode for vertical pull-out test in different areas of the same printed circuit board; the printed circuit boards can be respectively provided with a first copper foil layer 3 and a plurality of laser holes 1 which are arranged according to a preset first arrangement mode for single-side pull-out test, and a first copper foil layer 3 and a plurality of laser holes 1 which are arranged according to a preset second arrangement mode for vertical pull-out test.
As shown in fig. 3-4, the principle of the single-sided pull-off test is as follows:
the first copper foil layer 3 is completely pulled off from one side by using a pulling machine, and the breaking modes of all laser perforation 1 are counted after the first copper foil layer 3 is pulled off, and generally, the method is divided into the following three types:
as shown in fig. 5, the electroplated copper 2 in the laser hole 1 and the second copper foil layer 5 are broken, which indicates that the bonding force between the electroplated copper 2 of the laser hole 1 and the second copper foil layer 5 is poor, and the laser hole 1 is judged to be a poor laser hole one;
as shown in fig. 6, the electroplated copper 2 in the laser hole 1 is broken with the first copper foil layer 3, which indicates that the electroplated copper 2 of the laser hole 1 has good bonding force with the second copper foil layer 5, and the laser hole 1 is judged to be a qualified laser hole;
as shown in fig. 7, the electroplated copper 2 in the laser hole 1 breaks itself, which indicates that the tensile strength of the electroplated copper 2 of the laser hole 1 is poor, and the laser hole 1 is judged to be a qualified laser hole two;
it is known that the number of laser holes 1 in the first arrangement is 20, and if the number of defective laser holes 1 is x and the number of defective laser holes second is z, the defective rate of the laser holes 1= (x+z)/20.
And establishing a statistical table, and monitoring quality fluctuation of the production line according to the change of the reject ratio.
As shown in fig. 9-10, the principle of the vertical pull-off test is as follows:
a tension rod 6 is welded on the first copper foil layer 3, in the embodiment, soldering is adopted, a steel wire with the diameter of 2mm can be selected as the tension rod 6, then a tension machine is used for pulling up the tension rod 6 and simultaneously pulling off the first copper foil layer 3, tension changes when the first copper foil layer 3 is pulled off are counted, and the maximum fracture tension F of the first copper foil layer 3 and the FR4 material layer 4 is recorded.
And establishing a statistical table, and monitoring quality fluctuation of the production line according to the change of the maximum tension.
In summary, the printed circuit board of the present utility model is provided with the first copper foil layer 3 and the plurality of laser holes 1, and different arrangements are presented according to different pull-out tests, and the pull-out of the first copper foil layer 3 and the laser holes 1 is performed by a pulling machine, so that the quality of the laser holes 1 in the PCB process can be monitored by analyzing the magnitude and variation of the pulling force and the breaking mode of the laser holes 1, thereby not only finding anomalies in time, but also optimizing the yield according to statistics.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present utility model, and such modifications and variations should also be regarded as being within the scope of the utility model.
Claims (8)
1. The printed circuit board for testing the reliability of the laser hole is characterized by comprising an FR4 material layer (4) and a second copper foil layer (5) which are sequentially arranged from top to bottom;
the printed circuit board is provided with a first copper foil layer (3) and a plurality of radium holes (1) which are arranged according to a preset first arrangement mode for single-side pull-out test;
and/or the printed circuit board is provided with a first copper foil layer (3) and a plurality of radium holes (1) which are arranged according to a preset second arrangement mode for vertical pull-out test;
the laser holes (1) sequentially penetrate through the first copper foil layer (3) and the FR4 material layer (4) from top to bottom; the inside of the laser hole (1) and the upper surface of the first copper foil layer (3) are both provided with electroplated copper (2).
2. The printed circuit board of claim 1, wherein the first copper foil layer (3) has a thickness in the range of 0.3mil to 1.4mil.
3. The printed circuit board of claim 1, wherein the second copper foil layer (5) has a thickness in the range of 0.3mil to 1.4mil.
4. The printed circuit board of claim 1, wherein the FR4 material of the FR4 material layer (4) comprises an epoxy or phenolic resin.
5. The printed circuit board of claim 1, wherein the layer (4) of FR4 material has a thickness in the range of 2mil to 5mil.
6. The printed circuit board of claim 1, wherein the laser holes (1) have a pore size in the range of 3mil to 6mil;
the vertical distance between the upper surface of the electroplated copper (2) in the laser hole (1) and the upper surface of the electroplated copper (2) on the first copper foil layer (3) is smaller than 15um.
7. The printed circuit board of claim 1, wherein the first arrangement is,
the surface area of the first copper foil layer (3) is 5mm by 10mm;
the number of the laser holes (1) is 20, the laser holes are uniformly distributed on the first copper foil layer (3) in two rows, the number of each row is 10, and the number of each row is 2;
the center distance of the laser holes (1) in two adjacent rows is 1mm; the center distance of the laser holes (1) of two adjacent rows is 0.5mm.
8. The printed circuit board of claim 1, wherein the second arrangement is,
the surface area of the first copper foil layer (3) is 4 mm-4 mm;
the number of the laser holes (1) is 5, and the laser holes are uniformly arranged in the center on the first copper foil layer (3) and comprise 1 center laser hole and 4 corner laser holes;
the center distance between the center radium perforation and the corner radium perforation isThe center distance between two adjacent corner radium perforations is 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320849455.5U CN220383283U (en) | 2023-04-17 | 2023-04-17 | Printed circuit board for testing reliability of laser hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320849455.5U CN220383283U (en) | 2023-04-17 | 2023-04-17 | Printed circuit board for testing reliability of laser hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220383283U true CN220383283U (en) | 2024-01-23 |
Family
ID=89572875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320849455.5U Active CN220383283U (en) | 2023-04-17 | 2023-04-17 | Printed circuit board for testing reliability of laser hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220383283U (en) |
-
2023
- 2023-04-17 CN CN202320849455.5U patent/CN220383283U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5404637A (en) | Method of manufacturing multilayer printed wiring board | |
| CN109526156B (en) | Detection module and detection method for detecting deviation degree of drilling hole | |
| CN102845141B (en) | Circuit board and manufacturing method therefor | |
| CN109462949B (en) | Manufacturing method of PCB with metalized edge | |
| CN111356290A (en) | PCB capable of detecting back drilling depth and detection method | |
| CN111315110A (en) | Circuit board and electronic device | |
| CN220383283U (en) | Printed circuit board for testing reliability of laser hole | |
| CN108303639A (en) | It is a kind of to carry on the back the aptitude tests module and aptitude tests method for being bored into line | |
| CN106525114B (en) | The test method of production line drilling ability in a kind of positive blade technolgy | |
| CN109982511A (en) | A kind of production method convenient for detecting the PCB for whether leaking brill without copper hole | |
| CN112504183B (en) | Hole deviation detection method | |
| JP2007235167A (en) | Wiring circuit board | |
| CN113068306A (en) | PCB and PCB mounting method | |
| CN105682365A (en) | Method of manufacturing semi-metallized platform on PCB | |
| JP2008198818A (en) | Method of manufacturing printed wiring circuit board | |
| CN116634662B (en) | High-speed printed circuit board and preparation method thereof | |
| CN217789988U (en) | Deep V-shaped via hole structure | |
| CN112014721B (en) | Universal LCR test board and manufacturing method thereof | |
| CN106556422B (en) | The test method of production line drilling ability in a kind of negative film technique | |
| KR100298896B1 (en) | A printed circuit board and a method of fabricating thereof | |
| CN219512131U (en) | Verifying plate for drilling defect detection capability | |
| CN221487960U (en) | Combined PCB | |
| CN118382228A (en) | PCB board plating resistance method and system and PCB board | |
| JPH0365676B2 (en) | ||
| JPH0786751A (en) | Manufacture of multilayer printed-wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |